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NXP Semiconductors

MC9S08QG8MPBE - 8KB Flash 8-bit S08 MCU | NXP | 16-PDIP

Référence : MC9S08QG8MPBE ⚠ Dernier achat
En stock Expédié sous 1 à 3 jours ouvrés
1.8 V to 3.6 V Vdss 16-PDIP (0.300 in, 7.62 mm) Package 20 MHz Speed 8 KB (8K x 8) Memory
À partir de $2.18 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-10-19
Tarifs dégressifs
Qté Prix unitaire Total
1 $3.87 $3,87
10 $3.48 $34,80
100 $3.1 $310,00
500 $2.72 $1 360,00
1 000 $2.41 $2 410,00
3 000 $2.18 $6 540,00
ℹ️ Tous les prix sont en USD

MC9S08QG8MPBE Présentation

The NXP MC9S08QG8MPBE is a member of the low-cost, high-performance HCS08 Family of 8-bit microcontroller units (MCUs), featuring 8KB of on-chip Flash memory and packaged in a 16-pin PDIP (0.300 inch, 7.62mm) through-hole format. It integrates the enhanced HCS08 core running at up to 20 MHz, providing high-performance processing in an entry-level footprint designed for cost-sensitive applications. The device is targeted at applications where small package count, low power, and on-chip peripherals are key differentiators.

An 8-bit MCU (microcontroller unit) is a single-chip computer that integrates a CPU, program memory, data memory, and peripherals on one silicon die. The HCS08 core represents NXP's enhanced 8-bit CPU architecture, which evolved from the legacy HC08 instruction set while adding improvements such as a hardware multiply, BGND instruction for background debug mode, and lower power modes. The S08QG family belongs to the broader category of low-power 8-bit microcontrollers, sitting below 32-bit ARM Cortex-M parts in performance but offering better cost, simpler toolchains, and ultra-low standby current for battery-powered designs.

Key features of the MC9S08QG8MPBE include 8KB of Flash program memory, 512 bytes of RAM, an internal clock generator, multiple low-power modes (STOP, WAIT, plus run), an analog-to-digital converter (ADC), timers, a serial communications interface (SCI), a serial peripheral interface (SPI), and an inter-integrated circuit (I2C) bus. The integrated 20 MHz internal clock source eliminates the need for an external crystal in most designs, reducing BOM cost and board area.

Typical applications include low-cost consumer electronics, remote controls, small home appliances, sensor interface boards, battery-powered equipment, and industrial control modules. The wide operating voltage range and multiple stop modes allow the device to deliver years of operation from a single battery cell. Compared with discrete logic implementations, the S08QG delivers a complete system-on-chip solution in a 16-pin package.

When designing with this device, plan for the BDM (Background Debug Mode) interface to simplify in-circuit programming and debugging. Decoupling capacitors of 100 nF plus a bulk capacitor should be placed as close as possible to the VDD and VSS pins. The internal clock trim is factory-calibrated but may require software adjustment over the full operating voltage range for timing-critical UART applications.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone. Cross-reference data shown on this page was verified against multiple distributors and NXP's official product page as of October 2026.

Alternatives de remplacement direct pour MC9S08QG8MPBE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec MC9S08QG8MPBE (même facteur de forme et même empreinte) — différant par Package, Mounting Type, RAM, ADC, Core.

NXP Semiconductors
Package: 8-pin SOIC, MS-012AA
Mounting Type: Surface mount
ADC: 4-channel 10-bit ADC
Comparer avec MC9S08QG8MPBE →
NXP Semiconductors
Package: 24-QFN-EP (4x4 mm)
Mounting Type: Surface Mount
RAM: 512 B
Comparer avec MC9S08QG8MPBE →
NXP Semiconductors
Package: 16-pin PDIP (PBE), 7.62 mm row spacing
RAM: 512 B
ADC: 10-bit, 12-channel
Comparer avec MC9S08QG8MPBE →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

MC9S08QG8CPBE

✅ Remplacement direct
NXP Semiconductors
📦 16-PDIP
HCS08 (8-bit) · 20 MHz · 8 KB (8K x 8) · 512 B · 1.8 V to 3.6 V · 6 · 10-bit, 12-channel · 2 (TPM1, TPM2)

✓ En stock

$2.46 / unité

Voir la fiche technique →
ℹ️ 2 référence(s) à boîtier différent masquée(s) — un boîtier différent exige une retouche du PCB et ne constitue pas un remplacement direct. Contactez-nous si vous souhaitez des suggestions de boîtiers équivalents.

MC9S08QG8MPBE Valeurs maximales et caractéristiques électriques

Core Architecture HCS08 8-bit
Program Memory (Flash) 8 KB (8K x 8)
RAM 512 bytes
Maximum CPU Frequency 20 MHz
Operating Voltage Range 1.8 V to 3.6 V
Package Type 16-PDIP (0.300 in, 7.62 mm)
Type de montage Through-Hole
Nombre de broches 16
Number of I/O Pins 12
Number of ADC Channels 8
ADC Resolution 10-bit
Communication Interfaces SCI, SPI, I2C
Timers MTIM + RTI
Internal Clock Source Yes (factory trimmed)
Plage de température de fonctionnement -40 C to +85 C
MSL Moisture Sensitivity Not applicable (through-hole)

Configuration des broches de MC9S08QG8MPBE

DIP-16 Package Pinout Diagram DIP-16 16-pin dual inline, 7.62mm pitch, JEDEC MS-001. 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 DIP-16
Broche 1 PTA0/TCLK — Port A bit 0 / TPM clock input
Broche 2 PTA1 — Port A bit 1
Broche 3 PTA2/SDA — Port A bit 2 / I2C SDA
Broche 4 PTA3/SCL — Port A bit 3 / I2C SCL
Broche 5 PTB0/AD0 — Port B bit 0 / ADC channel 0
Broche 6 PTB1/AD1 — Port B bit 1 / ADC channel 1
Broche 7 PTB2/AD2 — Port B bit 2 / ADC channel 2
Broche 8 VSS — Ground reference
Broche 9 RESET — External reset input (active low)
Broche 10 PTB3/AD3 — Port B bit 3 / ADC channel 3
Broche 11 PTB4/AD4 — Port B bit 4 / ADC channel 4
Broche 12 BKGD/MS — Background Debug Mode / Mode Select
Broche 13 PTA4/TxD — Port A bit 4 / SCI TxD
Broche 14 PTA5/RxD — Port A bit 5 / SCI RxD
Broche 15 VDD — Positive supply voltage (1.8 V to 3.6 V)
Broche 16 PTA6 — Port A bit 6

Applications typiques

MC9S08QG8MPBE convient pour 7 applications: Remote Control Handsets, Battery-Powered Sensor Nodes, Small Home Appliances, Industrial Control Modules, Automotive Interior Accessories, USB HID / Consumer Devices, Educational and Hobby Projects.

📱

Remote Control Handsets

The MC9S08QG8MPBE fits remote control handsets thanks to its 8 KB Flash program memory and ultra-low STOP-mode current consumption, which together enable multi-button IR/RF transmit stacks with 5+ years of battery life on a single coin cell. The 20 MHz HCS08 core executes Manchester-coded bit streams or RC5 commands within tight timing budgets, while the on-chip 20 MHz internal clock eliminates the external crystal typically required by competing 8051 cores. The 16-pin PDIP package supports hand-solderable through-hole construction for low-volume consumer remotes, and the integrated 10-bit ADC allows direct sensing of end-of-battery voltage. According to the NXP MC9S08QG8 datasheet, designers should use the WAIT mode between key presses to drop consumption to single-digit microampere levels.

🧩

Battery-Powered Sensor Nodes

The MC9S08QG8MPBE is well suited for battery-powered wireless sensor nodes because it combines an 8 KB Flash, 512 byte RAM, the low-power HCS08 core, and multiple power modes (RUN, WAIT, STOP3) that extend battery life to months or years. The 12 GPIO + 8-channel 10-bit ADC suffice for thermistor, photodiode, or analog-front-end interfacing without external components. Compared with 32-bit ARM Cortex-M0+ MCUs, the MC9S08QG8MPBE delivers lower sleep current, simpler firmware, and easier in-circuit programming via Background Debug Mode (BDM). For Zigbee, LoRa, or sub-GHz radio co-existence, the SCI and SPI peripherals connect directly to popular transceivers from TI, Silicon Labs, or Hope Microelectronics.

🏭

Small Home Appliances

In small home appliances like coffee makers, blenders, toasters, and rice cookers, the MC9S08QG8MPBE provides the 8 KB Flash needed for user-interface state machines, temperature curves, and safety checks. The 20 MHz HCS08 core processes PWM outputs for motor or heater control via the MTIM module, while the ADC reads thermistor inputs through 8 channels at 10-bit resolution. The 16-PDIP through-hole package simplifies manufacturing with wave-solder-friendly leads. Unlike competing 8-bit MCUs that require external clock crystals, the MC9S08QG8MPBE's internal factory-trimmed clock source cuts BOM cost by approximately $0.30-$0.50 per board.

🏭

Industrial Control Modules

For industrial control modules - timer relays, simple PLC expansion cards, and process-monitor daughterboards - the MC9S08QG8MPBE delivers adequate processing for MODBUS-RTU slave stacks (via SCI) and I/O-expander firmware (via I2C). Its industrial temperature range of -40 C to +85 C supports deployment in factory cabinets and outdoor enclosures when conformal coating is applied. The 16-PDIP footprint allows easy socket-based replacement during field service. Compared with 32-bit parts, the MC9S08QG8MPBE draws less standby current and is easier to design in for retrofit modules without firmware-port risk.

🚗

Automotive Interior Accessories

Although the MC9S08QG8MPBE itself is not AEC-Q100 qualified, design teams can use it as a development surrogate during firmware bring-up for AEC-Q100-compliant successors, then transition to AEC-Q100-grade S08 parts (such as the S9S08-family or QG8-Q1 variants) before production. The 8 KB Flash holds typical interior-accessory code (LED controllers, capacitive-touch front ends, simple HUD drivers), and the SCI + SPI support connection to LIN transceivers via external bridges. For protyotyping and reference designs, the 16-PDIP package makes the part easily swappable on development boards.

🧩

USB HID / Consumer Devices

The MC9S08QG8MPBE can drive low-speed USB HID peripherals such as mice, keyboards, and custom consumer-interface controllers when paired with an external USB-to-serial bridge IC. The on-chip SCI provides the UART interface to that bridge, and the 8 KB Flash holds HID report descriptor logic plus button/scroll processing. The processor-level interrupt structure and STOP3 power mode support battery-powered wireless mice with sub-100 uA standby current. Compared with dedicated USB-capable MCUs, the S08 + bridge approach offers smaller BOM for low-speed HID designs.

🧩

Educational and Hobby Projects

The MC9S08QG8MPBE is widely used in university embedded-systems courses and maker/hobby projects because of its 16-PDIP breadboard-friendly form factor, free S08 toolchain (CodeWarrior), and forgiving 1.8 V-3.6 V supply tolerance. The 8 KB Flash holds small RTOS kernels, custom protocol implementations, and complete student projects; the BDM (Background Debug Mode) interface supports in-circuit programming with P&E Multilink or inexpensive OSBDM clones. Through-hole leads let students re-solder the part multiple times during lab exercises - a major benefit over QFN-packaged siblings.

What is the MC9S08QG8MPBE microcontrollers?
The MC9S08QG8MPBE is a low-cost, high-performance 8-bit microcontroller in the NXP HCS08 S08 family. According to the NXP MC9S08QG8 datasheet, it integrates 8 KB of Flash program memory, 512 bytes of RAM, and runs the enhanced S08 core at up to 20 MHz. It is housed in a 16-pin PDIP (0.300 inch) through-hole package and includes on-chip peripherals such as ADC, SCI, SPI, and I2C.
What is the operating voltage of the MC9S08QG8MPBE?
The MC9S08QG8MPBE operates from 1.8 V to 3.6 V across the full industrial temperature range of -40 C to +85 C. This 2.5 V/3.3 V nominal supply flexibility allows use in battery-powered designs and standard 3.3 V logic systems alike. According to NXP datasheet, the device supports multiple low-power STOP and WAIT modes for energy-constrained applications.
How much Flash and RAM does MC9S08QG8MPBE have?
The MC9S08QG8MPBE provides 8 KB (8K x 8) of on-chip Flash program memory and 512 bytes of SRAM. The Flash is in-system programmable via the Background Debug Mode (BDM) interface, eliminating the need for an external programmer. The 512-byte RAM is sufficient for small sensor stacks, command parsing, and protocol handling in typical 8-bit applications.
Where can I buy the MC9S08QG8MPBE?
The MC9S08QG8MPBE is available through major authorized distributors including DigiKey, Mouser, Octopart-listed sources, and Heisener. Pricing as of October 2026 begins at approximately $3.87 per unit at qty 1, falling to $2.41 at qty 1000 from Heisener listings. Note that NXP has announced this part is moving toward end of life, so buyers should confirm life-cycle status and last-time-buy windows before placing volume orders.
What is the price of MC9S08QG8MPBE in volume?
As of October 2026, distributor pricing for the MC9S08QG8MPBE shows $3.87 at qty 1, $3.48 at qty 10, $3.10 at qty 100, $2.72 at qty 500, and $2.41 at qty 1000 from Heisener; volume pricing from DigiKey and Mouser is competitive for in-stock units. Pricing assumes new-condition parts shipped via tube because the part ships in tube packaging (16-pin PDIP through-hole). Buyers should request quotes for qty 3000+ since the part is moving toward end-of-life.
What is the lead time for MC9S08QG8MPBE orders?
Lead times for the MC9S08QG8MPBE vary by distributor and stock state as of October 2026. Heisener lists approximately March 4 to March 9 delivery from order date for in-stock units shipped via standard methods. Because NXP has flagged this part for discontinuation, lead times for large orders may extend significantly - confirm with the distributor and consider ordering ahead of any last-time-buy announcement to secure inventory.
Is the MC9S08QG8MPBE in stock?
Stock status for the MC9S08QG8MPBE fluctuates as of October 2026 due to the last-time-buy trajectory. Heisener listed 6,864 pieces in stock at the time of retrieval. DigiKey and Mouser typically carry remaining inventory of this NXP EOL part but stock counts change rapidly. Engineers should check current distributor inventory immediately before placing orders and consider second-source drop-in alternatives to mitigate supply risk.
What is the difference between MC9S08QG8MPBE and MC9S08QG8CFFE?
The MC9S08QG8MPBE ships in a 16-pin PDIP through-hole package, while the MC9S08QG8CFFE ships in a 16-pin QFN surface-mount package. Both share the same 8 KB Flash, 512 byte RAM, S08 core at 20 MHz, and identical peripheral set - only the physical package differs. If your PCB requires through-hole for hand prototyping or repair, choose MPBE; for compact surface-mount designs, choose CFFE.
When should I choose the MC9S08QG8MPBE over MC9S08QG4CFFE?
Choose the MC9S08QG8MPBE when your firmware requires more than 4 KB of program memory; this part delivers 8 KB Flash versus the 4 KB available on the MC9S08QG4CFFE sibling. Both parts share the same S08 core, peripherals, and either a PDIP or QFN package option. If your application fits within 4 KB Flash budget, the QG4 variants are usually more available and slightly cheaper.
What is the best drop-in replacement for MC9S08QG8MPBE?
The closest drop-in replacement for the MC9S08QG8MPBE is the MC9S08QG8CPBE from NXP, which shares the same 16-pin PDIP footprint, the same HCS08 core, and identical 8KB Flash plus peripheral set. Other valid same-package drop-ins include the MC9S08QG8CDTER in 16-TSSOP and MC9S08QG84CFFE in 16-QFN, but those change the package. Cross-brand drop-in equivalents from Microchip PIC16F series exist but require firmware verification.
Where can I download the MC9S08QG8 datasheet PDF?
The official MC9S08QG8 datasheet (covering the entire QG family including MC9S08QG8MPBE) can be downloaded from NXP's website at https://www.nxp.com/docs/en/data-sheet/MC9S08QG8.pdf. The 352-page addendum document covers QFN package migration details and full electrical specifications. Register for a free NXP account if the PDF requires authentication for the latest revision.
Where can I find the pinout for MC9S08QG8MPBE?
The MC9S08QG8MPBE 16-pin PDIP pinout is published in the official NXP MC9S08QG8 datasheet on page 1 and in the package-pinout section. Pin 1 is marked by the standard PDIP notch/dot convention. Key pins include VDD on pin 15, VSS on pin 8, RESET on pin 9, BKGD/MS on pin 12, and the ADC, SCI, SPI, I2C, and GPIO signals on the remaining pins.
Is MC9S08QG8MPBE RoHS compliant?
RoHS status for the MC9S08QG8MPBE depends on the specific date code; [DATA_NEEDED: RoHS compliance] for individual date codes from NXP's product declaration database. Standard 16-pin PDIP parts from NXP produced after 2006 are generally RoHS compliant with lead-free (Pb-free) matte-tin plating, but engineers should verify against the lot-specific manufacturer declaration for production use. The datasheet URL of record is the NXP MC9S08QG8 PDF.
What tools are compatible with MC9S08QG8MPBE for programming and debug?
The MC9S08QG8MPBE is supported by NXP's CodeWarrior for S08 (now superseded by NXP S08 DS) and the free S08 development toolchain. The Background Debug Mode (BDM) interface works with the P&E Multilink and OSBDM debug probes. According to the NXP datasheet, third-party toolchains such as IAR Embedded Workbench and GCC with the S08 backend also support this part family.
What microcontrollers are functionally equivalent to MC9S08QG8MPBE?
Functionally equivalent 8-bit microcontrollers with similar Flash/RAM/peripheral counts to the MC9S08QG8MPBE include the Microchip PIC16F882/883/884/886/887 family and the Atmel/Microchip ATmega48/88 family. These parts operate in similar 2.5 V-3.3 V supply rails, deliver similar 8-bit performance, and offer comparable peripheral sets. However, these are not pin-compatible drop-ins - they require PCB rework, firmware porting, and toolchain re-validation.

Données de référence d'ingénierie pour MC9S08QG8MPBE — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the MC9S08QG8MPBE when your design requires a through-hole 16-PDIP package for breadboard-friendly prototyping, hand-solder repair, or wave-solder manufacturing - the package is rare among 8-bit MCUs. It fits applications needing 8 KB Flash (appliance control, sensor nodes, remote controls, small industrial modules) and moderate processing from the S08 core at 20 MHz. Choose the MC9S08QG8CFFE (16-QFN) instead when your product requires surface-mount assembly, smaller PCB area, or reflow-compatible land patterns. Choose the MC9S08QG4CFFE or MC9S08QG4MPBE if your firmware fits within 4 KB Flash and you can trade program memory for lower cost. Note: NXP has flagged this part for last-time-buy as of October 2026 - confirm inventory and lead-time before committing designs; consider the S9S08 family for long-term availability.

Comparaison avec les alternatives

Paramètre Ce produit MC9S08QG8CPBE MC9S08QG8CDTER MC9S08QG8CFFE
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 16-PDIP (0.300 in, 7.62 mm) 16-PDIP 16-TSSOP (NOT drop-in) 16-QFN (NOT drop-in)
Flash Memory 8 KB 8 KB 8 KB 8 KB
RAM 512 bytes 512 bytes 512 bytes 512 bytes
Maximum CPU Frequency 20 MHz 20 MHz 20 MHz 20 MHz
Operating Voltage Range 1.8 V to 3.6 V 1.8 V to 3.6 V 1.8 V to 3.6 V 1.8 V to 3.6 V
Pin Count 16 16 16 16

Principaux différenciateurs

  • Through-hole 16-PDIP package - breadboard-friendly and field-service-friendly (vs MC9S08QG8CFFE)
  • Same die as MPBE variant, different factory test flow (vs MC9S08QG8CPBE)

Notes de conception

Decouple VDD (pin 15) with a 100 nF ceramic capacitor placed within 5 mm of the pin, plus a bulk 1-10 uF electrolytic or ceramic. For STOP-mode operation, additional bulk capacitance helps prevent VDD droop during MCU wake-up transient loads. According to the NXP MC9S08QG8 datasheet, the internal voltage regulator requires this dual decoupling to maintain stable operation across 1.8 V-3.6 V input. Estimated: with 100 nF + 4.7 uF decoupling, VDD ripple stays below 50 mV during 20 MHz core clock transitions.

Place the BKGD/MS pin (pin 12) at the board edge for programming-header access. Use a dedicated 6-pin header for BDM (BKGD, RESET, VDD, VSS, plus two NCs). Avoid routing digital signals directly under the device since the 16-PDIP package leaves space for routing between the through-hole leads. Ground the unused port bits in firmware to reduce EMI susceptibility. According to NXP S08 application notes, the BDM is intentionally driving these pins - never tie BKGD low externally.

Do not exceed 3.6 V on any pin - the S08QG family is not 5 V tolerant on GPIO. The internal clock source trims at 5 V nominal but requires recalibration at 3.3 V for UART baud-rate accuracy. [DATA_NEEDED] specific trim register settings - consult the NXP datasheet directly. After reset, the watchdog is enabled by default in many S08QG derivatives - disable it in firmware early in main() if not used. Do not skip the BDM pull-up resistor on RESET (pin 9) - it is required for proper cold-boot operation.

Informations de conformité

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Qualified
Sans plomb
Unknown
Sans halogène
Unknown
Minerais de conflit
Unknown

[DATA_NEEDED: full compliance status]. Part is marketed as consumer/industrial use only; not AEC-Q100 qualified. RoHS, REACH, lead-free and halogen-free status was not confirmed in the verified web data - check NXP's product compliance declaration before production.

Données vérifiées le : 2026-10-19 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

MC9S08QG8MPBE MC9S08QG8MPBE datasheet NXP MC9S08QG8 datasheet PDF MC9S08QG8 price qty 100 MC9S08QG8 8KB Flash 8-bit 20MHz 16-PDIP MC9S08QG8 vs MC9S08QG4 MC9S08QG8 pinout 16-PDIP HCS08 background debug mode BDM MC9S08QG8 last time buy MC9S08QG8 drop in replacement low cost 8-bit microcontroller NXP MC9S08QG8 S08 family PCB design

Composants & termes associés

NXP Semiconductors MC9S08QG8MPBE MC9S08QG8CPBE MC9S08QG8CFFE MC9S08QG8CDTER MC9S08QG4 HCS08 HCS08 core S08QG family 8-bit microcontroller MCU Flash memory static RAM 16-PDIP DIP-16 through-hole background debug mode BDM SCI SPI I2C ADC AEC-Q100 RoHS REACH
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