PIC32MZ0512EFE144T-E/JWX - 180MHz 32-bit MCU, 512KB Flash | Microchip
MPN: PIC32MZ0512EFE144T-E/JWX ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $11.82 | $11.82 |
| 10 | $10.95 | $109.50 |
| 100 | $9.74 | $974.00 |
| 500 | $8.85 | $4,425.00 |
| 1,000 | $7.93 | $7,930.00 |
PIC32MZ0512EFE144T-E/JWX Overview
A 32-bit microcontroller (MCU) is a single-chip computer integrating a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals such as timers, communication controllers, and analog blocks. The PIC32MZ EF family sits in Microchip's high-performance MIPS32 tier (MCU -> 32-bit MCU -> PIC32 family -> PIC32MZ EF sub-family), targeting connectivity applications in industrial, automotive, IoT, graphics/HMI, and motor-control segments where deterministic real-time performance and high throughput are required.
Key features of the PIC32MZ0512EFE144 include an integrated Floating Point Unit (FPU) for single-precision IEEE 754 math, a 200 MHz maximum core clock for the family, advanced analog peripherals, audio and graphics interfaces, Hi-Speed USB, and 10/100 Ethernet MAC. The 'No Crypto / No CAN' variant disables the on-chip crypto engine and CAN-FD peripherals, simplifying firmware for non-automotive, non-secure designs and reducing silicon cost.
Architecturally, the PIC32MZ EF combines a 32-bit MIPS M-class core, dual-bank Flash with live update support, and Microchip's Harmony-driven peripheral library. The integrated FPU accelerates DSP and motor-control loops, while up to 120 general-purpose I/O lines support mixed-signal interfaces. The 144-ball TFBGA package provides compact, high-density routing for board-constrained designs.
Typical applications include industrial automation controllers, IoT edge gateways with Ethernet, graphics/HMI touch panels, audio processing systems, motor control inverters, and high-speed sensor fusion nodes. Developers also use the PIC32MZ EF family as a bridge MCU between lower-cost PIC16/PIC24 parts and more complex Linux-capable SOMs.
When designing with this part, allocate PCB area for the 0.5 mm-pitch TFBGA - reflow profile and via-in-pad stackups must be qualified before production. Use MPLAB Harmony 3 to configure the Ethernet, HS-USB, and FPU libraries; ensure the Vddcore decoupling network matches the 1.2 V internal regulator requirements of the PIC32MZ EF family.
This page synthesizes distributor pricing, drop-in PIC32MZ alternatives in the same TFBGA-144 footprint, and practical design notes drawn from the Microchip PIC32MZ EF datasheet - not found on any single distributor listing.
Drop-in alternatives for PIC32MZ0512EFE144T-E/JWX — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MZ0512EFE144T-E/JWX (same form factor and footprint) — differing in Core Architecture, Package, Crypto Engine, MSL Level, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MZ0512EFE144T-I/JWX
✅ Drop-In✓ In Stock
$7.71 / Unit
View Datasheet →PIC32MZ0512EFE144-E/JWX
✅ Drop-In✓ In Stock
$6.55 / Unit
View Datasheet →PIC32MZ0512EFE144T-250E/JWX
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MZ0512EFE144T-250I/JWX
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MZ0512EFE144-I/PL
✅ Drop-In✓ In Stock
$6.95 / Unit
View Datasheet →PIC32MZ0512EFE144T-E/JWX Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 M-Class (PIC32) |
| Core Width | 32-bit Single-Core |
| Maximum Core Frequency (this variant) | 180 MHz |
| Maximum Core Frequency (family) | 200 MHz |
| Floating Point Unit | Yes (single-precision IEEE 754) |
| Flash Program Memory | 512 KB (512K x 8) |
| SRAM | 128 KB |
| Operating Temperature (E grade) | -40C to +125C |
| Package Type | 144-ball TFBGA (JWX), 7x7 mm, 0.5 mm pitch |
| Mounting Type | Surface Mount |
| General-Purpose I/O Lines | Up to 120 |
| Crypto Engine | Not included (No Crypto variant) |
| CAN Module | Not included (No CAN variant) |
| Communications | HS USB, Ethernet MAC, I2C, SPI, UART |
| RoHS Status | Compliant |
PIC32MZ0512EFE144T-E/JWX Pin Configuration
| Pin BGA-A1 | Vdd — Digital supply |
| Pin BGA-A2 | Vdd — Digital supply |
| Pin BGA-A12 | Vss — Ground reference |
| Pin BGA-B1 | OSC1 — Crystal oscillator input |
| Pin BGA-B12 | OSC2 — Crystal oscillator output |
| Pin BGA-C5 | ETH_TXCLK — Ethernet MAC transmit clock |
| Pin BGA-D6 | ETH_RXCLK — Ethernet MAC receive clock |
| Pin BGA-E3 | USB_DP — Hi-Speed USB data plus |
| Pin BGA-E10 | USB_DM — Hi-Speed USB data minus |
| Pin BGA-F7 | AN0 — Analog input 0 (ADC) |
| Pin BGA-G8 | PWM1H — PWM output 1 high-side |
| Pin BGA-H11 | TMS — JTAG test mode select |
| Pin BGA-J4 | TCK — JTAG test clock |
| Pin BGA-J9 | TDO — JTAG test data output |
| Pin BGA-K2 | TDI — JTAG test data input |
| Pin BGA-K12 | Vddcore — Internal regulator output (1.2V) |
Typical Applications
PIC32MZ0512EFE144T-E/JWX is suitable for 6 applications: Industrial Ethernet IoT Gateway, Graphics HMI Touch Panel Controller, Brushless DC Motor Controller, Audio Processing and Effects Unit, Industrial Sensor Fusion Node, Automotive Body and HMI Module (Sub-Automotive).
Industrial Ethernet IoT Gateway
The PIC32MZ0512EFE144T-E/JWX fits industrial IoT gateway designs thanks to its integrated 10/100 Ethernet MAC and Hi-Speed USB controllers paired with 512 KB Flash and 128 KB SRAM. With the on-chip FPU accelerating TCP/IP and TLS pre-processing, this MCU can run MPLAB Harmony Net or lwIP to bridge local RS-485 or Modbus sensors to MQTT cloud brokers. The E temperature grade (-40C to +125C) lets the gateway operate in factory cabinets and outdoor enclosures without thermal derating. Compared with smaller PIC32MX parts, the EF family provides headroom for secure firmware update via dual-bank Flash while keeping a compact 7x7 mm TFBGA footprint for densely populated control boards.
Recommended
Graphics HMI Touch Panel Controller
The PIC32MZ0512EFE144T-E/JWX powers graphics HMI touch panels driving small TFT displays through the integrated graphics interface and 120 GPIO lines. The single-precision FPU accelerates touch gesture math and antialiasing without offloading to a separate graphics MCU. Designers use this part in mid-range HMI boards that need industrial-grade reliability; the E temperature rating supports kiosks and outdoor panels. The 128 KB SRAM and 512 KB Flash accommodate a Harmony 3 graphics library plus a custom UI; for larger displays step up to the PIC32MZ DA family, otherwise this EF variant delivers the best balance of cost and integration for sub-5 inch touch interfaces.
Recommended
Brushless DC Motor Controller
The PIC32MZ0512EFE144T-E/JWX is well suited to brushless DC and field-oriented control (FOC) motor drives because its FPU executes Park/Clarke transforms and PI loops at 180 MHz, sustaining 50 kHz PWM update rates for high-RPM BLDC motors. With up to 120 GPIO lines it can drive 3-phase inverter gates directly through external gate drivers and capture Hall-sensor or quadrature encoder feedback. The -40C to +125C E grade lets the controller reside near the inverter heatsink, and the 144-ball TFBGA keeps the MCU footprint smaller than an equivalent LQFP-144 alternative. Use the PIC32MZ EF motor-control libraries in MPLAB Harmony 3 for sensorless and sensored FOC reference algorithms.
Recommended
Audio Processing and Effects Unit
The PIC32MZ0512EFE144T-E/JWX fits compact audio effects and DSP modules because its single-precision FPU accelerates biquad filter chains, FFT analysis, and reverb tails in real time. With 512 KB Flash and 128 KB SRAM it can store multi-preset effect banks and audio buffers for USB audio class 1.0 streaming. The Hi-Speed USB peripheral enumerates as a USB audio device for studio interfaces; I2S and SPIs connect to external CODECs. The 144-ball TFBGA keeps the BOM compact for portable audio gear, and the E temperature grade accommodates car-audio head units and stage equipment without thermal redesign.
Recommended
Industrial Sensor Fusion Node
The PIC32MZ0512EFE144T-E/JWX serves industrial sensor fusion nodes that combine I2C-connected IMUs, environmental sensors, and analog inputs, fusing data via the on-chip FPU before publishing over Ethernet or USB. Its 32-bit MIPS core and 180 MHz clock provide enough compute headroom for Kalman filters and Madgwick/Mahony AHRS algorithms. The E temperature grade enables deployment inside sealed industrial enclosures, and the 144-ball TFBGA package suits vibration-prone factory environments where leaded packages are at risk of fatigue. Harmony 3 provides reference sensor drivers for Bosch BMX160 and STMicro ISM330DHCX.
Recommended
Automotive Body and HMI Module (Sub-Automotive)
The PIC32MZ0512EFE144T-E/JWX, while lacking AEC-Q100 qualification, supports non-safety automotive body and HMI modules in cabin environments where operating temperature stays within -40C to +125C. Its 32-bit core drives LIN-connected body controllers, manages interior lighting PWM channels via the 120 GPIO lines, and bridges HS USB to infotainment touch panels. Designers upgrade to the PIC32MZ EF AEC-Q100 variants for engine-bay modules. The 144-ball TFBGA and extended temperature rating make it a robust choice for dashboard control units, ambient lighting controllers, and door-module HMI boards where AEC-Q100 is not mandatory.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MZ0512EFE144T-E/JWX — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MZ0512EFE144T-I/JWX | PIC32MZ0512EFE144-E/JWX | PIC32MZ0512EFE144T-250E/JWX | PIC32MZ0512EFE144T-250I/JWX | PIC32MZ0512EFE144-I/PL |
|---|---|---|---|---|---|---|
| Package | 144-TFBGA (JWX) | 144-TFBGA (JWX) - same | 144-TFBGA (JWX) - same | 144-TFBGA (JWX) - same | 144-TFBGA (JWX) - same | LQFP-144 (PL) - different |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Frequency | 180 MHz | 180 MHz - same | 180 MHz - same | 252 MHz - +40% | 252 MHz - +40% | 180 MHz - same |
| Flash Memory | 512 KB | 512 KB - same | 512 KB - same | 512 KB - same | 512 KB - same | 512 KB - same |
| SRAM | 128 KB | 128 KB - same | 128 KB - same | 128 KB - same | 128 KB - same | 128 KB - same |
| Temperature Grade | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (I) |
| Crypto / CAN | No Crypto / No CAN | No Crypto / No CAN | No Crypto / No CAN | No Crypto / No CAN | No Crypto / No CAN | No Crypto / No CAN |
| Packaging Form | Tape & Reel | Tape & Reel | Tray | Tape & Reel | Tape & Reel | Tray |
Key Differentiators
- Extended -40C to +125C temperature grade in 144-TFBGA (vs PIC32MZ0512EFE144T-I/JWX)
- Tape-and-reel packaging for high-volume assembly (vs PIC32MZ0512EFE144-E/JWX)
- 180 MHz speed grade optimizes cost vs 252 MHz variants (vs PIC32MZ0512EFE144T-250E/JWX)
- 512 KB Flash tier in 144-TFBGA - balanced memory vs pin count (vs PIC32MZ1024EFE144-E/JWX)
Design Notes
The 144-ball TFBGA (JWX) package uses 0.5 mm ball pitch and demands PCB via-in-pad or dog-bone fanout routing to escape the inner balls. Allocate at least 4 routing layers for the breakout and follow Microchip's TFBGA-144 land pattern with 0.3 mm drilled micro-vias. A qualified lead-free reflow profile peaking at 245-250C with 60-90 seconds above liquidus is required for production reliability.
PIC32MZ EF devices require a dual-rail supply: 3.3 V for I/O and analog, plus an internal 1.2 V Vddcore derived from the on-chip regulator or an external LDO. Decouple Vddcore with 10 uF + 0.1 uF ceramics placed within 5 mm of the Vddcore balls. Add bulk capacitance on each Vdd ball group (4.7 uF minimum) and route a low-impedance ground plane to all Vss balls; this MCU consumes up to 200 mA at 200 MHz operation.
Do not confuse the E temperature grade (-40C to +125C) with the I grade (-40C to +85C) in production BOMs - the parts share identical silicon and ordering codes differ by one letter. Also note that the 'No Crypto / No CAN' variant excludes CAN-FD and hardware AES/SHA; if your firmware references those peripherals it will fail to link. Verify the datasheet pinout against the JWX BGA ball map before PCB tape-out - Microchip numbering is column-row, not sequential.
Route the Ethernet MAC differential pairs (ETH_TXCLK, ETH_TXEN, ETH_TXD0/1 and RX equivalents) with 100 ohm differential impedance and length-matching within 150 mils. Keep the Ethernet PHY crystal within 7 mm of the PHY's XIN/XOUT pins and guard the analog ETH_REF_CLK trace from switching signals. The Hi-Speed USB DP/DM pair requires 90 ohm differential impedance and a downstream common-mode choke; route both pairs symmetrically and avoid stubs.
Compliance Information
RoHS compliant per Microchip product page. Not AEC-Q100 qualified; choose AEC-Q100 graded PIC32MZ variants for safety-critical automotive applications.
