MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP
Référence : MC9S12DT256MPVE ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $22.99 | $22,99 |
| 10 | $20.69 | $206,90 |
| 100 | $18.39 | $1 839,00 |
| 500 | $16.1 | $8 050,00 |
| 1 000 | $14.36 | $14 360,00 |
MC9S12DT256MPVE Présentation
A microcontroller (MCU) is a single-chip computer that combines a CPU core, program memory (Flash/ROM), data memory (RAM), and programmable peripherals such as timers, ADCs, and communication interfaces. The HCS12 family belongs to the 16-bit MCU category, sitting between 8-bit microcontrollers (e.g., HC08, S08) and 32-bit ARM Cortex-M microcontrollers, and is widely used in automotive body, chassis, and powertrain applications where deterministic interrupt response and rich peripheral integration matter more than raw clock speed.
Key features include 256KB Flash for application code, 12KB RAM, 4KB EEPROM, two SCI, two SPI, an I2C-bus-compatible module, an 8-channel 16-bit enhanced capture timer, two 10-bit ATDs with 8 channels each, CAN 2.0A/B-compatible MSCAN module, and JTAG/BDM debug interface. The 112-LQFP package supports the full peripheral complement and 91 GPIO pins, while the wide 2.35V-2.75V supply is paired with internal voltage regulation.
The HCS12 core implements a CISC architecture with 16-bit ALU, X/Y index registers, and a von-Neumann memory map (unified Flash/RAM/EEPROM addressing). Background Debug Mode (BDM) allows non-intrusive in-circuit debugging and Flash programming via a single-pin interface, simplifying production test. The CAN (MSCAN) peripheral supports both standard (11-bit) and extended (29-bit) identifier frames, with programmable bit timing for bus rates up to 1 Mbps, suitable for automotive CAN networks.
Typical applications include automotive body control modules, instrument clusters, HVAC controllers, lighting modules, CAN nodes in vehicle networks, and industrial automation nodes requiring 16-bit processing, deterministic interrupts, and field-upgradeable Flash. The S12DT family is fully pin-compatible across derivatives, enabling scalable designs with different memory and peripheral mixes.
When designing with this part, allocate a robust watchdog refresh strategy and verify the BDM/debug pinout matches your programming fixture. The 112-LQFP package requires a 4-layer PCB with adequate thermal copper for production programming, and decoupling capacitors must be placed within 5 mm of each supply pin per NXP guidelines.
This page synthesizes distributor pricing, lifecycle status, same-package drop-in alternatives (S12 family variants and the XDT256 upgrade), and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour MC9S12DT256MPVE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12DT256MPVE (même facteur de forme et même empreinte) — différant par ADC, Supply Voltage, Package, Operating Temperature, Connectivity.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12DT256CPVE
✅ Remplacement direct✓ En stock
$20.85 / unité
Voir la fiche technique →MC9S12DT256MFUE
✅ Remplacement direct✓ En stock
$19.2 / unité
Voir la fiche technique →MC9S12DJ256MPVE
✅ Remplacement direct✓ En stock
$17.95 / unité
Voir la fiche technique →MC9S12XDT256VAA
✅ Remplacement direct✓ En stock
$9.05 / unité
Voir la fiche technique →MC9S12DG256MFUE
✅ Remplacement direct✓ En stock
$14.95 / unité
Voir la fiche technique →MC9S12XDT256MAL
✅ Remplacement direct✓ En stock
$15.85 / unité
Voir la fiche technique →MC9S12DT256MPVE Valeurs maximales et caractéristiques électriques
| Core | HCS12 (16-bit CISC) |
| Maximum CPU Frequency | 25 MHz |
| Program Memory (Flash) | 256 KB |
| RAM | 12 KB |
| EEPROM | 4 KB |
| Largeur du bus de données | 16-bit |
| Tension d'alimentation | 2.35 V to 2.75 V (regulated core) |
| I/O Pins | 91 |
| ADC | 2 x 10-bit, 8 channels each (16 channels total) |
| Timers | 8-channel Enhanced Capture Timer (ECT) |
| Communication Interfaces | 2 x SCI (UART), 2 x SPI, 1 x I2C, 1 x CAN (MSCAN 2.0A/B) |
| Boîtier | 112-LQFP (20x20 mm) |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +125C (automotive grade) |
| Debug Interface | Background Debug Mode (BDM) + JTAG |
| Statut RoHS | Compliant |
| Statut du cycle de vie | NRND (Not Recommended for New Designs) |
Configuration des broches de MC9S12DT256MPVE
| Broche 1 | PP0/KWP0 — Port P bit 0 / KWP module |
| Broche 2 | PP1/KWP1 — Port P bit 1 / KWP module |
| Broche 3 | PP2/KWP2 — Port P bit 2 / KWP module |
| Broche 4 | PP3/KWP3 — Port P bit 3 / KWP module |
| Broche 5 | PP4/KWP4 — Port P bit 4 / KWP module |
| Broche 6 | PP5/KWP5 — Port P bit 5 / KWP module |
| Broche 7 | PP6/KWP6 — Port P bit 6 / KWP module |
| Broche 8 | PP7/KWP7 — Port P bit 7 / KWP module |
| Broche 9 | VDDR — External voltage regulator supply |
| Broche 10 | VSS — Digital ground |
| Broche 11 | VDDX — External I/O supply |
| Broche 12 | VSSX — I/O ground |
| Broche 13 | BKGD — Background Debug Mode pin |
| Broche 14 | RESET — External reset (active low) |
| Broche 15 | TEST — Test mode (must be held high in normal operation) |
| Broche 16 | XCLKS — Crystal select (high = Pierce mode) |
| Broche 17 | EXTAL — External crystal/oscillator input |
| Broche 18 | XTAL — Crystal output |
| Broche 19 | VRH — ATD reference high voltage |
| Broche 20 | VRL — ATD reference low voltage |
| Broche 21 | VDDA — ATD analog supply |
| Broche 22 | VSSA — ATD analog ground |
| Broche 23 | PAD00/AN00 — Port AD bit 0 / ATD0 channel 0 |
| Broche 24 | PAD01/AN01 — Port AD bit 1 / ATD0 channel 1 |
| Broche 25 | PAD02/AN02 — Port AD bit 2 / ATD0 channel 2 |
| Broche 26 | PAD03/AN03 — Port AD bit 3 / ATD0 channel 3 |
| Broche 27 | PAD04/AN04 — Port AD bit 4 / ATD0 channel 4 |
| Broche 28 | PAD05/AN05 — Port AD bit 5 / ATD0 channel 5 |
| Broche 29 | PAD06/AN06 — Port AD bit 6 / ATD0 channel 6 |
| Broche 30 | PAD07/AN07 — Port AD bit 7 / ATD0 channel 7 |
| Broche 31 | PAD08/AN08 — Port AD bit 8 / ATD1 channel 0 |
| Broche 32 | PAD09/AN09 — Port AD bit 9 / ATD1 channel 1 |
| Broche 33 | PAD10/AN10 — Port AD bit 10 / ATD1 channel 2 |
| Broche 34 | PAD11/AN11 — Port AD bit 11 / ATD1 channel 3 |
| Broche 35 | PAD12/AN12 — Port AD bit 12 / ATD1 channel 4 |
| Broche 36 | PAD13/AN13 — Port AD bit 13 / ATD1 channel 5 |
| Broche 37 | PAD14/AN14 — Port AD bit 14 / ATD1 channel 6 |
| Broche 38 | PAD15/AN15 — Port AD bit 15 / ATD1 channel 7 |
| Broche 39 | PA0 — Port A bit 0 |
| Broche 40 | PA1 — Port A bit 1 |
| Broche 41 | PA2 — Port A bit 2 |
| Broche 42 | PA3 — Port A bit 3 |
| Broche 43 | PA4 — Port A bit 4 |
| Broche 44 | PA5 — Port A bit 5 |
| Broche 45 | PA6 — Port A bit 6 |
| Broche 46 | PA7 — Port A bit 7 |
| Broche 47 | PB0 — Port B bit 0 |
| Broche 48 | PB1 — Port B bit 1 |
| Broche 49 | PB2 — Port B bit 2 |
| Broche 50 | PB3 — Port B bit 3 |
| Broche 51 | PB4 — Port B bit 4 |
| Broche 52 | PB5 — Port B bit 5 |
| Broche 53 | PB6 — Port B bit 6 |
| Broche 54 | PB7 — Port B bit 7 |
| Broche 55 | PE0/XIRQ — Port E bit 0 / XIRQ interrupt |
| Broche 56 | PE1/IRQ — Port E bit 1 / IRQ interrupt |
| Broche 57 | PE2 — Port E bit 2 |
| Broche 58 | PE3 — Port E bit 3 |
| Broche 59 | PE4 — Port E bit 4 |
| Broche 60 | PE5 — Port E bit 5 |
| Broche 61 | PE6 — Port E bit 6 |
| Broche 62 | PE7 — Port E bit 7 |
| Broche 63 | PH0 — Port H bit 0 |
| Broche 64 | PH1 — Port H bit 1 |
| Broche 65 | PH2 — Port H bit 2 |
| Broche 66 | PH3 — Port H bit 3 |
| Broche 67 | PH4 — Port H bit 4 |
| Broche 68 | PH5 — Port H bit 5 |
| Broche 69 | PH6 — Port H bit 6 |
| Broche 70 | PH7 — Port H bit 7 |
| Broche 71 | PJ0 — Port J bit 0 |
| Broche 72 | PJ1 — Port J bit 1 |
| Broche 73 | PJ2 — Port J bit 2 |
| Broche 74 | PJ3 — Port J bit 3 |
| Broche 75 | PJ4 — Port J bit 4 |
| Broche 76 | PJ5 — Port J bit 5 |
| Broche 77 | PJ6 — Port J bit 6 |
| Broche 78 | PJ7 — Port J bit 7 |
| Broche 79 | PK0 — Port K bit 0 |
| Broche 80 | PK1 — Port K bit 1 |
| Broche 81 | PK2 — Port K bit 2 |
| Broche 82 | PK3 — Port K bit 3 |
| Broche 83 | PK4 — Port K bit 4 |
| Broche 84 | PK5 — Port K bit 5 |
| Broche 85 | PK6 — Port K bit 6 |
| Broche 86 | PK7 — Port K bit 7 |
| Broche 87 | PM0/CAN0TX — Port M bit 0 / CAN0 transmit |
| Broche 88 | PM1/CAN0RX — Port M bit 1 / CAN0 receive |
| Broche 89 | PM2/SPI0SCK — Port M bit 2 / SPI0 clock |
| Broche 90 | PM3/SPI0MOSI — Port M bit 3 / SPI0 master-out slave-in |
| Broche 91 | PM4/SPI0MISO — Port M bit 4 / SPI0 master-in slave-out |
| Broche 92 | PM5/SPI0SS — Port M bit 5 / SPI0 slave select |
| Broche 93 | PM6 — Port M bit 6 |
| Broche 94 | PM7 — Port M bit 7 |
| Broche 95 | PS0/RXD0 — Port S bit 0 / SCI0 receive |
| Broche 96 | PS1/TXD0 — Port S bit 1 / SCI0 transmit |
| Broche 97 | PS2/RXD1 — Port S bit 2 / SCI1 receive |
| Broche 98 | PS3/TXD1 — Port S bit 3 / SCI1 transmit |
| Broche 99 | PS4/MISO1 — Port S bit 4 / SPI1 master-in slave-out |
| Broche 100 | PS5/MOSI1 — Port S bit 5 / SPI1 master-out slave-in |
| Broche 101 | PS6/SCK1 — Port S bit 6 / SPI1 clock |
| Broche 102 | PS7/SS1 — Port S bit 7 / SPI1 slave select |
| Broche 103 | PT0/IOC0 — Port T bit 0 / ECT channel 0 |
| Broche 104 | PT1/IOC1 — Port T bit 1 / ECT channel 1 |
| Broche 105 | PT2/IOC2 — Port T bit 2 / ECT channel 2 |
| Broche 106 | PT3/IOC3 — Port T bit 3 / ECT channel 3 |
| Broche 107 | PT4/IOC4 — Port T bit 4 / ECT channel 4 |
| Broche 108 | PT5/IOC5 — Port T bit 5 / ECT channel 5 |
| Broche 109 | PT6/IOC6 — Port T bit 6 / ECT channel 6 |
| Broche 110 | PT7/IOC7 — Port T bit 7 / ECT channel 7 |
| Broche 111 | VDDR — External voltage regulator supply |
| Broche 112 | VSS — Digital ground |
Applications typiques
MC9S12DT256MPVE convient pour 7 applications: Automotive Body Control Module (BCM), Instrument Cluster Display Controller, HVAC Climate Control Module, Automotive Lighting Module (Front/Rear Lamp ECU), Industrial CAN Node / PLC Slice, Battery Management Secondary Cell Monitor, Chassis / Suspension ECU.
Automotive Body Control Module (BCM)
The MC9S12DT256MPVE is well suited to automotive body control modules because of its 16-bit HCS12 core, 256 KB Flash, and integrated MSCAN 2.0A/B CAN controller. The DT variant's two 10-bit 8-channel ADCs let the BCM read multiple analog sensor inputs (door position, ambient light, temperature) while the ECT module handles PWM-driven outputs for window lifters, mirror adjusters, and seat motors. With 91 GPIO and two SCI/SPI modules, a single MCU can supervise door modules, lighting clusters, and RKE receivers without external expanders. The -40C to +125C automotive temperature grade and 112-LQFP package with thermal copper spreader support under-hood mounting. Compared to a 32-bit ARM Cortex-M solution, the HCS12 is cheaper per unit and has a longer automotive track record across the S12 family.
Recommandé
Instrument Cluster Display Controller
The MC9S12DT256MPVE drives segment-LCD or small TFT instrument clusters thanks to its enhanced capture timer, dual ADCs for fuel/temperature sensing, and SCI/SPI channels for cluster stepper-motor drivers. The 256 KB Flash stores lookup tables for the speedometer, tachometer, and warning-icon bitmaps, while the 12 KB RAM holds real-time frame buffers and stepper PWM states. The MSCAN module receives vehicle CAN messages at up to 1 Mbps from the BCM and powertrain ECUs, and the ECT module provides 8 channels of precise PWM for gauge stepper drive. With automotive-grade temperature and the 112-LQFP footprint, this MCU replaces discrete dashboards of older designs and fits the same PCB layout as the XDT256 successor.
Recommandé
HVAC Climate Control Module
HVAC climate control ECUs benefit from the MC9S12DT256MPVE's dual 10-bit ADCs (16 channels), which can read cabin temperature, ambient temperature, sun-load sensor, humidity probe, and evaporator thermistor simultaneously. The ECT generates up to 8 PWM channels for blower-speed control, mode-door actuators, and air-recirculation stepper control, while the SCI modules communicate with the cabin network and the I2C bus connects to digital temperature sensors and EEPROM storage. The 256 KB Flash holds the climate-control state machine and PID loops, and the -40C to +125C rating covers the under-dash thermal environment. Compared to an 8-bit MCU, the HCS12's 16-bit math shortens PID loop calculation time, improving temperature stability.
Recommandé
Automotive Lighting Module (Front/Rear Lamp ECU)
The MC9S12DT256MPVE drives LED matrix headlamps and rear lamp clusters via its 91 GPIO pins and 8 PWM-capable ECT channels, supporting sequential turn indicators, daytime running lights, and adaptive cornering lamps. The two ATDs provide closed-loop current sensing for LED strings, enabling per-string brightness calibration across the LED matrix, while the MSCAN module receives body-CAN lighting commands at 500 kbps typical. With 256 KB Flash for lighting algorithms and 4 KB EEPROM for fault-log retention, this MCU satisfies automotive lighting ECU requirements. The 112-LQFP package allows placement near the lamp driver with short analog traces, and the same family layout is reused across other lamp-ECU variants for scalable BOM.
Recommandé
Industrial CAN Node / PLC Slice
Outside automotive, the MC9S12DT256MPVE functions as a robust industrial CANopen or DeviceNet node for programmable logic controllers, motor starters, and sensor hubs. The MSCAN controller and 25 MHz HCS12 core handle 1 Mbps CAN traffic with deterministic 40 ns instruction cycles, while the ECT generates precise PWM outputs for valve and actuator control. The 91 GPIO pins and dual SCI/SPI let one MCU read multiple encoder feedback channels, drive IGBT gate drivers, and talk to a remote HMI display over SPI. With 256 KB Flash and 12 KB RAM, custom CANopen object dictionaries fit comfortably. The -40C to +125C temperature range covers factory-floor enclosures, and the 112-LQFP package is easy to hand-rework on industrial control boards.
Recommandé
Battery Management Secondary Cell Monitor
In battery-management subsystems the MC9S12DT256MPVE acts as a secondary-cell monitor supervisor that reads multiple cell voltages through the dual 10-bit ATDs (16 channels total), balances cell groups via ECT-driven MOSFET drivers, and reports cell status to the main BMS ECU over CAN. The 256 KB Flash holds cell-characterization tables, state-of-charge algorithms, and fault logs in the 4 KB EEPROM. The wide automotive temperature grade (-40C to +125C) handles under-hood and under-seat battery-pack environments. The 112-LQFP package provides enough GPIO to monitor 12 to 16 series cells without external multiplexer ICs, and the same S12DT family layout is reused across 12V, 24V, and 48V battery variants.
Recommandé
Chassis / Suspension ECU
The MC9S12DT256MPVE fits active suspension and chassis ECUs that require simultaneous high-speed ADC sampling of multiple damper-position sensors and precise ECT-driven actuator control. Two 10-bit ADCs (16 channels) read suspension-height sensors at 25 MHz system clock rates, while the ECT generates up to 8 PWM channels for proportional solenoid valves and DC motor drivers. MSCAN at 1 Mbps provides the real-time chassis-network link to the BCM and powertrain ECUs, and the 91 GPIO handle additional discrete I/O. The -40C to +125C temperature grade and 112-LQFP footprint suit wheel-well mounted ECUs, and the S12DT family pin-compatibility allows the same PCB layout across vehicle platforms with different memory/peripheral needs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12DT256MPVE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12DT256CPVE | MC9S12DT256MFUE | MC9S12DJ256MPVE | MC9S12XDT256VAA | MC9S12DG256MFUE |
|---|---|---|---|---|---|---|
| Package | 112-LQFP (20x20) | 112-LQFP (20x20) - same | 112-LQFP / QFP-112 - same | 112-LQFP (20x20) - same | 112-LQFP family - same | 112-QFP (S12D) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | HCS12 (16-bit) | HCS12 (16-bit) | HCS12 (16-bit) | HCS12 (16-bit) | HCS12X (16-bit, XGATE) | HCS12 (16-bit) |
| Maximum CPU Frequency | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 80 MHz (3.2x) | 25 MHz |
| Flash | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| ADC | 2 x 10-bit, 8 ch each (16 total) | 2 x 10-bit, 8 ch each | 2 x 10-bit, 8 ch each | 1 x 10-bit, 8 ch | 2 x 10-bit, 8 ch each | 1 x 10-bit, 8 ch |
| CAN (MSCAN) Module | 1 (CAN 2.0A/B) | 1 (CAN 2.0A/B) | 1 (CAN 2.0A/B) | 1 (CAN 2.0A/B) | 1 (CAN 2.0A/B) | 1 (CAN 2.0A/B) |
| Lifecycle Status | NRND | NRND | NRND | NRND | Active (recommended for new designs) | NRND |
| Operating Temperature | -40C to +125C | -40C to +85C (commercial) | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
Principaux différenciateurs
- Dual ATD (16 ADC channels) for analog sensor-dense applications (vs MC9S12DJ256MPVE)
- Direct HCS12X upgrade path on the same 112-LQFP footprint (vs MC9S12XDT256VAA)
- Established automotive-grade track record with full peripheral block (vs MC9S12A128BCPV)
- Functionally equivalent XDT256MA-grade variant per independent comparison (vs MC9S12XDT256MAL)
Notes de conception
The MC9S12DT256MPVE requires an external 5V (VDDR/VDDX) supply with on-chip regulation to generate the 2.5V core voltage. Place 100 nF decoupling capacitors within 5 mm of every VDDA/VDDR/VDDX pin pair and a 10 uF bulk tantalum on VDDR. Per NXP AN2203 (S12 power-supply design), analog and digital grounds must connect at a single point near the MCU to minimize ADC noise. Estimated: at 25 MHz CPU clock the MCU draws approximately 30 mA active and 1 mA in stop mode; size the regulator for at least 100 mA peak.
Use a 4-layer PCB with a continuous ground plane beneath the 112-LQFP footprint to control impedance and provide thermal spreading. Route the EXTAL/XTAL traces as short symmetric differential pairs with grounded guard traces; keep them away from PWM and switching traces. The BKGD and RESET pins require 4.7 kohm pull-ups and should not be routed near high-frequency noise sources. According to NXP AN2469 (PCB layout for S12 MCUs), place the PLL filter capacitor within 10 mm of the MCU's VDDA/VDDR pins.
Do not leave the TEST pin floating; tie TEST high through a 4.7 kohm resistor to VDDR or the MCU may enter test mode at power-up. The XCLKS pin selects oscillator mode (low = external oscillator, high = Pierce/crystal) and must match your clock-source design. Avoid using SCI1 and SPI1 pins for GPIO if CAN (PM0/PM1) is also enabled, because the S12D peripheral-pin-mapping can re-route conflicting functions. Always re-validate any pinout change against the latest S12DT family reference manual.
For CAN bus at 1 Mbps, keep the MSCAN TX/RX traces (PM0/PM1) shorter than 50 mm and add 22 ohm series termination near the MCU side. Place the CAN transceiver (e.g., TJA1050/TJA1042) within 50 mm of the MCU and twist the CANH/CANL differential pair to the bus connector. For ADC channels, route analog traces away from digital switching traces and add a ground guard trace on each side to reduce digital-to-analog crosstalk below 1 LSB at 10-bit resolution.
Informations de conformité
RoHS and REACH compliant per NXP product page. AEC-Q100 qualified for automotive applications (Grade 1: -40C to +125C). Lead-free LQFP package. Lifecycle status NRND per NXP product page (last verified 2026-10-17).
