MC9S12A256MPVE - 16-bit HCS12 MCU, 256KB Flash, 25MHz | NXP
Référence : MC9S12A256MPVE ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.8 | $1 380,00 |
| 500 | $11.45 | $5 725,00 |
| 1 000 | $9.95 | $9 950,00 |
MC9S12A256MPVE Présentation
A microcontroller (MCU) is an integrated circuit containing a processor, memory (Flash for program storage and RAM for working storage), and programmable I/O peripherals on a single die. MCUs sit in the system hierarchy as: microcontroller -> embedded processor -> semiconductor IC. The HCS12 architecture is a 16-bit CISC core widely deployed in body, chassis, and powertrain ECUs, offering deterministic interrupt behaviour and a memory-mapped peripheral set that simplifies long-lifecycle automotive designs.
Key features include 256 KB of on-chip Flash for program storage, 12 KB of RAM for working data, up to 91 general-purpose I/O pins for external interfacing, and a 25 MHz bus clock for instruction throughput. Integrated peripherals typically include multiple PWM channels, timers (ECT/PWM/TIM), SCI and SPI communication blocks, a 10-bit or 12-bit ADC, and a CAN 2.0 controller, supporting a wide range of automotive and industrial sensor and actuator interfaces. The 112-LQFP package provides ample pin count for full external bus and peripheral breakout.
The HCS12 core uses a 16-bit data path with a programmable 8-bit or 16-bit external bus interface, allowing both 8-bit and 16-bit memory expansion. The integrated system integration module (SIM) handles clock generation, interrupt arbitration, and chip-select decoding, reducing external logic and BOM cost. The 112-LQFP (20x20 mm) surface-mount package offers reliable PCB manufacturability.
A representative application is automotive body control modules where the HCS12's CAN bus, PWM, and ADC peripherals interface directly with sensors and actuators. Another common use is industrial PLC I/O expansion, where the large I/O count and CAN/SPI peripherals enable distributed I/O nodes. Powertrain and chassis ECUs historically adopted this family for its deterministic interrupt latency.
When designing with this device, consider migrating to the S12X or S12XE family for new designs, since the part is NXP listed as NRND. Existing programs using the HCS12 should plan PCN-driven migration to the S912XEQ512 or similar newer variants sharing the same 112-LQFP footprint.
Alternatives de remplacement direct pour MC9S12A256MPVE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12A256MPVE (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Core Processor, Supply Voltage, Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12A512CPVE
✅ Remplacement direct✓ En stock
$10.45 / unité
Voir la fiche technique →MC9S12A256CFUE
✅ Remplacement direct✓ En stock
$47.08 / unité
Voir la fiche technique →MC9S12E256CFUE
✅ Remplacement direct✓ En stock
$9.75 / unité
Voir la fiche technique →MC9S12E256VPVE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12DT128MPVE
✅ Remplacement direct✓ En stock
$36.5 / unité
Voir la fiche technique →MC9S12DG128MPV
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →MC9S12A64CPVE
✅ Remplacement direct✓ En stock
$32.6 / unité
Voir la fiche technique →S912XET512J2VAGR
✅ Remplacement direct✓ En stock
$1 / unité
Voir la fiche technique →MC9S12A256MPVE Valeurs maximales et caractéristiques électriques
| Product Type | Microcontroller (MCU) |
| Core | HCS12 (16-bit) |
| Family | BARRACUDA4 / S12A |
| Fréquence d'horloge maximale | 25 MHz |
| Program Memory (Flash) | 256 KB (256K x 8) |
| RAM Size | 12 KB (12K x 8) |
| Number of I/O Pins | 91 |
| Boîtier | 112-LQFP (20x20 mm) |
| Type de montage | Surface Mount |
| Plage de température de fonctionnement | -40 C to +125 C (TA) |
| External Bus Width | 8/16-bit (programmable narrow mode) |
| Peripherals | PWM, ECT, ADC, SCI, SPI, CAN 2.0 |
Configuration des broches de MC9S12A256MPVE
| Broche 1 | PAD — Voltage reference / ETPU channel |
| Broche 2 | PAD — General-purpose I/O |
| Broche 3 | PAD — General-purpose I/O |
| Broche 4 | VDDR — Voltage regulator output (internal 2.5V) |
| Broche 5 | VDD — Digital supply voltage |
| Broche 6 | VSS — Digital ground |
| Broche 7 | VDDX — I/O supply voltage |
| Broche 8 | VSSX — I/O ground |
| Broche 9 | RESET — Active-low external reset input |
| Broche 10 | XCLKS — Crystal oscillator select / mode |
| Broche 11 | EXTAL — External clock / crystal input |
| Broche 12 | XTAL — Crystal output |
| Broche 13 | TEST — Test mode pin (must be tied high or left open per datasheet) |
| Broche 14 | BKGD — Background Debug Mode pin |
| Broche 15 | PAD — General-purpose I/O |
| Broche 16 | PAD — General-purpose I/O |
| Broche 17 | PAD — General-purpose I/O |
| Broche 18 | PAD — General-purpose I/O |
| Broche 19 | PAD — General-purpose I/O |
| Broche 20 | PAD — General-purpose I/O |
| Broche 21 | PAD — General-purpose I/O |
| Broche 22 | PAD — General-purpose I/O |
| Broche 23 | PAD — General-purpose I/O |
| Broche 24 | PAD — General-purpose I/O |
| Broche 25 | PAD — General-purpose I/O |
| Broche 26 | PAD — General-purpose I/O |
| Broche 27 | PAD — General-purpose I/O |
| Broche 28 | PAD — General-purpose I/O |
| Broche 29 | PAD — General-purpose I/O |
| Broche 30 | PAD — General-purpose I/O |
| Broche 31 | PAD — General-purpose I/O |
| Broche 32 | PAD — General-purpose I/O |
| Broche 33 | PAD — General-purpose I/O |
| Broche 34 | PAD — General-purpose I/O |
| Broche 35 | PAD — General-purpose I/O |
| Broche 36 | PAD — General-purpose I/O |
| Broche 37 | PAD — General-purpose I/O |
| Broche 38 | PAD — General-purpose I/O |
| Broche 39 | PAD — General-purpose I/O |
| Broche 40 | PAD — General-purpose I/O |
| Broche 41 | PAD — General-purpose I/O |
| Broche 42 | PAD — General-purpose I/O |
| Broche 43 | PAD — General-purpose I/O |
| Broche 44 | PAD — General-purpose I/O |
| Broche 45 | PAD — General-purpose I/O |
| Broche 46 | PAD — General-purpose I/O |
| Broche 47 | PAD — General-purpose I/O |
| Broche 48 | PAD — General-purpose I/O |
| Broche 49 | PAD — General-purpose I/O |
| Broche 50 | PAD — General-purpose I/O |
| Broche 51 | PAD — General-purpose I/O |
| Broche 52 | PAD — General-purpose I/O |
| Broche 53 | PAD — General-purpose I/O |
| Broche 54 | PAD — General-purpose I/O |
| Broche 55 | PAD — General-purpose I/O |
| Broche 56 | PAD — General-purpose I/O |
| Broche 57 | PAD — General-purpose I/O |
| Broche 58 | PAD — General-purpose I/O |
| Broche 59 | PAD — General-purpose I/O |
| Broche 60 | PAD — General-purpose I/O |
| Broche 61 | PAD — General-purpose I/O |
| Broche 62 | PAD — General-purpose I/O |
| Broche 63 | PAD — General-purpose I/O |
| Broche 64 | PAD — General-purpose I/O |
| Broche 65 | PAD — General-purpose I/O |
| Broche 66 | PAD — General-purpose I/O |
| Broche 67 | PAD — General-purpose I/O |
| Broche 68 | PAD — General-purpose I/O |
| Broche 69 | PAD — General-purpose I/O |
| Broche 70 | PAD — General-purpose I/O |
| Broche 71 | PAD — General-purpose I/O |
| Broche 72 | PAD — General-purpose I/O |
| Broche 73 | PAD — General-purpose I/O |
| Broche 74 | PAD — General-purpose I/O |
| Broche 75 | PAD — General-purpose I/O |
| Broche 76 | PAD — General-purpose I/O |
| Broche 77 | PAD — General-purpose I/O |
| Broche 78 | PAD — General-purpose I/O |
| Broche 79 | PAD — General-purpose I/O |
| Broche 80 | PAD — General-purpose I/O |
| Broche 81 | PAD — General-purpose I/O |
| Broche 82 | PAD — General-purpose I/O |
| Broche 83 | PAD — General-purpose I/O |
| Broche 84 | PAD — General-purpose I/O |
| Broche 85 | PAD — General-purpose I/O |
| Broche 86 | PAD — General-purpose I/O |
| Broche 87 | PAD — General-purpose I/O |
| Broche 88 | PAD — General-purpose I/O |
| Broche 89 | PAD — General-purpose I/O |
| Broche 90 | PAD — General-purpose I/O |
| Broche 91 | PAD — General-purpose I/O |
| Broche 92 | PAD — General-purpose I/O |
| Broche 93 | PAD — General-purpose I/O |
| Broche 94 | PAD — General-purpose I/O |
| Broche 95 | PAD — General-purpose I/O |
| Broche 96 | PAD — General-purpose I/O |
| Broche 97 | PAD — General-purpose I/O |
| Broche 98 | PAD — General-purpose I/O |
| Broche 99 | PAD — General-purpose I/O |
| Broche 100 | PAD — General-purpose I/O |
| Broche 101 | PAD — General-purpose I/O |
| Broche 102 | PAD — General-purpose I/O |
| Broche 103 | VDDA — ADC supply voltage |
| Broche 104 | VSSA — ADC ground |
| Broche 105 | VRH — ADC high reference voltage |
| Broche 106 | VRL — ADC low reference voltage |
| Broche 107 | PAD — General-purpose I/O |
| Broche 108 | PAD — General-purpose I/O |
| Broche 109 | PAD — General-purpose I/O |
| Broche 110 | PAD — General-purpose I/O |
| Broche 111 | PAD — General-purpose I/O |
| Broche 112 | PAD — General-purpose I/O |
Applications typiques
MC9S12A256MPVE convient pour 7 applications: Automotive Body Control Module, Industrial PLC I/O Expansion Module, Powertrain Sensor Interface ECU, Chassis Control ECU (ABS/ESC precursor platforms), Industrial Motor Drive Front-End Controller, Automotive Instrument Cluster Controller, HVAC Climate Control Module.
Automotive Body Control Module
The MC9S12A256MPVE's 25 MHz HCS12 core, 91 I/O pins, and integrated CAN 2.0, PWM, ADC, SCI, and SPI peripherals make it a strong fit for body control modules (BCMs) that drive lighting, door locks, mirrors, and wiper motors. With 256 KB Flash it accommodates BCM firmware including diagnostic lighting stacks (UDS/KWP2000), and the 12 KB RAM is sufficient for CAN message buffering and ECU state machines. The -40 C to +125 C operating range covers under-hood temperature swings. Pin count is critical here: the BCM must interface with multiple LIN/CAN transceivers, switch inputs, PWM-driven loads, and analog sensors simultaneously, and the 112-LQFP's 91 I/O lines provide that connectivity without external muxing.
Recommandé
Industrial PLC I/O Expansion Module
For distributed PLC I/O nodes, the MC9S12A256MPVE delivers the deterministic interrupt latency and rich PWM/timer set that industrial expansion requires. Its 25 MHz HCS12 core, 91 I/O lines, and CAN 2.0 + SCI peripherals support fieldbus backhaul (CANopen / DeviceNet) and analog/digital I/O channels. The 256 KB Flash stores protocol stacks plus application logic, while 12 KB RAM handles cyclic scan buffers. The 112-LQFP provides the pin density needed to expose ADC inputs (typically 16+ analog channels), digital I/O banks, and dedicated peripheral pins without external I/O expanders, and the Part supports the wide -40 C to +125 C temperature range demanded by industrial cabinets.
Recommandé
Powertrain Sensor Interface ECU
The MC9S12A256MPVE's ADC and PWM peripherals paired with 256 KB Flash suit engine and transmission sensor interface ECUs where analog sensor signal conditioning and actuator PWM drive are co-located. Its 25 MHz HCS12 core handles sensor linearization math and CAN message assembly, while 91 I/O pins accommodate multi-channel pressure/temperature/position sensor inputs and solenoid drive outputs. The Part's -40 C to +125 C operating range meets powertrain thermal requirements, and its deterministic 16-bit instruction cycle supports tight control-loop timing critical for emission and fuel-efficiency strategies. The 112-LQFP provides the pin breakout needed for mixed analog/digital sensor wiring at the ECU harness.
Recommandé
Chassis Control ECU (ABS/ESC precursor platforms)
The MC9S12A256MPVE was widely deployed in chassis control platforms where deterministic interrupt handling, wheel-speed sensor inputs, and CAN networking converge. Its ECT (Enhanced Capture Timer) and PWM peripherals handle wheel-speed pulse timing and solenoid valve drive, while 256 KB Flash accommodates vehicle dynamics firmware. The 25 MHz HCS12 provides sufficient throughput for chassis control sample rates, and 12 KB RAM supports wheel-state snapshot buffers. The 112-LQFP exposes 91 I/O lines for sensor wiring harnesses; the Part's -40 C to +125 C rating supports chassis-mounted ECU environments where temperature swing is wide and vibration is present.
Recommandé
Industrial Motor Drive Front-End Controller
For low-power industrial motor drives (pumps, fans, conveyors), the MC9S12A256MPVE provides PWM generation, ADC feedback sampling, and CAN/SCI host communication in one device. Its HCS12 core runs field-oriented control (FOC) loops for small BLDC and stepper motors at acceptable bandwidths, while 256 KB Flash stores application firmware plus fault-handling routines. The 91 I/O pins handle three-phase PWM, current-sense ADC inputs, encoder feedback, and host comms simultaneously, and the -40 C to +125 C temperature range supports motor cabinet thermal environments. The 112-LQFP simplifies PCB layout by providing single-chip integration that replaces external DSP+FPGA combinations for low-end drives.
Recommandé
Automotive Instrument Cluster Controller
The MC9S12A256MPVE can drive instrument cluster functions including gauge stepper control, LCD segment driving, CAN message parsing, and switch input handling. Its 256 KB Flash stores gauge calibration and CAN database (dbcoded) message handlers, and its 12 KB RAM buffers incoming CAN frames for cluster animation timing. The 25 MHz core is fast enough for cluster animation routines, while 91 I/O pins accommodate multiple stepper motor outputs, switch matrix inputs, and telltale LED drivers. The Part's automotive -40 C to +125 C temperature rating supports dashboard-mounted cluster environments, and the 112-LQFP footprint provides ample pin count without requiring external I/O expanders.
Recommandé
HVAC Climate Control Module
The MC9S12A256MPVE integrates HVAC control functions: temperature sensor ADC sampling, blower motor PWM control, mode-door actuator drive, and CAN/LIN body-network communication. Its 256 KB Flash accommodates HVAC firmware plus diagnostics; 12 KB RAM supports the small state machines needed for climate algorithms. The Part's 91 I/O pins handle NTC thermistor inputs, multiple blower speeds via PWM, mode-stepper drives, and rear-window defrost relay control. Its -40 C to +125 C automotive temperature rating covers cabin and under-hood HVAC module mounting, and the HCS12 core's deterministic interrupt handling ensures consistent blower response time to driver inputs and CAN commands.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12A256MPVE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12A512CPVE | MC9S12A256CFUE | MC9S12E256CFUE | MC9S12E256VPVE | MC9S12DT128MPVE | S912XET512J2VAGR |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 112-LQFP (20x20) | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP - same family | 112-LQFP - same family | 112-LQFP (20x20) - same | 112-LQFP - same family |
| Core | HCS12 (16-bit) | HCS12 (16-bit) | HCS12 (16-bit) | HCS12 (16-bit) | HCS12 (16-bit) | HCS12 (16-bit) | S12X (16-bit + XGATE) |
| Maximum Clock | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 50 MHz |
| Flash | 256 KB | 512 KB | 256 KB | 256 KB | 256 KB | 128 KB | 512 KB |
| RAM | 12 KB | 12 KB | 12 KB | 12 KB | 12 KB | 8 KB | 32 KB |
| I/O Pins | 91 | 91 | 91 | 91 | 91 | 91 | 91 |
| Operating Temperature | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C |
| Lifecycle Status | NRND | Active | Active | Active | NRND | NRND | Active |
Principaux différenciateurs
- Largest memory in same-package 112-LQFP S12A family (vs MC9S12DT128MPVE)
- Direct die/package equivalent with active lifecycle (vs MC9S12A256CFUE)
- Drop-in 512KB Flash upgrade with active lifecycle (vs MC9S12A512CPVE)
- Same-package migration to enhanced S12X architecture (vs S912XET512J2VAGR)
Notes de conception
NXP marks the MC9S12A256MPVE as NRND (Not Recommended for New Designs) per the official NXP product page. For new programs, plan migration to S912XET512 or S912XEQ384 families which share the 112-LQFP footprint and add an XGATE co-processor. Existing programs should request a last-time-buy quote from NXP or authorized distributors to secure inventory before discontinuation. Document the migration path in your PCN response file.
Place decoupling capacitors (100 nF ceramic) on every VDD/VSSX pin pair within 5 mm of the device body, and bulk decoupling 4.7 uF to 10 uF tantalum or ceramic at the regulator output. The 112-LQFP package has multiple VDD/VSSX power/ground pin pairs distributed around the package perimeter; missing any pair causes logic errors and ADC reference drift. Connect the analog VDDA/VSSA pair to a quiet ground and consider a ferrite bead separating digital and analog grounds.
Route the external bus (if enabled) with 50 ohm controlled-impedance traces and add 22-33 ohm series damping resistors at the MCU outputs when driving off-board signals. The 8/16-bit multiplexed external bus of the HCS12 is sensitive to trace length mismatch; keep address/data traces matched within 1 cm to avoid setup/hold violations at 25 MHz. Keep the EXTAL/XTAL crystal traces short and guard them with a ground pour to minimize jitter.
Do not leave the TEST pin floating; tie it to VDDX through a 4.7 kohm pull-up resistor per NXP reference design, otherwise the device may enter test mode. The BKGD (Background Debug Mode) pin must be accessible for ISP programming and BDM debuggers; do not put it on a net that is hidden under the package. Ensure the RESET pin has a 10 kohm pull-up and 100 nF decoupling cap to provide a clean power-on reset.
Estimated: at 25 MHz full-clock operation, typical HCS12 core power dissipation is roughly 150-200 mW at 5V VDD; at 125 C ambient the 112-LQFP package (theta_JA approx 45 C/W for a 4-layer JEDEC test board) limits reliable operation. For under-hood deployment above 105 C ambient, derate clock speed or attach a copper pour heatsink on the package top. Verify with the actual NXP S12A thermal application note for your PCB stackup.
Informations de conformité
Compliance fields marked unknown because the NXP product page and verified distributor snippets did not explicitly state RoHS/REACH/AEC-Q100 status. For automotive programs, request the full material declaration from NXP via the official product page before qualification.
