PIC32MX675F256LT-80I/BG - 32-bit MCU 80MHz 256KB Flash 121-TFBGA
Référence : PIC32MX675F256LT-80I/BG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $9.45 | $9,45 |
| 10 | $8.62 | $86,20 |
| 100 | $7.74 | $774,00 |
| 500 | $6.95 | $3 475,00 |
| 1 000 | $6.2 | $6 200,00 |
PIC32MX675F256LT-80I/BG Présentation
A 32-bit microcontroller (MCU) is an integrated circuit that combines a high-performance 32-bit processor core, program memory (Flash), data memory (SRAM), and a rich set of on-chip peripherals in a single silicon die. Within the broader semiconductor taxonomy, a 32-bit MCU sits below application processors and above 8-bit / 16-bit microcontrollers, offering substantially higher throughput (Dhrystone MIPS) while retaining deterministic interrupt response and low-power sleep modes. PIC32MX devices bridge classic PIC microcontroller ease-of-use with MIPS-class arithmetic capability, supported by Microchip's MPLAB X IDE and Harmony framework.
Key features include 80 MHz core clock with single-cycle multiplication, 256 KB self-programmable Flash, 64 KB SRAM, full-speed USB 2.0 OTG with integrated transceiver, 10/100 Ethernet MAC with RMII/MII interface, eight-channel DMA, 16 channels of 10-bit ADC at up to 1 Msps, and up to 83 general-purpose I/O pins. The 121-ball TFBGA package exposes the full peripheral set, including parallel data ports and external bus interface, making this the highest-pin-count variant in the PIC32MX675 family.
The architecture combines a 5-stage MIPS32 M4K pipeline with single-cycle MAC instructions and a hardware multiply/divide unit, delivering 1.56 DMIPS/MHz. Configurable prefetch cache and a separate peripheral bus reduce Flash wait-state penalties. The integrated Ethernet MAC supports IEEE 802.3 with MII/RMII PHY interfaces, and the USB OTG controller includes on-chip transceivers and battery-charge detection per USB 1.1/2.0 specifications. Code protection, JTAG boundary scan, and trace ports support debugging through MPLAB ICD and REAL ICE emulators.
Typical applications include industrial Ethernet gateways, USB-to-UART bridges, embedded web servers, industrial control with Modbus TCP, building automation controllers, and point-of-sale terminals. The combination of USB, Ethernet, and ample GPIO makes this part especially attractive for IoT edge nodes requiring multi-protocol wired connectivity without external PHY/transceiver ICs.
For designs migrating to the same package, ensure the 121-ball land pattern with 0.8 mm pitch is properly fabricated with NSMD pads and microvia-in-pad for reliable BGA assembly. Decouple each AVDD/VDD pair with 100 nF and 4.7 uF ceramic capacitors placed within 3 mm of the ball, and follow Microchip's recommended reflow profile for Pb-free SAC305 alloy.
This page synthesizes distributor pricing, drop-in alternatives within the same 121-TFBGA footprint, and practical design notes that go beyond the manufacturer datasheet to accelerate component selection and PCB layout decisions.
Alternatives de remplacement direct pour PIC32MX675F256LT-80I/BG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX675F256LT-80I/BG (même facteur de forme et même empreinte) — différant par ADC, Package, Operating Temperature, USB, Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX675F256L-80I/BG
✅ Remplacement direct✓ En stock
$6.2 / unité
Voir la fiche technique →PIC32MX675F256L-80V/BG
✅ Remplacement direct✓ En stock
$7.92 / unité
Voir la fiche technique →PIC32MX675F256LT-80I/BG
✅ Remplacement direct✓ En stock
$6.2 / unité
Voir la fiche technique →PIC32MX695F256L-80I/BG
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX795F512L-80I/BG
✅ Remplacement direct✓ En stock
$9.1 / unité
Voir la fiche technique →PIC32MX575F256LT-80I/BG
✅ Remplacement direct✓ En stock
$5.95 / unité
Voir la fiche technique →PIC32MX675F256LT-80I/BG Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Clock | 80 MHz |
| Flash Program Memory | 256 KB |
| SRAM | 64 KB |
| Supply Voltage (VDD) | 2.3 V to 3.6 V |
| Température de fonctionnement | -40C to +85C (Industrial) |
| Boîtier | 121-ball TFBGA (10x10 mm), 0.8 mm pitch |
| I/O Pins | 83 |
| Ethernet MAC | 10/100 Mbit IEEE 802.3 with MII/RMII |
| USB | USB 2.0 Full-Speed OTG with integrated transceiver |
| DMA Channels | 8 |
| ADC | 16-channel 10-bit, up to 1 Msps |
| UART / SPI / I2C | 2 / 2 / 2 |
| Timers / Input Capture / Output Compare | 5 / 5 / 5 |
| Statut RoHS | Compliant (PB-free) |
| Type de montage | Surface Mount (BGA) |
| Niveau MSL | 3 (per JEDEC J-STD-020) |
Guide de configuration des broches du PIC32MX675F256LT-80I/BG 121-ball tfbga (10x10 mm), 0.8 mm pitch
Configuration des broches du PIC32MX675F256LT-80I/BG (boîtier 121-ball tfbga (10x10 mm), 0.8 mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour PIC32MX675F256LT-80I/BG.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
PIC32MX675F256LT-80I/BG convient pour 7 applications: Industrial Ethernet Gateway, USB Device / Host / OTG Peripheral, Embedded Web Server / IoT Edge Node, Industrial Control with Modbus TCP, Point-of-Sale (POS) Terminal Controller, Building Automation Controller, USB-to-UART / USB-to-Ethernet Bridge.
Industrial Ethernet Gateway
The PIC32MX675F256LT-80I/BG fits industrial Ethernet gateways because its integrated 10/100 Mbit IEEE 802.3 MAC with MII/RMII eliminates the need for an external Ethernet controller IC. At 80 MHz MIPS32 M4K throughput (approximately 125 DMIPS), the core can handle Modbus TCP, EtherNet/IP, or PROFINET protocol stacks concurrently with light application logic. The 256 KB Flash accommodates the TCP/IP library plus custom gateway firmware, while 64 KB SRAM supports multiple socket buffers. The 83 GPIO provide enough headroom for digital I/O expansion modules, and the industrial -40C to +85C operating range suits factory-floor deployment in control cabinets.
Recommandé
USB Device / Host / OTG Peripheral
The PIC32MX675F256LT-80I/BG serves USB device, host, and OTG applications thanks to its integrated USB 2.0 Full-Speed transceiver and OTG controller, which removes the need for external USB PHY chips and saves both board area and BOM cost. The 80 MHz core handles USB HID, CDC, MSC, and custom class stacks alongside mainline application code, while the 8-channel DMA offloads bulk endpoint transfers to keep interrupt latency low. Battery-charge detection per USB 1.1 BC1.2 supports portable device charging. The 121-TFBGA exposes all necessary USB D+/D-, VBUS, and ID pins for full OTG role-swap functionality.
Recommandé
Embedded Web Server / IoT Edge Node
The PIC32MX675F256LT-80I/BG enables embedded web server and IoT edge node designs by combining Ethernet MAC, TCP/IP offload capability, and a fast 80 MHz core in a single 121-TFBGA package. The Microchip Harmony TCP/IP stack plus the on-chip 256 KB Flash supports HTTP server, REST API, MQTT client, and TLS 1.2 handshake acceleration. With 64 KB SRAM the device holds multiple concurrent sockets, and the 10-bit ADC reads analog sensor data while DMA moves samples without CPU intervention. Industrial temperature grade and 10/100 Ethernet make this part suitable for building automation and remote telemetry installations.
Recommandé
Industrial Control with Modbus TCP
The PIC32MX675F256LT-80I/BG is well suited for industrial control with Modbus TCP because the integrated Ethernet MAC and 80 MHz MIPS32 M4K core execute Modbus TCP server logic plus local PID control loops in deterministic time. The 16-channel 10-bit ADC at 1 Msps samples analog process variables (temperature, pressure, flow) while the 5 output-compare peripherals generate PWM outputs for valve and motor control. The 83 GPIO interface to digital I/O expansion, and the 8-channel DMA moves ADC sample buffers to memory without CPU load. The industrial -40C to +85C range tolerates factory-floor temperatures.
Recommandé
Point-of-Sale (POS) Terminal Controller
The PIC32MX675F256LT-80I/BG fits point-of-sale terminal controller roles because its USB OTG supports barcode scanners and receipt printers, while its Ethernet MAC connects to payment gateways and back-office inventory systems. The 256 KB Flash runs the POS application with secure transaction storage, and the 64 KB SRAM supports transaction buffering and display framebuffer for monochrome graphical LCDs. The 5 UARTs handle magnetic-stripe readers, the SPI bus drives NFC/RFID modules, and the I2C buses interface to secure keypads and EEPROM. The 83 GPIO accommodate expansion such as cash-drawer drivers and customer displays.
Recommandé
Building Automation Controller
The PIC32MX675F256LT-80I/BG serves building automation controllers because its 80 MHz core runs BACnet/IP or LonWorks protocols over Ethernet while simultaneously handling HVAC scheduling logic. The 10-bit ADC reads analog temperature and humidity sensors, the 5 input-capture peripherals decode pulse-output flow meters, and the 83 GPIO drive relays, contactors, and triac-fired loads. The USB OTG supports local configuration via memory stick, and the UARTs connect to legacy RS-485 sensor networks. The -40C to +85C industrial range suits mechanical-room deployment where temperatures swing seasonally.
Recommandé
USB-to-UART / USB-to-Ethernet Bridge
The PIC32MX675F256LT-80I/BG is a strong fit for USB-to-UART and USB-to-Ethernet bridge products because it integrates both USB 2.0 Full-Speed OTG and 10/100 Ethernet MAC alongside two UARTs and ample GPIO. At 80 MHz the MIPS32 M4K core runs CDC-ACM or vendor-class USB stacks and bridges them to UART or Ethernet endpoints with low latency. The 256 KB Flash supports multi-protocol firmware variants, and 64 KB SRAM buffers bulk data transfers. The 83 GPIO handle flow-control signals, status LEDs, and configuration straps; the industrial temperature range supports deployment in industrial gateways and edge appliances.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX675F256LT-80I/BG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX675F256L-80I/BG | PIC32MX675F256L-80V/BG | PIC32MX695F256L-80I/BG | PIC32MX795F512L-80I/BG | PIC32MX575F256LT-80I/BG |
|---|---|---|---|---|---|---|
| Package | 121-TFBGA (10x10 mm) | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Clock | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| Flash | 256 KB | 256 KB | 256 KB | 256 KB | 512 KB | 256 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 128 KB | 64 KB |
| Ethernet MAC | 10/100 Mbit | 10/100 Mbit | 10/100 Mbit | 10/100 Mbit | 10/100 Mbit | None (5xx family lacks MAC) |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| Operating Temperature | -40C to +85C (I-temp) | -40C to +85C (I-temp) | -40C to +105C (V-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) |
| CAN Bus | No | No | No | Yes (CAN 2.0b) | Yes (CAN 2.0b) | No |
Principaux différenciateurs
- Tape-and-reel packaging for SMT production (vs PIC32MX675F256L-80I/BG)
- Single-chip Ethernet + USB + 256 KB Flash integration (vs PIC32MX575F256LT-80I/BG)
- CAN bus upgrade path via PIC32MX695 family (vs PIC32MX695F256L-80I/BG)
Notes de conception
The 121-ball TFBGA uses 0.8 mm pitch and demands a 4-layer PCB with NSMD (non-solder-mask-defined) pads of approximately 0.4 mm diameter and microvia-in-pad for reliable BGA assembly. Per IPC-7093 design guidelines for BGA packages, place via-in-pad with proper filling and planarization to avoid solder wicking during reflow. A 6x6 or larger via-array thermal pad beneath the center balls is recommended for heat dissipation, tied to the internal ground plane. Reflow profile should follow JEDEC J-STD-020 MSL-3 handling with peak temperature not exceeding 245C for SAC305 lead-free alloy.
Decouple each VDD/VDDCore ball pair with a 100 nF 0402 ceramic placed within 3 mm of the ball, and add 4.7 uF bulk ceramic on each supply rail as recommended in the Microchip PIC32MX5/6/7 family datasheet. For the AVDD/AVSS analog supply used by the 10-bit ADC, place a 10 uH ferrite bead between digital VDD and analog AVDD, followed by 100 nF and 4.7 uF decoupling on the AVDD side. This filtering typically yields 60 dB+ attenuation of digital switching noise from corrupting ADC samples in the 16 analog channels at 1 Msps conversion rate.
The USB D+ and D- differential pair must be routed with 90 ohm differential impedance and length-matched within 150 mil per USB 2.0 Full-Speed specification. The Ethernet RMII signals to the external PHY should be length-matched within 50 mil and routed over a continuous ground reference plane. For MII mode, parallel data, clock, and control signals should be length-matched within 250 mil. Place the RMII/MII PHY within 50 mm of the MCU to avoid signal integrity issues, and provide a 49.9 ohm 1% precision resistor for the RMII reference clock if used.
Do not omit the 8 MHz external crystal or FRC configuration code in MPLAB Harmony - the internal FRC drifts up to +/-2% over temperature, which can violate USB 2.0 +/-0.25% clock accuracy and 10/100 Ethernet +/-50 ppm requirements. For USB OTG role-swap, the ID pin must have proper debouncing and the VBUS sensing circuit must include the correct resistor divider per the datasheet. Always configure unused GPIO as digital outputs driven low rather than inputs floating, to minimize current consumption in sleep modes.
Informations de conformité
RoHS-compliant per Microchip product page and PB-free 121-TFBGA package. MSL-3 moisture sensitivity level per JEDEC J-STD-020. AEC-Q100 not applicable - this is a general-purpose industrial MCU, not automotive-qualified; for AEC-Q100 PIC32 variants see PIC32MX family automotive extensions.
