MT41K128M16JT-125K - 2Gb DDR3L SDRAM 1600MT/s | Micron
Référence : MT41K128M16JT-125K ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $13.96 | $13,96 |
| 10 | $12.9 | $129,00 |
| 100 | $11.8 | $1 180,00 |
| 500 | $10.9 | $5 450,00 |
| 1 000 | $9.98 | $9 980,00 |
MT41K128M16JT-125K Présentation
DDR3L SDRAM is a low-voltage version of DDR3 SDRAM; unless stated otherwise, DDR3L parts meet the functional and timing specifications of the DDR3 standard defined for the JEDEC DRAM family. DRAM components form the volatile working-memory layer of the memory hierarchy, sitting between nonvolatile storage and the processor cache in embedded, industrial, networking, and consumer platforms.
Key features of this part include the industry-standard 8n-bit prefetch architecture, auto self-refresh, write leveling, data mask (DM) support, dynamic on-die termination (ODT), and an asynchronous reset function. Operating temperature spans 0C to +95C, making the commercial-temperature -125K version suited to cost-sensitive systems rather than extended-temperature industrial deployments (the IT/XIT variants cover that range).
Architecturally, the device uses CMOS technology with a bank-based array supporting burst, interleaved, and posted-CAS read/write operations. The -125 speed bin supports DDR3L-1600 operation with CAS Latency 11, enabling seamless pairing with mainstream SoCs, FPGAs, and memory controllers that implement DDR3L PHY interfaces.
Typical applications include industrial controllers and gateways, networking equipment, digital televisions and set-top boxes, and embedded computing modules. The 16-bit data width allows one or two devices to be placed on a 32-bit bus for compact designs.
When designing the power tree, plan a 1.35V VDD/VDDQ rail with proper decoupling per the Micron datasheet layout guidance, and verify controller support for the DDR3L voltage range and the -125 timing bin.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour MT41K128M16JT-125K — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MT41K128M16JT-125 AIT:K
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MT41K128M16JT-125 XIT:K
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MT41K128M16JT-125 AAT:K
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MT41K128M16JT-107 IT:K
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MT41J128M16JT-125:K
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
HGD32G16M16
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MT41K128M16JT-125K Valeurs maximales et caractéristiques électriques
| Type de mémoire | DDR3L SDRAM |
| Taille de mémoire | 2 Gbit |
| Organisation de la mémoire | 128M x 16 |
| Interface | Parallel |
| Clock Frequency | 800 MHz |
| Débit de données | 1600 MT/s (-125 speed bin) |
| Access Time | 13.75 ns |
| Tension d'alimentation | 1.35 V (DDR3L); 1.5 V (DDR3) compatible |
| Logic Family | CMOS |
| Prefetch Architecture | 8n-bit |
| Température de fonctionnement | 0C to +95C |
| Boîtier | 96-FBGA (8x14 mm), lead free |
| Ball Count | 96 |
| Type de montage | Surface Mount |
| Caractéristiques | Auto self-refresh, write leveling, data mask, dynamic ODT, asynchronous reset |
| Statut RoHS | Lead free (PBGA96, LEAD FREE per datasheet record) |
Guide de configuration des broches du MT41K128M16JT-125K 96-fbga (8x14 mm), lead free
Configuration des broches du MT41K128M16JT-125K (boîtier 96-fbga (8x14 mm), lead free). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MT41K128M16JT-125K.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MT41K128M16JT-125K convient pour 6 applications: Industrial Controllers and Gateways, Networking Equipment, Digital TV and Set-Top Boxes, Embedded FPGA Processing Boards, Medical Monitoring and Diagnostic Devices, Test and Measurement Instruments.
Industrial Controllers and Gateways
Industrial controllers and gateways require 1-2 GB of volatile working memory for protocol stacks, buffers, and logging. The MT41K128M16JT-125K provides 2 Gbit (256 MB) per device; two devices on a 32-bit bus deliver 512 MB, sufficient for most PLC and edge-gateway workloads. Its 1.35V DDR3L operation reduces memory subsystem power versus 1.5V DDR3, helping thermal management in sealed industrial enclosures. Note the 0C to +95C commercial range: for cold-storage or outdoor installations, select the AIT:K industrial variant on the same footprint. The asynchronous reset and auto self-refresh features simplify reset supervision and low-power idle states in always-on gateways. Pair with DDR3L-capable SoCs or FPGA memory controllers supporting the -125 (1600 MT/s) timing bin.
Recommandé
Networking Equipment
Switches, routers, and network appliances use DDR3L SDRAM for packet buffering, routing tables, and management CPU workloads. The MT41K128M16JT-125K's 1600 MT/s data rate and x16 organization allow compact, cost-effective buffering banks; two devices on a 32-bit bus achieve 3.2 GB/s peak bandwidth at DDR3L-1600. Write leveling and dynamic ODT support multi-load fly-by topologies common in networking boards, improving signal integrity at speed. The data mask function enables efficient partial-word writes during packet processing. For telecom platforms with extended ambient requirements, drop in the XIT:K variant without layout changes. Verify the network processor's memory compatibility list for the -125 speed bin before finalizing the BOM.
Recommandé
Digital TV and Set-Top Boxes
DTV and set-top-box SoCs commonly pair with a single 2 Gbit x16 DDR3L device for frame buffers, middleware, and application memory. The MT41K128M16JT-125K's 1600 MT/s bandwidth comfortably supports 1080p decode pipelines, and its 1.35V operation cuts standby and active power, supporting energy-efficiency requirements in consumer video platforms. The 96-FBGA 8x14 mm footprint fits dense PCBs around the tuner and power stages. Auto self-refresh lowers power in standby modes, while write leveling and dynamic ODT ease routing on four-layer consumer boards. Confirm the SoC boot-time initialization supports Micron's -125 timing tables; most mainstream broadcast SoCs include Micron DDR3L presets.
Recommandé
Embedded FPGA Processing Boards
FPGA-based embedded vision, motion, and data-acquisition boards use DDR3L SDRAM as line-buffer and frame-buffer memory behind FPGA memory controllers. The MT41K128M16JT-125K at 1600 MT/s provides up to 3.2 GB/s per x16 device, and pairs directly with Xilinx 7-series memory controllers, which include validated DDR3L timing presets. Write leveling is mandatory for fly-by calibration in these controllers, and this device supports it natively. Because the 96-FBGA footprint is shared across the Micron -125 family, designers can qualify the commercial -125K and swap in AIT/XIT industrial variants for extended-temperature SKUs without respin. Use dynamic ODT to keep signal integrity on longer trace runs common in FPGA layouts.
Recommandé
Medical Monitoring and Diagnostic Devices
Medical monitors and diagnostic instruments require responsive data buffers for waveforms, image pipelines, and application software. The MT41K128M16JT-125K offers 256 MB of DDR3L memory per device with deterministic 8n-bit prefetch behavior suited to sustained streaming. Low 1.35V operation reduces internal heating in fanless bedside enclosures, and auto self-refresh supports fast wake from low-power states between measurements. For devices that must operate in cold transport or unconditioned clinical rooms, the same-footprint AIT:K variant extends the range to -40C. Designers should pair the DRAM with medical-grade SoCs whose memory qualification covers the -125 bin, and verify refresh behavior across the full operating range per the Micron datasheet.
Recommandé
Test and Measurement Instruments
Bench instruments such as logic analyzers, signal generators, and data recorders need fast buffer memory for sample streams and instrument firmware. The MT41K128M16JT-125K's 1600 MT/s interface sustains high-throughput sample capture when paired with FPGA front ends, and the x16 organization keeps the memory footprint compact on instrument main boards. Dynamic ODT and write leveling maintain margins on instrument-length PCB traces. Because instrument SKUs often span commercial and industrial temperature ranges, the shared 96-FBGA footprint across Micron -125 variants enables one layout serving multiple grades. For long-duration capture, confirm sustained refresh overhead at the -125 bin matches your acquisition duty cycle per the datasheet timing tables.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MT41K128M16JT-125K — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MT41K128M16JT-125 AIT:K | MT41K128M16JT-125 XIT:K | MT41K128M16JT-125 AAT:K | MT41K128M16JT-107 IT:K | HGD32G16M16 |
|---|---|---|---|---|---|---|
| Package | 96-FBGA (8x14 mm) | 96-FBGA (8x14) - same | 96-FBGA (8x14) - same | 96-FBGA (8x14) - same | 96-FBGA (8x14) - same | 96-FBGA (8x14) - same |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | HGCHIPS | |
| Memory Size | 2 Gbit | 2 Gbit | 2 Gbit | 2 Gbit | 2 Gbit | |
| Organization | 128M x 16 | 128M x 16 | 128M x 16 | 128M x 16 | ||
| Operating Temperature | 0C to +95C | -40C to +95C | -40C to +95C (extended industrial) | -40C to +105C (automotive) | -40C to +95C |
Principaux différenciateurs
- Low-power DDR3L 1.35V operation (vs MT41J128M16JT-125:K)
- Lowest-cost commercial grade (vs MT41K128M16JT-125 AIT:K)
- Supply-continuity cross available (vs HGD32G16M16)
- Bandwidth headroom via faster sibling (vs MT41K128M16JT-107 IT:K)
Notes de conception
DDR3L-1600 routing demands controlled impedance (50 ohm single-ended, 100 ohm differential for DQS pairs) and length matching of data byte lanes within roughly +/-25 mils group skew. Place the MT41K128M16JT-125K within 2-3 inches of the controller where possible; for fly-by clock/address topologies, implement write leveling and dynamic ODT, both supported natively on this device. Follow the Micron datasheet layout and routing guidelines for VREF decoupling and the 96-FBGA escape pattern; use via-in-pad or fan-out vias as appropriate for the 0.8 mm ball pitch.
Plan a 1.35V rail for VDD and VDDQ with low-ripple DC-DC conversion and bulk plus high-frequency decoupling near each supply ball group. DDR3L transient currents are bursty during read/write bursts; undersized decoupling shows up as eye shrinkage on DQ signals. If reusing a 1.5V DDR3 layout, confirm the regulator can be configured for 1.35V and that VREF traces are rerouted appropriately. Estimated: idle DDR3L power is typically tens of percent lower than the equivalent 1.5V DDR3 configuration, benefiting thermally constrained enclosures.
The -125K variant is rated 0C to +95C; do not use it in outdoor, cold-chain, or extended-industrial products where the ambient can drop below 0C - select the same-footprint AIT:K or XIT:K industrial variant instead. Also confirm your SoC or FPGA controller's memory compatibility list includes the -125 (CL11, DDR3L-1600) timing bin; some controllers only auto-detect limited bins. Finally, when substituting cross-brand parts such as HGD32G16M16, run full boot and stress validation since vendor init sequences and calibration can differ despite identical ball maps.
Informations de conformité
Datasheet records describe the PBGA96 package as LEAD FREE; Micron K-suffix packaging denotes lead-free construction. Halogen-free and conflict-minerals status not stated in provided data - confirm via Micron product environmental documentation.
