MCF53011CQT240 - ColdFire V3 MPU, 240MHz, 208-TQFP | NXP
Référence : MCF53011CQT240 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.75 | $38,75 |
| 10 | $36.2 | $362,00 |
| 100 | $32.95 | $3 295,00 |
| 250 | $30.8 | $7 700,00 |
| 500 | $28.6 | $14 300,00 |
MCF53011CQT240 Présentation
What is a ColdFire microprocessor? A ColdFire microprocessor is a 32-bit RISC-style processor architecture originally derived from the Motorola 68000 family, designed by NXP (formerly Freescale) for cost-sensitive, low-power embedded applications. Positioned in the taxonomy as: microprocessor (MPU) > 32-bit MPU > ColdFire family > ColdFire V3 core > semiconductor, ColdFire V3 parts combine moderate computational performance with low power consumption and rich peripheral integration, making them well suited to industrial control, point-of-sale, and embedded audio applications.
Key features of the MCF53011CQT240 include a fast Ethernet MAC (EMAC) with MII/RMII interface for industrial networking, USB 2.0 Full-Speed and Host/Device On-the-Go (OTG) controllers, a voice codec interface with multiple time-division-multiplexed (TDM) channels, CAN 2.0B controller for industrial fieldbus connectivity, and a peripheral set covering UARTs, I2C, SPI, and GPIOs. The integrated eSDHC and external bus interface support NAND flash, SDRAM, and SRAM memory expansion.
Architecturally, the ColdFire V3 core uses a variable-length instruction pipeline and Harvard-style split cache for instruction and data, allowing deterministic interrupt latency that is critical in real-time control loops. The dual-issue capabilities and dedicated multiply/accumulate (MAC) hardware accelerate DSP-style signal processing required by the integrated voice codec engine.
Typical applications include industrial control with embedded voice (intercom, public-address, and VoIP-style appliances), human-machine interface (HMI) terminals, point-of-sale terminals with audio feedback, factory automation PLCs with Ethernet connectivity, and medical/automation equipment requiring multi-protocol industrial networking. The combination of CAN + Ethernet + USB + voice codec removes several external ICs from a typical BOM, reducing board area and cost in compact embedded designs.
When designing with the MCF53011CQT240, follow the manufacturer reference design for power-rail decoupling and external bus termination. Place at least four 0.1 uF decoupling capacitors near each power pin, route the 50 MHz system clock with controlled impedance, and ensure the SDRAM traces are length-matched to the data strobe signals. The TQFP-208 package requires multilayer PCB stack-up for high-speed signal integrity.
This page synthesizes distributor pricing, pin-compatible drop-in alternatives within the MCF5301x family, and practical PCB and firmware design notes not consolidated in a single place in the manufacturer datasheet.
Alternatives de remplacement direct pour MCF53011CQT240 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MCF53011CQT240 (même facteur de forme et même empreinte) — différant par Package, Mounting Type, Architecture, Connectivity, Dhrystone 2.1 MIPS.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MCF53013CQT240
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →MCF53010CQT240
✓ En stock
$9.8 / unité
Voir la fiche technique →MCF53015CMJ240J
✅ Remplacement direct✓ En stock
$22.85 / unité
Voir la fiche technique →MCF53011CQT240 Valeurs maximales et caractéristiques électriques
| Core | ColdFire V3 with EMAC |
| Architecture | 32-bit ColdFire Version 3 |
| Fréquence d'horloge maximale | 240 MHz |
| Dhrystone 2.1 MIPS | 211 MIPS |
| Instruction/Data Cache | 16 KBytes unified |
| Internal SRAM | 128 KBytes |
| External Memory | ROMless, SDRAM/NOR/NAND interface |
| Boîtier | 208-TQFP (28 x 28 mm) |
| Nombre de broches | 208 |
| Type de montage | Surface Mount |
| Terminal Form | GULL WING |
| Package Code | QFP (208-TQFP) |
| Ethernet | 10/100 MAC with EMAC, MII/RMII |
| USB | USB 2.0 Full-Speed Host/Device/OTG |
| CAN | CAN 2.0B controller |
| Voice Codec Interface | TDM/I2S, multi-channel |
| Other Peripherals | UART, I2C, SPI, GPIO, eSDHC, DMA, Timers |
| Operating Temperature Grade | Industrial |
Guide de configuration des broches du MCF53011CQT240 qfp (208-tqfp)
Configuration des broches du MCF53011CQT240 (boîtier qfp (208-tqfp)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MCF53011CQT240.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MCF53011CQT240 convient pour 6 applications: Industrial Control with Embedded Voice, Human-Machine Interface (HMI) Terminals, Point-of-Sale Terminals with Audio Feedback, Factory Automation PLCs with Ethernet, Embedded VoIP Intercom Gateways, Industrial Printers and Labeling Equipment.
Industrial Control with Embedded Voice
The MCF53011CQT240 is tailored for industrial control panels that need real-time control plus voice playback or intercom capability. The 240 MHz ColdFire V3 core (211 MIPS Dhrystone 2.1) executes PID control loops with deterministic interrupt latency, while the integrated TDM/I2S voice codec interface streams multi-channel audio without an external DSP. The on-chip 10/100 EMAC and CAN 2.0B allow simultaneous connection to factory PLCs and IP-based control networks, removing an external MCU from the BOM. Reference designs from NXP combine the part with a simple Class-D amplifier for embedded intercom stations.
Recommandé
Human-Machine Interface (HMI) Terminals
HMI terminals benefit from the MCF53011CQT240's 240 MHz core, dedicated TFT/LCD controller, and USB 2.0 Full-Speed OTG for touch panels and USB peripherals. The 16 KByte unified cache plus 128 KByte on-chip SRAM support graphic framebuffer manipulation in real time, while the SDRAM controller extends memory for richer UIs in industrial terminals. The 208-TQFP package also supports multi-layer PCB layouts required for noise-isolated analog sensor acquisition alongside the digital graphic data path.
Recommandé
Point-of-Sale Terminals with Audio Feedback
POS terminals with audio guidance rely on the MCF53011CQT240's on-chip voice codec and EMAC for networked audio over IP. The ColdFire V3 core runs MQX RTOS with TCP/IP for payment processing while the DMA engine handles audio streams independently, leaving CPU bandwidth for transaction encryption and EMV card interface. The 128 KByte SRAM buffers audio frames, and the USB OTG port supports external PIN pads or printers without a hub chip.
Recommandé
Factory Automation PLCs with Ethernet
Industrial PLCs benefit from the MCF53011CQT240's combination of on-chip 10/100 EMAC, CAN 2.0B, and 240 MHz ColdFire V3 core. The deterministic interrupt response of the ColdFire architecture is well-suited for IEC 61131 scan loops, while the external memory bus supports large ladder-logic programs in external NOR flash. The 208-TQFP footprint gives room for analog front-end signals, and NXP's MQX RTOS provides pre-validated TCP/IP and Modbus/TCP stacks that target this exact silicon.
Recommandé
Embedded VoIP Intercom Gateways
Embedded VoIP and intercom gateways leverage the MCF53011CQT240's TDM voice codec interface, 10/100 EMAC, and DMA channels for simultaneous audio streaming and packet processing. The 211 MIPS core budget is sufficient for G.711 and G.729 codecs plus RTP/UDP/IP stack, and the USB OTG enables Wi-Fi or 4G module attachment for wireless variants. The 208-TQFP package supports multilayer PCBs needed for clean analog audio routing alongside the digital Ethernet PHY lines.
Recommandé
Industrial Printers and Labeling Equipment
Industrial label printers and barcode scanners use the MCF53011CQT240 to combine Ethernet, USB OTG, and CAN connectivity for shop-floor integration. The ColdFire V3 core drives the printer engine via PWM timers, while the EMAC streams print jobs from the host and the CAN bus exchanges status with surrounding automation cells. The 128 KByte SRAM acts as a print buffer for non-bleed operation, and the 208-TQFP provides margin for thermal printer driver electronics on the same board.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MCF53011CQT240 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MCF53013CQT240 | MCF53010CQT240 | MCF53015CMJ240J |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 208-TQFP (28x28) | 208-TQFP (28x28) - same | 208-TQFP (28x28) - same | 208-TQFP (28x28) - same |
| Core | ColdFire V3 + EMAC | ColdFire V3 + EMAC + crypto | ColdFire V3 + EMAC | ColdFire V3 + EMAC |
| Max Clock Frequency | 240 MHz | 240 MHz | 240 MHz | 240 MHz |
| Dhrystone 2.1 MIPS | 211 MIPS | 211 MIPS | 211 MIPS | 211 MIPS |
| Ethernet | 10/100 EMAC MII/RMII | 10/100 EMAC MII/RMII | 10/100 EMAC MII/RMII | 10/100 EMAC MII/RMII |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| Voice Codec Interface | Multi-channel TDM/I2S enhanced | Multi-channel TDM/I2S | Reduced voice codec channels | Multi-channel TDM/I2S |
| Hardware Crypto / Secure Boot | No | Yes (adds hardware crypto + secure boot) | No | No |
| Operating Temperature Grade | Industrial | Industrial | Industrial | Industrial (extended) |
Principaux différenciateurs
- Higher peripheral integration than MCF53010 (vs MCF53010CQT240)
- No hardware crypto vs MCF53013 (vs MCF53013CQT240)
- Unified 16 KByte cache reduces determinism issues (vs Generic ColdFire V2 parts)
Notes de conception
The 208-TQFP package at 28 x 28 mm requires a multilayer PCB (4-layer minimum) for proper return-current paths on the SDRAM interface. According to NXP layout guidance, keep SDRAM data traces within 5 mm of length-matching, route clock signals over a continuous ground plane, and place at least one 0.1 uF decoupling capacitor (plus a 10 uF bulk) within 5 mm of each power pin. Estimate: total bulk decoupling budget for this part typically exceeds 40 capacitors due to the high pin count and multiple power rails.
Ethernet MII/RMII lines run at 25 MHz or 50 MHz respectively, while the USB 2.0 Full-Speed data rate is 12 Mbps. Route the MII traces within a tight 50 ohm controlled impedance to the Ethernet PHY, and keep USB DP/DM as a 90 ohm differential pair. Series termination resistors on clock and strobe signals reduce reflections on the SDRAM bus, especially when operating at the full 240 MHz system clock.
Avoid enabling the on-chip USB OTG charge pump if your system powers down in deep sleep, as the pump has a startup delay that can mislead USB host enumeration. Also, the MCF53011CQT240 requires a 32 kHz watchdog crystal if you intend to use the real-time clock; many designs use a single 8 MHz crystal plus PLL to generate the 240 MHz core clock but still need the dedicated 32 kHz for RTC accuracy. The voice-codec block requires a separate crystal for TDM frame synchronization if not driven from an external master.
Informations de conformité
RoHS, REACH, lead-free and halogen-free status not explicitly provided in the verified web data; marked 'unknown' rather than assumed. Conflict-mineral statement compliance inferred from industry-standard NXP corporate policy. AEC-Q100 is 'not_applicable' because the MCF53011CQT240 is industrial-grade, not automotive-grade.
