PIC24FJ256GB610-I/BG - 256KB Flash USB XLP MCU 121-TFBGA | Microchip
Référence : PIC24FJ256GB610-I/BG ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.1 | $6,10 |
| 10 | $5.62 | $56,20 |
| 100 | $4.95 | $495,00 |
| 500 | $4.4 | $2 200,00 |
| 1 000 | $3.95 | $3 950,00 |
PIC24FJ256GB610-I/BG Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), working memory (RAM), and a rich set of peripherals on one silicon die. The PIC24F family sits in the broader taxonomy of 16-bit microcontrollers -> microcontrollers -> embedded processors -> semiconductors. 16-bit MCUs fill the gap between 8-bit parts (limited math and address space) and 32-bit Cortex-M parts (more complex toolchain, higher cost), making them well-suited for moderate-throughput embedded designs with USB connectivity.
Key features of this part include 256 KB of ECC-protected dual Flash (85.5K x 24 organization) with Live Update, 32 KB of RAM, USB OTG with dedicated DMA, multiple serial interfaces (I2C, SPI, UART with IrDA), six PWM channels, eight DMA channels, a 10-bit and 12-bit ADC, and the XLP deep-sleep current regime. The 121-ball TFBGA package supports the device's 121-pin-out at a compact 10x10 mm body height of 1.20 mm, suiting space-constrained applications. The -I temperature grade covers -40C to +85C industrial operation.
Architecturally, the PIC24FJ256GB610 uses a 16-bit modified Harvard CPU with single-cycle multiply, a programmable instruction cache, and a peripheral bus that maps timers, capture/compare, ADC, and the USB SIE through independent DMA channels. The dual-bank Flash with Live Update allows one bank to receive new code while the other executes, enabling firmware upgrades without halting the application - a key benefit for industrial and connected devices.
Typical applications include USB peripherals and embedded hosts (HID, CDC, mass storage), industrial sensor nodes with USB diagnostics, low-power data loggers, and home/building automation controllers. The Live Update feature is particularly attractive in industrial gateways that must be field-upgradable without service windows.
When designing with this part, plan the dual-Flash bank layout early and verify the Live Update boot sequence against your application linker script; the 121-TFBGA requires PCB pads with sub-0.5 mm pitch and reflow profile control to avoid ball-bridge defects. Power-rail decoupling (10 uF + 0.1 uF) must be placed within 5 mm of VDD/VSS balls.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour PIC24FJ256GB610-I/BG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC24FJ256GB610-I/BG (même facteur de forme et même empreinte) — différant par Package, ADC, Program Memory (Flash), Core Architecture, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC24FJ256GA610-I/BG
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.41 / unité
Voir la fiche technique →PIC24FJ1024GA610-I/BG
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$8.2 / unité
Voir la fiche technique →PIC24FJ128GA610-I/BG
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
PIC24FJ256GB610-E/BG
✅ Remplacement direct✓ En stock
$9.05 / unité
Voir la fiche technique →PIC24FJ256GA610T-I/BG
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$5.36 / unité
Voir la fiche technique →PIC24FJ256GB610-I/BG Valeurs maximales et caractéristiques électriques
| Core Architecture | PIC24F 16-bit modified Harvard |
| CPU Core | PIC24 RISC |
| Maximum CPU Speed | 32 MHz |
| Program Flash Memory | 256 KB (85.5K x 24), ECC + dual-bank Live Update |
| RAM | 32 KB |
| USB Interface | USB 2.0 On-The-Go (OTG), integrated PHY, dedicated DMA |
| ADC | 10-bit and 12-bit A/D converter |
| PWM Channels | 6 |
| DMA Channels | 8 |
| Serial Interfaces | I2C (multiple), SPI (multiple), UART with IrDA |
| Tension d'alimentation | 3.3 V (typical) |
| Température de fonctionnement | -40C to +85C (Industrial) |
| Boîtier | 121-TFBGA (10x10 mm), 1.20 mm height |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant |
| Low-Power Family | XLP (eXtreme Low Power) with deep-sleep |
| Largeur du bus de données | 16-bit external |
Configuration des broches de PIC24FJ256GB610-I/BG
| Broche A1 | VSS — Ground reference |
| Broche B5 | VDD — Core supply voltage (3.3 V) |
| Broche F10 | D+ — USB data plus (USB OTG) |
| Broche F11 | D- — USB data minus (USB OTG) |
| Broche G11 | VBUS — USB VBUS detect |
| Broche H10 | VUSB — USB transceiver supply (3.3 V) |
| Broche K1 | OSC1 — Crystal oscillator input |
| Broche K2 | OSC2 — Crystal oscillator output |
| Broche J10 | MCLR — Master clear reset (active low) |
| Broche G10 | PGEC1 — ICSP programming clock pair 1 |
| Broche G9 | PGED1 — ICSP programming data pair 1 |
| Broche H11 | PGEC2 — ICSP programming clock pair 2 |
| Broche H9 | PGED2 — ICSP programming data pair 2 |
| Broche A11 | AVDD — Analog supply voltage |
| Broche B11 | AVSS — Analog ground |
Applications typiques
PIC24FJ256GB610-I/BG convient pour 6 applications: USB Human Interface Device (HID) Peripherals, Industrial USB Sensor Nodes, Low-Power Data Loggers, Embedded USB Host (Mass Storage / HID), Home and Building Automation Controllers, Industrial Gateways with USB Diagnostics.
USB Human Interface Device (HID) Peripherals
The PIC24FJ256GB610-I/BG is a strong fit for USB HID peripherals such as keyboards, mice, game controllers, and custom input devices because of its integrated USB 2.0 full-speed OTG controller with on-chip PHY and dedicated DMA. With 256 KB of Flash and 32 KB of RAM it can host HID report tables, debounce state, and a small bootloader without external memory. The 32 MHz 16-bit core executes HID report generation at low latency, while XLP deep-sleep extends battery life in wireless HID dongles.
Recommandé
Industrial USB Sensor Nodes
Industrial sensor nodes that expose a USB diagnostic or configuration port benefit from the PIC24FJ256GB610-I/BG's combination of 256 KB Flash, USB OTG, and -40C to +85C industrial temperature range. The dual-bank Live Update Flash lets a field technician re-flash the node over USB without halting the sensor acquisition loop. The XLP deep-sleep current regime allows battery- or solar-powered remote nodes to sleep between measurements while still servicing USB enumeration when a host is attached.
Recommandé
Low-Power Data Loggers
The PIC24FJ256GB610-I/BG suits battery-powered data loggers because the XLP deep-sleep current is below 100 nA in retention, while 256 KB of dual-bank Flash provides ample non-volatile storage for time-stamped sensor records. The 12-bit ADC captures analog sensor channels with up to 16-channel scan, and the 8 DMA channels offload sample transfers without waking the CPU. Live Update lets the logger receive new firmware revisions over its USB service port in the field.
Recommandé
Embedded USB Host (Mass Storage / HID)
For embedded host applications such as USB mass-storage readers, HID dongle gateways, or USB-to-UART bridges, the PIC24FJ256GB610-I/BG provides an integrated USB OTG controller that can act as host or device. According to the Microchip datasheet, the OTG controller includes the necessary session request protocol (SRP) and host negotiation protocol (HNP) signaling. The 32 KB RAM can host a small FAT file system buffer for read-only USB stick playback in kiosks or industrial HMIs.
Recommandé
Home and Building Automation Controllers
Smart-home and building automation controllers benefit from the PIC24FJ256GB610-I/BG's mix of USB diagnostics, multiple UART/SPI/I2C interfaces for sensor and actuator busses, and the XLP low-power modes that let battery-powered wireless sensors sleep for years. The 256 KB Flash fits a full Modbus, BACnet, or proprietary automation stack with room for OTA update payloads. The 121-TFBGA package integrates these peripherals in a 10x10 mm outline suitable for compact wall-mount controllers.
Recommandé
Industrial Gateways with USB Diagnostics
The PIC24FJ256GB610-I/BG serves as a USB service-port MCU inside industrial gateways that bridge RS-485, CAN, or Ethernet to a USB diagnostic laptop. The dual-bank Live Update enables field firmware upgrades via USB stick without halting the gateway, a key benefit in 24/7 industrial environments. The 32 KB RAM buffers diagnostic logs, while the 256 KB Flash stores protocol stacks and configuration. Six PWM channels can drive status LEDs and small actuators on the gateway front panel.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC24FJ256GB610-I/BG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC24FJ256GA610-I/BG | PIC24FJ1024GA610-I/BG | PIC24FJ128GA610-I/BG | PIC24FJ256GB610-E/BG | PIC24FJ256GA610T-I/BG |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 121-TFBGA (10x10 mm) | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same |
| Core | PIC24F 16-bit | PIC24F 16-bit | PIC24F 16-bit | PIC24F 16-bit | PIC24F 16-bit | PIC24F 16-bit |
| CPU Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Flash Memory | 256 KB | 256 KB | 1024 KB (1 MB) | 128 KB | 256 KB | 256 KB |
| RAM | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| USB OTG | Yes (integrated PHY) | No | No | No | Yes (integrated PHY) | No |
| Dual-Bank Live Update Flash | Yes | Yes | Yes | Yes | Yes | Yes |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Extended (-40C to +125C) | Industrial (-40C to +85C) |
| Lifecycle Status | NRND | Active | Active | Active | NRND | Active |
Principaux différenciateurs
- Integrated USB OTG with on-chip PHY and dedicated DMA (vs PIC24FJ256GA610-I/BG)
- Highest-density dual-bank Flash in the GB6xx family at 121-pin (vs PIC24FJ256GB412-I/BG)
- XLP deep-sleep current below 100 nA in retention (vs PIC24FJ1024GA610-I/BG)
Notes de conception
Estimated: at 32 MHz with USB full-speed operation, place a 10 uF bulk decoupling capacitor and a 0.1 uF ceramic cap within 5 mm of each VDD/VSS ball pair on the 121-TFBGA. The USB D+/D- traces must be length-matched to within 150 mil and routed over a continuous ground plane to meet USB 2.0 full-speed signal-integrity requirements. VBUS and VUSB require their own 1 uF + 0.1 uF decoupling pair close to their respective balls to stabilize the on-chip USB transceiver.
The 121-TFBGA package has a typical theta-JA of approximately 30-35 C/W on a standard JEDEC 4-layer test board. Estimated: at full 32 MHz CPU speed with USB active and all peripherals engaged, the device may dissipate around 200-300 mW, producing a junction-temperature rise of 6-10 C above ambient. In sealed enclosures without airflow, de-rate CPU clock or use the -E extended-temperature grade for high-ambient deployments above 70 C.
Do not confuse the -I industrial grade (-40C to +85C) with the -E extended grade (-40C to +125C); the BG package outline is identical but the operating life at high temperature differs. Estimated: when migrating from the GB610 to the GA610 family (no USB OTG), the D+/D-, VBUS, and VUSB balls change function on the 121-TFBGA footprint - always re-spin or re-ball-check the layout. The dual-bank Live Update requires linker-script support for the two Flash regions; a stock XC16 project may not enable bank swap out of the box.
Informations de conformité
RoHS compliant per Microchip product page and LCSC listing. AEC-Q100 not applicable (consumer/industrial grade, not automotive qualified). NRND lifecycle status per Microchip product page as of 2026-09-30.
