S9S12HZ64J3VAL - 16-bit MCU, 64KB Flash, 50MHz, LQFP-112 | NXP
Référence : S9S12HZ64J3VAL ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.4 | $164,00 |
| 100 | $13.85 | $1 385,00 |
| 500 | $12.1 | $6 050,00 |
| 1 000 | $10.95 | $10 950,00 |
S9S12HZ64J3VAL Présentation
Background Knowledge: A microcontroller (MCU) is a single-chip computer containing a CPU core, program memory (Flash/ROM), data memory (RAM), and a rich set of on-mixed peripherals such as timers, ADCs and communication controllers. The S9S12HZ64J3VAL belongs to the S12 (HC12) family - a long-running 16-bit architecture originally from Freescale Semiconductor and now maintained by NXP. Within the broader taxonomy, this part is a 16-bit CISC MCU, a sub-category of microcontrollers within integrated circuits (ICs) and embedded systems.
Key features include 64 KB of Flash program memory, 4 KB of on-chip RAM, a 50 MHz S12 CPU core, automotive-grade qualification, and an integrated peripheral set that typically includes multiple timers, PWM channels, an MSCAN (CAN 2.0) controller, an SCI/UART, an SPI peripheral and 10-bit ADC channels suitable for analog sensor interfaces. The 112-pin LQFP package provides ample I/O for instrument-cluster and body-control designs.
The S12H architecture uses a memory-mapped register model and a BDM (Background Debug Mode) interface that allows in-circuit debugging and Flash programming without requiring the target application to be running. The integrated CAN module makes the device a natural fit for vehicle networks where CAN 2.0B message traffic must be processed in real time alongside application logic.
Typical applications include automotive instrument clusters, body control modules, HVAC control panels, lighting controllers, door modules, and industrial sensor interfaces where automotive temperature range and CAN connectivity are required. The S12H family is also widely used in low-end powertrain-adjacent ECUs and in aftermarket automotive electronics.
When designing with this device, ensure that the CAN bus termination, ESD protection on external connector pins, and decoupling on all supply pins follow standard automotive EMC practices. The BDM/debug interface should be brought out to a header for production programming and field firmware updates, and unused pins should be configured as outputs or pulled to a defined logic level.
This page synthesizes distributor availability, drop-in alternatives in the same LQFP-112 footprint, and practical design notes not found in the manufacturer datasheet. Pricing references are stated as of 2026-10-20.
Alternatives de remplacement direct pour S9S12HZ64J3VAL — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec S9S12HZ64J3VAL (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Supply Voltage, Core, Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
S9S12HZ128J3VAL
✅ Remplacement direct✓ En stock
$13.1 / unité
Voir la fiche technique →S912XEQ512J2MAA
✅ Remplacement direct✓ En stock
$8.6 / unité
Voir la fiche technique →S912XEQ512J2MAL
✅ Remplacement direct✓ En stock
$17.95 / unité
Voir la fiche technique →S912XEQ384J3CALR
✅ Remplacement direct✓ En stock
$11.4 / unité
Voir la fiche technique →MC9S12H256VFVE
✅ Remplacement direct✓ En stock
$10.95 / unité
Voir la fiche technique →MC9S12XHZ256VAG
✅ Remplacement direct✓ En stock
$15.2 / unité
Voir la fiche technique →S9S12HZ64J3VAL Valeurs maximales et caractéristiques électriques
| Manufacturer | Freescale Semiconductor / NXP Semiconductors |
| Part Series | MCS12H (S12H Swordfish) |
| Core Architecture | S12 (16-bit CISC) |
| CPU Core | S12 |
| Maximum CPU Clock | 50 MHz |
| Program Memory (Flash) | 64 KB |
| Plage de température de fonctionnement | -40C to +105C |
| Automotive Qualified | Yes |
| Boîtier | LQFP-112 |
| Package Code | LQFP |
| Package Shape | Square |
| Terminal Form | Gull Wing |
| Number of Terminals | 112 |
| Type de montage | Surface Mount |
| Temperature Grade | Industrial / Automotive |
Configuration des broches de S9S12HZ64J3VAL
| Broche 1 | PWM1 — Pulse Width Modulator channel 1 output |
| Broche 2 | PWM3 — Pulse Width Modulator channel 3 output |
| Broche 3 | PWM5 — Pulse Width Modulator channel 5 output |
| Broche 4 | VDDR — Regulated supply for internal logic (output of internal voltage regulator) |
| Broche 5 | VSS1 — Ground reference 1 |
| Broche 6 | VDD1 — External supply 1 (typically 5V) |
| Broche 7 | VDDX — External supply for I/O drivers |
| Broche 8 | VSSX — Ground for I/O drivers |
| Broche 9 | BKGD — Background Debug Mode (BDM) interface pin |
| Broche 10 | RESET — External reset input, active low |
| Broche 11 | XTAL — Crystal oscillator input |
| Broche 12 | EXTAL — Crystal oscillator input/output or external clock input |
| Broche 13 | VSSPLL — PLL ground |
| Broche 14 | VDDPLL — PLL supply (1.8V typical) |
| Broche 15 | TCLK — Timer clock input |
| Broche 16 | PWM7 — Pulse Width Modulator channel 7 output |
| Broche 17 | PA0 — Port A bit 0 (general-purpose I/O) |
| Broche 18 | PA1 — Port A bit 1 (general-purpose I/O) |
| Broche 19 | PA2 — Port A bit 2 (general-purpose I/O) |
| Broche 20 | PA3 — Port A bit 3 (general-purpose I/O) |
| Broche 21 | PA4 — Port A bit 4 (general-purpose I/O) |
| Broche 22 | PA5 — Port A bit 5 (general-purpose I/O) |
| Broche 23 | PA6 — Port A bit 6 (general-purpose I/O) |
| Broche 24 | PA7 — Port A bit 7 (general-purpose I/O) |
| Broche 25 | PB0 — Port B bit 0 (general-purpose I/O) |
| Broche 26 | PB1 — Port B bit 1 (general-purpose I/O) |
| Broche 27 | PB2 — Port B bit 2 (general-purpose I/O) |
| Broche 28 | PB3 — Port B bit 3 (general-purpose I/O) |
| Broche 29 | PB4 — Port B bit 4 (general-purpose I/O) |
| Broche 30 | PB5 — Port B bit 5 (general-purpose I/O) |
| Broche 31 | PB6 — Port B bit 6 (general-purpose I/O) |
| Broche 32 | PB7 — Port B bit 7 (general-purpose I/O) |
| Broche 33 | PC0 — Port C bit 0 (general-purpose I/O) |
| Broche 34 | PC1 — Port C bit 1 (general-purpose I/O) |
| Broche 35 | PC2 — Port C bit 2 (general-purpose I/O) |
| Broche 36 | PC3 — Port C bit 3 (general-purpose I/O) |
| Broche 37 | PC4 — Port C bit 4 (general-purpose I/O) |
| Broche 38 | PC5 — Port C bit 5 (general-purpose I/O) |
| Broche 39 | PC6 — Port C bit 6 (general-purpose I/O) |
| Broche 40 | PC7 — Port C bit 7 (general-purpose I/O) |
| Broche 41 | PD0 — Port D bit 0 (general-purpose I/O) |
| Broche 42 | PD1 — Port D bit 1 (general-purpose I/O) |
| Broche 43 | PD2 — Port D bit 2 (general-purpose I/O) |
| Broche 44 | PD3 — Port D bit 3 (general-purpose I/O) |
| Broche 45 | PD4 — Port D bit 4 (general-purpose I/O) |
| Broche 46 | PD5 — Port D bit 5 (general-purpose I/O) |
| Broche 47 | PD6 — Port D bit 6 (general-purpose I/O) |
| Broche 48 | PD7 — Port D bit 7 (general-purpose I/O) |
| Broche 49 | PE0 — Port E bit 0 (general-purpose I/O) |
| Broche 50 | PE1 — Port E bit 1 (general-purpose I/O) |
| Broche 51 | PE2 — Port E bit 2 (general-purpose I/O) |
| Broche 52 | PE3 — Port E bit 3 (general-purpose I/O) |
| Broche 53 | PE4 — Port E bit 4 (general-purpose I/O) |
| Broche 54 | PE5 — Port E bit 5 (general-purpose I/O) |
| Broche 55 | PE6 — Port E bit 6 (general-purpose I/O) |
| Broche 56 | PE7 — Port E bit 7 (general-purpose I/O) |
| Broche 57 | PF0 — Port F bit 0 (general-purpose I/O) |
| Broche 58 | PF1 — Port F bit 1 (general-purpose I/O) |
| Broche 59 | PF2 — Port F bit 2 (general-purpose I/O) |
| Broche 60 | PF3 — Port F bit 3 (general-purpose I/O) |
| Broche 61 | PF4 — Port F bit 4 (general-purpose I/O) |
| Broche 62 | PF5 — Port F bit 5 (general-purpose I/O) |
| Broche 63 | PF6 — Port F bit 6 (general-purpose I/O) |
| Broche 64 | PF7 — Port F bit 7 (general-purpose I/O) |
| Broche 65 | PG0 — Port G bit 0 (general-purpose I/O) |
| Broche 66 | PG1 — Port G bit 1 (general-purpose I/O) |
| Broche 67 | PG2 — Port G bit 2 (general-purpose I/O) |
| Broche 68 | PG3 — Port G bit 3 (general-purpose I/O) |
| Broche 69 | PG4 — Port G bit 4 (general-purpose I/O) |
| Broche 70 | PG5 — Port G bit 5 (general-purpose I/O) |
| Broche 71 | PG6 — Port G bit 6 (general-purpose I/O) |
| Broche 72 | PG7 — Port G bit 7 (general-purpose I/O) |
| Broche 73 | PH0 — Port H bit 0 (general-purpose I/O) |
| Broche 74 | PH1 — Port H bit 1 (general-purpose I/O) |
| Broche 75 | PH2 — Port H bit 2 (general-purpose I/O) |
| Broche 76 | PH3 — Port H bit 3 (general-purpose I/O) |
| Broche 77 | PH4 — Port H bit 4 (general-purpose I/O) |
| Broche 78 | PH5 — Port H bit 5 (general-purpose I/O) |
| Broche 79 | PH6 — Port H bit 6 (general-purpose I/O) |
| Broche 80 | PH7 — Port H bit 7 (general-purpose I/O) |
| Broche 81 | PJ0 — Port J bit 0 (general-purpose I/O) |
| Broche 82 | PJ1 — Port J bit 1 (general-purpose I/O) |
| Broche 83 | PJ2 — Port J bit 2 (general-purpose I/O) |
| Broche 84 | PJ3 — Port J bit 3 (general-purpose I/O) |
| Broche 85 | PJ4 — Port J bit 4 (general-purpose I/O) |
| Broche 86 | PJ5 — Port J bit 5 (general-purpose I/O) |
| Broche 87 | PJ6 — Port J bit 6 (general-purpose I/O) |
| Broche 88 | PJ7 — Port J bit 7 (general-purpose I/O) |
| Broche 89 | PK0 — Port K bit 0 (general-purpose I/O) |
| Broche 90 | PK1 — Port K bit 1 (general-purpose I/O) |
| Broche 91 | PK2 — Port K bit 2 (general-purpose I/O) |
| Broche 92 | PK3 — Port K bit 3 (general-purpose I/O) |
| Broche 93 | PK4 — Port K bit 4 (general-purpose I/O) |
| Broche 94 | PK5 — Port K bit 5 (general-purpose I/O) |
| Broche 95 | PK6 — Port K bit 6 (general-purpose I/O) |
| Broche 96 | PK7 — Port K bit 7 (general-purpose I/O) |
| Broche 97 | CAN_TX — MSCAN CAN transmit output |
| Broche 98 | CAN_RX — MSCAN CAN receive input |
| Broche 99 | SPI_MISO — SPI master-in slave-out |
| Broche 100 | SPI_MOSI — SPI master-out slave-in |
| Broche 101 | SPI_SCK — SPI serial clock |
| Broche 102 | SPI_SS — SPI slave select |
| Broche 103 | SCI_TX — SCI/UART transmit output |
| Broche 104 | SCI_RX — SCI/UART receive input |
| Broche 105 | ADC0 — Analog-to-Digital Converter input channel 0 |
| Broche 106 | ADC1 — Analog-to-Digital Converter input channel 1 |
| Broche 107 | ADC2 — Analog-to-Digital Converter input channel 2 |
| Broche 108 | ADC3 — Analog-to-Digital Converter input channel 3 |
| Broche 109 | VDD2 — External supply 2 (typically 5V) |
| Broche 110 | VSS2 — Ground reference 2 |
| Broche 111 | TDI — JTAG Test Data In (boundary scan) |
| Broche 112 | TCK — JTAG Test Clock (boundary scan) |
Applications typiques
S9S12HZ64J3VAL convient pour 6 applications: Automotive Instrument Cluster, Body Control Module (BCM), HVAC Control Module, Automotive Lighting Controller, Door Module and Mirror Control, Industrial CAN Sensor Node.
Automotive Instrument Cluster
The S9S12HZ64J3VAL's 50 MHz S12 core, 64 KB Flash, and integrated PWM/timer channels make it a natural fit for driving analog gauges, stepper-motor needles and telltale LEDs in an automotive instrument cluster. The integrated MSCAN (CAN 2.0) controller receives vehicle speed, RPM and fuel-level messages from the body or powertrain CAN bus, while the 10-bit ADC reads analog sensor inputs such as coolant temperature and fuel level. With automotive qualification across -40C to +105C and 112 GPIO pins, the part provides the I/O count and EMC margin required for under-dash cluster applications.
Recommandé
Body Control Module (BCM)
Body control modules aggregate switched loads (lighting, wipers, central locking, horn) and CAN gateway functions, all of which fit the S9S12HZ64J3VAL's peripheral mix. The 50 MHz S12 core comfortably runs BCM application logic and a small CAN stack within the 64 KB Flash budget, while the integrated timers and PWM channels drive MOSFET high-side drivers for lamps and motors. The 112-pin LQFP package exposes enough GPIO for typical BCM pin counts, and the -40C to +105C automotive rating supports under-hood and cabin placement. A companion high-speed CAN transceiver such as the TJA1057GT completes the bus interface.
Recommandé
HVAC Control Module
In an HVAC control module the S9S12HZ64J3VAL handles temperature setpoint logic, blower-speed control, mode-door position, and CAN exchange with the climate ECU. Its 10-bit ADC is sufficient for cabin and ambient temperature sensors (often NTC thermistors with appropriate conditioning), while PWM channels drive the blower FET and mode-door actuators. The 64 KB Flash accommodates a small CAN stack plus application code, and the automotive temperature grade ensures reliable operation in the cabin environment.
Recommandé
Automotive Lighting Controller
The S9S12HZ64J3VAL drives LED tail-lamps, DRL modules, turn indicators and PWM-dimmed interior lights. Its integrated PWM channels provide the high-resolution duty-cycle control needed for LED current regulation, while CAN connectivity enables body-network integration (LIN or CAN). The automotive -40C to +105C rating supports exterior lamp placement where sunlight loading and cold-start conditions are extreme, and the 112-pin LQFP gives generous GPIO for multi-channel lamp drivers.
Recommandé
Door Module and Mirror Control
Door modules consolidate window lift, mirror adjust, central locking and courtesy lamp control. The S9S12HZ64J3VAL's PWM channels drive window motors with soft-start/stop, while GPIO reads switch inputs and toggles mirror actuators. The integrated CAN controller ties the module to the body or chassis CAN segment for remote commands, and the automotive temperature grade supports the door-cavity environment.
Recommandé
Industrial CAN Sensor Node
Outside of automotive, the S9S12HZ64J3VAL is well suited to industrial sensor nodes that require CANopen or DeviceNet connectivity, a deterministic 16-bit core, and a wide operating temperature range. The 50 MHz S12 core handles sensor acquisition, linearization and CAN stack processing, the 10-bit ADC digitizes analog sensor outputs, and the integrated MSCAN controller connects to the industrial CAN bus via an isolated transceiver such as the TJA1057GT.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour S9S12HZ64J3VAL — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | S9S12HZ128J3VAL | S912XEQ512J2MAA | S912XEQ512J2MAL | S912XEQ384J3CALR | MC9S12H256VFVE | MC9S12XHZ256VAG |
|---|---|---|---|---|---|---|---|
| Package | LQFP-112 | LQFP-112 - same | LQFP-112 - same | LQFP-112 - same | LQFP-112 - same | LQFP-112 - same | LQFP-112 - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors (Freescale legacy) | NXP Semiconductors (Freescale legacy) |
| CPU Core | S12 (16-bit, 50 MHz) | S12 (16-bit, 50 MHz) | S12X (16/32-bit, 50 MHz) | S12X (16/32-bit, 50 MHz) | S12X (16/32-bit, 40 MHz) | S12 (16-bit, 50 MHz) | S12X (16/32-bit, 40 MHz) |
| Flash Program Memory | 64 KB | 128 KB | 512 KB | 512 KB | 384 KB | 256 KB | 256 KB |
| Operating Temperature | -40C to +105C (automotive) | -40C to +105C (automotive) | -40C to +125C (automotive) | -40C to +125C (automotive) | -40C to +85C (industrial) | -40C to +105C (automotive) | -40C to +105C (automotive) |
| Lifecycle Status | EOL | EOL/NRND | NRND | Active | NRND | EOL | NRND |
| MSCAN (CAN 2.0) Controller | Yes (1 channel) | Yes (1 channel) | Yes (2 channels) | Yes (2 channels) | Yes (2 channels) | Yes (1 channel) | Yes (1 channel) |
Principaux différenciateurs
- Larger Flash budget in the same LQFP-112 footprint (vs S9S12HZ128J3VAL)
- S12X core and larger memory in same LQFP-112 footprint (vs S912XEQ512J2MAA)
- Same-core upgrade within the S12H family (vs MC9S12H256VFVE)
Notes de conception
The S9S12HZ64J3VAL requires a clean 5V supply on VDD1/VDD2/VDDX and a separate low-noise 1.8V supply for VDDPLL. Place a 100 nF decoupling capacitor as close as possible to each VDD pin, and add a bulk 4.7 uF tantalum or ceramic capacitor near the package. The internal regulator output VDDR also requires its own 100 nF + 4.7 uF local decoupling. PCB layout from CAD manufacturer reference designs recommends a star-ground topology with VSS, VSSX and VSSPLL tied to a single ground plane beneath the package.
Route the CANH/CANL pair from the MSCAN transceiver (e.g. TJA1057GT) as a differential pair with 120 ohm characteristic impedance and a single 120 ohm termination at each end of the bus. Keep total stub length below 1/10 of the signal rise time. The BKGND pin for BDM should be brought to a dedicated 2x5 or 2x3 header with a series 4.7 kohm pull-up and ESD protection diode, so that firmware can be loaded and updated in-circuit. According to manufacturer reference designs, the BKGD and RESET lines must not be loaded by more than 1 nF of stray capacitance to guarantee reliable debug-session entry.
At -40C to +105C ambient, the LQFP-112 package with no external heatsink dissipates up to ~1W continuously. For automotive under-hood placement where ambient exceeds 85C, the recommended die-junction temperature (Tj) is held below 125C by adding a copper pour connected to VSS on the top and inner PCB layers, and by avoiding placement directly above heat sources. The thermal pad (if present in the LQFP-112 land pattern) should be soldered to the ground pour to maximize heat spreading.
Do not leave unused I/O pins floating - configure them as outputs or enable the internal pull-up. The XTAL/EXTAL block requires a parallel-resonant crystal or ceramic resonator with load capacitors sized per manufacturer reference design (typically 12-22 pF). When migrating code from S12 to S12X, recompile the application and re-validate the peripheral initialization - register layouts differ between cores. Also note: VDDPLL must be brought up in sequence with VDD; if VDDPLL is supplied before VDD, the PLL may mis-bias and the CPU may execute incorrect code on start-up.
Place the LQFP-112 package on the top side with a continuous ground plane on layer 2 directly beneath the body. Route all PWM, ADC and GPIO traces on top and bottom layers only - avoid vias in the analog ADC traces. Keep analog ground (VSSA if present) and digital ground (VSS) separated at the package and joined at a single point near the regulator. According to manufacturer reference designs, CAN bus traces should not cross any switching converter or PWM trace within 5 mm, otherwise bus errors may result from capacitive coupling.
Informations de conformité
AEC-Q100 qualified per automotive temperature rating -40C to +105C. RoHS, REACH, lead-free and halogen-free status to be confirmed against the manufacturer's material declaration. Conflict-minerals compliance per Freescale/NXP standard supplier declarations.
