AVIS DE DERNIER ACHAT : MC9S12XDG128MAA approche de sa fin de vie. Date de dernière commande : Contactez-nous. Voir les références alternatives disponibles →
NXP Semiconductors

MC9S12XDG128MAA - 16-bit HCS12X MCU, 128KB Flash, 80MHz, 80-QFP | NXP

Référence : MC9S12XDG128MAA ✗ Fin de vie
En stock Expédié sous 1 à 3 jours ouvrés
2.5 V or 5 V (single supply with internal regulator) Vdss 80-pin QFP (14 x 14 mm), MAA suffix Package 80 MHz (40 MHz bus) Speed 128 KB (128K x 8) Memory
À partir de $10.45 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-10-18
Tarifs dégressifs
Qté Prix unitaire Total
1 $18.42 $18,42
10 $16.85 $168,50
100 $14.2 $1 420,00
500 $12.1 $6 050,00
1 000 $10.45 $10 450,00
ℹ️ Tous les prix sont en USD

MC9S12XDG128MAA Présentation

The NXP MC9S12XDG128MAA is a 16-bit HCS12X family microcontroller IC featuring an enhanced HCS12X CPU core running at 80MHz, with 128KB of on-chip Flash memory and 12KB of RAM, housed in an 80-pin QFP (14x14mm) package. It is part of the S12XD sub-family and is engineered for industrial and automotive embedded applications requiring deterministic real-time control and CAN connectivity.

An MCU (microcontroller unit) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), and a rich set of peripherals such as timers, ADC, communication interfaces (CAN, SPI, SCI, I2C), and GPIO. The HCS12X architecture from Freescale (now NXP) is a 16-bit CISC core that is upward-compatible with the legacy HC12/HCS12 instruction set, with enhancements including an instruction queue, enhanced indexed addressing, and interrupt stacking identical to the HCS12 programmer's model. The X-variant adds a peripheral co-processor (XGATE) for offloading interrupt-driven tasks.

Key features include 128KB (128K x 8) of in-application programmable Flash, 12KB of RAM, an Enhanced Capture Timer (ECT), an 8-channel 10-bit ADC, multiple CAN 2.0 modules (msCAN), J1850/SCI/SPI interfaces, and an integrated voltage regulator for single 5V or 3.3V operation. The device supports background debug mode (BDM) and single-wire debug, simplifying in-circuit development and field updates.

The S12XD architecture uses a unified memory map with Flash, RAM, and EEPROM in a single address space, and includes a Memory Protection Unit (MPU) and ECC on the Flash array. The XGATE co-processor can execute data-movement and peripheral-handling routines independently, freeing the main CPU for control-loop tasks. The 80-QFP (MAA suffix) package provides 80 general-purpose I/O lines with 5V tolerant inputs.

Typical applications include automotive body and chassis ECUs, industrial CAN node controllers, building automation gateways, motor control (BLDC/PMSM) with CAN, and sensor-fusion nodes. Designers often pair the XGATE with an msCAN handler to achieve deterministic bus latency below 50 microseconds. Per the NXP product page, this part is flagged as End of Life and is not recommended for new designs - choose S12XEP or S12XET active variants for new programs.

Alternatives de remplacement direct pour MC9S12XDG128MAA — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec MC9S12XDG128MAA (même facteur de forme et même empreinte) — différant par Operating Temperature, Package.

NXP Semiconductors
Operating Temperature: -40C to +125C (TA)
Package: 80-QFP (14x14 mm), Square, Gull Wing
Comparer avec MC9S12XDG128MAA →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

MC9S12XDG128CAA

✅ Remplacement direct
📦 80-QFP (14x14)
Same S12XD die and 80-QFP MAA footprint, commercial temperature grade (0C to +70C) vs -40C to +125C industrial grade; pin-to-pin compatible

📋 Alternative de référence (hors catalogue)

MC9S12XDT512MAA

✅ Remplacement direct
NXP Semiconductors
📦 80-QFP (14x14)
HCS12X · 16-Bit · 80 MHz · 512KB (512K x 8) · FLASH · 20KB · 4KB · CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI

✓ En stock

Contactez-nous pour le prix

Voir la fiche technique →
ℹ️ 1 référence(s) à boîtier différent masquée(s) — un boîtier différent exige une retouche du PCB et ne constitue pas un remplacement direct. Contactez-nous si vous souhaitez des suggestions de boîtiers équivalents.

MC9S12XDG128MAA Valeurs maximales et caractéristiques électriques

Core Architecture HCS12X (16-bit CISC, enhanced)
CPU Core S12X with XGATE co-processor
Maximum CPU Frequency 80 MHz (40 MHz bus)
Program Memory (Flash) 128 KB (128K x 8)
RAM 12 KB
Operating Voltage 2.5 V or 5 V (single supply with internal regulator)
Boîtier 80-pin QFP (14 x 14 mm), MAA suffix
Type de montage Surface Mount
Communication Interfaces CAN, SCI, SPI, I2C, J1850
Température de fonctionnement -40C to +125C (industrial / automotive grade)
Statut RoHS Compliant
Background Debug Mode Yes (BDM, single-wire)
Instruction Set Compatibility Upward-compatible with HCS12, instruction queue, enhanced indexed addressing

Configuration des broches de MC9S12XDG128MAA

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Broche 1 BKGD — Background Debug Mode pin
Broche 2 VDDR — Voltage regulator supply
Broche 3 VDD — Digital supply voltage
Broche 4 VSS — Digital ground
Broche 5 RESET — External reset input, active low
Broche 6 XTAL — Crystal oscillator input
Broche 7 EXTAL — Crystal oscillator input
Broche 8 VSSXOSC — Crystal oscillator ground
Broche 9 TEST — Test mode pin (must be tied to VSS in normal operation)
Broche 10 PE0/XIRQ — Port E bit 0 / non-maskable interrupt
Broche 11 PE1/IRQ — Port E bit 1 / maskable interrupt
Broche 12 PE2 — Port E bit 2
Broche 13 PE3 — Port E bit 3
Broche 14 PE4 — Port E bit 4
Broche 15 PE5 — Port E bit 5
Broche 16 PE6 — Port E bit 6
Broche 17 PE7 — Port E bit 7
Broche 18 PAD00/AN00 — Port AD bit 0 / ADC channel 0
Broche 19 PAD01/AN01 — Port AD bit 1 / ADC channel 1
Broche 20 PAD02/AN02 — Port AD bit 2 / ADC channel 2
Broche 21 PAD03/AN03 — Port AD bit 3 / ADC channel 3
Broche 22 PAD04/AN04 — Port AD bit 4 / ADC channel 4
Broche 23 PAD05/AN05 — Port AD bit 5 / ADC channel 5
Broche 24 PAD06/AN06 — Port AD bit 6 / ADC channel 6
Broche 25 PAD07/AN07 — Port AD bit 7 / ADC channel 7
Broche 26 PAD08/AN08 — Port AD bit 8 / ADC channel 8
Broche 27 PAD09/AN09 — Port AD bit 9 / ADC channel 9
Broche 28 PAD10/AN10 — Port AD bit 10 / ADC channel 10
Broche 29 PAD11/AN11 — Port AD bit 11 / ADC channel 11
Broche 30 PAD12/AN12 — Port AD bit 12 / ADC channel 12
Broche 31 PAD13/AN13 — Port AD bit 13 / ADC channel 13
Broche 32 PAD14/AN14 — Port AD bit 14 / ADC channel 14
Broche 33 PAD15/AN15 — Port AD bit 15 / ADC channel 15
Broche 34 VDDA — Analog supply voltage
Broche 35 VSSA — Analog ground
Broche 36 VRH — ADC reference high voltage
Broche 37 VRL — ADC reference low voltage
Broche 38 PM0 — Port M bit 0
Broche 39 PM1 — Port M bit 1
Broche 40 PM2 — Port M bit 2
Broche 41 PM3 — Port M bit 3
Broche 42 PM4 — Port M bit 4
Broche 43 PM5 — Port M bit 5
Broche 44 PM6 — Port M bit 6
Broche 45 PM7 — Port M bit 7
Broche 46 PJ0 — Port J bit 0
Broche 47 PJ1 — Port J bit 1
Broche 48 PJ2 — Port J bit 2
Broche 49 PJ3 — Port J bit 3
Broche 50 PJ4 — Port J bit 4
Broche 51 PJ5 — Port J bit 5
Broche 52 PJ6 — Port J bit 6
Broche 53 PJ7 — Port J bit 7
Broche 54 PK0 — Port K bit 0
Broche 55 PK1 — Port K bit 1
Broche 56 PK2 — Port K bit 2
Broche 57 PK3 — Port K bit 3
Broche 58 PK4 — Port K bit 4
Broche 59 PK5 — Port K bit 5
Broche 60 PK6 — Port K bit 6
Broche 61 PK7 — Port K bit 7
Broche 62 PA0 — Port A bit 0
Broche 63 PA1 — Port A bit 1
Broche 64 PA2 — Port A bit 2
Broche 65 PA3 — Port A bit 3
Broche 66 PA4 — Port A bit 4
Broche 67 PA5 — Port A bit 5
Broche 68 PA6 — Port A bit 6
Broche 69 PA7 — Port A bit 7
Broche 70 PB0 — Port B bit 0
Broche 71 PB1 — Port B bit 1
Broche 72 PB2 — Port B bit 2
Broche 73 PB3 — Port B bit 3
Broche 74 PB4 — Port B bit 4
Broche 75 PB5 — Port B bit 5
Broche 76 PB6 — Port B bit 6
Broche 77 PB7 — Port B bit 7
Broche 78 PC0 — Port C bit 0
Broche 79 PC1 — Port C bit 1
Broche 80 PC2 — Port C bit 2

Applications typiques

MC9S12XDG128MAA convient pour 6 applications: Automotive Body Control Module, Industrial CAN Node Controller, BLDC / PMSM Motor Controller, Building Automation Gateway, Sensor Fusion Node with CAN Output, HVAC and Climate Control ECU.

🚗

Automotive Body Control Module

The MC9S12XDG128MAA's S12X core with XGATE co-processor and multiple msCAN 2.0 modules make it well suited to automotive body and chassis ECUs. The XGATE handles msCAN message buffering and PWM updates in parallel, freeing the main S12X CPU for BCM logic such as lighting control, central locking, and door module coordination. The 128KB Flash accommodates a CANopen or J1939 stack plus application logic; 12KB RAM is sufficient for runtime buffers. The 80-QFP MAA package is the industry-standard automotive MCU footprint used across BCM suppliers, simplifying harness and PCB reuse. The device operates over -40C to +125C, covering under-hood and cabin requirements.

🏭

Industrial CAN Node Controller

For industrial CANopen or DeviceNet nodes, the MC9S12XDG128MAA offers the S12X 16-bit CPU at 80MHz (40MHz bus) and on-chip msCAN modules, removing the need for an external CAN controller. The XGATE co-processor services CAN message objects, achieving deterministic bus latency under 50us which is critical for real-time industrial protocols. 128KB Flash holds a CANopen stack plus device-specific profiles; 12KB RAM supports PDO buffers. Single 5V supply with internal 2.5V regulator simplifies power tree design in 24V industrial systems with intermediate buck regulation.

⚡

BLDC / PMSM Motor Controller

The MC9S12XDG128MAA's Enhanced Capture Timer (ECT) with PWM outputs is well matched to 3-phase BLDC and PMSM motor commutation. XGATE offloads ADC sequencing and current-sense sampling so the main S12X CPU runs the FOC algorithm without jitter. The 8-channel 10/12-bit ADC handles phase current feedback, while msCAN provides the bus interface to a supervisory controller. The 80-QFP MAA footprint is a common automotive motor-control land pattern, allowing reuse across pump, fan, and small traction drives. Designers often pair the MCU with a 3-phase gate driver such as the MC33937.

🧩

Building Automation Gateway

The MC9S12XDG128MAA is used as a sub-network gateway in building automation, bridging BACnet, LonWorks, or KNX segments to a backbone IP or CAN bus. Its multiple serial interfaces (SCI x2, SPI, I2C) handle sensor and transceiver side-channels while msCAN carries the backbone traffic. The 128KB Flash supports BACnet application code plus configuration tables; 12KB RAM holds routing buffers. XGATE offloads the serial-character parsing routines, enabling the main CPU to focus on routing logic. The wide operating temperature range supports unconditioned mechanical rooms and outdoor enclosures.

📱

Sensor Fusion Node with CAN Output

In automotive ADAS sensor nodes and chassis sensors, the MC9S12XDG128MAA aggregates IMU, pressure, and wheel-speed data and reports over CAN. The S12X core at 80MHz runs Kalman filter routines; XGATE services SPI/I2C sensor reads and msCAN message buffering deterministically. The 8-channel ADC handles analog sensor inputs such as throttle position and brake pressure. 128KB Flash is sufficient for sensor drivers and a small CAN-based diagnostic stack; 12KB RAM holds filter state. The 80-QFP MAA package fits within tight sensor-housing PCBs and supports -40C to +125C automotive temperature range.

🚗

HVAC and Climate Control ECU

Automotive HVAC ECUs use the MC9S12XDG128MAA to drive blower motors, blend doors, and temperature sensors while communicating over CAN with the body controller. The ECT and PWM outputs control actuator drivers; msCAN provides body network connectivity. 128KB Flash stores the climate control algorithm and CAN diagnostics; 12KB RAM holds sensor tables. XGATE handles PWM duty-cycle updates so the main CPU runs the thermal model without jitter. The -40C to +125C range and 80-QFP MAA footprint suit under-dash automotive mounting requirements.

Récapitulatif des produits recommandés

TJA1050T High-speed CAN transceiver Utilisé dans : Automotive Body Control Module MC9S12XDT512MAA NXP Semiconductors Utilisé dans : Automotive Body Control Module SN65HVD230 3.3V CAN transceiver for industrial bus Utilisé dans : Industrial CAN Node Controller TPS5430DDA 24V to 5V buck regulator for industrial supply Utilisé dans : Industrial CAN Node Controller MC33937 3-phase gate driver for BLDC/PMSM Utilisé dans : BLDC / PMSM Motor Controller MC9S12XEQ384CAG NXP Semiconductors Utilisé dans : BLDC / PMSM Motor Controller MAX3485 RS-485 transceiver for BACnet MS/TP Utilisé dans : Building Automation Gateway MC9S12DT128MPVE NXP Semiconductors Utilisé dans : Building Automation Gateway MPU-6050 6-axis IMU for sensor fusion Utilisé dans : Sensor Fusion Node with CAN Output MCP2551 CAN transceiver for sensor node Utilisé dans : Sensor Fusion Node with CAN Output MC9S12A256CFUE NXP Semiconductors Utilisé dans : HVAC and Climate Control ECU TJA1042T CAN transceiver for body network Utilisé dans : HVAC and Climate Control ECU
What is the operating voltage of MC9S12XDG128MAA?
The MC9S12XDG128MAA operates from a single 5V supply (with internal regulator generating 2.5V for the core) or directly from a 3.3V rail on the VDD pins, per the NXP S12XD datasheet. The device includes an on-chip 2.5V regulator for the core logic, so a single external 5V rail powers both I/O and core domains. Always check the VREG ballast and decoupling requirements in the reference manual before PCB layout.
How much Flash and RAM does the MC9S12XDG128MAA have?
The MC9S12XDG128MAA integrates 128KB of in-application programmable Flash (128K x 8) and 12KB of RAM, according to the DigiKey listing and the NXP S12XD family datasheet. This memory configuration targets mid-range industrial CAN nodes and body-control modules where 128KB is sufficient for CAN stack, application code, and bootloader without external memory expansion.
What is the difference between MC9S12XDG128MAA and MC9S12DG128CFUE?
The MC9S12XDG128MAA uses the S12X core with the XGATE co-processor running at 80MHz (40MHz bus), whereas the MC9S12DG128CFUE uses the non-X S12 core at 25MHz bus. The XGATE co-processor offloads interrupt-driven peripheral handling, giving the XD series better deterministic real-time performance for CAN and PWM tasks at the cost of slightly higher complexity. Both share the 80-QFP footprint on selected part numbers, but the MC9S12DG128CFUE uses an 80-LQFP while the MAA suffix is 80-QFP 14x14mm.
Is MC9S12XDG128MAA still in production or is it obsolete?
The NXP product page flags the MC9S12XDG128MAA as End of Life and Not Recommended for New Designs (NRND). NXP recommends migrating to active S12XEP or S12XET family members such as MC9S12XEP768CAG or S912XET512BMAGR for new programs. Stock may still be available through distribution for existing designs and long-term support windows.
What is the best drop-in replacement for MC9S12XDG128MAA?
The closest drop-in replacements in the same S12X 80-QFP family are MC9S12XDG128CAA (commercial temperature grade) and MC9S12XDT512MAA (512KB Flash upgrade with extra peripheral set). For migration to an active part, the S912XET512BMAGR (S12XET active family in 144-LQFP) requires PCB rework, while the MC9S12XEQ384CAG offers XGATE and 384KB Flash in a 144-LQFP. Choose based on whether you need a true drop-in (80-QFP) or are willing to re-layout.
What package does the MC9S12XDG128MAA use?
The MC9S12XDG128MAA is packaged in an 80-pin QFP (Plastic Quad Flat Pack) measuring 14mm x 14mm with 0.65mm pitch, designated by the MAA suffix. The 80-QFP MAA footprint is shared across the S12XD family including the MC9S12XDT512MAA and the XEP/XEQ variants in 80-pin variants, enabling PCB reuse across different Flash densities within the same family.
Does MC9S12XDG128MAA support CAN bus?
Yes, the MC9S12XDG128MAA includes multiple msCAN (Motorola Scalable CAN) modules compliant with CAN 2.0A/B, per the S12XD family datasheet. The XGATE co-processor can service CAN message buffering independently of the main CPU, achieving deterministic bus latency. Typical automotive body and chassis ECUs use two msCAN channels for chassis CAN and powertrain CAN simultaneously.
Where to download MC9S12XDG128MAA datasheet PDF?
The official NXP datasheet covering the S12XD, S12XB, and S12XA families is available at https://www.nxp.com/docs/en/data-sheet/MC9S12XDG128.pdf as referenced on the NXP product page. For complete register-level details, also download the S12XDG128 reference manual from the NXP website. The datasheet PDF is approximately 1,300+ pages covering electrical characteristics, memory map, and peripheral descriptions.
MC9S12XDG128MAA vs MC9S12XDT512MAA - which is better for CAN node design?
For a CAN node with code under 128KB, the MC9S12XDG128MAA is sufficient and lowest cost. If your application needs additional Flash for bootloader, logging, or larger protocol stacks (J1939, CANopen), choose the MC9S12XDT512MAA which offers 512KB Flash and shares the same 80-QFP MAA footprint, making it a true drop-in upgrade. Both share XGATE, msCAN, and ECT peripherals, so application code ports with only linker memory remapping changes.
When should I choose MC9S12XDG128MAA over an ARM Cortex-M0 MCU?
Choose the MC9S12XDG128MAA when you need a 16-bit deterministic architecture with the XGATE co-processor for offloaded interrupt service routines, mature automotive toolchains (CodeWarrior, Cosmic, IAR), or direct migration from legacy HC12 designs. For new low-power IoT designs where ARM ecosystem maturity matters more, an STM32 or Kinetis E-series Cortex-M0+ will typically win. The HCS12X remains preferred in automotive body/chassis where its deterministic interrupt latency is a regulatory concern.
What is the lead time and stock for MC9S12XDG128MAA?
As of 2026-10-19, the MC9S12XDG128MAA is flagged End of Life by NXP, so distributor stock is limited and lead times may extend to 25-30 weeks or more depending on remaining inventory. Distributors such as DigiKey and Mouser may show small reels; for production volumes, request a Last-Time-Buy quote from NXP before stock depletes. For new designs, choose an active S12XET or S12XEP variant with confirmed multi-year availability.
What is the XGATE co-processor and how does it help in MC9S12XDG128MAA?
The XGATE is an independent RISC-like co-processor on the S12X core that runs at twice the bus speed and executes data-movement and peripheral-handling routines in parallel with the main CPU. According to the NXP S12XD datasheet, XGATE can service msCAN message objects, PWM updates, and ADC sequencing without interrupting the main CPU, reducing jitter in control loops. Typical XGATE routines move 50-200 CPU cycles worth of work off the S12X core per interrupt.
Can MC9S12XDG128MAA be programmed in-circuit?
Yes, the MC9S12XDG128MAA supports in-application programming (IAP) of its Flash via the standard NXP BDM (Background Debug Mode) interface using a single-wire debug protocol, plus a serial bootloader via SCI/CAN. The Flash is organized into 1KB-2KB pages with ECC, supporting field firmware updates required by automotive and industrial customers. Always implement a fail-safe bootloader with rollback for production deployments.
How does MC9S12XDG128MAA compare to MC9S12XEP768CAG?
The MC9S12XEP768CAG is the active, higher-density successor with 768KB Flash and 64KB RAM in a 144-LQFP package, while the MC9S12XDG128MAA is End of Life with 128KB Flash and 12KB RAM in an 80-QFP. The XEP adds USB, FlexRay, and more CAN channels. Migration from the MAA to the XEP requires PCB redesign (different package) and code re-mapping, so it is not a drop-in replacement.
What is the price of MC9S12XDG128MAA in 100-piece quantity?
As of 2026-10-19, the MC9S12XDG128MAA lists at approximately $14.20 per unit at 100-piece quantity through major distributors, based on DigiKey pricing. Single-unit pricing is around $18.42. Because the part is End of Life, prices may fluctuate significantly with remaining inventory - always request a current quote before placing production orders. Volume pricing above 1,000 pieces may reach $10.45 per unit if stock is available.

Données de référence d'ingénierie pour MC9S12XDG128MAA — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the MC9S12XDG128MAA when you need a 16-bit S12X MCU with XGATE for deterministic CAN/PWM offload, 128KB Flash, and 80-QFP MAA footprint in industrial/automotive applications. For commercial temperature (0C to +70C) or designs that do not need automotive qualification, choose the MC9S12XDG128CAA as a lower-cost drop-in. If your application needs more Flash for J1939 stacks, larger bootloaders, or logging, choose the MC9S12XDT512MAA in the same footprint - 512KB Flash and 32KB RAM. Because the MC9S12XDG128MAA is End of Life, new programs should target active S12XET or S12XEP family members, accepting that this requires PCB redesign away from the 80-QFP MAA footprint.

Comparaison avec les alternatives

Paramètre Ce produit MC9S12XDG128CAA MC9S12XDT512MAA
Package 80-QFP (14x14 mm) 80-QFP (14x14 mm) - same 80-QFP (14x14 mm) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core S12X with XGATE S12X with XGATE - same S12X with XGATE - same
Maximum CPU Frequency 80 MHz (40 MHz bus) 80 MHz 80 MHz
Flash Memory 128 KB 128 KB 512 KB (+300%)
RAM 12 KB 12 KB 32 KB (+167%)
Operating Temperature -40C to +125C (industrial / automotive) 0C to +70C (commercial) -40C to +125C
Lifecycle Status End of Life (NRND) Not Recommended for New Designs Active / Last Time Buy varies
CAN Modules (msCAN) Multiple msCAN 2.0 A/B Same Same or more

Principaux différenciateurs

  • XGATE co-processor for deterministic interrupt offload (vs MC9S12DG128CFUE (non-X S12 core))
  • 128KB Flash in 80-QFP MAA footprint with full automotive grade (vs MC9S12XDG128CAA (commercial grade))
  • Same 80-QFP MAA footprint as higher-density S12XDT (vs MC9S12XDT512MAA (512KB variant))

Notes de conception

The MC9S12XDG128MAA requires a single 5V supply on VDDR/VSS with the internal 2.5V regulator powering the core. Decouple VDDR with a 1uF X7R ceramic placed within 5mm of the pin and add a bulk 10uF tantalum or aluminum polymer capacitor. The internal voltage regulator requires an external ballast capacitor on the VDD core rail; consult the S12XD reference manual for exact values. Estimated: at 80MHz core, the device draws approximately 50-70 mA from VDDR - design your 5V LDO or buck regulator with at least 200 mA headroom.

In the 80-QFP MAA package, theta_JA is approximately 50 C/W typical on a 4-layer JEDEC test board. At -40C to +125C operation, the junction temperature must stay below 150C, leaving ~25C margin at the upper ambient bound. For under-hood automotive designs at +85C ambient with full peripheral activity, confirm with on-board thermal measurements. The XGATE co-processor adds a small additional thermal load proportional to its duty cycle - typically 5-10% of CPU thermal contribution.

Place all decoupling capacitors (0.1uF + 1uF) on VDD/VSS pairs within 2-3mm of the IC pins. The XTAL and EXTAL traces should be short and surrounded by a ground guard ring; keep crystal traces away from noisy switching signals. The 80-QFP MAA package has a 14x14 mm body with 0.65mm pitch - use 4-layer PCB with a continuous ground plane for noise immunity. Route CAN differential pairs (CANH, CANL) as a matched 100-ohm impedance pair with no stubs.

Do not float the TEST pin - it must be tied to VSS for normal operation or the device enters test mode. The BKGD pin is shared with the MODC function at reset - ensure proper pull-up or pull-down configuration for the desired debug mode. The XGATE co-processor requires explicit setup code before use - leaving it uninitialized is acceptable but disabling interrupts on the main CPU assumes XGATE handles them. Always check the S12XD errata document for known silicon revisions before locking the PCB layout.

Informations de conformité

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Sans plomb
Yes
Sans halogène
Unknown
Minerais de conflit
Compliant

RoHS compliant per NXP product page. AEC-Q100 grade not stated explicitly - the industrial -40C to +125C temperature range supports automotive under-hood designs but explicit AEC-Q100 qualification should be confirmed with NXP for safety-critical applications. Halogen-free status not stated in available data.

Données vérifiées le : 2026-10-19 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

MC9S12XDG128MAA MC9S12XDG128MAA datasheet NXP HCS12X 128KB Flash 80MHz MCU MC9S12XDG128MAA 80-QFP MAA footprint MC9S12XDG128MAA automotive CAN node MC9S12XDG128MAA drop-in replacement MC9S12XDG128MAA vs MC9S12XDT512MAA MC9S12XDG128MAA buy obsolete stock what is XGATE co-processor S12X S12XD family pin compatible upgrade MC9S12XDG128MAA end of life replacement HCS12X 16-bit automotive microcontroller QFP

Composants & termes associés

NXP Semiconductors Freescale Semiconductor MC9S12XDG128MAA MC9S12XDG128CAA MC9S12XDT512MAA MC9S12XEP768CAG HCS12X HCS12 XGATE co-processor S12XD S12XDT msCAN CAN 2.0 A/B automotive body control module BLDC motor control industrial CAN node ECT (Enhanced Capture Timer) BDM (Background Debug Mode) 80-QFP (MAA) RoHS AEC-Q100 CISC architecture 16-bit MCU
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