MCF53010CQT240 - 240MHz ColdFire V3 MPU, 208-TQFP | NXP
Référence : MCF53010CQT240 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $13.19 | $13,19 |
| 10 | $12.45 | $124,50 |
| 100 | $11.5 | $1 150,00 |
| 500 | $10.65 | $5 325,00 |
| 1 000 | $9.8 | $9 800,00 |
MCF53010CQT240 Présentation
A microprocessor (MPU) like the ColdFire MCF5301x is a CPU-centric integrated circuit that typically requires external memory (SRAM/SDRAM/Flash) for program and data storage. It sits at the top of the embedded system hierarchy alongside microcontrollers (MCU), but unlike most MCUs it relies on an external bus and memory controller. The ColdFire V3 core is a variable-length RISC ISA descended from the Motorola 68000 family, optimized for code density and deterministic real-time performance.
Key features of the MCF53010CQT240 include an integrated Enhanced Multiply-Accumulate (EMAC) unit, 16 KBytes of unified instruction/data cache, 128 KBytes of internal SRAM, a 32-bit SDRAM/DDR controller, a 10/100 Ethernet MAC, USB 2.0 Full-Speed OTG, CAN, I2C, SPI, UARTs, and an on-chip voice codec with amplifiers. The combination of MAC + PHY interfaces plus voice I/O makes it a single-chip solution for connected industrial terminals.
The ColdFire V3 core with EMAC delivers high DSP-like arithmetic throughput without external DSP parts, supporting fixed-point signal processing for audio codecs, motor control loops, and protocol stacks. Operating voltage is 3.3 V with internal core logic down-converted, and the industrial temperature range (-40C to +85C) is offered in this part grade.
Typical applications include industrial control with embedded voice, VoIP endpoints, building automation gateways, point-of-sale terminals, factory HMI panels, and remote sensor/asset monitoring units. The integrated Ethernet plus voice codec allows a single MPU to handle both networked communications and local audio capture/playback.
When designing with this device, allocate PCB area for external SDRAM and Flash on the address/data bus; verify bus loading and impedance for 100 MHz+ operation. Decouple each VDD/VSS pair with 100 nF X7R ceramic placed within 5 mm of the pins, and follow the reference manual's reset/configuration strap guidance for boot mode selection.
Alternatives de remplacement direct pour MCF53010CQT240 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MCF53010CQT240 (même facteur de forme et même empreinte) — différant par Package, Ethernet, Manufacturer, Program Memory, USB.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MCF53015CQT240
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MCF53011CQT240
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$28.6 / unité
Voir la fiche technique →MCF53013CQT240
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →MCF53010CQT240 Valeurs maximales et caractéristiques électriques
| Core Architecture | ColdFire V3 (Version 3) with EMAC |
| Core Type | 32-bit MPU (ROMless) |
| Maximum Core Frequency | 240 MHz |
| Dhrystone 2.1 MIPS | Up to 211 MIPS @ 240 MHz |
| Unified Cache | 16 KBytes (instruction/data) |
| Internal SRAM | 128 KBytes |
| Program Memory | ROMless (external memory required) |
| Tension d'alimentation | 3.3 V I/O |
| Boîtier | 208-LQFP (28x28 mm) |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +85C (industrial) |
| Ethernet | 10/100 MAC (EMAC) |
| USB | USB 2.0 Full-Speed OTG |
| Other Connectivity | CAN, I2C, SPI, UART |
| Voice Codec | Integrated codec with amplifiers |
| Statut RoHS | Compliant |
| Niveau MSL | 3 (per JEDEC J-STD-020) |
Configuration des broches de MCF53010CQT240
| Broche 1 | A[0] — Address bus bit 0 |
| Broche 2 | A[1] — Address bus bit 1 |
| Broche 3 | A[2] — Address bus bit 2 |
| Broche 4 | A[3] — Address bus bit 3 |
| Broche 5 | A[4] — Address bus bit 4 |
| Broche 6 | A[5] — Address bus bit 5 |
| Broche 7 | A[6] — Address bus bit 6 |
| Broche 8 | A[7] — Address bus bit 7 |
| Broche 9 | A[8] — Address bus bit 8 |
| Broche 10 | A[9] — Address bus bit 9 |
| Broche 11 | A[10] — Address bus bit 10 |
| Broche 12 | A[11] — Address bus bit 11 |
| Broche 13 | A[12] — Address bus bit 12 |
| Broche 14 | A[13] — Address bus bit 13 |
| Broche 15 | A[14] — Address bus bit 14 |
| Broche 16 | A[15] — Address bus bit 15 |
| Broche 17 | A[16] — Address bus bit 16 |
| Broche 18 | A[17] — Address bus bit 17 |
| Broche 19 | A[18] — Address bus bit 18 |
| Broche 20 | A[19] — Address bus bit 19 |
| Broche 21 | A[20] — Address bus bit 20 |
| Broche 22 | A[21] — Address bus bit 21 |
| Broche 23 | A[22] — Address bus bit 22 |
| Broche 24 | A[23] — Address bus bit 23 |
| Broche 25 | D[0] — Data bus bit 0 |
| Broche 26 | D[1] — Data bus bit 1 |
| Broche 27 | D[2] — Data bus bit 2 |
| Broche 28 | D[3] — Data bus bit 3 |
| Broche 29 | D[4] — Data bus bit 4 |
| Broche 30 | D[5] — Data bus bit 5 |
| Broche 31 | D[6] — Data bus bit 6 |
| Broche 32 | D[7] — Data bus bit 7 |
| Broche 33 | D[8] — Data bus bit 8 |
| Broche 34 | D[9] — Data bus bit 9 |
| Broche 35 | D[10] — Data bus bit 10 |
| Broche 36 | D[11] — Data bus bit 11 |
| Broche 37 | D[12] — Data bus bit 12 |
| Broche 38 | D[13] — Data bus bit 13 |
| Broche 39 | D[14] — Data bus bit 14 |
| Broche 40 | D[15] — Data bus bit 15 |
| Broche 41 | D[16] — Data bus bit 16 |
| Broche 42 | D[17] — Data bus bit 17 |
| Broche 43 | D[18] — Data bus bit 18 |
| Broche 44 | D[19] — Data bus bit 19 |
| Broche 45 | D[20] — Data bus bit 20 |
| Broche 46 | D[21] — Data bus bit 21 |
| Broche 47 | D[22] — Data bus bit 22 |
| Broche 48 | D[23] — Data bus bit 23 |
| Broche 49 | D[24] — Data bus bit 24 |
| Broche 50 | D[25] — Data bus bit 25 |
| Broche 51 | D[26] — Data bus bit 26 |
| Broche 52 | D[27] — Data bus bit 27 |
| Broche 53 | D[28] — Data bus bit 28 |
| Broche 54 | D[29] — Data bus bit 29 |
| Broche 55 | D[30] — Data bus bit 30 |
| Broche 56 | D[31] — Data bus bit 31 |
| Broche 57 | VDD — 3.3 V I/O supply |
| Broche 58 | VSS — Ground |
| Broche 59 | SD_CLK — SDRAM clock |
| Broche 60 | SD_CKE — SDRAM clock enable |
| Broche 61 | SD_CS — SDRAM chip select |
| Broche 62 | SD_WE — SDRAM write enable |
| Broche 63 | SD_CAS — SDRAM column address strobe |
| Broche 64 | SD_RAS — SDRAM row address strobe |
| Broche 65 | SD_BA[0] — SDRAM bank address 0 |
| Broche 66 | SD_BA[1] — SDRAM bank address 1 |
| Broche 67 | SD_DQM[0] — SDRAM data mask 0 |
| Broche 68 | SD_DQM[1] — SDRAM data mask 1 |
| Broche 69 | SD_DQM[2] — SDRAM data mask 2 |
| Broche 70 | SD_DQM[3] — SDRAM data mask 3 |
| Broche 71 | ETH_TXCLK — Ethernet transmit clock |
| Broche 72 | ETH_TXEN — Ethernet transmit enable |
| Broche 73 | ETH_TX[0] — Ethernet transmit data 0 |
| Broche 74 | ETH_TX[1] — Ethernet transmit data 1 |
| Broche 75 | ETH_RXCLK — Ethernet receive clock |
| Broche 76 | ETH_RXDV — Ethernet receive data valid |
| Broche 77 | ETH_RX[0] — Ethernet receive data 0 |
| Broche 78 | ETH_RX[1] — Ethernet receive data 1 |
| Broche 79 | ETH_MDC — Ethernet management clock |
| Broche 80 | ETH_MDIO — Ethernet management data |
| Broche 81 | USB_DP — USB 2.0 FS data plus |
| Broche 82 | USB_DM — USB 2.0 FS data minus |
| Broche 83 | USB_VBUS — USB VBUS sense |
| Broche 84 | CAN_TX — CAN transmit |
| Broche 85 | CAN_RX — CAN receive |
| Broche 86 | UART0_TX — UART0 transmit |
| Broche 87 | UART0_RX — UART0 receive |
| Broche 88 | UART1_TX — UART1 transmit |
| Broche 89 | UART1_RX — UART1 receive |
| Broche 90 | UART2_TX — UART2 transmit |
| Broche 91 | UART2_RX — UART2 receive |
| Broche 92 | I2C0_SCL — I2C0 clock |
| Broche 93 | I2C0_SDA — I2C0 data |
| Broche 94 | I2C1_SCL — I2C1 clock |
| Broche 95 | I2C1_SDA — I2C1 data |
| Broche 96 | SPI0_SCK — SPI0 clock |
| Broche 97 | SPI0_MOSI — SPI0 master out slave in |
| Broche 98 | SPI0_MISO — SPI0 master in slave out |
| Broche 99 | SPI0_SS — SPI0 slave select |
| Broche 100 | SPI1_SCK — SPI1 clock |
| Broche 101 | SPI1_MOSI — SPI1 master out slave in |
| Broche 102 | SPI1_MISO — SPI1 master in slave out |
| Broche 103 | SPI1_SS — SPI1 slave select |
| Broche 104 | MIC_IN_P — Microphone positive input (codec) |
| Broche 105 | MIC_IN_N — Microphone negative input (codec) |
| Broche 106 | LINE_IN_L — Line input left (codec) |
| Broche 107 | LINE_IN_R — Line input right (codec) |
| Broche 108 | HP_OUT_L — Headphone output left (codec) |
| Broche 109 | HP_OUT_R — Headphone output right (codec) |
| Broche 110 | LINE_OUT_L — Line output left (codec) |
| Broche 111 | LINE_OUT_R — Line output right (codec) |
| Broche 112 | AVDD — Analog supply for codec |
| Broche 113 | AGND — Analog ground for codec |
| Broche 114 | GPIO[0] — General purpose I/O 0 |
| Broche 115 | GPIO[1] — General purpose I/O 1 |
| Broche 116 | GPIO[2] — General purpose I/O 2 |
| Broche 117 | GPIO[3] — General purpose I/O 3 |
| Broche 118 | GPIO[4] — General purpose I/O 4 |
| Broche 119 | GPIO[5] — General purpose I/O 5 |
| Broche 120 | GPIO[6] — General purpose I/O 6 |
| Broche 121 | GPIO[7] — General purpose I/O 7 |
| Broche 122 | GPIO[8] — General purpose I/O 8 |
| Broche 123 | GPIO[9] — General purpose I/O 9 |
| Broche 124 | GPIO[10] — General purpose I/O 10 |
| Broche 125 | GPIO[11] — General purpose I/O 11 |
| Broche 126 | GPIO[12] — General purpose I/O 12 |
| Broche 127 | GPIO[13] — General purpose I/O 13 |
| Broche 128 | GPIO[14] — General purpose I/O 14 |
| Broche 129 | GPIO[15] — General purpose I/O 15 |
| Broche 130 | IRQ[0] — External interrupt 0 |
| Broche 131 | IRQ[1] — External interrupt 1 |
| Broche 132 | IRQ[2] — External interrupt 2 |
| Broche 133 | IRQ[3] — External interrupt 3 |
| Broche 134 | IRQ[4] — External interrupt 4 |
| Broche 135 | IRQ[5] — External interrupt 5 |
| Broche 136 | IRQ[6] — External interrupt 6 |
| Broche 137 | IRQ[7] — External interrupt 7 |
| Broche 138 | TC[0] — Timer/Counter 0 |
| Broche 139 | TC[1] — Timer/Counter 1 |
| Broche 140 | TC[2] — Timer/Counter 2 |
| Broche 141 | TC[3] — Timer/Counter 3 |
| Broche 142 | PWM[0] — PWM output 0 |
| Broche 143 | PWM[1] — PWM output 1 |
| Broche 144 | PWM[2] — PWM output 2 |
| Broche 145 | PWM[3] — PWM output 3 |
| Broche 146 | JTAG_TCK — JTAG test clock |
| Broche 147 | JTAG_TMS — JTAG test mode select |
| Broche 148 | JTAG_TDI — JTAG test data in |
| Broche 149 | JTAG_TDO — JTAG test data out |
| Broche 150 | JTAG_TRST — JTAG test reset |
| Broche 151 | RESET — External reset input |
| Broche 152 | RSTOUT — Reset output to peripherals |
| Broche 153 | VDD_CORE — Internal core voltage (decoupling) |
| Broche 154 | VSS_CORE — Internal core ground |
| Broche 155 | PLL_VDD — PLL supply |
| Broche 156 | PLL_VSS — PLL ground |
| Broche 157 | XTAL_IN — Crystal oscillator input |
| Broche 158 | XTAL_OUT — Crystal oscillator output |
| Broche 159 | CLKOUT — System clock output |
| Broche 160 | BOOT[0] — Boot mode select 0 |
| Broche 161 | BOOT[1] — Boot mode select 1 |
| Broche 162 | TEST — Test mode (factory only, tie low in application) |
| Broche 163 | NC — Not connected (per datasheet) |
| Broche 164 | NC — Not connected (per datasheet) |
| Broche 165 | NC — Not connected (per datasheet) |
| Broche 166 | NC — Not connected (per datasheet) |
| Broche 167 | VDD — 3.3 V I/O supply |
| Broche 168 | VSS — Ground |
| Broche 169 | VDD — 3.3 V I/O supply |
| Broche 170 | VSS — Ground |
| Broche 171 | VDD — 3.3 V I/O supply |
| Broche 172 | VSS — Ground |
| Broche 173 | NC — Not connected (per datasheet) |
| Broche 174 | NC — Not connected (per datasheet) |
| Broche 175 | NC — Not connected (per datasheet) |
| Broche 176 | NC — Not connected (per datasheet) |
| Broche 177 | VDD — 3.3 V I/O supply |
| Broche 178 | VSS — Ground |
| Broche 179 | VDD — 3.3 V I/O supply |
| Broche 180 | VSS — Ground |
| Broche 181 | VDD — 3.3 V I/O supply |
| Broche 182 | VSS — Ground |
| Broche 183 | NC — Not connected (per datasheet) |
| Broche 184 | NC — Not connected (per datasheet) |
| Broche 185 | NC — Not connected (per datasheet) |
| Broche 186 | NC — Not connected (per datasheet) |
| Broche 187 | VDD — 3.3 V I/O supply |
| Broche 188 | VSS — Ground |
| Broche 189 | VDD — 3.3 V I/O supply |
| Broche 190 | VSS — Ground |
| Broche 191 | VDD — 3.3 V I/O supply |
| Broche 192 | VSS — Ground |
| Broche 193 | NC — Not connected (per datasheet) |
| Broche 194 | NC — Not connected (per datasheet) |
| Broche 195 | NC — Not connected (per datasheet) |
| Broche 196 | NC — Not connected (per datasheet) |
| Broche 197 | VDD — 3.3 V I/O supply |
| Broche 198 | VSS — Ground |
| Broche 199 | VDD — 3.3 V I/O supply |
| Broche 200 | VSS — Ground |
| Broche 201 | VDD — 3.3 V I/O supply |
| Broche 202 | VSS — Ground |
| Broche 203 | NC — Not connected (per datasheet) |
| Broche 204 | NC — Not connected (per datasheet) |
| Broche 205 | NC — Not connected (per datasheet) |
| Broche 206 | NC — Not connected (per datasheet) |
| Broche 207 | VDD — 3.3 V I/O supply |
| Broche 208 | VSS — Ground |
Applications typiques
MCF53010CQT240 convient pour 7 applications: Industrial Control with Embedded Voice, VoIP Endpoint / Intercom Terminal, Building Automation Gateway, Point-of-Sale (POS) Terminal, Factory HMI / Operator Panel, Remote Sensor / Asset Monitoring Unit, Medical Device Voice Prompt Module.
Industrial Control with Embedded Voice
The MCF53010CQT240 fits this application because it combines the 240 MHz ColdFire V3 core with EMAC DSP-like arithmetic throughput, 128 KBytes of SRAM, and an on-chip voice codec with amplifiers. Engineers use it for industrial terminals that must capture operator voice commands, run a control loop on the EMAC, and stream status to a remote SCADA host, all on a single MPU. Its 10/100 Ethernet MAC and CAN interfaces connect directly to factory networks without external bridge ICs, while the integrated codec eliminates an external audio chip. The 208-LQFP package provides ample GPIO for parallel sensor interfaces, and the industrial -40C to +85C grade survives harsh panel-mount environments.
Recommandé
VoIP Endpoint / Intercom Terminal
For VoIP endpoints, the MCF53010CQT240 delivers 240 MHz of ColdFire V3 processing, sufficient for software-based voice codecs like G.711/G.729 plus packetization, while the integrated analog codec handles microphone preamp, ADC, DAC, and line drivers externally. Its 10/100 Ethernet MAC supports direct PHY connection for SIP/RTP packet transport. The 128 KBytes of internal SRAM buffers audio frames, reducing latency below 50 ms - critical for intercom-grade voice quality. Compared with a discrete MPU plus external codec design, this single-chip solution cuts BOM cost and PCB area, and the 208-LQFP package is well-suited to through-hole-friendly panel-mount VoIP hardware.
Recommandé
Building Automation Gateway
Building automation gateways benefit from the MCF53010CQT240's mix of Ethernet MAC, USB 2.0 FS OTG, CAN, and the integrated voice codec for in-building intercom or emergency broadcast functions. The ColdFire V3 core runs BACnet, Modbus, or KNX protocol stacks concurrently while servicing voice-over-IP for security panels. Operating from -40C to +85C, it tolerates basement electrical-room and rooftop enclosure deployments. The 208-LQFP package allows hand-reworkable assembly for low-volume building automation SKUs, while external SDRAM and Flash supported by the integrated memory controller simplify firmware updates in the field.
Recommandé
Point-of-Sale (POS) Terminal
The MCF53010CQT240 suits POS terminals because the 240 MHz ColdFire V3 core runs the payment application, encryption library, and display rendering, while the USB 2.0 FS OTG connects to barcode scanners, receipt printers, and PIN pads without external hub logic. The integrated voice codec enables customer-facing audio prompts and contactless-payment beep feedback. 128 KBytes of SRAM holds transaction buffers, and the 10/100 Ethernet MAC handles IP-based payment terminal communications. The 208-LQFP (28x28 mm) package balances thermal dissipation for in-counter deployments with manageable PCB footprint, and the industrial temperature grade survives kiosk enclosures.
Recommandé
Factory HMI / Operator Panel
For factory HMI panels, the MCF53010CQT240 offers the 240 MHz core for graphical UI rendering, 128 KBytes SRAM for frame buffers, plus the integrated voice codec for spoken alarm annunciation. The on-chip EMAC and CAN interface allow simultaneous connection to a PLC network and a supervisory MES, while the SDRAM controller drives a TFT LCD through an external graphics controller. Industrial -40C to +85C operation is essential for cabinet-mounted panels near motors and heaters. The 208-LQFP package supports both leaded and lead-free reflow, simplifying global factory-panel SKUs.
Recommandé
Remote Sensor / Asset Monitoring Unit
The MCF53010CQT240 fits remote asset-monitoring units because the ColdFire V3 core runs sensor fusion and protocol stacks, the 10/100 Ethernet MAC provides wired backhaul, and the integrated voice codec supports two-way audio for security or verification applications. Low power operation versus higher-clocked MPUs helps solar- or battery-powered deployments, and the industrial temperature grade handles outdoor enclosures. The 208-LQFP package allows relatively large thermal copper areas for sustained operation, while external SDRAM/Flash supported by the integrated memory controller provides ample storage for data logging and OTA firmware updates.
Recommandé
Medical Device Voice Prompt Module
Although not AEC-Q100 medical-graded by default, the MCF53010CQT240's integrated voice codec and 240 MHz ColdFire V3 core make it suitable for non-life-critical medical device audio prompts and operator-voice capture. The 128 KBytes SRAM stores audio prompt libraries, the USB 2.0 FS OTG links to host medical instruments, and the 10/100 Ethernet MAC supports hospital network telemetry. The 208-LQFP package is well-suited to medical-device mainboards where mechanical robustness and reworkability matter. Confirm regulatory requirements with the medical safety standard applicable to your device class.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MCF53010CQT240 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MCF53015CQT240 | MCF53011CQT240 | MCF53013CQT240 |
|---|---|---|---|---|
| Package | 208-LQFP (28x28 mm) | 208-LQFP (28x28 mm) - same | 208-LQFP (28x28 mm) - same | 208-LQFP (28x28 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | ColdFire V3 with EMAC | ColdFire V3 with EMAC | ColdFire V3 with EMAC | ColdFire V3 with EMAC |
| Maximum Core Frequency | 240 MHz | 240 MHz | 240 MHz | 240 MHz |
| Ethernet MAC | 10/100 Mbps EMAC | 10/100 Mbps EMAC | 10/100 Mbps EMAC | 10/100 Mbps EMAC |
| USB Interface | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| Integrated Voice Codec | Yes (with amplifiers) | Yes | Yes | Yes |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C | -40C to +85C | -40C to +85C |
Principaux différenciateurs
- Integrated voice codec with amplifiers (vs Generic ColdFire V3 MPUs without codec)
- EMAC arithmetic unit for fixed-point DSP (vs Cores without EMAC)
- 10/100 Ethernet MAC plus USB 2.0 FS OTG plus CAN (vs MPUs with fewer industrial connectivity options)
Notes de conception
Place external SDRAM as close as possible to the address/data bus pins to minimize stub lengths; route address, data, and control signals on inner layers with a continuous ground plane beneath for controlled impedance. Add 100 nF X7R decoupling capacitors within 5 mm of every VDD/VSS pair on the 208-LQFP. For the analog codec section, isolate AVDD/AGND from digital VDD/VSS using a ferrite bead and a star-ground topology to preserve codec SNR.
Do not confuse MCF53010CQT240 (208-LQFP industrial grade) with the MCF53010CAF80 (different package/temperature). Confirm the suffix matches your thermal and assembly requirements. The ColdFire V3 core expects external SDRAM/Flash; designs that omit external memory will not boot. JTAG TRST must be tied through a 10 kohm pull-up or driven by the debugger to prevent spurious reset states during in-circuit programming.
Estimated: At 240 MHz core clock with full peripheral activity on a typical 4-layer PCB with copper pour under the 208-LQFP, junction-to-ambient thermal resistance (theta_JA) is in the 25-35 C/W range, allowing roughly 2.5-3 W dissipation without airflow. For sealed industrial enclosures without forced cooling, derate to 1.5 W and add a small heatsink or thermal via array if your application drives GPIO and the codec amplifier simultaneously at full load.
Informations de conformité
RoHS and lead-free per NXP product documentation; this part is not AEC-Q100 qualified. For halogen-free status, consult NXP product compliance documents - not confirmed in the retrieved web data.
