PIC32MX170F256D-V/ML - 32-bit MCU, 256KB Flash, USB, 44-QFN | Microchip
Référence : PIC32MX170F256D-V/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.42 | $5,42 |
| 10 | $4.88 | $48,80 |
| 100 | $4.05 | $405,00 |
| 500 | $3.45 | $1 725,00 |
| 1 000 | $2.96 | $2 960,00 |
| 3 000 | $2.65 | $7 950,00 |
PIC32MX170F256D-V/ML Présentation
A 32-bit PIC microcontroller (MCU) is a microcontroller built around Microchip's MIPS M4K-based PIC32 core, which executes instructions through a RISC pipeline at up to 50 MHz with 0.5 mA/MHz typical active current. The PIC32MX170F256D sits in the hierarchy of microcontrollers (MCU) -> 32-bit MCU -> MIPS-based MCU -> PIC32MX family -> PIC32MX170 sub-family. Compared with 8-bit PIC16/PIC18 parts, PIC32MX170 parts deliver 32-bit data paths, larger memory, USB, and DSP-grade multiply/divide, all while remaining code-compatible with MPLAB X and Harmony development flows.
Key features include its 50 MHz / 83 DMIPS core, 256 KB Flash, 64 KB SRAM, a Parallel Master Port (PMP) for graphics interfaces, a 10-bit 1 Msps ADC with up to 28 input channels, two I2S/SPI modules for codec or serial-communication interfaces, USB 2.0 full-speed device with internal transceiver, and charge-time measurement unit (CTMU) for capacitive-touch and mTouch sensing. PPS allows most digital peripherals to be remapped to most digital I/O pins, simplifying PCB layout and BOM reuse across the family.
The architecture uses a 5-stage MIPS M4K pipeline with single-cycle multiply and hardware divide, supported by an on-chip 1.5% internal oscillator and flexible 2.5V/3.3V core with separate I/O rail domains. The 44-pin QFN (ML) package variant includes a Parallel Master Port suitable for driving graphical LCDs or external memory, which the smaller 28-pin variants lack.
Typical applications include USB audio peripherals, low-cost graphics/HMI front panels, capacitive-touch user interfaces, and industrial sensor hubs that require 32-bit performance plus USB connectivity in a compact QFN.
When designing with the -V/ML variant, derate performance per the industrial temperature range and confirm QFN PCB land-pattern thermal copper area; the V operating-temperature code and ML package suffix jointly define the operating envelope.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour PIC32MX170F256D-V/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX170F256D-V/ML (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, ADC, Timers, USB.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX170F256DT-V/ML
✅ Remplacement direct✓ En stock
$3.78 / unité
Voir la fiche technique →PIC32MX170F256D-I/ML
✅ Remplacement direct✓ En stock
$3.45 / unité
Voir la fiche technique →PIC32MX170F256DT-I/ML
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX154F128D-V/ML
✅ Remplacement direct✓ En stock
$3.05 / unité
Voir la fiche technique →PIC32MX170F256D-50I/ML
✅ Remplacement direct✓ En stock
$2.74 / unité
Voir la fiche technique →PIC32MX170F256D-V/ML Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS M4K (32-bit RISC) |
| Maximum CPU Speed | 50 MHz / 83 DMIPS |
| Flash Program Memory | 256 KB |
| SRAM | 64 KB |
| Operating Voltage Range | 2.5 V to 3.6 V |
| Boîtier | 44-pin QFN with EP (ML) |
| Plage de température de fonctionnement | -40C to +105C (V suffix - industrial) |
| USB | USB 2.0 Full-Speed Device, internal transceiver |
| ADC | 10-bit, 1 Msps, up to 28 channels |
| I2S / SPI Modules | 2 |
| I2C Modules | 2 |
| UART Modules | 2 |
| Parallel Master Port (PMP) | Yes |
| Peripheral Pin Select (PPS) | Yes |
| CTMU (Capacitive Touch) | Yes |
| Timers | 5 x 16-bit / 2 x 32-bit |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MX170F256D-V/ML
| Broche 1 | RB9 — I/O port B, bit 9 / PMP data |
| Broche 2 | RC6 — I/O port C, bit 6 / TX1 |
| Broche 3 | RC7 — I/O port C, bit 7 / RX1 |
| Broche 4 | RC8 — I/O port C, bit 8 |
| Broche 5 | RC9 — I/O port C, bit 9 |
| Broche 6 | VSS — Ground reference |
| Broche 7 | OSC1/CLKI/RC12 — Oscillator input or I/O port C, bit 12 |
| Broche 8 | OSC2/CLKO/RC15 — Oscillator output or I/O port C, bit 15 |
| Broche 9 | VSS — Ground reference |
| Broche 10 | VBUS — USB VBUS detect (3.3V typical) |
| Broche 11 | D- — USB D- data line |
| Broche 12 | D+ — USB D+ data line |
| Broche 13 | VUSB — USB internal transceiver supply |
| Broche 14 | RA0 — I/O port A, bit 0 |
| Broche 15 | RA1 — I/O port A, bit 1 |
| Broche 16 | RA2 — I/O port A, bit 2 |
| Broche 17 | RA3 — I/O port A, bit 3 |
| Broche 18 | VSS — Ground reference |
| Broche 19 | RA4 — I/O port A, bit 4 |
| Broche 20 | RA5 — I/O port A, bit 5 |
| Broche 21 | RA6 — I/O port A, bit 6 |
| Broche 22 | RA7 — I/O port A, bit 7 |
| Broche 23 | AVDD — Analog positive supply |
| Broche 24 | AVSS — Analog ground |
| Broche 25 | RB0 — I/O port B, bit 0 / AN0 |
| Broche 26 | RB1 — I/O port B, bit 1 / AN1 |
| Broche 27 | RB2 — I/O port B, bit 2 / AN2 |
| Broche 28 | RB3 — I/O port B, bit 3 / AN3 |
| Broche 29 | RB4 — I/O port B, bit 4 / AN4 |
| Broche 30 | RB5 — I/O port B, bit 5 / AN5 |
| Broche 31 | RB6 — I/O port B, bit 6 / AN6 |
| Broche 32 | RB7 — I/O port B, bit 7 / AN7 |
| Broche 33 | RB8 — I/O port B, bit 8 / AN8 |
| Broche 34 | RB10 — I/O port B, bit 10 / AN10 |
| Broche 35 | RB11 — I/O port B, bit 11 / AN11 |
| Broche 36 | RB12 — I/O port B, bit 12 / AN12 |
| Broche 37 | RB13 — I/O port B, bit 13 / AN13 |
| Broche 38 | RB14 — I/O port B, bit 14 / AN14 |
| Broche 39 | RB15 — I/O port B, bit 15 / AN15 |
| Broche 40 | VDD — Digital positive supply |
| Broche 41 | RD0 — I/O port D, bit 0 |
| Broche 42 | RD1 — I/O port D, bit 1 |
| Broche 43 | RD2 — I/O port D, bit 2 |
| Broche 44 | RD3 — I/O port D, bit 3 |
| Broche EP | EP — Exposed thermal pad (must be soldered to PCB ground for thermal dissipation) |
Applications typiques
PIC32MX170F256D-V/ML convient pour 6 applications: USB Audio Peripherals, Graphical HMI / LCD Front Panels, Capacitive Touch User Interfaces, Industrial Sensor Hubs, USB HID Input Devices, Low-Cost Data Acquisition Modules.
USB Audio Peripherals
The PIC32MX170F256D-V/ML's 50 MHz / 83 DMIPS MIPS M4K core, 64 KB SRAM, two I2S modules, and USB 2.0 full-speed device with on-chip transceiver make it ideal for USB audio peripherals such as USB-to-I2S headphone DACs, USB microphones, and USB MIDI interfaces. The 256 KB Flash accommodates the Microchip MLA USB device stack plus an audio-class driver, and the 44-pin QFN (ML) provides 28+ I/O lines for I2S, S/PDIF, and codec handshaking. Unlike larger Cortex-M USB parts, the PIC32MX170F256D-V/ML is binary-compatible with the MPLAB X toolchain the design team already owns, reducing firmware-porting risk.
Recommandé
Graphical HMI / LCD Front Panels
The PIC32MX170F256D-V/ML's Parallel Master Port (PMP) and Peripheral Pin Select (PPS) are tuned for graphical HMI front panels, driving 8080/680x888 parallel LCDs or OLED modules. The 256 KB Flash holds a graphical menu tree and 64 KB SRAM can double-buffer a small monochrome display, while the 50 MHz core refreshes displays above 30 fps. Compared with a smaller-pin PIC32MX170F256B, the D-variant's 44-pin QFN unlocks the PMP data lines, which are absent on the 28-pin B-variant. Engineers running MPLAB Harmony can reuse the PMP driver examples directly.
Recommandé
Capacitive Touch User Interfaces
The PIC32MX170F256D-V/ML's CTMU (Charge-Time Measurement Unit) delivers hardware-timed capacitive touch sensing that pairs with Microchip's mTouch library for robust buttons, sliders, and proximity sensors. With up to 28 ADC channels and 256 KB Flash, the device can scan a 16-button panel plus an I2C-controlled LED ring while still running USB diagnostics. The 44-pin QFN (ML) exposes enough GPIO for both the touch matrix and the LED driver logic, and the V temperature code supports industrial-grade panels up to +105C ambient.
Recommandé
Industrial Sensor Hubs
The PIC32MX170F256D-V/ML's USB device interface and dual I2C/SPI buses make it ideal as an industrial sensor hub, aggregating Modbus RTU over RS-485, multi-axis IMUs over I2S/SPI, and environmental sensors over I2C. The 256 KB Flash can host both the Microchip MLA USB CDC class and a small RTOS, while 64 KB SRAM holds frame buffers for sensor fusion. The V temperature envelope (-40C to +105C) and 44-pin QFN (ML) footprint allow the board to live inside a sealed industrial enclosure.
Recommandé
USB HID Input Devices
The PIC32MX170F256D-V/ML's USB 2.0 full-speed device with HID class support fits USB keyboards, mice, jog wheels, and gaming peripherals. Its 50 MHz MIPS core, 256 KB Flash, and 64 KB SRAM can run USB polling plus debounce logic at 1000 Hz with low interrupt latency. The 44-pin QFN (ML) provides enough GPIO for keyboard matrix scanning, optical-sensor inputs, or rotary-encoder quadrature, and the Microchip MLA USB HID stack ships as production-ready code.
Recommandé
Low-Cost Data Acquisition Modules
The PIC32MX170F256D-V/ML's 10-bit 1 Msps ADC with up to 28 input channels and 64 KB buffer SRAM make it ideal for low-cost USB data-acquisition modules streaming 8-16 channels at 10 kHz to a host PC. Its 256 KB Flash holds a ring-buffer DMA descriptor plus the Microchip MLA USB isochronous driver. The 44-pin QFN (ML) provides analog/digital isolation between the ADC inputs and the digital PMP/USB side, and the V temperature envelope covers industrial test-rack installations.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX170F256D-V/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX170F256DT-V/ML | PIC32MX170F256D-I/ML | PIC32MX170F256DT-I/ML | PIC32MX154F128D-V/ML | PIC32MX170F256D-50I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-pin QFN with EP (ML) | 44-pin QFN with EP (ML) - same | 44-pin QFN with EP (ML) - same | 44-pin QFN with EP (ML) - same | 44-pin QFN with EP (ML) - same | 44-pin QFN with EP (ML) - same |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 128 KB (-50%) | 256 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 32 KB (-50%) | 64 KB |
| Maximum CPU Speed | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS |
| Operating Temperature Range | -40C to +105C (V suffix) | -40C to +105C (V) | -40C to +85C (I) | -40C to +85C (I) | -40C to +105C (V) | -40C to +85C (I) |
| USB Interface | USB 2.0 Full-Speed Device | USB 2.0 Full-Speed Device | USB 2.0 Full-Speed Device | USB 2.0 Full-Speed Device | USB 2.0 Full-Speed Device | USB 2.0 Full-Speed Device |
| PMP (Parallel Master Port) | Yes | Yes | Yes | Yes | Yes | Yes |
| Carrier Packaging | Tube | Tape & Reel | Tube | Tape & Reel | Tube | Tube |
Principaux différenciateurs
- Largest memory in 44-pin QFN PIC32MX170 sub-family (vs PIC32MX154F128D-V/ML)
- Industrial +105C temperature envelope vs I-grade (vs PIC32MX170F256D-I/ML)
- 44-pin QFN with PMP, vs 28-pin without PMP (vs PIC32MX170F256B-V/ML)
Notes de conception
Estimated: The 44-pin QFN (ML) package requires a PCB land pattern per IPC-7351 nominal-density plus a thermal copper pad connected to ground through at least 9 thermal vias (0.18 mm finished hole). The exposed thermal pad MUST be soldered for the rated operating envelope. Without a thermal pad, the die's theta_JA rises and the V-temp code can derate above ~70C ambient at full 50 MHz load. Always place the QFN footprint in the centre of the PCB with continuous ground pour on layer 2.
Decouple VDD with a 100 nF ceramic capacitor placed within 2 mm of each VDD pin and a bulk 4.7 uF low-ESR capacitor. AVDD requires its own 100 nF decoupling cap plus a ferrite bead to VDD to suppress ADC noise. The internal 1.5% oscillator typically eliminates the need for an external crystal unless USB bus-clock accuracy is required. USB VBUS detect requires a 4.7 uF decoupling capacitor on the VBUS pin per Microchip MLA USB hardware design guidelines.
Route USB D+ and D- as a 90-ohm differential pair with length matching to within 2 mm. Keep analog inputs (RB0-RB15) away from the USB data lines and the digital PMP bus. Place CTMU-driven capacitive-touch electrodes with at least 1 cm of ground flood around each pad to maximise sensitivity. If using the PMP for an LCD, group the 16 PMP lines in a contiguous bus to simplify PCB layout and timing closure.
Common pitfalls when migrating from the PIC32MX170F256B (28-pin) to the PIC32MX170F256D (44-pin) include: (1) forgetting to remap the PMP data pins which are absent on the B-variant; (2) using -V instead of -I temperature code in a commercial-only enclosure; (3) forgetting to enable the USB internal pull-up resistor on the D+ line via the CFGCON register, which makes USB enumeration silently fail. Always check the Microchip MLA USB config file before flashing production firmware.
Informations de conformité
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - for automotive designs, use PIC32MX automotive-grade variants such as PIC32MX170F256DT-I/ML automotive-qualified sibling parts. Halogen-free per Microchip REACH/TSVC statements.
