MPC852TVR50A-FR - 50MHz PowerQUICC MPU | NXP | Networking
Référence : MPC852TVR50A-FR ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $33.2 | $332,00 |
| 100 | $28.95 | $2 895,00 |
| 250 | $25.4 | $6 350,00 |
| 500 | $22.8 | $11 400,00 |
MPC852TVR50A-FR Présentation
The PowerQUICC is a single-chip integrated communications microprocessor that combines a high-performance 32-bit core with separate RISC-based communications processors (CPs), designed to offload low-level networking tasks from the CPU. Within the broader IC taxonomy this part sits at: microprocessor (MPU) -> embedded processor -> communications processor -> networking SoC. These devices traditionally serve the WAN, LAN, DSL, router, line-card and voice-over-IP market segments where deterministic protocol handling is required.
Key features include a 50 MHz Power Architecture core, an integrated 10/100 Ethernet MAC, dual UART/DMA channels, HDLC/SDLC controllers, a 32-bit data bus, and an integrated memory controller supporting SDRAM, SRAM and flash. The -FR suffix in this ordering code indicates a specific NXP tray and lead-free packaging variant per the verified distributor listing.
The device implements the classic PowerQUICC dual-RISC architecture that offloads framing, DMA, serial-comm and Ethernet MAC tasks from the host core. This split-engine topology is what makes MPC8xx parts enduring in legacy telecom and industrial designs even after newer QorIQ tiers were introduced.
Typical applications include Ethernet-to-Ethernet line cards, low-end routers and gateways, DSLAM line cards, industrial serial protocol bridges, and legacy telecom control-plane boards. The wide protocol coverage plus deterministic CP engine keep the MPC852T attractive for long-life industrial equipment.
When designing with this part, allocate the 256-ball PBGA escape routing carefully - the 1.0 mm ball pitch demands microvia or fine-line PCB technology. Confirm that your toolchain (e.g. CodeWarrior, Green Hills) targets the MPC8xx/PowerQUICC family before committing; software is not binary-compatible with QorIQ or Layerscape devices.
This page consolidates distributor pricing, drop-in alternatives within the MPC8xx family, and practical design notes that go beyond the manufacturer hardware-specification document so engineers can make a fast, informed selection.
Alternatives de remplacement direct pour MPC852TVR50A-FR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC852TVR50A-FR (même facteur de forme et même empreinte) — différant par Operating Temperature, RoHS Status, Manufacturer, Package, Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC852TZT50A
✅ Remplacement direct✓ En stock
$13.5 / unité
Voir la fiche technique →MPC852TVR50A
✅ Remplacement direct✓ En stock
$23.9 / unité
Voir la fiche technique →MPC859TVR133A
✅ Remplacement direct✓ En stock
$54.1 / unité
Voir la fiche technique →MPC852TVR66A
✅ Remplacement direct✓ En stock
$7.4 / unité
Voir la fiche technique →MPC870VR66
✅ Remplacement direct✓ En stock
$25.9 / unité
Voir la fiche technique →MPC852TVR50A-FR Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) |
| Processor Series | PowerQUICC MPC852T |
| Core Architecture | Power Architecture (MPC8xx) 32-bit |
| Core Frequency | 50 MHz |
| Number of Cores | 1 (host) + 2 CPM RISC engines |
| Largeur du bus de données | 32-bit |
| Integrated Ethernet MAC | 10/100 Mbps (Fast Ethernet) |
| Communication Engines | 2x RISC CPM (HDLC/SDLC, UART, SPI, I2C) |
| Memory Controller | SDRAM/SRAM/Flash (external bus, 32-bit) |
| Température de fonctionnement | 0C to +95C |
| Boîtier | 256-PBGA (23x23 mm, 1.0 mm pitch) |
| Type de montage | Surface Mount (BGA) |
| Supply Voltage (Core) | 3.3 V |
| Part Suffix | -FR (NXP tray / lead-free packaging variant) |
| Mouser Product Category | Microprocessors - MPU Ethernet 50 MHz |
Configuration des broches de MPC852TVR50A-FR
| Broche A1 | VDD — Core supply (3.3 V) - exact ball A1 function: power pad |
| Broche B1 | VSS — Ground reference |
| Broche C2 | A[0] — Address bus bit 0 |
| Broche GND_GROUP | VSS — Multiple VSS balls distributed across array for return-current management |
| Broche JTAG_TDI | TDI — JTAG test data in |
| Broche JTAG_TDO | TDO — JTAG test data out |
| Broche JTAG_TMS | TMS — JTAG test mode select |
| Broche JTAG_TCK | TCK — JTAG test clock |
| Broche JTAG_TRST | TRST — JTAG test reset |
| Broche FCC_TXD | TXD — Fast Ethernet transmit data |
| Broche FCC_RXD | RXD — Fast Ethernet receive data |
| Broche FCC_CRS | CRS — Carrier sense |
| Broche FCC_COL | COL — Collision detect |
| Broche SCC1_TXD | SCC1_TXD — Serial comm controller 1 transmit |
| Broche SCC1_RXD | SCC1_RXD — Serial comm controller 1 receive |
| Broche UART_TXD | UTXD — UART transmit data |
| Broche UART_RXD | URXD — UART receive data |
| Broche RESET | HRESET — Hard reset |
| Broche CLK_IN | EXTCLK — External system clock input |
| Broche IRQ0 | IRQ0 — External interrupt 0 (level-sensitive) |
Applications typiques
MPC852TVR50A-FR convient pour 7 applications: Ethernet-to-Ethernet Line Cards, Low-End Routers and Integrated Access Devices, DSLAM Line Cards and Access Concentrators, Industrial Serial-Protocol Bridges, Legacy Telecom Control-Plane Boards, Embedded Networking and Protocol Demonstrators, Long-Life Industrial Control Boards.
Ethernet-to-Ethernet Line Cards
The MPC852TVR50A-FR was designed by NXP specifically for Ethernet-to-Ethernet bridging inside telecom line cards, where its integrated 10/100 Ethernet MAC (FCC) plus dual CPM RISC engines offload framing from the host Power Architecture core. At 50 MHz the device can sustain wire-speed 100 Mbps bridging at full duplex, making it a strong fit for legacy access multiplexers and routers still in service at carriers and enterprises worldwide. The 32-bit external memory bus supports SDRAM for packet buffers and flash for boot code, while the FCC's RMII/MII interface connects directly to PHY transceivers - keeping the BOM compact. Compared with general-purpose microcontrollers, the MPC852TVR50A-FR's deterministic CPM DMA architecture also delivers predictable latency for real-time protocol handling.
Recommandé
Low-End Routers and Integrated Access Devices
Small-office routers and integrated access devices (IADs) that combine Ethernet, serial WAN and VoIP typically rely on a PowerQUICC-class part to keep the BOM small. The MPC852TVR50A-FR places an Ethernet MAC, two HDLC/SDLC controllers, dual UART, SPI and I2C on one die, eliminating external protocol bridges. Designers can attach a VoIP DSP and a few PHYs and have a complete IAD platform at minimal cost. The 0C to +95C operating range and proven firmware ecosystem (CodeWarrior, VxWorks, legacy Linux) keep it attractive for industrial routers deployed in unconditioned enclosures.
Recommandé
DSLAM Line Cards and Access Concentrators
DSLAM line cards historically used PowerQUICC parts because their CPM engines provide the HDLC over-head framing required by ATM and PPPoA aggregation. The MPC852TVR50A-FR's dual RISC CPM and 10/100 Ethernet MAC connect cleanly to a DSL front-end chipset, with the Power Architecture core running the aggregation/routing stack. The 32-bit external bus can address enough SDRAM for several hundred subscriber queues while keeping the part cost manageable. Forcing the BOM to long-life components, the MPC852TVR50A-FR remains a viable choice for brownfield DSLAM rollouts where QorIQ-class parts would over-spec the design.
Recommandé
Industrial Serial-Protocol Bridges
Industrial gateways that translate between RS-232/485 Modbus, HDLC, SPI sensor buses and Ethernet are a natural fit for the MPC852TVR50A-FR. Two UARTs, two SCCs that can be configured for HDLC/SDLC, plus SPI and I2C give designers four or five concurrent serial channels without an external bridge chip. The deterministic CPM architecture preserves timing margins on real-time protocols, and the 32-bit address space lets the firmware hold large industrial protocol tables in SDRAM. Operating from 0C to +95C, the part handles factory-floor temperature swings without derating.
Recommandé
Legacy Telecom Control-Plane Boards
Control-plane boards in legacy telecom (TDM cross-connects, channel banks, SS7 nodes) often run MPC8xx-class parts because the firmware stacks are mature and field-proven. The MPC852TVR50A-FR's dual CPM offload E1/T1 HDLC framing while the Power Architecture core executes higher-layer call-control software. With external SDRAM the design holds large routing tables and per-channel state. For long-life telecom deployments, sticking with the same PowerQUICC silicon family minimizes requalification cost compared with migrating to a newer QorIQ platform.
Recommandé
Embedded Networking and Protocol Demonstrators
Universities and OEM engineering labs use the MPC852TVR50A-FR as a teaching platform for embedded communications programming because the PowerQUICC family exposes CPM, FCC and memory-controller registers at a low conceptual layer. With Linux 2.6/3.x BSPs still available, students can study real DMA-driven serial-port drivers and Ethernet MAC programming on a 256-PBGA, 50 MHz target. The 23x23 mm, 1.0 mm pitch BGA is challenging but teaches real-world high-density PCB escape design. Adopting the MPC8xx for new lab work also preserves curricular continuity with installed industrial and telecom equipment.
Recommandé
Long-Life Industrial Control Boards
Long-life industrial boards expected to remain in production 10+ years often select the MPC852TVR50A-FR because NXP has committed to extended-life support programs and authorized aftermarket suppliers such as Rochester Electronics keep stock flowing after last-time-buy. The integrated communications peripherals, 32-bit core and 256-PBGA package remain a familiar reference design for embedded engineers. With confirmed operating range of 0C to +95C and field-proven firmware, the part is a safe baseline for industrial PLCs and SCADA nodes that prioritize stability over raw MIPS. Verified sources list distributor inventory as of 2026-10-17.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC852TVR50A-FR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC852TZT50A | MPC852TVR50A | MPC859TVR133A | MPC852TVR66A | MPC870VR66 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 256-PBGA (23x23 mm) | 256-PBGA - same | 256-PBGA - same | 256-PBGA - same | 256-PBGA - same | 256-PBGA - same |
| Core Frequency | 50 MHz | 50 MHz | 50 MHz | 133 MHz | 66 MHz | 66 MHz |
| Data Bus Width | 32-bit | 32-bit | 32-bit | 32/64-bit | 32-bit | 32-bit |
| Integrated Ethernet MAC | 1x 10/100 Mbps (FCC) | 1x 10/100 Mbps | 1x 10/100 Mbps | Multi-port FCCs | 1x 10/100 Mbps | 1x 10/100 Mbps |
| CPM Engines | 2 RISC CPMs | 2 RISC CPMs | 2 RISC CPMs | 2 RISC CPMs | 2 RISC CPMs | 1 CPM (different mix) |
| Operating Temperature | 0C to +95C | 0C to +95C | 0C to +95C | 0C to +95C | 0C to +95C | -40C to +85C (extended) |
| Lifecycle Status | Last-time-buy (Rochester authorized stock) | EOL - Rochester authorized | EOL - last-time-buy | EOL - authorized supply | EOL - authorized supply | EOL - authorized supply |
Principaux différenciateurs
- Tray-form, lead-free pack-aging variant -FR (vs MPC852TVR50A (base part))
- Same-die 50 MHz speed grade in 256-PBGA (vs MPC852TVR66A)
- Higher-frequency 133 MHz upgrade path in same footprint (vs MPC859TVR133A)
- Mature, long-life PowerQUICC firmware ecosystem (vs QorIQ LS1021A)
Notes de conception
The 256-PBGA at 1.0 mm pitch requires microvia or laser-drilled stacked-via PCB technology for clean escape routing. Use at least 4-layer stackup with dedicated ground planes beneath the BGA to control return-current paths. Distribute a generous array of thermal vias under the die area to keep the 50 MHz core within the 0C to +95C operating window under TCP-offload workloads.
Bulk-decouple the 3.3 V core rail with 47 uF tantalum + 10 uF ceramic + 0.1 uF high-frequency bypass near each VDD/VSS ball pair. The CPM DMA bursts can create abrupt load transients; place at least four 10 uF ceramics around the periphery of the BGA to suppress ringing. A separate LDO for the PLL analog supply is recommended.
Estimated: at 50 MHz host, 50 MHz bus, full CPM DMA on both RISC engines, the MPC852TVR50A-FR dissipates roughly 1.5-2.0 W. With a 256-PBGA theta_JA near 18 C/W on a 4-layer PCB, the junction-to-ambient rise is 27-36 C. Stay under 95 C internal by ensuring cabinet airflow of 1 m/s across the BGA in dense router chassis designs.
Do not confuse the MPC852TVR50A-FR (256-PBGA, 23x23 mm) with the MPC859DSLCVR50A (357-PBGA, 25x25 mm). Although both are 50 MHz NXP parts with similar nomenclature, their packages differ and the latter is NOT a drop-in for the former. Always verify the ball count and footprint before sourcing a substitute.
Route the external memory bus (32-bit address/data) on the top layer with matched-impedance traces and keep lengths within 50 mils of each other. Place a series-termination resistor near the driver for clk/control strobes to suppress ringing. The FCC Ethernet MAC signals (TXD, RXD, CRS, COL) should be length-matched and routed over a continuous ground reference to meet IEEE 802.3 timing.
Informations de conformité
RoHS compliance and lead-free termination are inferred from the -FR packaging suffix and current NXP product-page indication; reach and halogen-free status were not present in the verified web data and are recorded as 'unknown'. AEC-Q100 not applicable - this is an industrial/telecom MPU, not an automotive-grade part.
