MCIMX233DJM4B - i.MX23 ARM926EJ-S MPU, 454 MHz, 169-MAPBGA | NXP Semiconductors
Référence : MCIMX233DJM4B ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.4 | $18,40 |
| 10 | $16.1 | $161,00 |
| 100 | $13.55 | $1 355,00 |
| 500 | $11.2 | $5 600,00 |
| 1 000 | $9.85 | $9 850,00 |
MCIMX233DJM4B Présentation
An applications processor (AP) is a system-on-chip (SoC) class of integrated circuit that combines a microprocessor core, memory interfaces, peripherals, and increasingly on-chip analog blocks to run a complete end-product application without external companion logic. Within NXP's i.MX family hierarchy, the i.MX23 sits in the low-power ARM9 stratum: applications processor -> multimedia applications processor -> i.MX family -> ARM9 stratum, with descendants i.MX25, i.MX27, i.MX28 and later Cortex-A series such as i.MX6 and i.MX8.
Key features include ARM926EJ-S core, 454 MHz maximum clock, 16 KB I-cache and 16 KB D-cache, integrated Power Management Unit (PMU) with linear regulators and DCDC control, mixed-signal analog audio block with headphone amplifier, LCD controller supporting digital TFT panels, USB High-Speed with integrated PHY (device and host roles), three UARTs, two SSP ports, I2C master, two SAI (serial audio interface) blocks, SPDIF transceiver, 6-channel 12-bit Low Resolution ADC, and on-chip boot ROM supporting NAND, SD/MMC, SPI flash and USB boot. Operating junction temperature range is -40 C to +85 C for the commercial grade.
The i.MX23 was Freescale's first applications processor to integrate a full PMU directly on-die, allowing the part to be powered from a single 3.6 V to 4.5 V Li-Ion cell or USB bus without external voltage rails. This integration, combined with the 11x11 mm MAPBGA, made the i.MX23 popular in cost-sensitive portable media players, e-readers, and entry-level industrial HMI panels between 2009 and 2014.
Typical applications include portable media players, e-readers, IP cameras, low-cost industrial human-machine interface (HMI) panels, point-of-sale terminals, and connected sensor hubs. The integrated PMU and USB HS PHY reduce BOM count, while the 454 MHz ARM926EJ-S headroom supports light Linux/MQX RTOS workloads and modest LCD GUI rendering.
Designers should plan the PCB stackup around the 169-MAPBGA's 0.65 mm pitch and provide a solid GND pour plus thermal vias under the exposed die paddle for the 1 W worst-case dissipation. The on-chip PMU requires careful sequencing of DCDC vs LDO modes and adequate input bulk capacitance to handle the audio amplifier inrush current without sagging the digital supply.
This page synthesizes distributor pricing, lifecycle context, drop-in alternative guidance, and practical design considerations not consolidated in the Freescale/NXP reference manual, enabling sourcing and design engineers to evaluate the MCIMX233DJM4B for both new designs and legacy support commitments.
Alternatives de remplacement direct pour MCIMX233DJM4B — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MCIMX233DJM4B (même facteur de forme et même empreinte) — différant par Core Architecture, Mounting Type, Package, Data Cache, Integrated ADC.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MCIMX233CJM4B
✅ Remplacement direct✓ En stock
$4.45 / unité
Voir la fiche technique →MCIMX233CJM4C
✅ Remplacement direct✓ En stock
$9.85 / unité
Voir la fiche technique →MCIMX233DJM4C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCIMX283DAG4B
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCIMX287DAG4B
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCIMX233DJM4B Valeurs maximales et caractéristiques électriques
| Core Architecture | ARM926EJ-S |
| Core Count | 1 |
| Largeur du bus de données | 32-bit |
| Maximum CPU Clock | 454 MHz |
| Instruction Cache | 16 KB |
| Data Cache | 16 KB |
| Boîtier | 169-MAPBGA (11x11 mm) |
| Ball Pitch | 0.65 mm |
| USB | USB HS Device/Host with integrated PHY |
| UART | 3 |
| SSP (SPI) | 2 |
| I2C | 1 master |
| Serial Audio Interface (SAI) | 2 |
| SPDIF | 1 (transceiver) |
| Low-Resolution ADC | 6 channels, 12-bit |
| LCD Controller | Yes (digital TFT panels) |
| Integrated PMU | Yes (linear LDOs + DCDC control) |
| Mixed-Signal Audio / Headphone Amplifier | Yes (integrated) |
| Tension d'alimentation | Single 3.6 V to 4.5 V (Li-Ion cell) |
| Plage de température de fonctionnement | -40 C to +85 C (commercial grade) |
| Type de montage | Surface Mount (BGA) |
Guide de configuration des broches du MCIMX233DJM4B 169-mapbga (11x11 mm)
Configuration des broches du MCIMX233DJM4B (boîtier 169-mapbga (11x11 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MCIMX233DJM4B.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MCIMX233DJM4B convient pour 6 applications: Portable Media Player, E-Reader, Low-Cost Industrial HMI Panel, IP Network Camera, Point-of-Sale Terminal, Connected Sensor Hub / IoT Gateway.
Portable Media Player
Why MCIMX233DJM4B fits: the ARM926EJ-S core at 454 MHz delivers enough MIPS to decode MP3, WMA, and low-bitrate MPEG-4 video while the integrated mixed-signal audio block and headphone amplifier drive 16-ohm or 32-ohm headphones directly without an external DAC. The integrated PMU lets the entire player run from a single 3.7 V Li-Ion cell, eliminating external DC-DC parts and shrinking the BOM. How used: the SoC streams decoded audio to its internal SAI block, drives a small TFT panel via the on-die LCD controller, and boots the firmware from NAND or SD/MMC. Trade-off vs an i.MX28 upgrade: the i.MX23 is in Last-Time-Buy, so for new programs the i.MX28 (same ARM9 + PMU architecture) is preferred.
Recommandé
E-Reader
Why MCIMX233DJM4B fits: e-ink panels require only modest refresh rates, and the i.MX23's 454 MHz ARM926EJ-S core plus integrated LCD controller handles 8-bit grayscale waveform update at acceptable page-turn latency. The integrated PMU and low standby current let e-readers sustain weeks of battery life between charges, and the 169-MAPBGA footprint keeps the board compact behind the panel. How used: the SoC streams panel waveforms over its parallel LCD interface, reads page data from SD/MMC or NAND, and wakes on GPIO for the next page. Trade-off: the i.MX23 lacks hardware e-ink controllers found in newer i.MX7D/i.MX8MM parts, so waveform generation is firmware-driven.
Recommandé
Low-Cost Industrial HMI Panel
Why MCIMX233DJM4B fits: industrial HMIs need a real-time controller with USB for programming, an LCD controller for the panel, and a small BOM. The i.MX23 hits all three while keeping the bill of materials under USD 15 by absorbing the PMU and USB HS PHY on-die. The 169-MAPBGA at 0.65 mm pitch supports compact panel-mounted PCBs. How used: the SoC runs a light Linux or MQX RTOS stack, drives a 3.5" to 7" TFT panel via the integrated LCD controller, and exposes UART/RS-485 for the fieldbus. Trade-off vs i.MX6ULL: newer designs prefer i.MX6ULL for Cortex-A7 performance and active NXP lifecycle support.
Recommandé
IP Network Camera
Why MCIMX233DJM4B fits: the i.MX23 was a popular SoC for early-generation IP cameras because the ARM926EJ-S handles MJPEG compression at CIF/VGA resolution while the integrated USB HS PHY and Ethernet MAC provide wired networking. The on-die PMU lets the camera draw from PoE or a 12 V adapter with minimal external regulation. How used: the SoC captures from an external image sensor over its parallel CMOS sensor interface, performs MJPEG compression in software, and streams over Ethernet. Trade-off: modern cameras require H.264 hardware acceleration, which the i.MX23 lacks - new designs should use the i.MX6ULL or i.MX8M.
Recommandé
Point-of-Sale Terminal
Why MCIMX233DJM4B fits: point-of-sale terminals need an LCD, a keypad scan interface, USB for peripherals, and a small footprint - all of which the i.MX23 integrates. The integrated mixed-signal audio supports beeper and voice prompts, and the 169-MAPBGA footprint fits a compact main board under the keypad. How used: the SoC drives a small character or TFT LCD for the cashier display, scans the keypad matrix via GPIO, and exposes USB host for the barcode scanner and receipt printer. Trade-off: the i.MX23 lacks secure-boot hardware acceleration needed for PCI-compliant terminals, so newer POS designs should use i.MX6ULL with HAB.
Recommandé
Connected Sensor Hub / IoT Gateway
Why MCIMX233DJM4B fits: the on-die 6-channel 12-bit LRADC, three UARTs, and two SSPs let a single i.MX23 aggregate sensor data from multiple analog and digital sensors and forward it over Ethernet or USB. The integrated PMU keeps idle power low, which matters for solar- or battery-powered IoT gateways. How used: the SoC periodically wakes from sleep, scans the LRADC for analog sensor values, reads UART/SSP digital sensors, packages the data, and transmits over USB or Ethernet. Trade-off: newer i.MX RT parts (i.MX RT1060) deliver Cortex-M7 performance at much lower power, so new gateways should evaluate those first.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MCIMX233DJM4B — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MCIMX233CJM4B | MCIMX233CJM4C | MCIMX233DJM4C | MCIMX283DAG4B | MCIMX287DAG4B |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 169-MAPBGA (11x11 mm) | 169-MAPBGA (11x11 mm) - same | 169-MAPBGA (11x11 mm) - same | 169-MAPBGA (11x11 mm) - same | 169-MAPBGA (11x11 mm) - same | 169-MAPBGA (11x11 mm) - same |
| Core Architecture | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S |
| Integrated PMU | Yes | Yes | Yes | Yes | Yes | Yes |
| USB HS PHY | Integrated | Integrated | Integrated | Integrated | Integrated | Integrated |
| LCD Controller | Yes | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| Lifecycle Status | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Active (i.MX28 family) | Active (i.MX28 family) |
Principaux différenciateurs
- Integrated PMU on-die (vs MCIMX233CJM4B)
- Integrated USB HS PHY (vs MCIMX233DJM4C)
- Integrated mixed-signal audio block + headphone amplifier (vs MCIMX233CJM4C)
- Same-package migration path to i.MX28 family (vs MCIMX283DAG4B)
Notes de conception
Estimated: at 454 MHz core clock with USB HS and audio playback active, the i.MX23 dissipates roughly 0.5 W to 1 W. The 169-MAPBGA exposes a thermal pad under the die that must be soldered to a solid GND copper pour with at least four thermal vias to the inner plane. Without this, junction temperature will rise above 100 C under load, especially inside enclosed plastic enclosures typical of portable media players. Always re-measure the actual dissipation with the target firmware workload before finalizing the thermal design.
Use an ENIG or immersion-silver surface finish and NSMD land pads for the 0.65 mm pitch MAPBGA. Place 0.1 uF and 4.7 uF decoupling capacitors on every power pin within 1 mm of the package, with the smallest value closest to the ball. Reference Freescale/NXP AN3461 ('i.MX23 PCB Design Guidelines') for stackup, via-in-pad, and trace-routing recommendations. A 4-layer stackup (signal/GND/PWR/signal) with continuous reference planes is required for USB HS signal integrity.
The integrated PMU requires careful input bulk capacitance: at least 22 uF low-ESR ceramic plus a 100 uF tantalum or polymer bulk on the VBAT pin to handle the headphone-amplifier inrush current. Follow the NXP i.MX23 reference manual power-sequencing section exactly: DCDC vs LDO mode bits must be programmed via OTP or boot ROM straps, otherwise the part will not start reliably. Designers should also add a single-cell Li-Ion charger IC if battery-powered.
Do not assume the i.MX233 suffix letters are field-replaceable: the 'D' vs 'C' prefix and 'M4B' vs 'M4C' suffix letters reflect different fab revisions and OTP trim values for the PMU. Always re-validate boot ROM, USB PHY enumeration, and headphone-amplifier behavior when substituting one suffix for another, even within the same package. Also note that the i.MX23 family is in Last-Time-Buy, so securing long-term supply requires either a stocking agreement with Rochester Electronics or migration to i.MX28 / i.MX6ULL.
Informations de conformité
RoHS-compliant, lead-free, halogen-free per Freescale/NXP product page. Commercial grade only - not AEC-Q100 qualified. For automotive deployments, migrate to AEC-Q100-qualified members of the i.MX family.
