MC9S08QG8MPBE - 8KB Flash 8-bit S08 MCU | NXP | 16-PDIP
MPN: MC9S08QG8MPBE ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.87 | $3.87 |
| 10 | $3.48 | $34.80 |
| 100 | $3.1 | $310.00 |
| 500 | $2.72 | $1,360.00 |
| 1,000 | $2.41 | $2,410.00 |
| 3,000 | $2.18 | $6,540.00 |
MC9S08QG8MPBE Overview
An 8-bit MCU (microcontroller unit) is a single-chip computer that integrates a CPU, program memory, data memory, and peripherals on one silicon die. The HCS08 core represents NXP's enhanced 8-bit CPU architecture, which evolved from the legacy HC08 instruction set while adding improvements such as a hardware multiply, BGND instruction for background debug mode, and lower power modes. The S08QG family belongs to the broader category of low-power 8-bit microcontrollers, sitting below 32-bit ARM Cortex-M parts in performance but offering better cost, simpler toolchains, and ultra-low standby current for battery-powered designs.
Key features of the MC9S08QG8MPBE include 8KB of Flash program memory, 512 bytes of RAM, an internal clock generator, multiple low-power modes (STOP, WAIT, plus run), an analog-to-digital converter (ADC), timers, a serial communications interface (SCI), a serial peripheral interface (SPI), and an inter-integrated circuit (I2C) bus. The integrated 20 MHz internal clock source eliminates the need for an external crystal in most designs, reducing BOM cost and board area.
Typical applications include low-cost consumer electronics, remote controls, small home appliances, sensor interface boards, battery-powered equipment, and industrial control modules. The wide operating voltage range and multiple stop modes allow the device to deliver years of operation from a single battery cell. Compared with discrete logic implementations, the S08QG delivers a complete system-on-chip solution in a 16-pin package.
When designing with this device, plan for the BDM (Background Debug Mode) interface to simplify in-circuit programming and debugging. Decoupling capacitors of 100 nF plus a bulk capacitor should be placed as close as possible to the VDD and VSS pins. The internal clock trim is factory-calibrated but may require software adjustment over the full operating voltage range for timing-critical UART applications.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone. Cross-reference data shown on this page was verified against multiple distributors and NXP's official product page as of October 2026.
Drop-in alternatives for MC9S08QG8MPBE — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MC9S08QG8MPBE (same form factor and footprint) — differing in Package, Mounting Type, RAM, ADC, Core.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MC9S08QG8CPBE
✅ Drop-In✓ In Stock
$2.46 / Unit
View Datasheet →MC9S08QG8MPBE Maximum Ratings & Electrical Characteristics
| Core Architecture | HCS08 8-bit |
| Program Memory (Flash) | 8 KB (8K x 8) |
| RAM | 512 bytes |
| Maximum CPU Frequency | 20 MHz |
| Operating Voltage Range | 1.8 V to 3.6 V |
| Package Type | 16-PDIP (0.300 in, 7.62 mm) |
| Mounting Type | Through-Hole |
| Pin Count | 16 |
| Number of I/O Pins | 12 |
| Number of ADC Channels | 8 |
| ADC Resolution | 10-bit |
| Communication Interfaces | SCI, SPI, I2C |
| Timers | MTIM + RTI |
| Internal Clock Source | Yes (factory trimmed) |
| Operating Temperature Range | -40 C to +85 C |
| MSL Moisture Sensitivity | Not applicable (through-hole) |
MC9S08QG8MPBE Pin Configuration
| Pin 1 | PTA0/TCLK — Port A bit 0 / TPM clock input |
| Pin 2 | PTA1 — Port A bit 1 |
| Pin 3 | PTA2/SDA — Port A bit 2 / I2C SDA |
| Pin 4 | PTA3/SCL — Port A bit 3 / I2C SCL |
| Pin 5 | PTB0/AD0 — Port B bit 0 / ADC channel 0 |
| Pin 6 | PTB1/AD1 — Port B bit 1 / ADC channel 1 |
| Pin 7 | PTB2/AD2 — Port B bit 2 / ADC channel 2 |
| Pin 8 | VSS — Ground reference |
| Pin 9 | RESET — External reset input (active low) |
| Pin 10 | PTB3/AD3 — Port B bit 3 / ADC channel 3 |
| Pin 11 | PTB4/AD4 — Port B bit 4 / ADC channel 4 |
| Pin 12 | BKGD/MS — Background Debug Mode / Mode Select |
| Pin 13 | PTA4/TxD — Port A bit 4 / SCI TxD |
| Pin 14 | PTA5/RxD — Port A bit 5 / SCI RxD |
| Pin 15 | VDD — Positive supply voltage (1.8 V to 3.6 V) |
| Pin 16 | PTA6 — Port A bit 6 |
Typical Applications
MC9S08QG8MPBE is suitable for 7 applications: Remote Control Handsets, Battery-Powered Sensor Nodes, Small Home Appliances, Industrial Control Modules, Automotive Interior Accessories, USB HID / Consumer Devices, Educational and Hobby Projects.
Remote Control Handsets
The MC9S08QG8MPBE fits remote control handsets thanks to its 8 KB Flash program memory and ultra-low STOP-mode current consumption, which together enable multi-button IR/RF transmit stacks with 5+ years of battery life on a single coin cell. The 20 MHz HCS08 core executes Manchester-coded bit streams or RC5 commands within tight timing budgets, while the on-chip 20 MHz internal clock eliminates the external crystal typically required by competing 8051 cores. The 16-pin PDIP package supports hand-solderable through-hole construction for low-volume consumer remotes, and the integrated 10-bit ADC allows direct sensing of end-of-battery voltage. According to the NXP MC9S08QG8 datasheet, designers should use the WAIT mode between key presses to drop consumption to single-digit microampere levels.
Recommended
Battery-Powered Sensor Nodes
The MC9S08QG8MPBE is well suited for battery-powered wireless sensor nodes because it combines an 8 KB Flash, 512 byte RAM, the low-power HCS08 core, and multiple power modes (RUN, WAIT, STOP3) that extend battery life to months or years. The 12 GPIO + 8-channel 10-bit ADC suffice for thermistor, photodiode, or analog-front-end interfacing without external components. Compared with 32-bit ARM Cortex-M0+ MCUs, the MC9S08QG8MPBE delivers lower sleep current, simpler firmware, and easier in-circuit programming via Background Debug Mode (BDM). For Zigbee, LoRa, or sub-GHz radio co-existence, the SCI and SPI peripherals connect directly to popular transceivers from TI, Silicon Labs, or Hope Microelectronics.
Recommended
Small Home Appliances
In small home appliances like coffee makers, blenders, toasters, and rice cookers, the MC9S08QG8MPBE provides the 8 KB Flash needed for user-interface state machines, temperature curves, and safety checks. The 20 MHz HCS08 core processes PWM outputs for motor or heater control via the MTIM module, while the ADC reads thermistor inputs through 8 channels at 10-bit resolution. The 16-PDIP through-hole package simplifies manufacturing with wave-solder-friendly leads. Unlike competing 8-bit MCUs that require external clock crystals, the MC9S08QG8MPBE's internal factory-trimmed clock source cuts BOM cost by approximately $0.30-$0.50 per board.
Recommended
Industrial Control Modules
For industrial control modules - timer relays, simple PLC expansion cards, and process-monitor daughterboards - the MC9S08QG8MPBE delivers adequate processing for MODBUS-RTU slave stacks (via SCI) and I/O-expander firmware (via I2C). Its industrial temperature range of -40 C to +85 C supports deployment in factory cabinets and outdoor enclosures when conformal coating is applied. The 16-PDIP footprint allows easy socket-based replacement during field service. Compared with 32-bit parts, the MC9S08QG8MPBE draws less standby current and is easier to design in for retrofit modules without firmware-port risk.
Recommended
Automotive Interior Accessories
Although the MC9S08QG8MPBE itself is not AEC-Q100 qualified, design teams can use it as a development surrogate during firmware bring-up for AEC-Q100-compliant successors, then transition to AEC-Q100-grade S08 parts (such as the S9S08-family or QG8-Q1 variants) before production. The 8 KB Flash holds typical interior-accessory code (LED controllers, capacitive-touch front ends, simple HUD drivers), and the SCI + SPI support connection to LIN transceivers via external bridges. For protyotyping and reference designs, the 16-PDIP package makes the part easily swappable on development boards.
Recommended
USB HID / Consumer Devices
The MC9S08QG8MPBE can drive low-speed USB HID peripherals such as mice, keyboards, and custom consumer-interface controllers when paired with an external USB-to-serial bridge IC. The on-chip SCI provides the UART interface to that bridge, and the 8 KB Flash holds HID report descriptor logic plus button/scroll processing. The processor-level interrupt structure and STOP3 power mode support battery-powered wireless mice with sub-100 uA standby current. Compared with dedicated USB-capable MCUs, the S08 + bridge approach offers smaller BOM for low-speed HID designs.
Recommended
Educational and Hobby Projects
The MC9S08QG8MPBE is widely used in university embedded-systems courses and maker/hobby projects because of its 16-PDIP breadboard-friendly form factor, free S08 toolchain (CodeWarrior), and forgiving 1.8 V-3.6 V supply tolerance. The 8 KB Flash holds small RTOS kernels, custom protocol implementations, and complete student projects; the BDM (Background Debug Mode) interface supports in-circuit programming with P&E Multilink or inexpensive OSBDM clones. Through-hole leads let students re-solder the part multiple times during lab exercises - a major benefit over QFN-packaged siblings.
Recommended
Recommended Products Summary
Engineering reference data for MC9S08QG8MPBE — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC9S08QG8CPBE | MC9S08QG8CDTER | MC9S08QG8CFFE |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 16-PDIP (0.300 in, 7.62 mm) | 16-PDIP | 16-TSSOP (NOT drop-in) | 16-QFN (NOT drop-in) |
| Flash Memory | 8 KB | 8 KB | 8 KB | 8 KB |
| RAM | 512 bytes | 512 bytes | 512 bytes | 512 bytes |
| Maximum CPU Frequency | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
| Operating Voltage Range | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| Pin Count | 16 | 16 | 16 | 16 |
Key Differentiators
- Through-hole 16-PDIP package - breadboard-friendly and field-service-friendly (vs MC9S08QG8CFFE)
- Same die as MPBE variant, different factory test flow (vs MC9S08QG8CPBE)
Design Notes
Decouple VDD (pin 15) with a 100 nF ceramic capacitor placed within 5 mm of the pin, plus a bulk 1-10 uF electrolytic or ceramic. For STOP-mode operation, additional bulk capacitance helps prevent VDD droop during MCU wake-up transient loads. According to the NXP MC9S08QG8 datasheet, the internal voltage regulator requires this dual decoupling to maintain stable operation across 1.8 V-3.6 V input. Estimated: with 100 nF + 4.7 uF decoupling, VDD ripple stays below 50 mV during 20 MHz core clock transitions.
Place the BKGD/MS pin (pin 12) at the board edge for programming-header access. Use a dedicated 6-pin header for BDM (BKGD, RESET, VDD, VSS, plus two NCs). Avoid routing digital signals directly under the device since the 16-PDIP package leaves space for routing between the through-hole leads. Ground the unused port bits in firmware to reduce EMI susceptibility. According to NXP S08 application notes, the BDM is intentionally driving these pins - never tie BKGD low externally.
Do not exceed 3.6 V on any pin - the S08QG family is not 5 V tolerant on GPIO. The internal clock source trims at 5 V nominal but requires recalibration at 3.3 V for UART baud-rate accuracy. [DATA_NEEDED] specific trim register settings - consult the NXP datasheet directly. After reset, the watchdog is enabled by default in many S08QG derivatives - disable it in firmware early in main() if not used. Do not skip the BDM pull-up resistor on RESET (pin 9) - it is required for proper cold-boot operation.
Compliance Information
[DATA_NEEDED: full compliance status]. Part is marketed as consumer/industrial use only; not AEC-Q100 qualified. RoHS, REACH, lead-free and halogen-free status was not confirmed in the verified web data - check NXP's product compliance declaration before production.
