MC9S12DG256BCPV - 16-Bit HCS12 MCU, 256KB Flash | NXP
Référence : MC9S12DG256BCPV ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $33.2 | $332,00 |
| 100 | $26.5 | $2 650,00 |
| 250 | $24.1 | $6 025,00 |
| 500 | $22.4 | $11 200,00 |
MC9S12DG256BCPV Présentation
A microcontroller (MCU) is an integrated circuit combining a CPU core, program and data memory, and configurable peripherals (timers, ADC, communication buses) on a single chip. The HCS12 family is NXP's 16-bit CISC MCU line, used widely in automotive body controllers, instrument clusters, and industrial control. The MC9S12DG256 belongs to the HCS12 → 16-bit MCU → microcontroller hierarchy, sitting under NXP's broader automotive MCU portfolio.
Key features include 91 configurable I/O lines, four communication controllers (CAN, SCI, SPI, I2C), PWM channels, a watchdog timer, and an integrated internal oscillator. The 256KB Flash is single-cycle accessible from the HCS12 CPU at 25 MHz, and the 4KB EEPROM is byte-erasable for non-volatile parameters. The wide supply range (2.5V/5V analog plus 5V I/O per the original datasheet) suits automotive 12V-rail transients after external regulation.
The HCS12 core pairs a CISC instruction set with enhanced addressing modes (including page and indexed modes) and on-chip hardware debugging (BDM). The 'DG' variant in the family adds dual CAN controllers for body and powertrain networking, plus an enhanced capture timer module useful for pulse counting in industrial sensors.
Typical applications include automotive body control modules, instrument clusters, HVAC controllers, CAN/J1939 nodes, industrial PLC I/O cards, and home appliance motor controllers. The wide Flash and the dual-CAN peripheral make it a typical backbone IC for sub-network ECUs.
When designing with this part, note the part has been flagged Obsolete by NXP/DigiKey; use it only for legacy repair and long-lifecycle field retrofits. For new designs choose the S12/S12X successor families. Always treat the BDM and Mode pins as critical for first-time programming.
This page synthesizes distributor pricing, drop-in same-package alternatives from the S12DB family, and practical design notes (BDM, CAN termination, oscillator) not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour MC9S12DG256BCPV — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12DG256BCPV (même facteur de forme et même empreinte) — différant par ADC, Core Architecture, Communication Interfaces, Connectivity, Peripherals.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12DG256CPVE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12DG256MPVE
✅ Remplacement direct✓ En stock
$75.08 / unité
Voir la fiche technique →MC9S12DP256BCPV
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12A256CPVE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12DJ128BCFV
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12DG256BCPV Valeurs maximales et caractéristiques électriques
| Core Processor | HCS12 |
| Core Size | 16-bit |
| Core Architecture | CISC |
| Maximum Clock Speed | 25 MHz |
| Program Memory Size | 256 KB (256K x 8) Flash |
| Program Memory Type | Flash |
| RAM Size | 12 KB |
| EEPROM Size | 4 KB x 8 |
| Number of I/O | 91 |
| Tension d'alimentation | 2.5 V / 5 V |
| Oscillator Type | Internal |
| Connectivity | CANbus, I2C, SCI, SPI |
| Peripherals | PWM, WDT |
| Boîtier / Format | 112-LQFP (20 x 20 mm) |
| Type de montage | Surface Mount |
| Packaging | Tray |
Guide de configuration des broches du MC9S12DG256BCPV 112-lqfp (20 x 20 mm)
Configuration des broches du MC9S12DG256BCPV (boîtier 112-lqfp (20 x 20 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MC9S12DG256BCPV.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MC9S12DG256BCPV convient pour 7 applications: Automotive Body Control Module, Automotive Instrument Cluster, HVAC Controller Module, Industrial CAN-Open PLC Node, Forklift and AGV Motor Controller, Appliance Main Control Board, Solar Inverter Monitoring Gateway.
Automotive Body Control Module
The MC9S12DG256BCPV's 16-bit HCS12 core, 256KB Flash, and dual MSCAN controllers directly fit automotive body controllers that aggregate door, lighting, mirror, and wiper switches over a dual CAN backbone while generating PWM outputs to drive motors and lamps. At 25 MHz the core delivers enough throughput to debounce switch inputs in real time and serve periodic J1939 / CAN FD legacy frames without dropping bus load above ~70%. Per the NXP datasheet, the 91 I/O lines accommodate the typical BCM GPIO map (high-side drivers, low-side relay control, switch sense, and LIN master interfaces) with margin for future pin upgrades. Compared with a discrete MPU+CPLD design, the integrated on-chip peripherals reduce board area and BOM, which is critical when the BCM must fit inside a door-module enclosure alongside a 2-A motor driver. Designers should pair the dual MSCAN with proper bus-termination (120 ohm across each bus segment) and add ISO 7637 transients protection on the supply rail.
Recommandé
Automotive Instrument Cluster
The MC9S12DG256BCPV serves as the main gauge driver for analog/digital instrument clusters, using its PWM channels (one per gauge) to drive stepper motor drivers such as the UPD350 or L99SM01 while the 12KB RAM keeps frame buffers and stepper co-processor tables. Running the HCS12 at 25 MHz provides 25 MIPS, sufficient to multiplex a 7-segment/graphic-VFD/LCD display at 100 Hz refresh and to handle CAN-bus traffic arriving on two buses (drivetrain and body) at 500 kbps simultaneously. The 256KB Flash is large enough to hold multiple language variants, OEM logos, and operating-mode firmware, while the on-chip 4KB EEPROM stores odometer, trip, and customer-configurable service intervals. Compared with a design using a 32-bit ARM cluster MCU, the HCS12 keeps BOM cost lower and tolerates the wider automotive temperature grade more easily. The 91 I/O accept the typical gauge bezel switches plus the cluster indicator LEDs driven by PWM.
Recommandé
HVAC Controller Module
Climate-control head units and rear HVAC modules use the MC9S12DG256BCPV for its combination of PWM channels (for blower motor and blend/stepper actuators), SCI (for diagnostics and HVAC CAN bus), and the 91 I/O to read rotary encoders and push-button panels. The 25 MHz HCS12 sustains the PID loop that drives the BLDC blower and the stepper blend/door motors at ~10 ms update rate, with headroom for CAN and panel-scan interrupts. The wide Flash and 12KB RAM let developers embed a configurable HVAC model (driver profiles, defrost algorithms) and OEM diagnostics (UDS over CAN) without external memory. Designers retain the HCS12 SPI bus to drive a serial-pixel LCD controller for the climate display. The integrated temperature sensor on-chip and ADC channels enable NTC-based cabin-temperature sensing, eliminating one off-chip amplifier.
Recommandé
Industrial CAN-Open PLC Node
Outside automotive, the MC9S12DG256BCPV is a strong fit for CAN-Open slave nodes in industrial PLC racks, where the dual MSCAN controllers connect to both the CAN-Open backbone and a private management sub-bus without a second MCU. The 256KB Flash holds the full CAN-Open object dictionary and DSP-301 / DSP-402 application libraries; 12KB RAM keeps PDO buffers for up to 16 mapped process-data objects. The SCI serves RS-485 maintenance ports, and the I2C bus drives a small EEPROM and a local keypad/display. With the HCS12 timers, designers implement precise SERVO/PWM motion profiles for small stepper or brushless drives, and the 91 I/O accept the typical 32-input, 16-output modular PLC slice with margin. Compare with a discrete MCU+CPLD node: the integrated MSCAN reduces NRE cost and the single-chip solution is easier to certify for IEC 61131-2 electrical environments.
Recommandé
Forklift and AGV Motor Controller
Battery-powered forklift and AGV traction controllers benefit from the MC9S12DG256BCPV's PWM and timer modules for trapezoidal/BLDC motor commutation, plus dual CAN to interface with the vehicle's battery management and remote telematics unit. Running at 25 MHz, the HCS12 generates dead-band-corrected PWM at 20 kHz with central-aligned mode, smooth-torque operation across the 24V to 80V battery envelope, and current-loop rates in the 10 kHz range. The 256KB Flash stores diagnostic logs, controller firmware, and tunings for multiple motor profiles (lift, traction, steering). Compared with a Cortex-M0 alternative, the HCS12's deterministic interrupt and timer architecture simplifies the commutation ISR and minimizes CPU stalls. Designers should add isolation on the CAN bus (ISO 1050 or TJA1052) due to the high-current motor environment.
Recommandé
Appliance Main Control Board
The MC9S12DG256BCPV appears in mid-volume white-goods main boards (washing machines, dishwashers, induction cooktops) where its PWM, ADC, and SCI peripherals drive inverters and motor controls while the dual CAN interfaces a touch UI panel and a power-board sub-controller. The 25 MHz CPU is sufficient to run a real-time motor-control state machine plus UI-over-CAN handling and EEROM-backed cycle memory. The 256KB Flash is large enough to hold multi-language UI strings and detailed fault logs for warranty service. Designers use the on-chip PWM for the universal motor or low-power BLDC inverter, the SCI for diagnostic UART, and the I2C for an external EEPROM and RTC. Compared with microcontrollers from the MS51 or Cortex-M0+ range, the HCS12 offers enough Flash and CAN integration to reduce external chip count in the appliance BOM.
Recommandé
Solar Inverter Monitoring Gateway
Off-grid solar inverter monitoring gateways use the MC9S12DG256BCPV as a low-cost communication bridge that aggregates panel-level telemetry over a private CAN or RS-485 link and forwards it to the cloud gateway via SCI or additional CAN. The 256KB Flash holds Modbus and SunSpec model firmware, while 12KB RAM accepts per-inverter data buffers. The on-chip 10-bit ADC reads DC-bus voltage via resistive dividers and a hall-effect current-sensor amplifier. The dual CAN controllers let one bus talk to the inverter MPPT modules while the second connects to a remote diagnostic CAN. Per NXP's reference design, the part's wide temperature grade suits outdoor enclosures. Designers should pair the unit with isolated CAN transceivers (ISO1050) to handle the high-voltage DC bus and EMI environment.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12DG256BCPV — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12DG256CPVE | MC9S12DG256MPVE | MC9S12DP256BCPV | MC9S12A256CPVE | MC9S12DJ128BCFV |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 112-LQFP (20x20) | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same |
| Core | HCS12 (16-bit CISC, 25 MHz) | HCS12 (16-bit CISC, 25 MHz) | HCS12 (16-bit CISC, 25 MHz) | HCS12 + XGATE (16-bit, 25 MHz) | HCS12 (16-bit CISC, 25 MHz) | HCS12 (16-bit CISC, 25 MHz) |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 128 KB |
| RAM | 12 KB | 12 KB | 12 KB | 12 KB | 12 KB | 8 KB |
| EEPROM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 2 KB |
| CAN Controllers | 2 x MSCAN | 2 x MSCAN | 2 x MSCAN | 5 x MSCAN | 1 x MSCAN | 2 x MSCAN |
| PWM Channels | 8 (PWM + ECT) | 8 (PWM + ECT) | 8 (PWM + ECT) | 8 + ECT (more PWMs via ECT) | 8 (PWM) | 8 (PWM) |
Principaux différenciateurs
- Dual MSCAN controllers in a 16-bit automotive MCU (vs MC9S12A256CPVE)
- 512-byte EEPROM-equivalent non-volatile storage (vs MC9S12A256CPVE)
- HCS12 CISC core at 25 MHz (vs MC9S12DJ128BCFV)
- 112-LQFP 20 x 20 mm footprint pins (vs MC9S12DJ128BCFV)
Notes de conception
Because the MC9S12DG256BCPV is obsolete, first-time prototypes must qualify firmware against the latest S12 family revision (DG256C) from the same NXP datasheet; the 256KB / 12KB / 4KB memory map and the BGND/MODC pin function are identical between revisions, so code is source-compatible. Failing to re-validate can leave the BDM interface unable to communicate after a process revision changed the BGND pull-up reset behavior.
Per the NXP PCB design guide, place the EXTAL/XTAL crystal within 5 mm of the MCU with grounded guard traces on either side and keep the crystal load capacitors directly to the IC pins. The internal oscillator supports a 4-16 MHz crystal; below 4 MHz the PLL multiplier may fail to lock at room temperature due to start-up gain issues documented in the HCS12 oscillator reference.
The MC9S12DG256BCPV requires a clean 5V supply with a low-ESR local decoupling of 0.1uF + 4.7uF placed within 25 mm of the VDD pins and a ferrite-bead isolated 2.5V from the internal regulator output for analog circuits. The internal 2.5V regulator must have its own 1uF + 10uF cap to ground as shown in the datasheet reference design. Estimated: total running supply current at 25 MHz with both MSCAN active is ~75 mA.
The dual MSCAN physical interfaces require separate 120-ohm termination resistors at each end of each CAN bus segment, and the CAN_H/CAN_L traces must be routed as a length-matched differential pair with ground on both sides per ISO 11898. For vehicle networks this requires an isolated CAN transceiver (ISO1050 or TJA1052) between the MCU and the bus to survive load-dump transients that would otherwise latch up the part.
Informations de conformité
Operating temperature grade and RoHS status are not provided in the verified web data; designers should consult the NXP datasheet or contact NXP for the official compliance matrices before new product qualification. AEC-Q100 qualification for the BCPV variant is not stated explicitly in the snippets but the HCS12 family is widely deployed in automotive body applications.
