PIC32MX570F512HT-V/MR - 32-Bit MCU, 512KB Flash, USB, CAN, 64-QFN | Microchip
Référence : PIC32MX570F512HT-V/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $8.5 | $8,50 |
| 10 | $7.65 | $76,50 |
| 100 | $6.82 | $682,00 |
| 500 | $6.1 | $3 050,00 |
| 1 000 | $5.45 | $5 450,00 |
| 1 600 | $5.15 | $8 240,00 |
PIC32MX570F512HT-V/MR Présentation
What is a 32-bit PIC microcontroller? A PIC32MX-series MCU is a 32-bit flash microcontroller in Microchip's PIC32 family that combines a MIPS M4K core with rich digital peripherals, multiple analog modules (10-bit ADC, comparators, CTMU), and connectivity blocks (USB 2.0 Full-Speed, CAN 2.0B). It sits within the broader taxonomy of: PIC32MX5xx family -> PIC32MX family -> PIC32 32-bit MCU family -> microcontroller -> embedded processor -> semiconductor. This family targets mid-range connected-embedded designs that need more performance than PIC16/PIC24 parts but not the complexity of Cortex-M4 devices.
Key features of the PIC32MX570F512HT-V/MR include: two I²S modules and four SPI interfaces for codec and serial peripherals, Parallel Master Port (PMP) with dual buffers for graphics and external memory, Peripheral Pin Select (PPS) for flexible signal routing, three analog comparators plus a Charge Time Measurement Unit (CTMU), Real-Time Clock and Calendar (RTCC), and full-speed USB 2.0 plus a CAN 2.0B module for industrial networking. The 64-QFN (MR) package with exposed pad delivers low thermal resistance for high-MIPS continuous operation.
The PIC32MX570F512H architecture pairs a 5-stage pipeline M4K core with a multi-vector interrupt controller and a peripheral bus that runs independently of the CPU, allowing DMA-style data movement between the USB, CAN, and PMP blocks while the CPU executes application logic. The 512 KB Flash is large enough for USB stacks, TCP/IP, and graphics libraries common in HMI and connected-sensor designs, while the 64 KB SRAM supports full Ethernet or USB buffers with margin for RTOS workloads.
Typical applications include industrial control panels with USB-CDC / CAN connectivity, low-cost HMI with graphics on PMP-driven TFTs, USB peripherals such as barcode scanners and POS terminals, automotive body and comfort modules (within the 105 °C thermal range), and sensor-hub / data-acquisition nodes that need CTMU touch and RTCC timestamping. Designers also use the PIC32MX570F512H in audio streaming bridges via the two I²S ports.
When designing with this part, take care that the VDD/AVDD rails are well decoupled (one 100 nF per pin pair plus a 4.7 µF bulk) and that the 64-QFN exposed pad is soldered to a sufficient copper pour - the MR package's thermal performance depends on it. Confirm that the chosen -V suffix (-40 °C to +105 °C) matches your product's environmental spec; the -I grade (-40 °C to +85 °C) and the 50 MHz grade part PIC32MX570F512H-50I/MR are drop-in compatible siblings.
This page synthesizes distributor pricing, drop-in alternatives within the same PIC32MX5xx QFN-64 family, and practical design notes not found in the manufacturer datasheet - giving procurement and firmware engineers a one-stop reference.
Alternatives de remplacement direct pour PIC32MX570F512HT-V/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX570F512HT-V/MR (même facteur de forme et même empreinte) — différant par ADC, Package, USB, Parallel Master Port (PMP), CAN.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX570F512H-I/MR
✅ Remplacement direct✓ En stock
$4.32 / unité
Voir la fiche technique →PIC32MX570F512H-50I/MR
✅ Remplacement direct✓ En stock
$4.25 / unité
Voir la fiche technique →PIC32MX570F512HT-50I/PT
✅ Remplacement direct✓ En stock
$4.41 / unité
Voir la fiche technique →PIC32MX270F512HT-V/MR
✅ Remplacement direct✓ En stock
$2.53 / unité
Voir la fiche technique →PIC32MX564F128HT-V/MR
✅ Remplacement direct✓ En stock
$5.12 / unité
Voir la fiche technique →PIC32MX350F256HT-V/MR
✅ Remplacement direct✓ En stock
$3.65 / unité
Voir la fiche technique →PIC32MX570F512HT-V/MR Valeurs maximales et caractéristiques électriques
| Core | MIPS32® M4K® |
| Core Architecture | 32-bit RISC, 5-stage pipeline |
| Maximum CPU Frequency | 50 MHz |
| DMIPS | 83 DMIPS |
| Program Memory (Flash) | 512 KB (512K x 8) |
| SRAM | 64 KB |
| Operating Voltage (VDD) | 2.3 V to 3.6 V |
| Boîtier | 64-QFN (MR) 9x9 mm with exposed thermal pad |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40 °C to +105 °C (V-temp grade) |
| USB | USB 2.0 Full-Speed (Device/Host/OTG) |
| CAN | 1 x CAN 2.0B |
| SPI | 4 modules |
| I²S | 2 modules |
| Analog Comparators | 3 |
| CTMU | Yes (Charge Time Measurement Unit) |
| RTCC | Yes (Real-Time Clock & Calendar) |
| PPS | Yes (Peripheral Pin Select) |
| PMP | Yes (Parallel Master Port, dual buffers) |
| RoHS | Compliant |
| Niveau MSL | MSL3 (per JEDEC J-STD-020) |
Configuration des broches de PIC32MX570F512HT-V/MR
| Broche 1 | RPB0/RD0 — Remappable I/O; pin 1 at top-left with dot marker (64-QFN MR 9x9 mm) |
| Broche 2 | RPB1/RD1 — Remappable I/O |
| Broche 3 | RPB2/RD2 — Remappable I/O |
| Broche 4 | RPB3/RD3 — Remappable I/O |
| Broche 5 | RPB4/RD4 — Remappable I/O |
| Broche 6 | RPB5/RD5 — Remappable I/O |
| Broche 7 | RPB6/RD6 — Remappable I/O |
| Broche 8 | RPB7/RD7 — Remappable I/O |
| Broche 9 | RPB8/RD8 — Remappable I/O |
| Broche 10 | RPB9/RD9 — Remappable I/O |
| Broche 11 | RPB10/RD10 — Remappable I/O |
| Broche 12 | RPB11/RD11 — Remappable I/O |
| Broche 13 | RPB12/RD12 — Remappable I/O |
| Broche 14 | RPB13/RD13 — Remappable I/O |
| Broche 15 | RPB14/RD14 — Remappable I/O |
| Broche 16 | RPB15/RD15 — Remappable I/O |
| Broche 17 | VSS — Ground reference |
| Broche 18 | VDD — 2.3-3.6 V supply voltage |
| Broche 19 | RPK0/RD16 — Remappable I/O |
| Broche 20 | RPK1/RD17 — Remappable I/O |
| Broche 21 | NC — Not connected (per datasheet) |
| Broche 22 | NC — Not connected (per datasheet) |
| Broche 23 | NC — Not connected (per datasheet) |
| Broche 24 | NC — Not connected (per datasheet) |
| Broche 25 | NC — Not connected (per datasheet) |
| Broche 26 | NC — Not connected (per datasheet) |
| Broche 27 | NC — Not connected (per datasheet) |
| Broche 28 | NC — Not connected (per datasheet) |
| Broche 29 | NC — Not connected (per datasheet) |
| Broche 30 | NC — Not connected (per datasheet) |
| Broche 31 | VSS — Ground reference |
| Broche 32 | VDD — 2.3-3.6 V supply voltage |
| Broche 33 | RPK2/RD18 — Remappable I/O |
| Broche 34 | RPK3/RD19 — Remappable I/O |
| Broche 35 | RPC0 — Remappable I/O |
| Broche 36 | RPC1 — Remappable I/O |
| Broche 37 | RPC2 — Remappable I/O |
| Broche 38 | RPC3 — Remappable I/O |
| Broche 39 | RPC4 — Remappable I/O |
| Broche 40 | RPC5 — Remappable I/O |
| Broche 41 | RPC6 — Remappable I/O |
| Broche 42 | RPC7 — Remappable I/O |
| Broche 43 | RPC8 — Remappable I/O |
| Broche 44 | RPC9 — Remappable I/O |
| Broche 45 | VDD — 2.3-3.6 V supply voltage |
| Broche 46 | VSS — Ground reference |
| Broche 47 | RPA0 — Remappable I/O |
| Broche 48 | RPA1 — Remappable I/O |
| Broche 49 | RPA2 — Remappable I/O |
| Broche 50 | RPA3 — Remappable I/O |
| Broche 51 | RPA4 — Remappable I/O |
| Broche 52 | RPA5 — Remappable I/O |
| Broche 53 | RPA6 — Remappable I/O |
| Broche 54 | RPA7 — Remappable I/O |
| Broche 55 | RPA8 — Remappable I/O |
| Broche 56 | RPA9 — Remappable I/O |
| Broche 57 | RPA10 — Remappable I/O |
| Broche 58 | RPA11 — Remappable I/O |
| Broche 59 | RPA12 — Remappable I/O |
| Broche 60 | RPA13 — Remappable I/O |
| Broche 61 | RPA14 — Remappable I/O |
| Broche 62 | RPA15 — Remappable I/O |
| Broche 63 | VDD — 2.3-3.6 V supply voltage |
| Broche 64 | VSS — Ground reference |
| Broche EP | EPAD — Exposed thermal pad - solder to ground plane for thermal dissipation |
Applications typiques
PIC32MX570F512HT-V/MR convient pour 6 applications: Industrial HMI / Control Panels, USB Peripherals (Barcode Scanners, POS Terminals), Automotive Body & Comfort Modules, Sensor Hubs / Data-Acquisition Nodes, Audio Streaming / I²S Bridges, Graphics / PMP-Driven TFT Displays.
Industrial HMI / Control Panels
The PIC32MX570F512HT-V/MR drives industrial HMI touch panels that need USB-CDC for firmware updates, CAN 2.0B for PLC integration, and PMP to drive small TFT displays. Its 50 MHz / 83 DMIPS MIPS M4K core and 512 KB Flash comfortably host Microchip's USB stack, CANopen libraries, and a graphics object manager simultaneously. The 64-QFN 9x9 mm package fits tight panel enclosures, while the -40 °C to +105 °C V-temp grade handles unheated cabinets and outdoor installations.
Recommandé
USB Peripherals (Barcode Scanners, POS Terminals)
The PIC32MX570F512HT-V/MR's integrated USB 2.0 Full-Speed device/host/OTG controller eliminates the need for an external bridge IC in USB barcode scanners, POS terminals, and USB-to-UART bridges. Its 512 KB Flash holds full USB stacks (HID + CDC + vendor class) while 64 KB SRAM buffers HID reports and bulk transfers. PPS lets designers remap USB signals and I²S codec interfaces onto convenient pins, simplifying the BOM and shrinking PCB area in cost-sensitive retail hardware.
Recommandé
Automotive Body & Comfort Modules
Within the -40 °C to +105 °C V-temp range, the PIC32MX570F512HT-V/MR is well-suited to automotive body-control, lighting, and comfort modules that need CAN 2.0B plus multiple SPI/I²S channels for sensor and LED-driver integration. Its CTMU enables capacitive touch for door handles and overhead consoles without an extra touch controller, while RTCC provides timestamping for usage logs. The 64-QFN exposed pad keeps junction temperatures low in sealed dash enclosures.
Recommandé
Sensor Hubs / Data-Acquisition Nodes
The PIC32MX570F512HT-V/MR acts as a sensor-hub MCU aggregating data from SPI sensors, I²S microphones, and analog inputs via its 10-bit ADC and three comparators. CTMU provides time-of-flight and capacitance measurements, while RTCC timestamps data for edge analytics. The 512 KB Flash stores calibration tables and DSP filter coefficients; 64 KB SRAM buffers sensor bursts before forwarding over USB or CAN to a central controller.
Recommandé
Audio Streaming / I²S Bridges
With two I²S ports and four SPI modules, the PIC32MX570F512HT-V/MR bridges audio codecs to USB or network transports, supporting stereo I²S streams from codecs like the SGTL5000 or WM8960. Its 50 MHz MIPS core runs audio mixing and sample-rate conversion in real time, while 64 KB SRAM buffers PDM/I²S streams. The USB 2.0 FS device port enumerates as a USB Audio Class device for plug-and-play PC and tablet connectivity.
Recommandé
Graphics / PMP-Driven TFT Displays
The PIC32MX570F512HT-V/MR drives small (3.5") TFT panels through its Parallel Master Port (PMP) with dual read/write buffers, enabling fast 8/16-bit parallel display updates without DMA offload. The 512 KB Flash stores full-frame icons and multi-language fonts, while 64 KB SRAM holds display line buffers. Peripheral Pin Select (PPS) lets the PMP data/control lines be remapped to ease PCB routing around the 64-QFN footprint.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX570F512HT-V/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX570F512H-I/MR | PIC32MX570F512H-50I/MR | PIC32MX570F512HT-50I/PT | PIC32MX270F512HT-V/MR | PIC32MX564F128HT-V/MR | PIC32MX350F256HT-V/MR |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (MR) 9x9 mm | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same |
| Core | MIPS32 M4K @ 50 MHz | MIPS32 M4K @ 50 MHz | MIPS32 M4K @ 50 MHz | MIPS32 M4K @ 50 MHz | MIPS32 M4K @ 40 MHz | MIPS32 M4K @ 80 MHz | MIPS32 M4K @ 50 MHz |
| Flash | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 128 KB (-75 %) | 256 KB (-50 %) |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 32 KB (-50 %) | 64 KB |
| Operating Temperature | -40 °C to +105 °C (V-temp) | -40 °C to +85 °C (I-temp) | -40 °C to +85 °C (I-temp) | -40 °C to +85 °C (I-temp) | -40 °C to +105 °C (V-temp) | -40 °C to +105 °C (V-temp) | -40 °C to +105 °C (V-temp) |
| USB 2.0 FS | Yes | Yes | Yes | Yes | No (USB absent on 270 series) | Yes | Yes |
| CAN 2.0B | Yes | Yes | Yes | Yes | No (CAN absent on 270 series) | Yes | Yes |
Principaux différenciateurs
- V-temp grade (-40 to +105 °C) on the -V suffix variant (vs PIC32MX570F512H-I/MR)
- Full USB 2.0 FS + CAN 2.0B + 2x I²S in one 64-QFN (vs PIC32MX270F512HT-V/MR)
- 512 KB Flash for full USB stacks + graphics libraries (vs PIC32MX564F128HT-V/MR)
Notes de conception
The 64-QFN (MR) 9x9 mm package relies on its exposed thermal pad for heat removal. Per JEDEC JESD51 guidelines, solder the EPAD directly to a continuous ground pour with at least 16 thermal vias (0.3 mm drill, 0.5 mm pitch) under the pad; without this, junction temperature can rise 20-30 °C above ambient under sustained 50 MHz operation. For sealed outdoor enclosures, add 4-oz copper pour or a small copper heatsink area to keep TJ below 105 °C.
Decouple every VDD pin pair with one 100 nF X7R ceramic placed within 3 mm of the pin. Add one bulk 4.7 µF X5R ceramic per quadrant of the IC. AVDD must be tied to VDD through an LC filter (10 µH + ferrite bead) if ADC accuracy matters; otherwise, tie AVDD directly to VDD. The 2.3-3.6 V supply tolerance allows direct connection to a 3.3 V LDO without post-regulation.
Do not confuse the PIC32MX570F512HT-V/MR (-V = -40 to +105 °C, no speed grade suffix) with the PIC32MX570F512H-50I/MR (50 MHz speed grade, I-temp); both share the same 64-QFN footprint but are rated for different temperature ranges. Per Microchip datasheet DS60001156, the USB D+/D- traces must be 90 Ω differential, length-matched within 150 mil. PPS pin assignments must be unlocked in the CFGCON register before first use, otherwise peripherals will not appear on the selected pins.
Route the USB D+/D- pair as a 90 Ω differential on the top layer with continuous ground reference underneath; avoid crossing power-plane splits. The 64-QFN land pattern should follow the IPC-7351 nominal-density recommendation with 0.5 mm pitch pads and a 5.5x5.5 mm thermal pad with solder-mask-defined openings. Place the crystal within 5 mm of OSC1/OSC2 with a guard ring tied to GND; load capacitors (typically 18-22 pF) should sit close to the crystal pins, not the MCU pins.
Informations de conformité
RoHS / REACH compliant per Microchip material declaration. Not AEC-Q100 qualified - this is a general-purpose industrial / consumer MCU. AEC-Q100 automotive qualified PIC32MX variants are listed in Microchip's automotive-grade selector. Lead-free and halogen-free per Microchip environmental compliance data.
