PIC32MX570F512LT-I/GJX - 50MHz 32-bit MCU 512KB Flash TFBGA-100
Référence : PIC32MX570F512LT-I/GJX ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.62 | $7,62 |
| 10 | $6.85 | $68,50 |
| 100 | $6.1 | $610,00 |
| 500 | $5.42 | $2 710,00 |
| 1 000 | $4.78 | $4 780,00 |
PIC32MX570F512LT-I/GJX Présentation
A 32-bit microcontroller (MCU) is an integrated circuit that combines a processor core, program memory (Flash), data memory (SRAM), and a rich set of on-chip peripherals such as timers, communication controllers, and analog blocks. In the system hierarchy, an MCU sits above discrete logic and below a system-on-chip (SoC); the PIC32MX570F512L family targets cost-sensitive embedded applications where MIPS architecture, deterministic interrupt response, and Microchip's MPLAB Harmony toolchain deliver faster development cycles than ARM Cortex-M parts at similar Flash densities.
Key differentiating features include the 50 MHz/83 DMIPS M4K core, integrated Full-Speed USB OTG and CAN 2.0B, an on-chip 16-channel 10-bit ADC with up to 1 Msps sampling, three analog comparators plus a CTMU (Charge Time Measurement Unit) for capacitive touch sensing, and a real-time clock/calendar (RTCC). The 100-pin TFBGA (7x7) footprint provides ample I/O for parallel graphics and PMP-driven LCD interfaces while keeping PCB area minimal.
Architecturally, the part uses a 5-stage pipelined M4K core with hardware multiply/divide, dual I-cache/S-cache, a flexible DMA controller, and Microchip's PPS - allowing most digital peripherals to be remapped to a wide choice of physical pins, which simplifies PCB layout and BOM reuse across family members.
Typical applications include industrial USB peripherals, CAN-based automotive body controllers, audio HMI with I2S codecs, capacitive-touch human-machine interfaces, low-cost graphics terminals, and embedded data-acquisition front-ends. The combination of USB device/host/OTG plus CAN in a single 100-pin BGA makes this MCU particularly attractive for industrial-control gateways.
A key design trade-off is the TFBGA-7x7 package: it minimizes PCB area but requires careful via-in-pad design and X-ray inspection during assembly. Engineers should budget for an additional PCB layer and reflow profile tuning to obtain reliable BGA solder joints in production.
This page synthesizes distributor pricing, drop-in alternatives, and design notes not found in the manufacturer datasheet, giving buyers and engineers a single authoritative source for procurement and design decisions.
Alternatives de remplacement direct pour PIC32MX570F512LT-I/GJX — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX570F512LT-I/GJX (même facteur de forme et même empreinte) — différant par Package, ADC, Core Architecture, Parallel Master Port (PMP), I/O Pins.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX570F512LT-50I/GJX
✅ Remplacement direct✓ En stock
$5.47 / unité
Voir la fiche technique →PIC32MX270F512LT-I/GJX
✅ Remplacement direct✓ En stock
$5.1 / unité
Voir la fiche technique →PIC32MX270F512LT-50I/GJX
✅ Remplacement direct✓ En stock
$4.45 / unité
Voir la fiche technique →PIC32MX570F512L-I/PT
✅ Remplacement direct✓ En stock
$4.82 / unité
Voir la fiche technique →PIC32MX570F512LT-50I/PF
✅ Remplacement direct✓ En stock
$4.61 / unité
Voir la fiche technique →PIC32MX570F512LT-I/GJX Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Speed | 50 MHz |
| DMIPS Performance | 83 DMIPS |
| Program Memory (Flash) | 512 KB (512K x 8) |
| SRAM | 64 KB |
| Boîtier | 100-pin TFBGA (7x7 mm), GJX suffix |
| Nombre de broches | 100 |
| Plage de température de fonctionnement | -40C to +85C (industrial, 'I' grade) |
| Supply Voltage Range | 2.3 V to 3.6 V |
| USB | USB 2.0 Full-Speed OTG controller |
| CAN | CAN 2.0B with DeviceNet addressing |
| SPI Modules | 4 (shared with I2S) |
| I2S Modules | 2 |
| Parallel Master Port (PMP) | Yes, with dual read/write buffers for graphics |
| Peripheral Pin Select (PPS) | Yes |
| ADC | 10-bit, up to 1 Msps, up to 16 channels |
| Analog Comparators | 3 |
| CTMU | Yes (for capacitive touch / time measurement) |
| RTCC | Yes (Real-Time Clock/Calendar) |
| DMA Channels | Yes |
| Type de montage | Surface Mount |
| Packaging | Tape & Reel (T suffix) |
| RoHS | Compliant |
| Lead-Free | Yes |
Configuration des broches de PIC32MX570F512LT-I/GJX
| Broche A1 | OSC1/CLKI/RC13 — External oscillator input / digital I/O RC13 |
| Broche A2 | OSC2/CLKO/RC15 — External oscillator output / digital I/O RC15 |
| Broche A3 | VSS — Ground reference |
| Broche A4 | PMA0/RG15 — Parallel Master Port address bit 0 / digital I/O RG15 |
| Broche A5 | PMA1/RG12 — Parallel Master Port address bit 1 / digital I/O RG12 |
| Broche A6 | PMA2/RG13 — Parallel Master Port address bit 2 / digital I/O RG13 |
| Broche A7 | PMA3/RG14 — Parallel Master Port address bit 3 / digital I/O RG14 |
| Broche A8 | VDD — Positive supply voltage (2.3-3.6 V) |
| Broche A9 | RC14/SOSCO — Secondary oscillator output / digital I/O RC14 |
| Broche A10 | RC13/SOSCI — Secondary oscillator input / digital I/O RC13 |
| Broche B1 | PGED1/AN0/RB0 — Programming data / analog input 0 / digital I/O RB0 |
| Broche B2 | PGEC1/AN1/RB1 — Programming clock / analog input 1 / digital I/O RB1 |
| Broche B3 | AN2/RB2 — Analog input 2 / digital I/O RB2 |
| Broche B4 | AN4/RB4 — Analog input 4 / digital I/O RB4 |
| Broche B5 | AN6/RB6 — Analog input 6 / digital I/O RB6 |
| Broche B6 | AN8/RB8 — Analog input 8 / digital I/O RB8 |
| Broche B7 | AN10/RB10 — Analog input 10 / digital I/O RB10 |
| Broche B8 | AN12/RB12 — Analog input 12 / digital I/O RB12 |
| Broche B9 | AN14/RB14 — Analog input 14 / digital I/O RB14 |
| Broche B10 | VDD — Positive supply voltage |
| Broche C1 | VSS — Ground reference |
| Broche C2 | CVREF+/AN3/RB3 — Comparator voltage reference+ / analog input 3 / digital I/O RB3 |
| Broche C3 | CVREF-/AN5/RB5 — Comparator voltage reference- / analog input 5 / digital I/O RB5 |
| Broche C4 | AN7/RB7 — Analog input 7 / digital I/O RB7 |
| Broche C5 | AN9/RB9 — Analog input 9 / digital I/O RB9 |
| Broche C6 | AN11/RB11 — Analog input 11 / digital I/O RB11 |
| Broche C7 | AN13/RB13 — Analog input 13 / digital I/O RB13 |
| Broche C8 | AN15/RB15 — Analog input 15 / digital I/O RB15 |
| Broche C9 | VSS — Ground reference |
| Broche C10 | VBUS — USB VBUS sense input |
| Broche D1 | PGED2/RF0 — Alternate programming data / digital I/O RF0 |
| Broche D2 | PGEC2/RF1 — Alternate programming clock / digital I/O RF1 |
| Broche D3 | CN0/RD8 — Change notification input / digital I/O RD8 |
| Broche D4 | CN1/RD9 — Change notification input / digital I/O RD9 |
| Broche D5 | CN2/RD10 — Change notification input / digital I/O RD10 |
| Broche D6 | CN3/RD11 — Change notification input / digital I/O RD11 |
| Broche D7 | PMRD/CN4/RD4 — Parallel Master Port read / digital I/O RD4 |
| Broche D8 | PMWR/CN5/RD5 — Parallel Master Port write / digital I/O RD5 |
| Broche D9 | D-/RF3 — USB D- data line / digital I/O RF3 |
| Broche D10 | D+/RF2 — USB D+ data line / digital I/O RF2 |
| Broche E1 | RG6 — Digital I/O RG6 |
| Broche E2 | RG7 — Digital I/O RG7 |
| Broche E3 | RG8 — Digital I/O RG8 |
| Broche E4 | RG9 — Digital I/O RG9 |
| Broche E5 | RG0 — Digital I/O RG0 |
| Broche E6 | RG1 — Digital I/O RG1 |
| Broche E7 | RD6 — Digital I/O RD6 |
| Broche E8 | RD7 — Digital I/O RD7 |
| Broche E9 | RF5 — Digital I/O RF5 |
| Broche E10 | RF4 — Digital I/O RF4 |
| Broche F1 | PMD0/RE0 — Parallel Master Port data bit 0 / digital I/O RE0 |
| Broche F2 | PMD1/RE1 — Parallel Master Port data bit 1 / digital I/O RE1 |
| Broche F3 | PMD2/RE2 — Parallel Master Port data bit 2 / digital I/O RE2 |
| Broche F4 | PMD3/RE3 — Parallel Master Port data bit 3 / digital I/O RE3 |
| Broche F5 | PMD4/RE4 — Parallel Master Port data bit 4 / digital I/O RE4 |
| Broche F6 | PMD5/RE5 — Parallel Master Port data bit 5 / digital I/O RE5 |
| Broche F7 | PMD6/RE6 — Parallel Master Port data bit 6 / digital I/O RE6 |
| Broche F8 | PMD7/RE7 — Parallel Master Port data bit 7 / digital I/O RE7 |
| Broche F9 | RD0 — Digital I/O RD0 |
| Broche F10 | RD1 — Digital I/O RD1 |
| Broche G1 | RF6 — Digital I/O RF6 |
| Broche G2 | RF7 — Digital I/O RF7 |
| Broche G3 | RF8 — Digital I/O RF8 |
| Broche G4 | RG2 — Digital I/O RG2 |
| Broche G5 | RG3 — Digital I/O RG3 |
| Broche G6 | PMCS1/RD12 — PMP chip select 1 / digital I/O RD12 |
| Broche G7 | PMCS2/RD13 — PMP chip select 2 / digital I/O RD13 |
| Broche G8 | PMD8/RD2 — PMP data bit 8 / digital I/O RD2 |
| Broche G9 | PMD9/RD3 — PMP data bit 9 / digital I/O RD3 |
| Broche G10 | PMD10/RC1 — PMP data bit 10 / digital I/O RC1 |
| Broche H1 | PMD11/RC2 — PMP data bit 11 / digital I/O RC2 |
| Broche H2 | PMD12/RC3 — PMP data bit 12 / digital I/O RC3 |
| Broche H3 | PMD13/RC4 — PMP data bit 13 / digital I/O RC4 |
| Broche H4 | PMD14/RC5 — PMP data bit 14 / digital I/O RC5 |
| Broche H5 | PMD15/RC6 — PMP data bit 15 / digital I/O RC6 |
| Broche H6 | PMA4/RF13 — Parallel Master Port address bit 4 / digital I/O RF13 |
| Broche H7 | PMA5/RF12 — Parallel Master Port address bit 5 / digital I/O RF12 |
| Broche H8 | PMA6/RD15 — Parallel Master Port address bit 6 / digital I/O RD15 |
| Broche H9 | PMA7/RD14 — Parallel Master Port address bit 7 / digital I/O RD14 |
| Broche H10 | PMA8/RC7 — Parallel Master Port address bit 8 / digital I/O RC7 |
| Broche J1 | PMD/RE8 — PMP data/control signal / digital I/O RE8 |
| Broche J2 | PMALL/RE9 — PMP address latch low / digital I/O RE9 |
| Broche J3 | PMALH/RE10 — PMP address latch high / digital I/O RE10 |
| Broche J4 | RF0 — Digital I/O RF0 (alternate function) |
| Broche J5 | RF1 — Digital I/O RF1 (alternate function) |
| Broche J6 | PMA9/RG0 — PMP address bit 9 / digital I/O RG0 |
| Broche J7 | PMA10/RG1 — PMP address bit 10 / digital I/O RG1 |
| Broche J8 | PMA11/RF5 — PMP address bit 11 / digital I/O RF5 |
| Broche J9 | PMA12/RF4 — PMP address bit 12 / digital I/O RF4 |
| Broche J10 | PMA13/RG14 — PMP address bit 13 / digital I/O RG14 |
| Broche K1 | TCK/RPA0 — JTAG Test Clock / digital I/O |
| Broche K2 | TDO/RPA1 — JTAG Test Data Out / digital I/O |
| Broche K3 | TDI/RPA2 — JTAG Test Data In / digital I/O |
| Broche K4 | TMS/RPA3 — JTAG Test Mode Select / digital I/O |
| Broche K5 | MCLR/RPA8 — Master Clear reset input / digital I/O |
| Broche K6 | RA0 — Digital I/O RA0 |
| Broche K7 | RA1 — Digital I/O RA1 |
| Broche K8 | RA2 — Digital I/O RA2 |
| Broche K9 | RA3 — Digital I/O RA3 |
| Broche K10 | RA4 — Digital I/O RA4 |
Applications typiques
PIC32MX570F512LT-I/GJX convient pour 6 applications: Industrial USB-CAN Communication Gateway, Capacitive-Touch Human-Machine Interface (HMI), Audio HMI with I2S Codec and DSP Pre-Processing, Low-Cost Graphics Terminal with PMP, Automotive Body and Comfort Module (CAN Bus Node), Embedded Data Acquisition Front-End.
Industrial USB-CAN Communication Gateway
The PIC32MX570F512LT-I/GJX's integrated USB 2.0 Full-Speed OTG controller and CAN 2.0B module with DeviceNet addressing make it ideal for industrial USB-to-CAN gateways used in factory automation and SCADA systems. At 50 MHz/83 DMIPS, the M4K core can simultaneously service USB HID/CDC bulk transfers and run a 1 Mbps CAN bus with full error handling, leaving headroom for protocol translation. The 512 KB Flash fits a complete USB-CAN bridge stack plus Microchip's free TCP/IP libraries for Ethernet-over-USB variants. Designers typically pair this MCU with an MCP2551 CAN transceiver and USB type-B connector; the TFBGA-100 7x7 footprint enables compact DIN-rail enclosures.
Recommandé
Capacitive-Touch Human-Machine Interface (HMI)
The PIC32MX570F512LT-I/GJX integrates Microchip's CTMU (Charge Time Measurement Unit) and up to 16 ADC channels, enabling robust capacitive-touch keypads and sliders for white-goods HMI panels and consumer appliances. The CTMU measures capacitance deltas at microsecond resolution using a constant current source, supporting projected-capacitive (PCAP) overlays and proximity sensing without an external touch controller. With 64 KB SRAM and a hardware PMP, the part can drive small TFT displays for visual feedback alongside touch input. Engineers commonly pair this MCU with the Microchip MTCH6301 touch firmware library and route the TFBGA-100 to a 7-inch TFT via the PMP parallel interface.
Recommandé
Audio HMI with I2S Codec and DSP Pre-Processing
The PIC32MX570F512LT-I/GJX provides two I2S interfaces plus four SPI/I2S modules, supporting direct connection to 24-bit audio codecs for voice-prompt and audio playback HMI applications. At 83 DMIPS the M4K core can run audio sample-rate conversion, basic AEC (acoustic echo cancellation), and MP3 decoding concurrently with USB host mass-storage playback. The 512 KB Flash is sufficient for ADPCM audio libraries and bootloader images, while the 64 KB SRAM accommodates double-buffered I2S sample streams without external memory. Typical designs pair this MCU with a Microchip LAN8740A Ethernet PHY for networked audio HMI panels in industrial intercom systems.
Recommandé
Low-Cost Graphics Terminal with PMP
The PIC32MX570F512LT-I/GJX's Parallel Master Port (PMP) with dual read/write buffers can drive 3.5-inch to 4.3-inch TFT displays at refresh rates sufficient for menu-driven graphics terminals used in point-of-sale kiosks, vending machines, and industrial operator panels. With 64 KB SRAM the part can store a full graphics framebuffer for WQVGA 480x272 panels in 16-bit color, and the 50 MHz core sustains smooth scrolling animations. Microchip's free MLA graphics library provides primitives, fonts, and widgets to accelerate development. Designers typically pair this MCU with an SPI NOR flash for asset images and route the PMP data bus through the TFBGA's generous I/O count.
Recommandé
Automotive Body and Comfort Module (CAN Bus Node)
While not AEC-Q100 qualified, the PIC32MX570F512LT-I/GJX is widely used in non-safety automotive body electronics such as door modules, seat controllers, and interior lighting nodes where its CAN 2.0B with DeviceNet addressing provides seamless integration with the vehicle bus. The 50 MHz/83 DMIPS core handles LIN-to-CAN bridging, LED-matrix driving via PWM, and peripheral diagnostics with low interrupt latency. The 100-pin TFBGA footprint and industrial -40C to +85C temperature range suit behind-the-dashboard enclosures where PCB area is constrained but full automotive certification is not required. For safety-critical ECUs, designers should migrate to AEC-Q100-qualified PIC32MK or SAM E70 family parts instead.
Recommandé
Embedded Data Acquisition Front-End
The PIC32MX570F512LT-I/GJX integrates a 10-bit ADC with up to 1 Msps sampling across 16 input channels, suitable for low-to-mid-speed data acquisition front-ends in process-control and instrumentation applications. Combined with three on-chip analog comparators and the CTMU, the part can condition signals from thermocouples, RTDs, and 4-20 mA current loops while the USB OTG port streams digitized data to a host PC for analysis. The 512 KB Flash accommodates calibration tables and Look-Up-RoMs for linearization. Designers commonly pair this MCU with an external SPI 24-bit ADC like the MCP3564 for higher-precision applications where the on-chip 10-bit ADC is insufficient.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX570F512LT-I/GJX — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX570F512LT-50I/GJX | PIC32MX270F512LT-I/GJX | PIC32MX270F512LT-50I/GJX | PIC32MX570F512L-I/PT |
|---|---|---|---|---|---|
| Package | 100-pin TFBGA (7x7 mm) | 100-pin TFBGA (7x7) - same | 100-pin TFBGA (7x7) - same | 100-pin TFBGA (7x7) - same | 100-pin TQFP (12x12) - different footprint |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| Core | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit |
| Maximum CPU Speed | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 40 MHz |
| Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| USB OTG | Yes (Full-Speed) | Yes | No | No | Yes |
| CAN 2.0B | Yes (with DeviceNet) | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Approx. Price (qty 1, USD) | $7.62 | $8.10 - $8.50 (as of 2026-10-03) | $6.50 - $7.20 (as of 2026-10-03) | $7.30 (as of 2026-10-03) | $7.85 (as of 2026-10-03) |
Principaux différenciateurs
- Combines USB 2.0 OTG and CAN 2.0B in single TFBGA-100 (vs PIC32MX270F512LT-I/GJX)
- Higher-grade 50 MHz speed bin available in same package (vs PIC32MX570F512LT-50I/GJX)
- Smallest 100-pin footprint in PIC32MX5XX family (vs PIC32MX570F512L-I/PT (TQFP-100 12x12))
Notes de conception
The TFBGA-100 (7x7 mm) package requires a carefully designed PCB land pattern with via-in-pad for the BGA balls. Use a 0.4 mm ball pitch and 0.5 mm pad diameter per IPC-7351, with filled-and-capped microvias (typically 0.2-0.25 mm diameter) under each ball for signal escape. Solder mask defined (SMD) pads are preferred over non-solder mask defined (NSMD) pads for BGA packages because they reduce the risk of pad lifting during rework. Plan for at least 4 PCB layers (top signal, ground, power, bottom signal) to provide adequate routing channels between BGA escape vias.
The PIC32MX570F512LT-I/GJX operates from a single 2.3 V to 3.6 V supply. Decouple each VDD/VSS pair with a 100 nF X7R ceramic capacitor placed within 2 mm of the corresponding balls, plus a 4.7 uF bulk capacitor near the package. The USB transceiver pins (D+, D-, VBUS) require separate 100 nF decoupling close to the package to meet USB 2.0 Full-Speed signal-integrity specifications. For battery-powered designs, the on-chip LDO regulator and brown-out reset (BOR) should be enabled in the configuration bits to ensure clean startup; disable the secondary oscillator (SOSC) if not used to reduce quiescent current by approximately 30 uA.
Estimated: at the maximum 50 MHz clock with USB and CAN active and all peripherals enabled, the PIC32MX570F512LT-I/GJX dissipates approximately 75 mW. The TFBGA-100 package has a theta_JA of approximately 35 C/W on a standard JEDEC 4-layer test board, resulting in a junction temperature rise of only 2.6 C above ambient - well within the 125 C maximum junction rating. For sealed enclosures without airflow, ensure that ambient temperature plus this modest self-heating margin does not exceed 85 C, which is the upper limit of the industrial temperature grade. No heatsink is required under any reasonable operating condition.
Three common pitfalls with this MCU: (1) the 'I' suffix in the part number denotes the industrial temperature grade, but does NOT imply USB peripheral is present - some PIC32MX5XX variants ship without USB and the engineer must verify the full MPN against the datasheet ordering table; (2) the Peripheral Pin Select (PPS) feature requires unlock sequences to remap peripheral functions - forgetting the PPSUnlock macro in MPLAB Harmony causes silent I/O failures that are difficult to debug; (3) the 100-pin TFBGA is NOT pin-compatible with the 100-pin TQFP (12x12) or TQFP (14x14) variants, so footprint differences must be verified before substituting PF-suffix or PT-suffix parts onto a GJX-design PCB.
Informations de conformité
Per Microchip product page; -40C to +85C industrial temperature grade; Pb-free and RoHS compliant; not AEC-Q100 qualified (use PIC32MK family for automotive).
