MSC8157TVT1000A - 6-Core SC3850 DSP 1GHz 783-FCBGA | NXP
Référence : MSC8157TVT1000A ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $256.5 | $2 565,00 |
| 100 | $228 | $22 800,00 |
| 500 | $199.5 | $99 750,00 |
| 1 000 | $171 | $171 000,00 |
MSC8157TVT1000A Présentation
A multi-core DSP (Digital Signal Processor) is a specialized microprocessor whose architecture is optimized for the high-speed, repetitive arithmetic of real-time signal processing, typically SIMD-style fixed/floating-point operations running in tight inner loops on streaming data. Within the wider taxonomy the MSC8157TVT1000A sits as: DSP -> embedded processor -> MPU/MCU family -> semiconductor IC. The StarCore SC3850 ISA delivers both 16-bit and 32-bit fixed-point modes plus single-precision floating-point, balancing DSP density with general-purpose code density.
Key features include six SC3850 cores each with dedicated L1 instruction/data caches, a unified L2 cache hierarchy, a 32-bit/64-bit DDR2/3 memory controller, and a rich Serial RapidIO / SGMII / PCI / Ethernet / I2C / SPI / UART peripheral set. The device typically operates the core at 1.0 V and the I/O rails at 1.0/1.5/2.5 V, providing a clean power tree for the FCBGA-783 package. On-chip RAM of 6.375 MB plus a small on-chip ROM (96 kB) is available for boot/code lowering.
Typical applications include 3G/4G baseband processing, channel cards, multi-channel voice/media gateways, radar signal preprocessing, and high-density DSP farms. The high MIPS density per watt makes it well-suited when many channels must be processed in a single shelf of equipment.
When designing with the MSC8157TVT1000A, plan a multi-layer PCB with controlled-impedance routing for the DDR2/3 interface and a thorough thermal strategy: the 783-ball FCBGA draws significant power at full load and requires a heatsink or heat-spreader design. Use the manufacturer's reference platform and boot ROM documentation as a starting point; software initialization is non-trivial and the part's lifecycle is restricted to qualified industrial channels.
This page synthesizes distributor pricing, drop-in NXP/MSC815x alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour MSC8157TVT1000A — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MSC8157TVT1000A (même facteur de forme et même empreinte) — différant par Operating Temperature, Performance, Data Bus Width, Mounting Type, On-Chip RAM.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MSC8256ESVT1000B
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MSC8156ETVT1000A
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MSC8154ETVT1000B
✅ Remplacement direct✓ En stock
$171 / unité
Voir la fiche technique →MSC8154ETVT1000A
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MSC8157ETVT1000A
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$190.89 / unité
Voir la fiche technique →TMSC8157TVT1000A
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MSC8157TVT1000A Spécifications
| Series | StarCore |
| Type | SC3850 Six-Core Digital Signal Processor |
| Largeur du bus de données | 32-Bit / 64-Bit |
| Core Architecture | StarCore SC3850 |
| Number of Cores | 6 |
| Clock Rate | 1 GHz |
| Performance | 1000 MIPS per core (up to 6000 MIPS aggregate) |
| Package Type | FCBGA-783 (29 mm x 29 mm) |
| Nombre de broches | 783 |
| Type de montage | Surface Mount (BGA) |
| Température de fonctionnement | -40 C to +105 C |
| Voltage - Core (Vccint) | 1.0 V |
| Voltage - I/O | 1.0 V / 1.5 V / 2.5 V |
| On-Chip RAM | 6.375 MB |
| Non-Volatile Memory (ROM) | 96 kB |
| Interfaces | Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART |
| Memory Controller | DDR2 / DDR3 (32-bit / 64-bit) |
| Statut RoHS | Lead-free (per FCBGA marking) |
| Status | Obsolete (EOL) |
Guide de configuration des broches du MSC8157TVT1000A fcbga-783 (29 mm x 29 mm)
Configuration des broches du MSC8157TVT1000A (boîtier fcbga-783 (29 mm x 29 mm)). La numérotation des broches, les fonctions et les schémas de connexion sont définis dans la fiche technique du fabricant. Consultez-la pour l'empreinte exacte et les directives de soudage.
Aucune donnée de brochage détaillée disponible pour MSC8157TVT1000A.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MSC8157TVT1000A convient pour 6 applications: 3G/4G Baseband Channel Card Processing, Multi-Channel Voice/Media Gateway, Radar and Sonar Signal Pre-Processing, Industrial Imaging and Machine-Vision Pre-Processing, Test & Measurement Instrumentation Front-End, Secure Networking Appliance Offload Engine.
3G/4G Baseband Channel Card Processing
The MSC8157TVT1000A's six SC3850 cores at 1 GHz deliver up to 6000 MIPS aggregate, well-suited for the L1/L2 baseband inner loops of a 3G/4G channel card. Each core can be locked to a different sub-channel, with dedicated L1 caches keeping the working set hot for the tight inner loops of turbo decoding and chip-rate processing. The integrated DDR2/DDR3 controller sustains the high memory bandwidth demanded by multi-antenna MIMO paths. Rich high-speed peripherals (Serial RapidIO, SGMII, PCI) match standard ATCA/AdvancedMC backplanes. Industrial-grade temperature range (-40 to +105 C) supports indoor carrier environments; you should still thermal-test with a real heatsink under worst-case load.
Recommandé
Multi-Channel Voice/Media Gateway
Six independent SC3850 cores make the MSC8157TVT1000A a strong fit for packet voice and transcoding gateways that need to run many G.711/G.729/SBC sessions in parallel without context-switch overhead. One core can own a fixed pool of channels, with deterministic latency improving jitter tolerance. The integrated Ethernet and SGMII ports connect directly to carrier Ethernet, while I2C and SPI provide glue to SLAC/codec chips. Industrial temperature range and the 1.0 V core / 1.0-2.5 V I/O rails match telecom shelf power budgets. Use the manufacturer's reference Linux/SYS/BIOS-style BSP where available; bare-metal is feasible but multi-core boot is non-trivial.
Recommandé
Radar and Sonar Signal Pre-Processing
For radar and sonar front-ends, the MSC8157TVT1000A handles pulse-compression, beamforming, and CFAR detection across six parallel SC3850 cores with deterministic interrupt latency. Sustained filtering on streaming ADC data is enabled by the integrated 32-bit/64-bit DDR controller that keeps latency low enough for closed-loop tracking. StarCore's 16-bit fixed-point mode is dense for the FFT/multiply-accumulate kernels typical of pulse-Doppler radar. Designers should plan careful thermal management at full load given the 783-ball FCBGA's power dissipation, and budget for industrial-temperature screening at the system level. Lifecycle status (Obsolete) means long-life programs should qualify a same-package sibling.
Recommandé
Industrial Imaging and Machine-Vision Pre-Processing
Six SC3850 cores suit multi-camera machine-vision pipelines where each core owns pre-processing for one sensor stream - filtering, edge detection, color-space conversion - before handoff to a host or FPGA. The 6.375 MB on-chip SRAM is large enough for many frame-cache regions, lowering DDR bandwidth pressure. Industrial-grade temperature range (-40 to +105 C) supports factory automation cells. Rich standard interfaces (PCI, Ethernet, SPI) ease integration with industrial PCs and PLC backplanes. The Obsolete status means new designs should pair this part with a long-life aftermarket supplier or evaluate the MSC8256ESVT1000B successor in the same FCBGA footprint.
Recommandé
Test & Measurement Instrumentation Front-End
Multi-channel test instruments - digitizers, signal analyzers, communications testers - benefit from the MSC8157TVT1000A's six cores handling parallel DSP pipelines (FFT, demodulation, filtering) while a host MCU orchestrates the user interface. Each core's L1 caches keep real-time DSP loops deterministic, and the integrated DDR2/DDR3 controller streams high-rate sample buffers to/from external ADC/DAC. The Serial RapidIO and PCI endpoints fit standard test-and-measurement backplanes. Industrial temperature grading suits bench/ATE environments; final thermal validation should reflect the chassis airflow design, since the 783-FCBGA dissipates significant power at full core load.
Recommandé
Secure Networking Appliance Offload Engine
The MSC8157TVT1000A's Serial RapidIO and SGMII ports slot it into security appliances as a low-latency offload engine for cipher, packet classification, and deep-packet inspection workloads. Six cores run parallel IPSec / MACsec pipelines, with the DDR2/DDR3 controller feeding bulk packet buffers without host CPU intervention. Industrial temperature grade supports hardened networking gear; pair with a heatsink on the FCBGA land pattern and validate under worst-case sustained throughput. The part's Obsolete lifecycle status means new deployments should source authorized aftermarket stock or move to the MSC8256 successor on the same 783-FCBGA footprint.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MSC8157TVT1000A — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MSC8256ESVT1000B | MSC8156ETVT1000A | MSC8154ETVT1000B | MSC8154ETVT1000A | MSC8157ETVT1000A |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCBGA (29x29) | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same |
| Number of Cores | 6 (SC3850) | 6 | 6 | 4 | 4 | 6 |
| Clock Rate | 1 GHz | 1 GHz | 1 GHz | 1 GHz | 1 GHz | 1 GHz |
| Aggregate MIPS | 6000 MIPS (6 x 1000) | 6000 MIPS | 6000 MIPS | 4000 MIPS (-33%) | 4000 MIPS (-33%) | 6000 MIPS |
| On-Chip RAM | 6.375 MB | 6.375 MB | 6.375 MB | 4.25 MB (approx, 4-core) | 4.25 MB (approx, 4-core) | 6.375 MB |
| Core Voltage | 1.0 V | 1.0 V | 1.0 V | 1.0 V | 1.0 V | 1.0 V |
| Series / Family | StarCore MSC815x | StarCore MSC825x | StarCore MSC815x | StarCore MSC815x | StarCore MSC815x | StarCore MSC815x |
Principaux différenciateurs
- Six-core SC3850 at 1 GHz with shared 783-FCBGA family (vs MSC8154ETVT1000B)
- Same-package migration to refreshed peripheral revision (vs MSC8256ESVT1000B)
- Single 1.0 V core rail, multi-voltage I/O (vs TI TMS320C6657 (C66x))
Notes de conception
Estimated: At 1 GHz with all six SC3850 cores active, the FCBGA-783 package dissipates substantial power (typical core voltage 1.0 V at full utilization) and requires a heatsink or heat-spreader design. Use a thermal interface material rated for the industrial temperature range and a forced-air flow that meets worst-case ambient for your enclosure; junction-rise above ambient should be budgeted against the -40 to +105 C operating junction envelope, since the FCBGA top surface does NOT include a user-attached heatsink land pattern beyond the central thermal pad array.
Estimated: The 783-ball FCBGA at 29 mm x 29 mm (fine ball pitch) requires via-in-pad or micro-via escape with at least a 6-layer stack-up to route the DDR2/DDR3 memory controller and high-speed Serial RapidIO/SGMII. Follow NXP's reference layout for BGA break-out and the DDR2/DDR3 design guide for length-matched address/command, DQ, and DQS traces; impedance-controlled stack-up is mandatory for the DDR interface to meet 800 MT/s or higher rates used by multi-core DSP workloads.
Estimated: The MSC8157TVT1000A needs a sequenced multi-rail supply (1.0 V core plus 1.0/1.5/2.5 V I/O rails) with the core rail coming up first or in a controlled sequence per NXP's power-up specification to prevent latch-up. Use a PMIC or discrete LDO/DCDC with sequencing support and add bulk decoupling plus high-frequency ceramic decoupling on each rail adjacent to the package balls. Monitor the reset sequence and bring the device out of reset only after all rails are stable.
This part is marked Obsolete by NXP, so new designs should not be built around it as the sole source. Plan second-source strategy with same-package NXP siblings (MSC815x, MSC825x) and confirm authorized aftermarket supply for the lifecycle window your product must support. MSC8101M1250F and TI C66x parts that share function but not footprint are NOT drop-in replacements - any migration requires board rework and full firmware revalidation, and should be treated as a redesign rather than a substitution.
Informations de conformité
Lead-free per FCBGA marking on package top - confirmed against Freescale/NXP product description on DigiKey. Reach, halogen-free, and conflict-mineral statements are not explicitly published for this EOL part; treat as 'unknown' and request a CoC from your authorized supplier if needed.
