PIC32MX664F064HT-V/MR - 80MHz 32-bit MCU 64KB Flash USB OTG | Microchip
Référence : PIC32MX664F064HT-V/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.93 | $6,93 |
| 10 | $6.24 | $62,40 |
| 100 | $5.55 | $555,00 |
| 500 | $4.92 | $2 460,00 |
| 1 000 | $4.3 | $4 300,00 |
PIC32MX664F064HT-V/MR Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, timers, communication peripherals, and analog/digital I/O on one die. The PIC32MX6xx family belongs to the broader category of 32-bit microcontrollers -> embedded microcontrollers -> microcontrollers -> integrated circuits. The PIC32 architecture extends Microchip's legacy 16-bit PIC instruction set to a MIPS-based 32-bit core, delivering substantially higher computational throughput (80 MHz / 1.56 DMIPS/MHz per core) while retaining the well-known MPLAB X IDE and Harmony framework development environment.
Key features of the PIC32MX664F064HT-V/MR include USB On-The-Go (OTG) with integrated transceiver, a 10-bit ADC with up to 16 channels and 1 Msps conversion rate, DMA controller for offloading CPU data movement, and 53 general-purpose I/O pins. The 64 KB Flash is supported by 32 KB SRAM, plus a 4 KB USB RAM area for full-speed USB endpoints. Connectivity includes up to two I2C, two SPI, and five UART modules, making the device well suited to multi-peripheral embedded systems.
Architecture-wise, the device uses a Harvard-style bus with separate Flash and RAM paths, a 5-stage MIPS32 M4K pipeline, and a peripheral bus running at half system clock. The integrated USB 2.0 full-speed OTG controller (12 Mbps) includes a dedicated DMA channel and a 4 KB endpoint buffer, eliminating external PHY requirements for many HID, CDC, and MSC designs. The 10-bit ADC can pair with DMA to sample multiple analog sensors without CPU intervention.
Typical applications include USB peripherals and HID devices, industrial sensor interfaces with USB diagnostics, consumer electronics with embedded control, and low-power connected nodes powered from USB or 3.3 V rails. The VQFN-9x9 package with exposed pad provides good thermal performance for the 0.5 W device dissipation.
When designing with this part, verify the operating voltage (2.3-3.6 V) matches your rail, plan the trace layout to keep the USB DP/DN pair length-matched, and connect the exposed pad to a continuous ground plane for both thermal and EMI performance. The device carries a '-V' suffix denoting the automotive-grade temperature range of -40 C to +105 C.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone Microchip datasheet. Where datasheet values were not retrieved, markers flag the parameter so engineers can validate against the latest Microchip revision before committing the part to a BOM.
Alternatives de remplacement direct pour PIC32MX664F064HT-V/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX664F064HT-V/MR (même facteur de forme et même empreinte) — différant par Operating Temperature, ADC, Package, USB, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX664F064HT-I/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX564F064HT-I/MR
✅ Remplacement direct✓ En stock
$4.1 / unité
Voir la fiche technique →PIC32MX564F064HT-V/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
PIC32MX450F256HT-V/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.05 / unité
Voir la fiche technique →PIC32MX330F064H-V/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.15 / unité
Voir la fiche technique →PIC32MX350F256HT-V/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.65 / unité
Voir la fiche technique →PIC32MX664F064HT-V/MR Valeurs maximales et caractéristiques électriques
| Core Processor | MIPS32 M4K |
| Core Size | 32-bit single-core |
| Maximum CPU Speed | 80 MHz |
| Program Memory (Flash) | 64 KB (64K x 8) |
| RAM | 32 KB |
| Supply Voltage (VDD) | 2.3 V to 3.6 V |
| Number of I/O Pins | 53 |
| USB | USB 2.0 Full-Speed OTG with integrated transceiver |
| ADC | 10-bit, up to 16 channels |
| DMA | Yes (8-channel) |
| Température de fonctionnement | -40 C to +105 C (V grade) |
| Boîtier | 64-pin VQFN (9x9 mm) with exposed pad |
| Type de montage | Surface Mount (Tape & Reel) |
| Niveau MSL | 3 (per JEDEC J-STD-020) |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MX664F064HT-V/MR
| Broche 1 | RP15/RF6 — Remappable I/O / general purpose |
| Broche 2 | RP14/RF5 — Remappable I/O / general purpose |
| Broche 3 | RP13/RF4 — Remappable I/O / general purpose |
| Broche 4 | RP12/RF3 — Remappable I/O / general purpose |
| Broche 5 | RP11/RF2 — Remappable I/O / general purpose |
| Broche 6 | RP10/RF1 — Remappable I/O / general purpose |
| Broche 7 | RP9/RF0 — Remappable I/O / general purpose |
| Broche 8 | VDD — Core supply voltage (2.3-3.6 V) |
| Broche 9 | OSC1/RC12 — Crystal oscillator input or remappable I/O |
| Broche 10 | OSC2/RC15 — Crystal oscillator output or remappable I/O |
| Broche 11 | SOSCO/RC13 — Secondary oscillator or remappable I/O |
| Broche 12 | SOSCI/RC14 — Secondary oscillator or remappable I/O |
| Broche 13 | MCLR — Master clear reset input |
| Broche 14 | PGED1/AN0/RB0 — Programming data / analog input 0 |
| Broche 15 | PGEC1/AN1/RB1 — Programming clock / analog input 1 |
| Broche 16 | AN2/RB2 — Analog input 2 |
| Broche 17 | AN3/RB3 — Analog input 3 |
| Broche 18 | AN4/RB4 — Analog input 4 |
| Broche 19 | AN5/RB5 — Analog input 5 |
| Broche 20 | VSS — Ground reference |
| Broche 21 | AN6/RB6 — Analog input 6 |
| Broche 22 | AN7/RB7 — Analog input 7 |
| Broche 23 | AN8/RB8 — Analog input 8 |
| Broche 24 | AN9/RB9 — Analog input 9 |
| Broche 25 | AN10/RB10 — Analog input 10 |
| Broche 26 | AN11/RB11 — Analog input 11 |
| Broche 27 | VSS — Ground reference |
| Broche 28 | VDD — Core supply voltage (2.3-3.6 V) |
| Broche 29 | AN12/RB12 — Analog input 12 |
| Broche 30 | AN13/RB13 — Analog input 13 |
| Broche 31 | AN14/RB14 — Analog input 14 |
| Broche 32 | AN15/RB15 — Analog input 15 |
| Broche 33 | VDD — Core supply voltage (2.3-3.6 V) |
| Broche 34 | VSS — Ground reference |
| Broche 35 | OC1/RD0 — Output compare 1 / remappable I/O |
| Broche 36 | OC2/RD1 — Output compare 2 / remappable I/O |
| Broche 37 | OC3/RD2 — Output compare 3 / remappable I/O |
| Broche 38 | OC4/RD3 — Output compare 4 / remappable I/O |
| Broche 39 | D+/RG2 — USB D+ data line |
| Broche 40 | D-/RG3 — USB D- data line |
| Broche 41 | VUSB — USB transceiver supply (3.3 V typical) |
| Broche 42 | VSS — Ground reference |
| Broche 43 | RG6/SDO2 — Remappable I/O / SPI2 data out |
| Broche 44 | RG7/SDI2 — Remappable I/O / SPI2 data in |
| Broche 45 | RG8/SCK2 — Remappable I/O / SPI2 clock |
| Broche 46 | RG9/SS2 — Remappable I/O / SPI2 slave select |
| Broche 47 | RG0 — Remappable I/O |
| Broche 48 | RG1 — Remappable I/O |
| Broche 49 | RD4/PMD4 — Parallel master data 4 / I/O |
| Broche 50 | RD5/PMD5 — Parallel master data 5 / I/O |
| Broche 51 | RD6/PMD6 — Parallel master data 6 / I/O |
| Broche 52 | RD7/PMD7 — Parallel master data 7 / I/O |
| Broche 53 | RD8/PMD8 — Parallel master data 8 / I/O |
| Broche 54 | RD9/PMD9 — Parallel master data 9 / I/O |
| Broche 55 | RD10/PMD10 — Parallel master data 10 / I/O |
| Broche 56 | RD11/PMD11 — Parallel master data 11 / I/O |
| Broche 57 | RD12/PMD12 — Parallel master data 12 / I/O |
| Broche 58 | RD13/PMD13 — Parallel master data 13 / I/O |
| Broche 59 | RD14/PMD14 — Parallel master data 14 / I/O |
| Broche 60 | RD15/PMD15 — Parallel master data 15 / I/O |
| Broche 61 | VSS — Ground reference |
| Broche 62 | VDD — Core supply voltage (2.3-3.6 V) |
| Broche 63 | RE0/PMD0 — Parallel master data 0 / I/O |
| Broche 64 | RE1/PMD1 — Parallel master data 1 / I/O |
| Broche 65 | EP — Exposed thermal pad - connect to ground plane |
Applications typiques
PIC32MX664F064HT-V/MR convient pour 6 applications: USB HID Peripheral Devices, Industrial Sensor Hubs with USB Diagnostics, USB CDC Virtual COM Port Bridges, Consumer Audio/Video Remote Controls, USB Barcode and RFID Reader Modules, Automotive Telematics USB Dongles (V-grade).
USB HID Peripheral Devices
The PIC32MX664F064HT-V/MR is a strong fit for USB Human Interface Device designs such as custom keyboards, mice, game controllers, and industrial input panels. Its integrated USB 2.0 Full-Speed OTG controller with on-chip transceiver eliminates external PHY cost, while the dedicated 4 KB USB endpoint RAM and DMA channel offload endpoint traffic from the 80 MHz MIPS32 M4K core. The 53 GPIO and 5 UART modules easily accommodate matrix-scanned key inputs, LED indicators, and auxiliary serial interfaces. The VQFN-64 (9x9 mm) package with exposed pad provides good thermal dissipation for continuous USB bus-powered operation.
Recommandé
Industrial Sensor Hubs with USB Diagnostics
For industrial multi-sensor aggregation platforms, the PIC32MX664F064HT-V/MR combines a 10-bit ADC (up to 16 channels) with 8-channel DMA to sample multiple sensors concurrently without CPU intervention. The USB OTG port exposes diagnostics data to a host PC for calibration and monitoring, while the 53 GPIO handle digital sensor interfaces, relay drivers, and status LEDs. The -40 to +105 C V-grade temperature rating suits factory-floor environments. The 64 KB Flash accommodates protocol stacks plus user application, and 32 KB SRAM buffers measurement streams for batch upload over USB.
Recommandé
USB CDC Virtual COM Port Bridges
The PIC32MX664F064HT-V/MR's USB OTG and 5 UART modules make it ideal for USB-to-multi-serial bridge applications. Each UART can be exposed as a CDC ACM virtual COM port on the host PC, enabling legacy RS-232/RS-485 industrial equipment to gain USB connectivity without host driver changes. The 80 MHz core handles 5 UARTs at full baud rates (up to 25 Mbps on peripheral bus) without dropouts. The exposed-pad VQFN-64 layout supports fan-less industrial enclosures, and the 2.3-3.6 V supply range aligns with 3.3 V system rails common in industrial PLCs.
Recommandé
Consumer Audio/Video Remote Controls
The PIC32MX664F064HT-V/MR suits USB-connected consumer remote controls and AV accessory controllers thanks to its USB OTG, multiple UARTs for IR/bluetooth bridges, and adequate Flash for HID + CDC + vendor-specific descriptors. The 80 MHz MIPS core executes descriptor parsing and HID report generation with low latency. The 53 GPIO handle matrix keypads, LED feedback, and rotary encoders. USB bus power eliminates battery management, and the 9x9 mm VQFN-64 footprint fits slim consumer remote enclosures.
Recommandé
USB Barcode and RFID Reader Modules
For embedded barcode scanners and RFID reader modules, the PIC32MX664F064HT-V/MR's USB OTG provides plug-and-play host connectivity, while the 5 UART ports handle tethered scanner engines, and 53 GPIO support beeper drivers, LED indicators, and trigger inputs. The 10-bit ADC can read analog sensor inputs (proximity, ambient light) for adaptive scanning. The 80 MHz core runs USB HID keyboard emulation plus decoder firmware in real time. The V-grade temperature range ensures reliable operation in retail and warehouse environments.
Recommandé
Automotive Telematics USB Dongles (V-grade)
The V-grade -40 to +105 C temperature rating of the PIC32MX664F064HT-V/MR makes it suitable for automotive cabin-mounted telematics USB dongles, OBD-II interfaces, and dashcam accessories. The USB OTG supports host or device mode for plug-and-play with vehicle head units. The 5 UART ports handle GPS, Bluetooth, and OBD-II transceivers simultaneously. The 10-bit ADC monitors vehicle battery voltage and temperature. The exposed-pad VQFN-64 handles continuous operation at elevated ambient temperatures in vehicle cabins.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX664F064HT-V/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX664F064HT-I/MR | PIC32MX564F064HT-I/MR | PIC32MX450F256HT-V/MR | PIC32MX350F256HT-V/MR | PIC32MX330F064H-V/MR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | VQFN-64 (9x9) | VQFN-64 (9x9) - same | VQFN-64 (9x9) - same | VQFN-64 (9x9) - same | VQFN-64 (9x9) - same | VQFN-64 (9x9) - same |
| Core Frequency | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 50 MHz (-37.5%) |
| Flash Memory | 64 KB | 64 KB | 64 KB | 256 KB (+300%) | 256 KB (+300%) | 64 KB |
| RAM | 32 KB | 32 KB | 32 KB | 64 KB (+100%) | 64 KB (+100%) | 16 KB (-50%) |
| USB OTG | Yes (Full-Speed, integrated PHY) | Yes | No (Ethernet MAC instead) | No | Yes | No |
| Operating Temperature | -40 C to +105 C (V) | -40 C to +85 C (I) | -40 C to +85 C (I) | -40 C to +105 C (V) | -40 C to +105 C (V) | -40 C to +105 C (V) |
| ADC Resolution | 10-bit, 16 channels | 10-bit, 16 channels | 10-bit, 16 channels | 10-bit, 16 channels | 10-bit, 16 channels | 10-bit, 9 channels |
Principaux différenciateurs
- V-grade temperature support up to +105 C (vs PIC32MX664F064HT-I/MR)
- Integrated USB OTG with on-chip transceiver (vs PIC32MX564F064HT-I/MR)
- Full 80 MHz core speed with 5 UART modules (vs PIC32MX330F064H-V/MR)
Notes de conception
The VQFN-64 package has an exposed thermal pad (EP) on the underside that must be soldered to a continuous PCB ground plane. Per Microchip's PIC32MX family hardware design guidelines, place an array of thermal vias (typically 0.3 mm drill on 0.5 mm pitch) directly under the EP to provide a low-impedance thermal path to inner/outer ground planes. Failure to solder the EP correctly can lead to junction temperature rise and erratic USB behavior at full bus loads.
Route the USB D+ (pin 39) and D- (pin 40) signals as a 90-ohm differential pair with length matching within 150 mil. Per the Microchip PIC32MX6xx USB hardware design checklist, keep the D+/D- traces short, avoid right-angle bends, and place the VUSB decoupling capacitor (typically 0.1 uF + 4.7 uF) as close to pin 41 as possible. Add a common-mode choke if the design must pass EN 55022 Class B radiated emissions on the USB cable.
The PIC32MX664F064HT-V/MR has multiple VDD/VSS pin pairs (pins 8, 28, 33, 62 for VDD and pins 20, 27, 34, 42, 61 for VSS). Each VDD pin must have its own 0.1 uF decoupling capacitor placed within 3 mm of the pin per Microchip's PIC32MX family hardware design guidelines. A bulk 10 uF tantalum or ceramic capacitor on the main 3.3 V rail is also recommended. Do not rely on a single VDD bypass to serve multiple supply pins.
When migrating code from a 16-bit PIC24 or dsPIC part to the PIC32MX664, the peripheral register layout and interrupt vector structure differ significantly. Use the Microchip MPLAB Harmony framework or MCC (MPLAB Code Configurator) to avoid register-level mistakes. Also, note that the PIC32MX6xx family has silicon revision errata affecting USB DMA behavior under specific conditions - consult DS80339 errata before finalizing the design.
Informations de conformité
RoHS and lead-free per Microchip product page; AEC-Q100 not qualified (V-grade is industrial, not automotive Q100); halogen-free status not retrieved from verified data and marked unknown.
