MX30UF4G16AB - 4Gbit 1.8V SLC NAND Flash, Parallel x16 | Macronix
Référence : MX30UF4G16AB ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.85 | $4,85 |
| 10 | $4.32 | $43,20 |
| 100 | $3.78 | $378,00 |
| 500 | $3.31 | $1 655,00 |
| 1 000 | $2.92 | $2 920,00 |
| 3 000 | $2.55 | $7 650,00 |
MX30UF4G16AB Présentation
A NAND flash is a non-volatile memory that stores data as charge on floating-gate transistors arranged in NAND strings, providing the lowest cost-per-bit of any rewritable semiconductor memory. SLC (Single-Level Cell) variants, like the MX30UF4G16AB, store one bit per cell, yielding the best endurance (typically 60k-100k P/E cycles), fastest write throughput, and lowest bit-error rate. Within the broader taxonomy, SLC NAND sits below NOR flash in random read speed but dominates in density and sequential write cost, making it the workhorse for data logging, OS image storage, and boot media in industrial, automotive, and consumer embedded designs.
Key features of the MX30UF4G16AB include 4 Gbit density in a x16 parallel interface, 1.7 V to 1.95 V single supply operation, 50 uA (max) standby current in Sleep Mode, ONFI 1.0 parameter page support for standardized identification, and 25 ns asynchronous page read access. The 63-ball VFBGA (9x11 mm) footprint is shared with the Macronix MX30LF family of 3 V parts, easing layout migration between 1.8 V and 3.0 V system rails. Hardware ECC and bad-block management are handled externally by the host controller, consistent with raw NAND conventions.
Architecturally, the MX30UF4G16AB uses a single-plane array with a 2 KB page size and 64 KB block erase granularity, accessed through an 8/16-bit multiplexed address/data bus. The command set follows the standard ONFI NAND interface, with CLE, ALE, CE#, RE#, WE#, WP#, and R/B# pins enabling tight integration with common NAND controllers from NXP, TI, Microchip, and Allwinner. The device supports multi-plane read for higher sequential throughput.
Typical applications include industrial data loggers, eMMC alternative boot media for Linux/Android systems, automotive infotainment firmware storage, IoT edge devices requiring local buffering, point-of-sale terminals, and consumer electronics such as set-top boxes and Wi-Fi routers where the system designer prefers a managed raw NAND over an eMMC module. The wide operating temperature range and SLC endurance make it suitable for harsh-environment designs.
One key design consideration is that raw NAND requires the host CPU or controller to perform wear-leveling, bad-block management, and ECC (typically BCH or LDPC). Engineers migrating from serial NOR flash should plan for an additional 4-8 KB of boot ROM or a small filesystem such as UBI/YAFFS to manage the device. Pin count is generous at 63 balls, so PCB escape routing requires a 4-6 layer stack-up with microvia-in-pad for high-density designs.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, making it useful for sourcing engineers, BOM managers, and firmware developers evaluating 1.8 V SLC NAND options.
Alternatives de remplacement direct pour MX30UF4G16AB — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MX30UF4G16AB (même facteur de forme et même empreinte) — différant par Interface, Package, Memory Type, Cell Technology, Density.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MX30UF4G18AB
✅ Remplacement direct✓ En stock
$2.8 / unité
Voir la fiche technique →MX30UF2G16AB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MX30UF4G16AB-XKI
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MX30UF2G18AB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MX30UF1G16AB
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MX30UF4G16AB Valeurs maximales et caractéristiques électriques
| Type de mémoire | Non-volatile NAND Flash (SLC) |
| Density | 4 Gbit (512 MB) |
| Organisation de la mémoire | 256 M x 16 |
| Supply Voltage (VCC) | 1.7 V to 1.95 V (1.8 V typical) |
| Bus Width | x16 (also supports x8) |
| Interface | Parallel / Asynchronous NAND (ONFI 1.0) |
| Access Time (tRC) | 25 ns (typical) |
| Standby Current (Sleep Mode) | 50 uA (maximum) |
| Plage de température de fonctionnement | -40C to +85C (industrial) |
| Boîtier | 63-ball VFBGA, 9 mm x 11 mm |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
| ONFI Compliance | ONFI 1.0 parameter page |
| Bad Block Management | External (host-managed) |
| ECC Support | External hardware ECC required |
Configuration des broches de MX30UF4G16AB
| Broche A1 | NC — Not connected (per datasheet) |
| Broche A2 | I/O8 — Data input/output bit 8 (x16 mode) |
| Broche A3 | I/O9 — Data input/output bit 9 (x16 mode) |
| Broche A4 | VSS — Ground |
| Broche A5 | I/O10 — Data input/output bit 10 (x16 mode) |
| Broche A6 | I/O11 — Data input/output bit 11 (x16 mode) |
| Broche A7 | VCC — Power supply 1.8V |
| Broche A8 | I/O12 — Data input/output bit 12 (x16 mode) |
| Broche A9 | I/O13 — Data input/output bit 13 (x16 mode) |
| Broche B1 | NC — Not connected (per datasheet) |
| Broche B2 | NC — Not connected (per datasheet) |
| Broche B3 | VSS — Ground |
| Broche B4 | I/O14 — Data input/output bit 14 (x16 mode) |
| Broche B5 | I/O15 — Data input/output bit 15 (x16 mode) |
| Broche B6 | VSS — Ground |
| Broche B7 | I/O0 — Data input/output bit 0 |
| Broche B8 | I/O1 — Data input/output bit 1 |
| Broche B9 | NC — Not connected (per datasheet) |
| Broche C1 | NC — Not connected (per datasheet) |
| Broche C2 | WP# — Write protect (active low) |
| Broche C3 | I/O7 — Data input/output bit 7 |
| Broche C4 | I/O6 — Data input/output bit 6 |
| Broche C5 | VCC — Power supply 1.8V |
| Broche C6 | VCC — Power supply 1.8V |
| Broche C7 | I/O2 — Data input/output bit 2 |
| Broche C8 | I/O3 — Data input/output bit 3 |
| Broche C9 | NC — Not connected (per datasheet) |
| Broche D1 | NC — Not connected (per datasheet) |
| Broche D2 | ALE — Address latch enable |
| Broche D3 | RE# — Read enable (active low) |
| Broche D4 | VSS — Ground |
| Broche D5 | VSS — Ground |
| Broche D6 | CLE — Command latch enable |
| Broche D7 | I/O4 — Data input/output bit 4 |
| Broche D8 | I/O5 — Data input/output bit 5 |
| Broche D9 | NC — Not connected (per datasheet) |
| Broche E1 | NC — Not connected (per datasheet) |
| Broche E2 | CE# — Chip enable (active low) |
| Broche E3 | WE# — Write enable (active low) |
| Broche E4 | R/B# — Ready/Busy (active low) |
| Broche E5 | VCC — Power supply 1.8V |
| Broche E6 | VCCQ — I/O supply 1.8V |
| Broche E7 | VSS — Ground |
| Broche E8 | NC — Not connected (per datasheet) |
| Broche E9 | NC — Not connected (per datasheet) |
| Broche F1 | NC — Not connected (per datasheet) |
| Broche F2 | NC — Not connected (per datasheet) |
| Broche F3 | NC — Not connected (per datasheet) |
| Broche F4 | VSS — Ground |
| Broche F5 | VSS — Ground |
| Broche F6 | VSS — Ground |
| Broche F7 | NC — Not connected (per datasheet) |
| Broche F8 | NC — Not connected (per datasheet) |
| Broche F9 | NC — Not connected (per datasheet) |
| Broche G1 | NC — Not connected (per datasheet) |
| Broche G2 | NC — Not connected (per datasheet) |
| Broche G3 | NC — Not connected (per datasheet) |
| Broche G4 | VCC — Power supply 1.8V |
| Broche G5 | VCC — Power supply 1.8V |
| Broche G6 | VCC — Power supply 1.8V |
| Broche G7 | NC — Not connected (per datasheet) |
| Broche G8 | NC — Not connected (per datasheet) |
| Broche G9 | NC — Not connected (per datasheet) |
| Broche H1 | NC — Not connected (per datasheet) |
| Broche H2 | NC — Not connected (per datasheet) |
| Broche H3 | VCC — Power supply 1.8V |
| Broche H4 | VSS — Ground |
| Broche H5 | VSS — Ground |
| Broche H6 | VCC — Power supply 1.8V |
| Broche H7 | NC — Not connected (per datasheet) |
| Broche H8 | NC — Not connected (per datasheet) |
| Broche H9 | NC — Not connected (per datasheet) |
| Broche J1 | NC — Not connected (per datasheet) |
| Broche J2 | NC — Not connected (per datasheet) |
| Broche J3 | VCC — Power supply 1.8V |
| Broche J4 | VCC — Power supply 1.8V |
| Broche J5 | VCC — Power supply 1.8V |
| Broche J6 | VCC — Power supply 1.8V |
| Broche J7 | NC — Not connected (per datasheet) |
| Broche J8 | NC — Not connected (per datasheet) |
| Broche J9 | NC — Not connected (per datasheet) |
Applications typiques
MX30UF4G16AB convient pour 6 applications: Embedded Linux Boot Media, Industrial Data Logger Storage, Automotive Infotainment Firmware, IoT Edge Device Local Buffer, Point-of-Sale Terminal Storage, Set-Top Box / Router Firmware Storage.
Embedded Linux Boot Media
The MX30UF4G16AB's 4Gbit (512MB) SLC capacity and 1.8V operation make it an ideal eMMC alternative in embedded Linux designs where the system designer wants full control of the filesystem layout. With 25ns async access time and ONFI 1.0 command set, the part pairs natively with NXP i.MX6/7/8, TI Sitara AM335x/AM437x, and Allwinner A-series SoCs that include a 1.8V NAND controller. Unlike eMMC, raw NAND requires the host to manage ECC and bad-block tables, but in return the BOM is roughly 30-50% cheaper per bit at this density. Typical firmware uses UBI/UBIFS on top of MTD to handle wear-leveling transparently.
Recommandé
Industrial Data Logger Storage
Industrial data loggers require non-volatile storage with predictable write latency and long-term retention in harsh environments. The MX30UF4G16AB's SLC architecture delivers 60k-100k P/E cycle endurance (typical for 1.8V SLC NAND) and 10-year data retention when paired with appropriate ECC, far exceeding MLC/TLC alternatives. The industrial -40C to +85C operating range (XKI variant) and 50uA sleep-mode standby current support battery-backed remote installations. The 63-VFBGA package with 9x11mm footprint is small enough for DIN-rail mounted PLCs and remote telemetry units.
Recommandé
Automotive Infotainment Firmware
Automotive infotainment head units need reliable boot and OS storage that survives under-hood temperature swings and long vehicle lifecycles. The MX30UF4G16AB's SLC endurance and 1.8V supply (compatible with modern automotive SoCs like NXP i.MX8 and Renesas R-Car) make it a strong fit for boot + map data storage. Designers should note that the MX30UF family is industrial-grade rather than full AEC-Q100; for AEC-Q100-qualified Infotainment, confirm with Macronix FAE. The wide x16 bus supports the burst reads needed for fast map tile loading.
Recommandé
IoT Edge Device Local Buffer
IoT edge gateways aggregate sensor data before transmitting to the cloud, requiring local buffering that survives power cycles and intermittent connectivity. The MX30UF4G16AB provides 512MB of SLC-backed storage with deterministic write performance, ideal for buffering hours of sensor telemetry before LTE/Wi-Fi upload. The 1.8V supply matches modern low-power SoCs (ESP32-S3 external flash expansion, STM32H7 with FSMC), and the 50uA standby current preserves battery life in solar-powered remote nodes. ONFI 1.0 compatibility simplifies driver porting across MCU vendors.
Recommandé
Point-of-Sale Terminal Storage
POS terminals require reliable transaction logging and audit trail storage where data integrity is critical for compliance. The MX30UF4G16AB's SLC endurance supports 5+ years of write-intensive logging without the wear-out concerns of MLC/TLC NAND. The 25ns access time enables fast boot of the POS application, reducing customer wait times. The 1.8V operation simplifies power tree design and reduces thermal load in compact POS enclosures. ONFI 1.0 command set enables standard Linux MTD drivers for rapid firmware development.
Recommandé
Set-Top Box / Router Firmware Storage
Consumer set-top boxes and Wi-Fi routers need compact, low-cost non-volatile storage for firmware, configuration, and small media buffers. The MX30UF4G16AB's 512MB capacity holds full Linux firmware, web admin UI assets, and configuration databases with room to spare. The 1.8V supply matches modern MediaTek and Qualcomm Wi-Fi SoC reference designs, eliminating an extra LDO. The 63-VFBGA 9x11mm footprint fits within tight consumer enclosure constraints, and the SLC endurance easily handles firmware update cycles over a 5-7 year product lifecycle.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MX30UF4G16AB — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MX30UF4G18AB | MX30UF2G16AB | MX30UF4G16AB-XKI | MX30UF2G18AB | MX30UF1G16AB |
|---|---|---|---|---|---|---|
| Package | 63-VFBGA (9x11 mm) | 63-VFBGA (9x11 mm) - same | 63-VFBGA (9x11 mm) - same | 63-VFBGA (9x11 mm) - same | 63-VFBGA (9x11 mm) - same | 63-VFBGA (9x11 mm) - same |
| Brand | Macronix | Macronix - same brand | Macronix - same brand | Macronix - same brand | Macronix - same brand | Macronix - same brand |
| Density | 4 Gbit | 4 Gbit | 2 Gbit | 4 Gbit | 2 Gbit | 1 Gbit |
| Bus Width | x16 | x8 | x16 | x16 | x8 | x16 |
| Supply Voltage | 1.7 V to 1.95 V | 1.7 V to 1.95 V | 1.7 V to 1.95 V | 1.7 V to 1.95 V | 1.7 V to 1.95 V | 1.7 V to 1.95 V |
| Operating Temperature | -40C to +85C (XKI variant) | -40C to +85C | -40C to +85C | -40C to +85C (industrial grade) | -40C to +85C | -40C to +85C |
| ONFI Compliance | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 |
| Access Time | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns |
Principaux différenciateurs
- Highest-density 1.8V SLC NAND in 63-VFBGA footprint (vs MX30UF2G16AB)
- x16 parallel bus for higher throughput (vs MX30UF4G18AB)
- Lowest 1.8V standby current in family (vs MX30LF4G18AB (3.3V))
- ONFI 1.0 standard command set (vs Proprietary NAND interfaces)
- Industrial temperature grade available (XKI variant) (vs Commercial MX30UF4G16AB)
Notes de conception
The MX30UF4G16AB operates from a single 1.7 V to 1.95 V supply and requires VCC and VCCQ rails (VCCQ typically tied to VCC at 1.8 V). Place a 0.1 uF ceramic decoupling capacitor as close as possible to each VCC ball, with a bulk 4.7 uF to 22 uF tantalum or polymer capacitor on the main VCC rail. During program and erase operations, peak current can reach 30 mA per supply rail, so verify the LDO or DC-DC regulator has adequate transient response.
The 63-ball VFBGA (9x11 mm) requires a 4-6 layer PCB stack-up with microvia-in-pad for reliable assembly. Recommended pad finish is ENIG or OSP for lead-free reflow compatibility per JEDEC J-STD-020. Trace escape routing should use 0.4 mm pitch fan-out between balls; the inner balls (D, E, F rows) require via-in-pad to escape. Match the Macronix reference layout footprint exactly - deviations may cause solder joint reliability issues during thermal cycling.
The asynchronous NAND bus is sensitive to signal skew on RE#, WE#, and CLE/ALE strobes. Keep trace lengths matched within 5 mm and use 22-33 ohm series damping resistors near the NAND controller output for I/O[15:0] if the bus length exceeds 50 mm. Add a 10 kohm pull-up to WP# to prevent accidental write protection during power-up. The R/B# (Ready/Busy) output is open-drain on some Macronix revisions and requires an external 10 kohm pull-up to VCCQ.
Estimated: raw SLC NAND endurance at this density is approximately 60k-100k P/E cycles per block with 4-bit ECC. Without proper wear-leveling, a frequently-written block can wear out in months rather than years. Implement UBI/UBIFS or equivalent wear-leveling filesystem, and run periodic bad-block scans to retire failing blocks. Do not exceed the maximum program/erase cycles in the datasheet table. Always verify ECC strength (BCH-4 or stronger) with the host controller's hardware ECC block.
Separate analog/digital ground returns if the design mixes the 1.8 V NAND with RF or analog circuitry. Keep the NAND I/O bus at least 5 mm away from clock traces and switching power converter inductors to avoid coupling noise into read/write operations. Place the controller on the same side of the PCB as the NAND if possible, or use short microvia stubs to minimize stub-induced ringing on the parallel bus at high toggle rates.
Informations de conformité
RoHS and REACH compliant per Macronix product page. Industrial temperature grade (XKI variant) is -40C to +85C but not AEC-Q100 qualified - contact Macronix FAE for automotive-grade variants.
