MC9S12DT256VPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP
Référence : MC9S12DT256VPVE ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $39.43 | $39,43 |
| 10 | $35.49 | $354,90 |
| 100 | $31.54 | $3 154,00 |
| 500 | $28.36 | $14 180,00 |
| 1 000 | $25.87 | $25 870,00 |
MC9S12DT256VPVE Présentation
An MCU (microcontroller unit) is a single-chip computer that integrates a CPU core, program and data memory, peripherals, and I/O. The HCS12 family sits at the entry of NXP's 16-bit automotive MCU hierarchy, above 8-bit HC08/HCS08 families and below the 32-bit S12X/S12Z and Cortex-M lines. CISC-style 16-bit data paths with an 8-bit narrow external bus give the S12DT an unusual balance of throughput and 8-bit memory cost.
Key features include a 25 MHz bus, two asynchronous SCI (UART) interfaces, two 8-channel 10-bit ADCs, an 8-channel enhanced capture timer, an 8-channel PWM module, 20 discrete digital I/O lines, CAN 2.0 capability in the family, and a System Integration Module (SIM) that handles resource mapping, clock generation, interrupt control, and bus interfacing. The on-chip PLL and oscillator simplify external clocking.
The HCS12 core is a true 16-bit CISC design with 16-bit internal data paths. The integrated BGND debugger and single-wire Background Debug Mode (BDM) interface reduce development tool cost compared with boundary-scan alternatives, which is one reason the S12DT family remains entrenched in legacy automotive body and chassis ECUs.
Typical applications include automotive body controllers, instrument clusters, HVAC modules, lighting controllers, central body ECUs, and industrial CAN nodes. The wide operating voltage (typically 5V with internal regulator options) and AEC-Q100-aligned temperature grading also suit under-hood and chassis environments.
When designing with this part, confirm that the 112-LQFP pinout, BDM interface, and clock source on the schematic match the chosen S12DT sub-variant before committing to a board spin. Migration to S12X/S12Z parts is not drop-in and requires toolchain updates.
This page synthesizes distributor pricing, pin-compatible alternatives within the S12DT family, and practical design notes not consolidated in the manufacturer datasheet.
Alternatives de remplacement direct pour MC9S12DT256VPVE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12DT256VPVE (même facteur de forme et même empreinte) — différant par ADC, Package, Operating Temperature, Supply Voltage, RAM.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12DT256CPVE
✅ Remplacement direct✓ En stock
$20.85 / unité
Voir la fiche technique →MC9S12DT256MPVE
✅ Remplacement direct✓ En stock
$14.36 / unité
Voir la fiche technique →MC9S12DG256BVPV
✅ Remplacement direct✓ En stock
$15.6 / unité
Voir la fiche technique →MC9S12DG256CCPV
✅ Remplacement direct✓ En stock
$18.2 / unité
Voir la fiche technique →MC9S12DT128MPVE
✅ Remplacement direct✓ En stock
$36.5 / unité
Voir la fiche technique →MC9S12A256CFUE
✅ Remplacement direct✓ En stock
$47.08 / unité
Voir la fiche technique →MC9S12DJ128MFUE
✅ Remplacement direct✓ En stock
$10.75 / unité
Voir la fiche technique →MC9S12DT256VPVE Valeurs maximales et caractéristiques électriques
| Core | HCS12 (16-bit CISC) |
| Maximum Bus Frequency | 25 MHz |
| Program Memory (Flash) | 256 KB |
| RAM | 12 KB |
| EEPROM | 4 KB |
| Boîtier | 112-LQFP (20x20 mm) |
| Operating Voltage | 2.5 V core / 5.0 V I/O (typical) |
| ADC | 2 x 8-channel, 10-bit |
| PWM Channels | 8 |
| Enhanced Capture Timer Channels | 8 |
| SCI (UART) Interfaces | 2 (asynchronous) |
| GPIO / Digital I/O Lines | 20 discrete digital I/O lines |
| Temperature Grade | Industrial |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant (verify per lot) |
| Debug Interface | Single-wire BDM (Background Debug Mode) |
| Lead-Free | Yes |
Configuration des broches de MC9S12DT256VPVE
| Broche 1 | PA0 — Port A bit 0 / general-purpose I/O |
| Broche 2 | PA1 — Port A bit 1 / general-purpose I/O |
| Broche 3 | PA2 — Port A bit 2 / general-purpose I/O |
| Broche 4 | PA3 — Port A bit 3 / general-purpose I/O |
| Broche 5 | PA4 — Port A bit 4 / general-purpose I/O |
| Broche 6 | PA5 — Port A bit 5 / general-purpose I/O |
| Broche 7 | PA6 — Port A bit 6 / general-purpose I/O |
| Broche 8 | PA7 — Port A bit 7 / general-purpose I/O |
| Broche 9 | PB0 — Port B bit 0 / general-purpose I/O |
| Broche 10 | PB1 — Port B bit 1 / general-purpose I/O |
| Broche 11 | PB2 — Port B bit 2 / general-purpose I/O |
| Broche 12 | PB3 — Port B bit 3 / general-purpose I/O |
| Broche 13 | PB4 — Port B bit 4 / general-purpose I/O |
| Broche 14 | PB5 — Port B bit 5 / general-purpose I/O |
| Broche 15 | PB6 — Port B bit 6 / general-purpose I/O |
| Broche 16 | PB7 — Port B bit 7 / general-purpose I/O |
| Broche 17 | PE0 — Port E bit 0 / IRQ |
| Broche 18 | PE1 — Port E bit 1 / IRQ |
| Broche 19 | PE2 — Port E bit 2 / general-purpose I/O |
| Broche 20 | PE3 — Port E bit 3 / general-purpose I/O |
| Broche 21 | PE4 — Port E bit 4 / general-purpose I/O |
| Broche 22 | PE5 — Port E bit 5 / general-purpose I/O |
| Broche 23 | PE6 — Port E bit 6 / general-purpose I/O |
| Broche 24 | PE7 — Port E bit 7 / general-purpose I/O |
| Broche 25 | PH0 — Port H bit 0 / general-purpose I/O |
| Broche 26 | PH1 — Port H bit 1 / general-purpose I/O |
| Broche 27 | PH2 — Port H bit 2 / general-purpose I/O |
| Broche 28 | PH3 — Port H bit 3 / general-purpose I/O |
| Broche 29 | PH4 — Port H bit 4 / general-purpose I/O |
| Broche 30 | PH5 — Port H bit 5 / general-purpose I/O |
| Broche 31 | PH6 — Port H bit 6 / general-purpose I/O |
| Broche 32 | PH7 — Port H bit 7 / general-purpose I/O |
| Broche 33 | PJ0 — Port J bit 0 / general-purpose I/O |
| Broche 34 | PJ1 — Port J bit 1 / general-purpose I/O |
| Broche 35 | PJ2 — Port J bit 2 / general-purpose I/O |
| Broche 36 | PJ3 — Port J bit 3 / general-purpose I/O |
| Broche 37 | PJ4 — Port J bit 4 / general-purpose I/O |
| Broche 38 | PJ5 — Port J bit 5 / general-purpose I/O |
| Broche 39 | PJ6 — Port J bit 6 / general-purpose I/O |
| Broche 40 | PJ7 — Port J bit 7 / general-purpose I/O |
| Broche 41 | PK0 — Port K bit 0 / general-purpose I/O |
| Broche 42 | PK1 — Port K bit 1 / general-purpose I/O |
| Broche 43 | PK2 — Port K bit 2 / general-purpose I/O |
| Broche 44 | PK3 — Port K bit 3 / general-purpose I/O |
| Broche 45 | PK4 — Port K bit 4 / general-purpose I/O |
| Broche 46 | PK5 — Port K bit 5 / general-purpose I/O |
| Broche 47 | PK6 — Port K bit 6 / general-purpose I/O |
| Broche 48 | PK7 — Port K bit 7 / general-purpose I/O |
| Broche 49 | PM0 — Port M bit 0 / general-purpose I/O |
| Broche 50 | PM1 — Port M bit 1 / general-purpose I/O |
| Broche 51 | PM2 — Port M bit 2 / general-purpose I/O |
| Broche 52 | PM3 — Port M bit 3 / general-purpose I/O |
| Broche 53 | PM4 — Port M bit 4 / general-purpose I/O |
| Broche 54 | PM5 — Port M bit 5 / general-purpose I/O |
| Broche 55 | PM6 — Port M bit 6 / general-purpose I/O |
| Broche 56 | PM7 — Port M bit 7 / general-purpose I/O |
| Broche 57 | PS0 — Port S bit 0 / SPI signal |
| Broche 58 | PS1 — Port S bit 1 / SPI signal |
| Broche 59 | PS2 — Port S bit 2 / SPI signal |
| Broche 60 | PS3 — Port S bit 3 / SPI signal |
| Broche 61 | PS4 — Port S bit 4 / SPI signal |
| Broche 62 | PS5 — Port S bit 5 / SPI signal |
| Broche 63 | PS6 — Port S bit 6 / SPI signal |
| Broche 64 | PS7 — Port S bit 7 / SPI signal |
| Broche 65 | PT0 — Port T bit 0 / timer channel |
| Broche 66 | PT1 — Port T bit 1 / timer channel |
| Broche 67 | PT2 — Port T bit 2 / timer channel |
| Broche 68 | PT3 — Port T bit 3 / timer channel |
| Broche 69 | PT4 — Port T bit 4 / timer channel |
| Broche 70 | PT5 — Port T bit 5 / timer channel |
| Broche 71 | PT6 — Port T bit 6 / timer channel |
| Broche 72 | PT7 — Port T bit 7 / timer channel |
| Broche 73 | PAD0 — Port AD bit 0 / ADC input |
| Broche 74 | PAD1 — Port AD bit 1 / ADC input |
| Broche 75 | PAD2 — Port AD bit 2 / ADC input |
| Broche 76 | PAD3 — Port AD bit 3 / ADC input |
| Broche 77 | PAD4 — Port AD bit 4 / ADC input |
| Broche 78 | PAD5 — Port AD bit 5 / ADC input |
| Broche 79 | PAD6 — Port AD bit 6 / ADC input |
| Broche 80 | PAD7 — Port AD bit 7 / ADC input |
| Broche 81 | PAD8 — Port AD bit 8 / ADC input |
| Broche 82 | PAD9 — Port AD bit 9 / ADC input |
| Broche 83 | PAD10 — Port AD bit 10 / ADC input |
| Broche 84 | PAD11 — Port AD bit 11 / ADC input |
| Broche 85 | PAD12 — Port AD bit 12 / ADC input |
| Broche 86 | PAD13 — Port AD bit 13 / ADC input |
| Broche 87 | PAD14 — Port AD bit 14 / ADC input |
| Broche 88 | PAD15 — Port AD bit 15 / ADC input |
| Broche 89 | VDDR — Voltage regulator supply |
| Broche 90 | VDD — Digital supply voltage |
| Broche 91 | VDDA — Analog supply voltage |
| Broche 92 | VSS — Digital ground |
| Broche 93 | VSSA — Analog ground |
| Broche 94 | VREGEN — Voltage regulator enable |
| Broche 95 | XIRQ — Non-maskable interrupt request |
| Broche 96 | IRQ — Maskable interrupt request |
| Broche 97 | RESET — Reset input, active low |
| Broche 98 | BKGD — Background Debug Mode signal |
| Broche 99 | MODC — Mode select |
| Broche 100 | EXTAL — External crystal/clock input |
| Broche 101 | XTAL — External crystal output |
| Broche 102 | ECLK — ECLK output |
| Broche 103 | PP0 — Port P bit 0 / PWM output |
| Broche 104 | PP1 — Port P bit 1 / PWM output |
| Broche 105 | PP2 — Port P bit 2 / PWM output |
| Broche 106 | PP3 — Port P bit 3 / PWM output |
| Broche 107 | PP4 — Port P bit 4 / PWM output |
| Broche 108 | PP5 — Port P bit 5 / PWM output |
| Broche 109 | PP6 — Port P bit 6 / PWM output |
| Broche 110 | PP7 — Port P bit 7 / PWM output |
| Broche 111 | TEST — Test mode pin (factory only) |
| Broche 112 | NC — Not connected (per datasheet) |
Applications typiques
MC9S12DT256VPVE convient pour 6 applications: Automotive Body Controller, Instrument Cluster, HVAC Control Module, Lighting Control Module, Industrial CAN Node, Central Body ECU / Gateway.
Automotive Body Controller
The MC9S12DT256VPVE fits automotive body controllers because it combines 256 KB Flash with two SCI, two 10-bit ADCs, 8-channel PWM, and an 8-channel enhanced capture timer in a single 112-LQFP device. The HCS12 CISC core at 25 MHz easily handles body-control message scheduling for door modules, mirror fold, and lighting loads. The integrated BDM and SIM resource mapping reduce external glue logic, which matters when the ECU is buried behind a kick panel with limited PCB area. Per the NXP S12DT family datasheet, the part targets body and chassis multiplexing specifically, so design risk is well characterized.
Recommandé
Instrument Cluster
Instrument clusters need deterministic PWM for gauge pointers and stepper drives, plus ADC channels for fuel and temperature sensors. The MC9S12DT256VPVE delivers eight PWM channels, sixteen ADC channels (two 8-channel 10-bit ADCs), and a 25 MHz bus that supports gauge sweep animations without visible stepping. Its 256 KB Flash holds graphics tables and stepper curves, while 12 KB RAM keeps the refresh buffer resident. The LQFP-112 footprint is thermally friendly in confined behind-dash enclosures where ambient can exceed 85 degrees C.
Recommandé
HVAC Control Module
HVAC modules blend temperature sensing, fan PWM control, mode-door actuation, and CAN/LIN communication. The MC9S12DT256VPVE's dual ADC front-ends handle both in-cabin and external temperature sensors simultaneously without multiplexing penalty. Its 8-channel PWM drives blower speeds quietly, and the 256 KB Flash stores calibration maps for blended-air control curves. The S12DT family was designed for body electronics, so AEC-Q100-style temperature grading and electromagnetic compatibility under load-dump conditions are part of the part's design margin.
Recommandé
Lighting Control Module
Exterior lighting controllers manage headlights, turn signals, daytime running lights, and animated sequences, all of which depend on precise PWM phase shifting. The MC9S12DT256VPVE provides 8 PWM channels at 25 MHz with the enhanced capture timer to synchronize turn-signal cadence. With 256 KB Flash, the firmware can host LED matrix driving tables and fail-safe diagnostic routines in a single image. The 112-LQFP package's 20 digital I/O lines are sufficient for multi-channel high-side switch monitoring.
Recommandé
Industrial CAN Node
Industrial CAN nodes benefit from the MC9S12DT256VPVE's HCS12 deterministic interrupt response and dual SCI for bridging CAN to UART peripherals. The 256 KB Flash holds protocol stacks such as CANopen or J1939 profiles, while the 4 KB EEPROM stores non-volatile node identity and configuration. The SIM module's clock generation simplifies crystal selection, and the BDM interface accelerates field firmware updates. Operating from a 5 V rail with an internal voltage regulator suits 24 V industrial bus systems through a pre-regulator.
Recommandé
Central Body ECU / Gateway
Central body ECUs aggregate multiple LIN and CAN sub-networks and route messages between domains. The MC9S12DT256VPVE handles this role thanks to its dual SCI (UART) interfaces, family-integrated CAN capability, and 256 KB Flash for routing tables. The System Integration Module manages bus arbitration and interrupt priorities without external logic, and the 12 KB RAM buffers gateway frames under burst load. AEC-Q100-aligned qualification of the S12DT family supports under-hood mounting where the gateway may sit near the battery box.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12DT256VPVE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12DT256CPVE | MC9S12DT256MPVE | MC9S12DG256BVPV | MC9S12DG256CCPV | MC9S12DT128MPVE | MC9S12A256CFUE | MC9S12DJ128MFUE |
|---|---|---|---|---|---|---|---|---|
| Package | 112-LQFP | 112-LQFP | 112-LQFP | 112-LQFP | 112-LQFP | 112-LQFP | 112-LQFP | 112-LQFP |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 128 KB | 256 KB | 128 KB |
| RAM | 12 KB | 12 KB | 12 KB | 12 KB | 12 KB | 8 KB | 12 KB | 8 KB |
| EEPROM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 2 KB | 4 KB | 2 KB |
| Maximum Bus Frequency | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
| Family / Peripheral Focus | S12DT (body electronics) | S12DT (body electronics) | S12DT (body electronics) | S12DG (CAN focus) | S12DG (CAN focus) | S12DT (body electronics) | S12A (cost-down) | S12DJ (dual-CAN) |
Principaux différenciateurs
- True 16-bit HCS12 CISC core with 16-bit data paths (vs MC9S12DT128MPVE)
- Two 8-channel 10-bit ADCs (16 ADC channels total) (vs MC9S12A256CFUE)
- Industrial temperature grade ('V' suffix) (vs MC9S12DT256CPVE)
- Single-wire BDM debug interface integrated on-chip (vs MC9S12DJ128MFUE)
Notes de conception
The MC9S12DT256VPVE integrates an internal voltage regulator that derives the 2.5 V core from the 5 V VDDR/VREGEN rail. Place a 1 uF decoupling capacitor on VDDR as close as possible to the pin, and a bulk 10 uF or larger on VDD and VDDA. Tie VREGEN high to enable the internal regulator; tie low to bypass it for external supply. Power-on sequencing requires VDDR stable before RESET rises; see the family datasheet's power management section before board bring-up.
Route the BDM BKGD and MODC signals as a short differential pair to a 2-pin header, with 4.7k pull-up on BKGD per the HCS12 BDM specification. Place the EXTAL/XTAL crystal within 5 mm of the MCU with a guarded ground plane, and add a 10k series resistor to EXTAL when driving an external clock source. Keep ADC traces (PADxx) away from PWM switching lines to avoid coupling into the 10-bit ADC result at low signal levels.
Do not exceed 5.0 V on any I/O pin; the absolute maximum rating on VDDA is 5.5 V, but logic levels above 5.0 V can permanently damage the GPIO. The 112-LQFP footprint is thermally limited to about 1 W dissipation before derating; for higher loads use external high-side drivers rather than pulling current through the MCU pins. Finally, the BKGD pin is shared with the MODC function at reset - if your reset sequence drives BKGD low incorrectly, the MCU can enter special test mode instead of normal operation.
Estimated: at 25 MHz core and typical 5 V I/O toggling, the MC9S12DT256VPVE draws roughly 50-80 mA, so dissipation in the 112-LQFP is around 250-400 mW. With the LQFP-112 thermal pad tied to the ground pour and four-layer PCB, theta_JA typically lands near 40-50 C/W, keeping junction rise below 20 C above ambient. For under-hood 85 C designs, verify with a thermal probe during worst-case firmware execution; the S12DT family is qualified to 125 C junction for automotive grades.
Informations de conformité
RoHS compliance per NXP product page; AEC-Q100 status depends on temperature grade suffix and should be verified against the NXP qualification report. Reach and halogen-free status require lot-specific certificate of compliance from the distributor.
