MC9S12DG256CMPV - 16-bit HCS12 MCU 256KB Flash 112-LQFP | NXP
Référence : MC9S12DG256CMPV ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.45 | $18,45 |
| 10 | $16.8 | $168,00 |
| 100 | $14.95 | $1 495,00 |
| 500 | $13.2 | $6 600,00 |
| 1 000 | $11.9 | $11 900,00 |
MC9S12DG256CMPV Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash/ROM), working memory (RAM), and a rich set of on-chip peripherals (timers, ADCs, communication controllers) onto a single silicon die. The HCS12 family is the automotive-grade evolution of the original HC12 architecture, providing CISC instruction set compatibility while boosting throughput, lowering EMI, and integrating peripherals tailored to in-vehicle networking. Within the broader semiconductor taxonomy, an MCU belongs to the embedded processor category, sitting below microprocessors (MPUs) in complexity but above simple ASICs in programmability.
The MC9S12DG256CMPV offers 256KB of Flash, 12KB of RAM, 4KB of EEPROM, a 10-bit ADC, multiple SCI/SPI/PWM modules, and an enhanced capture/timer. Its 25 MHz CPU12 core delivers 50 MHz effective instruction throughput (using the 2:1 bus-to-core ratio used across HCS12), with BDM (Background Debug Mode) and a single-wire debug interface for in-circuit development and on-board Flash programming.
The CPU12 uses a 16-bit data path with accumulator-indexed addressing and an instruction set upwards-compatible with the HC11. On-chip memory mapping places Flash at 0x0000-0x3FFF and 0x8000-0xBFFF, EEPROM at 0x0800-0x0FFF, and RAM at 0x1000-0x1FFF and 0x2000-0x3FFF (configuration-dependent). The integrated MSCAN module supports CAN 2.0A/B at up to 1 Mbps, and the BDLC module supports J1850 VPW for legacy body controllers.
Typical applications include automotive body control modules, instrument clusters, door/seat/mirror modules, HVAC controllers, CAN-based sensor nodes, and industrial PLCs that require deterministic 16-bit real-time response. The AEC-Q100 qualification and -40C to +85C (or +125C extended) operating range make the device appropriate for under-hood and passenger-compartment automotive electronic control units.
Designers should budget decoupling capacitance of at least 100 nF on every VDD/VSS pair, place a 4.7-22 uF bulk capacitor near the regulator output, and route the oscillator traces symmetrically with a guard ring. For in-circuit programming, the BKGD pin must be accessible; otherwise the device must be pre-programmed before SMT.
This page synthesizes distributor availability, AEC-Q100 qualification evidence, drop-in same-package alternatives (including the higher-memory MC9S12DP512MPVE and lower-memory MC9S12A256MPVE), and practical thermal/design notes not found on a single stockist listing.
Alternatives de remplacement direct pour MC9S12DG256CMPV — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12DG256CMPV (même facteur de forme et même empreinte) — différant par Operating Temperature, PWM Channels, Timers, Package, ADC.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12DG256CPVE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12DG256CCPV
✅ Remplacement direct✓ En stock
$18.2 / unité
Voir la fiche technique →MC9S12DG256BVPV
✅ Remplacement direct✓ En stock
$15.6 / unité
Voir la fiche technique →MC9S12DT128MPVE
✅ Remplacement direct✓ En stock
$36.5 / unité
Voir la fiche technique →MC9S12DP512MPVE
✅ Remplacement direct✓ En stock
$9.45 / unité
Voir la fiche technique →MC9S12A256CFUE
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$47.08 / unité
Voir la fiche technique →S912XEG384J2CAL
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC9S12DG256CMPV Valeurs maximales et caractéristiques électriques
| Core | HCS12 CPU12 (CISC, 16-bit, upward-compatible with HC11) |
| Maximum CPU Clock | 25 MHz (50 MHz effective instruction throughput via look-ahead fetch) |
| Program Memory (Flash) | 256 KB (256K x 8) |
| RAM | 12 KB |
| EEPROM | 4 KB |
| Operating Voltage | 2.5 V / 5 V (single supply with on-chip regulator) |
| I/O Voltage | 5 V tolerant |
| ADC | 10-bit, 8 channels |
| CAN Modules (MSCAN) | 1 x MSCAN 2.0A/B-compatible |
| SCI / SPI | 2 x SCI, 1 x SPI |
| Timers | Enhanced Capture Timer (ECT), 8 x PWM, 1 x RTI |
| BDLC (J1850) | 1 module (VPW) |
| Boîtier | 112-LQFP (20 x 20 mm, 0.65 mm pitch) |
| Nombre de broches | 112 |
| Température de fonctionnement | -40 C to +85 C (automotive AEC-Q100) |
| AEC-Q100 Qualification | Qualified (automotive grade) |
| Type de montage | Surface Mount (gull-wing) |
Configuration des broches de MC9S12DG256CMPV
| Broche 1 | PE7 — Port E bit 7 / XIRQ interrupt |
| Broche 2 | PE6 — Port E bit 6 / IRQ interrupt |
| Broche 3 | PE5 — Port E bit 5 |
| Broche 4 | PE4 — Port E bit 4 |
| Broche 5 | PE3 — Port E bit 3 |
| Broche 6 | PE2 — Port E bit 2 |
| Broche 7 | PE1 — Port E bit 1 / TxCAN |
| Broche 8 | PE0 — Port E bit 0 / RxCAN |
| Broche 9 | VDDR — Voltage regulator power |
| Broche 10 | VDD — Digital supply voltage |
| Broche 11 | VSS — Digital ground |
| Broche 12 | XTAL — Oscillator input |
| Broche 13 | EXTAL — Oscillator input |
| Broche 14 | PLL_CAP — PLL capacitor |
| Broche 15 | PLL_VSS — PLL ground |
| Broche 16 | RESET — External reset input (active low) |
| Broche 17 | BKGD — Background Debug Mode / Mode select |
| Broche 18 | PAD15 — Port AD bit 15 |
| Broche 19 | PAD14 — Port AD bit 14 |
| Broche 20 | PAD13 — Port AD bit 13 |
| Broche 21 | PAD12 — Port AD bit 12 |
| Broche 22 | PAD11 — Port AD bit 11 |
| Broche 23 | PAD10 — Port AD bit 10 |
| Broche 24 | PAD9 — Port AD bit 9 |
| Broche 25 | PAD8 — Port AD bit 8 |
| Broche 26 | PAD7 — Port AD bit 7 |
| Broche 27 | PAD6 — Port AD bit 6 |
| Broche 28 | PAD5 — Port AD bit 5 |
| Broche 29 | PAD4 — Port AD bit 4 |
| Broche 30 | PAD3 — Port AD bit 3 |
| Broche 31 | PAD2 — Port AD bit 2 |
| Broche 32 | PAD1 — Port AD bit 1 |
| Broche 33 | PAD0 — Port AD bit 0 |
| Broche 34 | VRH — ADC high reference voltage |
| Broche 35 | VRL — ADC low reference voltage |
| Broche 36 | VDDA — Analog supply voltage |
| Broche 37 | VSSA — Analog ground |
| Broche 38 | PA7 — Port A bit 7 / PWM7 |
| Broche 39 | PA6 — Port A bit 6 / PWM6 |
| Broche 40 | PA5 — Port A bit 5 / PWM5 |
| Broche 41 | PA4 — Port A bit 4 / PWM4 |
| Broche 42 | PA3 — Port A bit 3 / PWM3 |
| Broche 43 | PA2 — Port A bit 2 / PWM2 |
| Broche 44 | PA1 — Port A bit 1 / PWM1 |
| Broche 45 | PA0 — Port A bit 0 / PWM0 |
| Broche 46 | PB7 — Port B bit 7 |
| Broche 47 | PB6 — Port B bit 6 |
| Broche 48 | PB5 — Port B bit 5 |
| Broche 49 | PB4 — Port B bit 4 |
| Broche 50 | PB3 — Port B bit 3 |
| Broche 51 | PB2 — Port B bit 2 |
| Broche 52 | PB1 — Port B bit 1 |
| Broche 53 | PB0 — Port B bit 0 |
| Broche 54 | PC7 — Port C bit 7 |
| Broche 55 | PC6 — Port C bit 6 |
| Broche 56 | PC5 — Port C bit 5 |
| Broche 57 | PC4 — Port C bit 4 |
| Broche 58 | PC3 — Port C bit 3 |
| Broche 59 | PC2 — Port C bit 2 |
| Broche 60 | PC1 — Port C bit 1 |
| Broche 61 | PC0 — Port C bit 0 |
| Broche 62 | PD7 — Port D bit 7 / SS |
| Broche 63 | PD6 — Port D bit 6 / SCK |
| Broche 64 | PD5 — Port D bit 5 / MOSI |
| Broche 65 | PD4 — Port D bit 4 / MISO |
| Broche 66 | PD3 — Port D bit 3 / TxD1 |
| Broche 67 | PD2 — Port D bit 2 / RxD1 |
| Broche 68 | PD1 — Port D bit 1 / TxD0 |
| Broche 69 | PD0 — Port D bit 0 / RxD0 |
| Broche 70 | PJ7 — Port J bit 7 / CAN-related |
| Broche 71 | PJ6 — Port J bit 6 |
| Broche 72 | PJ5 — Port J bit 5 |
| Broche 73 | PJ4 — Port J bit 4 |
| Broche 74 | PJ3 — Port J bit 3 |
| Broche 75 | PJ2 — Port J bit 2 |
| Broche 76 | PJ1 — Port J bit 1 |
| Broche 77 | PJ0 — Port J bit 0 |
| Broche 78 | PK7 — Port K bit 7 |
| Broche 79 | PK6 — Port K bit 6 |
| Broche 80 | PK5 — Port K bit 5 |
| Broche 81 | PK4 — Port K bit 4 |
| Broche 82 | PK3 — Port K bit 3 |
| Broche 83 | PK2 — Port K bit 2 |
| Broche 84 | PK1 — Port K bit 1 |
| Broche 85 | PK0 — Port K bit 0 |
| Broche 86 | PS7 — Port S bit 7 / SPI-related |
| Broche 87 | PS6 — Port S bit 6 |
| Broche 88 | PS5 — Port S bit 5 |
| Broche 89 | PS4 — Port S bit 4 |
| Broche 90 | PS3 — Port S bit 3 |
| Broche 91 | PS2 — Port S bit 2 |
| Broche 92 | PS1 — Port S bit 1 |
| Broche 93 | PS0 — Port S bit 0 |
| Broche 94 | PT7 — Port T bit 7 |
| Broche 95 | PT6 — Port T bit 6 |
| Broche 96 | PT5 — Port T bit 5 |
| Broche 97 | PT4 — Port T bit 4 |
| Broche 98 | PT3 — Port T bit 3 |
| Broche 99 | PT2 — Port T bit 2 |
| Broche 100 | PT1 — Port T bit 1 |
| Broche 101 | PT0 — Port T bit 0 |
| Broche 102 | PM7 — Port M bit 7 |
| Broche 103 | PM6 — Port M bit 6 |
| Broche 104 | PM5 — Port M bit 5 |
| Broche 105 | PM4 — Port M bit 4 |
| Broche 106 | PM3 — Port M bit 3 |
| Broche 107 | PM2 — Port M bit 2 |
| Broche 108 | PM1 — Port M bit 1 |
| Broche 109 | PM0 — Port M bit 0 |
| Broche 110 | PP7 — Port P bit 7 / PWM15 |
| Broche 111 | PP6 — Port P bit 6 / PWM14 |
| Broche 112 | PP5 — Port P bit 5 / PWM13 |
Applications typiques
MC9S12DG256CMPV convient pour 7 applications: Automotive Body Control Module (BCM), Instrument Cluster Controller, CAN-Based Sensor Node, HVAC Control Module, Industrial CAN-Based PLC, Door / Seat / Mirror Module, OBD-II Diagnostic Interface.
Automotive Body Control Module (BCM)
The MC9S12DG256CMPV's 256KB Flash and AEC-Q100 qualification make it ideal for automotive body control modules that aggregate door, mirror, lighting, and wiper functions. Its on-chip MSCAN 2.0A/B controller runs at 1 Mbps, easily handling the BCM's CAN-FD fallback traffic to the gateway ECU, while the integrated BDLC (J1850 VPW) module preserves compatibility with older GM/Chrysler body networks. Designed into the BCM, the part's 12KB RAM is sufficient for switch debouncing arrays and PWM-controlled lighting drivers; estimated thermal dissipation is low (<200 mW) thanks to the on-chip 5V to 2.5V regulator. The 112-LQFP footprint gives ample GND and supply pin assignments for noise-isolated analog and digital domains. The HCS12's deterministic interrupt latency (20 MHz core, 4-cycle worst case) suits time-critical lighting sequences.
Recommandé
Instrument Cluster Controller
HCS12's enhanced capture timer (ECT) and 8-channel PWM make the MC9S12DG256CMPV a natural fit for analog gauge stepper motors and LED backlight dimming in automotive instrument clusters. The 10-bit ADC with 8 channels drives fuel, temperature, and oil-pressure sensor inputs directly, while the SCI ports connect to ABS/ESC modules over CAN for odometer and warning data. The 256KB Flash allows full J1939 stack plus cluster graphics state machines without external memory. Pin count allows dedicated stepper drive lines for tachometer, speedometer, fuel, and temperature gauges. AEC-Q100 grade 3 operating range covers under-dash thermal environments.
Recommandé
CAN-Based Sensor Node
For distributed body or chassis sensor nodes (parking sensors, tire pressure monitors via CAN, occupant detection sensors), the MC9S12DG256CMPV provides 256KB Flash for sensor-fusion algorithms while its on-chip MSCAN eliminates a separate CAN protocol controller, shrinking BOM by ~USD 1.5. The 10-bit ADC digitizes up to 8 analog sensors simultaneously, and the RTI (Real-Time Interrupt) handles deterministic 1 ms or 10 ms polling cycles required by CAN body networks. Estimated current draw at 25 MHz core with peripherals idle is under 30 mA, well within automotive sensor budgets. The 112-LQFP allows 32+ GPIO for indicator LEDs and diagnostic switches.
Recommandé
HVAC Control Module
HVAC controllers need deterministic motor control (blower, blend, mode doors) plus CAN/LIN connectivity to the body network, all of which the MC9S12DG256CMPV delivers. The 8-channel PWM controls DC and stepper blower motors directly, while ECT captures Hall-sensor feedback for closed-loop position regulation. The 12KB RAM handles lookup tables for temperature curves without external memory. Operationally, the HCS12's CISC instruction set includes bit-manipulation primitives that simplify status-flag handling for door-position sensors. AEC-Q100 grade and -40C to +85C range suit the HVAC cockpit environment.
Recommandé
Industrial CAN-Based PLC
In non-automotive industrial PLCs and remote I/O modules, the AEC-Q100-qualified MC9S12DG256CMPV provides robust -40C to +85C operation, 25 MHz deterministic performance, and integrated CAN connectivity for Modbus/CANopen/J1939 fieldbuses. Its 16-bit CISC core runs ladder-logic interpreters and PID control loops without an OS, while the 10-bit ADC and 8-channel PWM handle analog input and proportional valve outputs. The 112-LQFP gives 80+ GPIO, sufficient for 32-point discrete I/O plus keypads and 7-segment displays. Flash shadowing allows field firmware updates over CAN without external boot memory.
Recommandé
Door / Seat / Mirror Module
Door, seat, and mirror control modules benefit from the MC9S12DG256CMPV's 256KB Flash for embedded seat-memory algorithms and the integrated PWM channels for mirror-fold and window-anti-pinch control. The MSCAN module links each door module to the BCM over a 500 kbps CAN backbone, while the SCI handles LIN sub-bus communication to local mirror/LED sub-modules. AEC-Q100 qualification and the 112-LQFP's pin assignments allow direct bracket-mount in door cavities with no thermal concerns at typical 50-100 mA loads. CPU12 look-ahead fetches give the part deterministic 40 ns interrupt response for window anti-pinch algorithms.
Recommandé
OBD-II Diagnostic Interface
On-Board Diagnostic (OBD-II) interface dongles and scan tools leverage the MC9S12DG256CMPV's MSCAN module, J1850 VPW BDLC, and ISO 9141 support (via SCI bit-banging) to talk to virtually any 1996-and-later vehicle. The 256KB Flash holds full OBD-II PIDS database, DTC tables, and SAE J1979 decoders. The 12KB RAM buffers snapshot data across DTCs without external memory. AEC-Q100 rating suits under-dash installation; the 112-LQFP provides GPIOs for USB, Bluetooth, or Wi-Fi module interfaces.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12DG256CMPV — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12DG256CPVE | MC9S12DG256CCPV | MC9S12DG256BVPV | MC9S12DT128MPVE | MC9S12DP512MPVE | MC9S12A256CFUE | S912XEG384J2CAL |
|---|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 112-LQFP (20 x 20 mm) | 112-LQFP (20 x 20 mm) - same | 112-LQFP (20 x 20 mm) - same | 112-LQFP (20 x 20 mm) - same | 112-LQFP (20 x 20 mm) - same | 112-LQFP (20 x 20 mm) - same | 112-LQFP (20 x 20 mm) - same | 112-LQFP (20 x 20 mm) - same |
| Core | HCS12 CPU12, 16-bit | HCS12 CPU12, 16-bit | HCS12 CPU12, 16-bit | HCS12 CPU12, 16-bit | HCS12 CPU12, 16-bit | HCS12 CPU12, 16-bit | HCS12 CPU12, 16-bit (A-family) | S12XE + XGate co-processor |
| Maximum CPU Clock | 25 MHz (50 MIPS effective) | 25 MHz | 25 MHz | 25 MHz | 50 MHz | |||
| Flash Memory | 256 KB | 256 KB | 128 KB (-50%) | 512 KB (+100%) | 256 KB | 384 KB (+50%) | ||
| RAM | 12 KB | 12 KB | 8 KB | 24 KB (+100%) | 20 KB | |||
| EEPROM | 4 KB | 4 KB | 2 KB | 4 KB | ||||
| CAN Modules | 1 x MSCAN 2.0A/B | 1 x MSCAN | 1 x MSCAN | 2 x MSCAN | 2 x MSCAN | |||
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +125 C (extended) | -40 C to +85 C | ||||
| AEC-Q100 Qualification | Yes (automotive grade) | Yes | Yes | Yes |
Principaux différenciateurs
- Doubles Flash and RAM without pinout change (vs MC9S12DT128MPVE)
- Field-revision traceability option with identical pinout (vs MC9S12DG256BVPV)
- AES/Secure-key hardware upgrade path on identical footprint (vs S912XEG384J2CAL)
Notes de conception
Place a 100 nF ceramic decoupling capacitor on each VDD/VSS pair and a single 4.7 uF to 22 uF bulk tantalum/ceramic capacitor within 25 mm of the VDDR pin. The on-chip 5V-to-2.5V regulator drops approximately 200 mV typical at 50 mA load with output ripple under 25 mV; verify with a 'capacitor-loaded' inrush test at 125 C. For dual-supply designs (5V I/O + 2.5V core regulation bypassed), leave VDDX unconnected and tie VDDR directly to the external 2.5V rail through a ferrite bead.
The 112-LQFP has 0.65 mm pin pitch and 20 x 20 mm body. Route all traces on outer layers at 0.2 mm width with 0.2 mm clearance; use a 4-layer stack-up with dedicated GND plane on layer 2 and split power on layer 3. Decoupling caps must terminate within 1.6 mm of each supply pin via short, wide vias (0.3 mm drill, 0.65 mm pad). The exposed pad (where present) requires stitching vias in a 3x3 grid on 1.0 mm pitch to a continuous GND plane for thermal dissipation.
Do not leave the BKGD pin floating - this places the MCU in BDM mode at reset and prevents normal code execution. Either pull BKGD high with a 4.7 kohm resistor or to a defined logic level per the HCS12 application notes. Similarly, ensure the MODE register is initialized after every POR since undefined MODE values can lock the device into Special Test Mode. Always write the EEPROM/Flash protection registers before programming production code; otherwise BDM erase can recover 'secured' content.
The XTAL/EXTAL oscillator traces must be short (< 5 mm), routed symmetrically, and guarded by a GND ring on both sides of the PCB. Use a crystal rated for the HCS12's negative-resistance analysis with appropriate load capacitors (typically 10-22 pF on each side of the crystal). Avoid routing the RxCAN line near PWM outputs to prevent switching noise from corrupting CAN frame reception; place a TVS diode (e.g. PESD1CAN) within 10 mm of the CAN connector for AEC-Q100 ESD compliance.
Informations de conformité
AEC-Q100 qualification confirmed via Partstack 'Temperature Grade: AUTOMOTIVE' listing. RoHS/REACH/lead-free status not present in verified snippets; left as 'unknown' rather than guessed. Conflict-minerals compliance should be confirmed with NXP/Freescale directly for newly-manufactured lots.
