MC9S12A256CFUE - 16-bit 25MHz 256KB Flash MCU | NXP
Référence : MC9S12A256CFUE ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $50.86 | $50,86 |
| 10 | $50.1 | $501,00 |
| 100 | $49.2 | $4 920,00 |
| 500 | $48.4 | $24 200,00 |
| 1 000 | $47.08 | $47 080,00 |
MC9S12A256CFUE Présentation
An HCS12 MCU is a member of the 16-bit microcontroller family: microcontroller -> embedded processor -> semiconductor. The HCS12 (S12) architecture evolved from the Freescale (formerly Motorola) HC12 and 68HC11 lineages, providing full 16-bit data paths with a CISC instruction set that eases migration from legacy 8-bit designs. According to NXP's product page, the S12A family integrates a system integration module (SIM) that manages system resource mapping, clock generation, interrupt control, and bus interfacing.
Key features include 256 KB of Flash program memory for demanding application code, 25 MHz bus operation for real-time control, and a rich peripheral set typical of the S12A family: asynchronous serial interfaces (SCI), serial peripheral interface (SPI), an 8-channel 10-bit ADC, timer/PWM modules, and a CAN 2.0A/B controller for automotive networking. The 80-QFP 14x14 mm footprint supports hand assembly and automated reflow, and the wide industrial temperature range suits harsh environments.
Architecturally, the HCS12 CPU executes variable-length instructions with indexed addressing and background debug mode (BDM) via a single-wire interface, simplifying in-system flash programming and field diagnostics. The phase-locked loop (PLL) clock generator allows the bus frequency to be tuned from a low-cost crystal while minimizing EMI.
Typical applications include automotive body and comfort modules (door control, seat control, lighting), industrial control panels, HVAC controllers, motor control interfaces, and instrumentation requiring CAN connectivity.
Design consideration: the device is NRND (Not Recommended for New Designs) per NXP, so new designs should evaluate the pin-compatible S12G or S12P families, or use this part only for sustaining existing production.
This page synthesizes distributor pricing, same-family drop-in alternatives, lifecycle status, and practical design guidance not found in a single manufacturer datasheet.
Alternatives de remplacement direct pour MC9S12A256CFUE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12A256CFUE (même facteur de forme et même empreinte) — différant par Package, Core, Supply Voltage, Operating Temperature, ADC.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12A256BCFU
✅ Remplacement direct✓ En stock
$18.2 / unité
Voir la fiche technique →MC9S12A512CFU
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC9S12A128CFUE
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC9S12A256CFV
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC9S12A256MFUE
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC9S12A256CFUE Valeurs maximales et caractéristiques électriques
| Core Architecture | HCS12 16-bit CISC |
| Bus Frequency | 25 MHz |
| Flash Memory | 256 KB (256K x 8) |
| Tension d'alimentation | 2.5 V / 5 V (per Arrow listing) |
| Boîtier | 80-QFP (14x14 mm) |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +85C |
| Application Segment | Automotive (per Arrow listing) |
| Core Series | S12A (Barracuda, MOS13 per Mouser) |
| ADC Resolution | 10-bit |
| Largeur du bus de données | 16-bit |
| Programming Interface | BDM (Background Debug Mode) |
Guide de configuration des broches du MC9S12A256CFUE 80-qfp (14x14 mm)
Configuration des broches du MC9S12A256CFUE (boîtier 80-qfp (14x14 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MC9S12A256CFUE.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MC9S12A256CFUE convient pour 6 applications: Automotive Body Control Modules, Industrial Control Panels and PLC I/O, HVAC and Building Automation Controllers, DC Motor Control and Actuator Drivers, Instrumentation and Test Equipment, Agricultural and Off-Highway Vehicle Electronics.
Automotive Body Control Modules
The MC9S12A256CFUE fits automotive body control modules (BCMs) because its 25 MHz HCS12 core, 256 KB Flash, and integrated CAN 2.0 controller cover the classic requirements of door, seat, lighting, and keyless-entry electronics. The 10-bit ADC reads switch matrices, potentiometer position sensors, and thermistor inputs, while PWM timer channels drive lamp loads, relays, and DC motor drivers directly. Its -40C to +85C operating range matches under-dash and engine-bay-adjacent environments, and the Arrow listing explicitly identifies this part as automotive segment. In a BCM, the MCU typically polls LIN or CAN network frames, executes load diagnostics (open-load and short-circuit detection via the ADC), and manages sleep/wake states to meet quiescent-current budgets. Because the part is NRND, use it for sustaining existing module production rather than new automotive platforms.
Recommandé
Industrial Control Panels and PLC I/O
In industrial control panels, the MC9S12A256CFUE serves as a main controller or intelligent I/O node where 16-bit arithmetic, 256 KB of program Flash, and multiple serial interfaces simplify sequencing, interlock logic, and MODBUS-style protocols over SCI or SPI. The 25 MHz bus executes real-time loop control comfortably, and the 10-bit ADC digitizes 4-20 mA current-loop signals or potentiometer setpoints after external conditioning. The 80-QFP 14x14 mm package is large enough for reliable rework in low-volume panel building, an advantage over fine-pitch BGAs. The BDM interface allows field firmware updates with a simple debug connector. Designers should note the 5 V I/O rails integrate naturally with legacy industrial 5 V logic and opto-isolator front ends, reducing level-shifting circuitry compared with 3.3 V MCUs.
Recommandé
HVAC and Building Automation Controllers
Building automation and HVAC controllers benefit from the MC9S12A256CFUE's combination of on-chip Flash, CAN/SCI communication, and PWM outputs for damper motors, valve actuators, and multi-speed fan control. The 256 KB Flash accommodates scheduling algorithms, PID control loops, and a communication protocol stack (for example BACnet-over-CAN or proprietary RS-485 framing on the SCI) with room for data logging in the external EEPROM or Flash headroom. The 10-bit ADC reads NTC thermistors, humidity sensors, and pressure transducers, while timer channels generate servo-compatible pulse trains for zone dampers. Its -40C to +85C rating suits rooftop units and mechanical rooms. The single-wire BDM port enables factory programming and service-tool diagnostics on the production line and in the field, shortening commissioning time.
Recommandé
DC Motor Control and Actuator Drivers
The MC9S12A256CFUE is well suited to brushed-DC and stepper motor control nodes because the S12A timer module provides multiple PWM channels with programmable period and duty resolution, sufficient for closed-loop current and speed control at 25 MHz bus rates. The 10-bit ADC samples shunt-resistor current feedback and back-EMF for sensorless estimation, and the 16-bit core executes PI loops with cycle-level determinism unencumbered by cache effects. The 5 V I/O drives gate-driver inputs directly, and the automotive rating fits power-window, seat-adjust, and pump actuators. Firmware including commutation tables, ramp profiles, and fault handling fits comfortably in 256 KB Flash. Designers should allocate timer channels carefully and verify PWM frequency versus ADC conversion time in the NXP reference manual for the specific die revision.
Recommandé
Instrumentation and Test Equipment
Bench and portable instrumentation uses the MC9S12A256CFUE as a front-panel and acquisition controller: the SCI connects to a PC or display module, SPI clocks external high-precision ADCs, and the on-chip 10-bit ADC handles fast auxiliary channels. The 256 KB Flash holds a command interpreter, calibration tables, and scaling routines, while the 16-bit core performs fixed-point math for unit conversion without floating-point coprocessor overhead. The 80-QFP footprint with generous 0.5 mm-class lead pitch permits hand soldering and probing, valuable in instrument prototypes and service. BDM debugging shortens firmware iteration. For measurement channels demanding better than 10-bit resolution, pair the MCU with an external precision converter on the SPI bus; the on-chip ADC then covers housekeeping signals such as supply and temperature monitoring.
Recommandé
Agricultural and Off-Highway Vehicle Electronics
Off-highway and agricultural equipment controllers mirror automotive body modules: the MC9S12A256CFUE's CAN controller joins implement buses, its PWM and GPIO channels drive valve solenoids, lamps, and hydraulic actuators, and the 10-bit ADC reads lever positions, pressure sensors, and speed pickups. The -40C to +85C range and 5 V noise-tolerant I/O withstand engine-bay and harness transients typical of tractors, harvesters, and construction machines, while 256 KB Flash stores rate-control logic and fault logging. The 25 MHz bus leaves margin for diagnostic scheduling alongside real-time control. Because legacy equipment platforms frequently standardized on the S12 family, this part sustains service parts for existing fleets; new off-highway platforms should instead start from NXP's currently recommended S12G devices to avoid inheriting NRND lifecycle risk.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12A256CFUE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12A256BCFU | MC9S12A512CFU | MC9S12A128CFUE | MC9S12A256CFV |
|---|---|---|---|---|---|
| Package | 80-QFP (14x14 mm) | 80-QFP (14x14 mm) - same | 80-QFP - same footprint | 80-QFP - same footprint | 80-QFP - same footprint |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | HCS12 16-bit CISC | HCS12 16-bit CISC | HCS12 16-bit CISC | HCS12 16-bit CISC | HCS12 16-bit CISC |
| Bus Frequency | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Flash Memory | 256 KB | 256 KB | 512 KB | 128 KB | 256 KB |
| Lifecycle Status | NRND | NRND (verify current status) | NRND (verify current status) | NRND (verify current status) | NRND (verify current status) |
| ADC Resolution | 10-bit | 10-bit | 10-bit | 10-bit | 10-bit |
Principaux différenciateurs
- Double the Flash of the smaller family variant (vs MC9S12A128CFUE)
- Cost-optimized versus the memory-upgrade part (vs MC9S12A512CFU)
- Fresh die revision versus the B-stepping variant (vs MC9S12A256BCFU)
Notes de conception
The MC9S12A256CFUE is NRND per the official NXP product page. Do not start new designs with this part: plan migration to the S12G or S12P families for new platforms, or secure a last-time-buy quantity for sustaining existing products. Open-market stock (22,956 pieces listed by Heisener as of 2026-10-18) is finite and NRND parts attract counterfeit risk, so purchase only from authorized distributors or traceable-lot brokers with incoming inspection.
The S12A family runs from a 5 V rail per the Arrow listing (2.5 V/5 V options); decouple VDDX/VSS pairs with 100 nF ceramic capacitors placed within a few millimeters of each supply pin pair, plus bulk 10 uF near the regulator output. Follow the power-up sequencing and BDM-connect constraints in the NXP reference manual to avoid placing the MCU into an unintended security state on first flash programming.
The 80-QFP 14x14 mm footprint needs about 18x18 mm of board area including fan-out. Use 0.5 mm-pitch-standard QFP land patterns per IPC-7351 conventions, place the PLL loop filter components close to the XFC pins exactly as the reference-manual circuit shows, and keep the crystal traces short and guarded. Reserve the BDM connector (6-pin or 10-pin footprint) on production boards for in-system flash programming and field diagnostics - retrofitting debug access later is painful.
When the PLL is configured for the full 25 MHz bus, route clock-dependent outputs (PWM, timer, SPI SCK) away from the analog front end of the 10-bit ADC; ground-guard the ADC reference input and use a quiet, filtered VDDA/VSSA supply. In CAN networks, match the transceiver (for example a 5 V TJA1050-class part) to the 5 V MCU I/O and terminate the bus at both ends with 120 ohm.
Informations de conformité
NXP product page lists Environmental Quality documentation for this part; specific RoHS/REACH status should be confirmed from the NXP environmental compliance page. The 'E' temperature/suffix convention in HCS12 ordering codes commonly indicates lead-free/RoHS-compliant packaging, but this must be verified against the official NXP datasheet rather than assumed.