PIC32MZ1024EFG100T-I/GJX - 200MHz 1MB Flash MCU 100-TFBGA | Microchip
Référence : PIC32MZ1024EFG100T-I/GJX ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $12.45 | $12,45 |
| 10 | $11.2 | $112,00 |
| 100 | $9.95 | $995,00 |
| 500 | $9.1 | $4 550,00 |
| 1 000 | $8.45 | $8 450,00 |
PIC32MZ1024EFG100T-I/GJX Présentation
A 32-bit microcontroller (MCU) is a single-chip processor with integrated Flash program memory, SRAM data memory, and peripherals such as timers, ADC, communication controllers and GPIOs. PIC32MZ EF devices target high-performance connectivity applications - sitting in the hierarchy: microcontroller -> embedded MCU -> 32-bit MIPS MCU -> PIC32MZ EF family -> graphics/HMI, industrial, automotive and IoT segments. The PIC32MZ1024EFG100T-I/GJX carries 1 MB Flash (1024 KB, no crypto), 512 KB SRAM, and a peripheral set including Hi-Speed USB 2.0, 10/100 Ethernet MAC, SQI for external serial Flash, and a graphics-friendly 32-bit external bus.
Key features include a 200 MHz MIPS32 M-Class core with 252 MHz maximum rated clock (per family datasheet), IEEE 754 single-precision FPU, 12-bit 18 MSPS ADC, and a Cryptographic Engine in the EF family (this part is the non-crypto variant). The 100-TFBGA (GJX) package is the compact 7x7 mm option for space-constrained designs, while a 100-TQFP (PF) variant exists for hand-solder prototypes.
Typical applications include industrial Human-Machine Interface (HMI) panels, IoT gateways with Ethernet and USB-HS, automotive infotainment prototypes, and motor-control boards where the 200 MHz MIPS core and FPU accelerate FFT and DSP-style filtering. The integrated Ethernet MAC and Hi-Speed USB controller reduce BOM by eliminating external PHY companion chips on simpler designs.
Design tip: at 200 MHz with 1.2V core, decoupling requires a 1uF + 100 nF pair within 5 mm of each VDD/VSS pair, and trace length matching for SDRAM if used. The non-crypto variant is intended for designs that do not need the on-chip Crypto Engine.
This page synthesizes distributor pricing, same-brand drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour PIC32MZ1024EFG100T-I/GJX — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1024EFG100T-I/GJX (même facteur de forme et même empreinte) — différant par Package, FPU, Operating Temperature, Core Architecture, Ethernet.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1024EFG100T-E/GJX
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1024EFH100T-I/GJX
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1024EFK100T-I/GJX
✅ Remplacement direct✓ En stock
$9.48 / unité
Voir la fiche technique →PIC32MZ1024EFF100T-I/GJX
✅ Remplacement direct✓ En stock
$9.5 / unité
Voir la fiche technique →PIC32MZ1024EFE100T-E/GJX
✅ Remplacement direct✓ En stock
$7.95 / unité
Voir la fiche technique →PIC32MZ1024EFG100T-I/GJX Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M-Class (microAptiv) |
| Core Frequency | 200 MHz (max 252 MHz per family) |
| Program Flash | 1 MB (1024 KB) |
| SRAM | 512 KB |
| FPU | Yes (IEEE 754 single-precision) |
| Boîtier | 100-TFBGA (GJX) 7x7 mm |
| Nombre de broches | 100 |
| Type de montage | Surface Mount |
| Operating Voltage | 2.2 V to 3.6 V |
| Température de fonctionnement | -40C to +85C (Industrial) |
| USB | USB 2.0 Hi-Speed |
| Ethernet | 10/100 Mbps MAC (RMII/MII) |
| SQI | Serial Quad Interface (for external Flash) |
| ADC | 12-bit, up to 18 MSPS |
| Cryptography | No (EF variant, non-crypto) |
| Niveau MSL | 3 |
| Statut RoHS | Compliant |
Guide de configuration des broches du PIC32MZ1024EFG100T-I/GJX 100-tfbga (gjx) 7x7 mm
Configuration des broches du PIC32MZ1024EFG100T-I/GJX (boîtier 100-tfbga (gjx) 7x7 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour PIC32MZ1024EFG100T-I/GJX.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
PIC32MZ1024EFG100T-I/GJX convient pour 6 applications: Industrial HMI Touch Panels, IoT Gateway with Ethernet and USB-HS, Motor Control and Field-Oriented Control (FOC), Automotive Infotainment Prototypes, USB Audio and Hi-Speed Peripherals, Connected Medical Monitoring Devices.
Industrial HMI Touch Panels
The PIC32MZ1024EFG100T-I/GJX fits industrial HMI panels where a 200 MHz MIPS core drives TFT LCD controllers, touch sensing, and real-time UI rendering. Its 1 MB Flash accommodates full graphics libraries plus multi-language assets, while 512 KB SRAM holds frame buffers and active UI state. The integrated Ethernet MAC enables remote monitoring and OTA firmware updates without external PHY complexity. Designers benefit from the 32-bit external bus for fast memory expansion if larger displays are needed.
Recommandé
IoT Gateway with Ethernet and USB-HS
The PIC32MZ1024EFG100T-I/GJX is well-matched for IoT edge gateways. The integrated 10/100 Ethernet MAC and USB-HS controller reduce BOM cost by eliminating external PHY/bridge chips. The 200 MHz core handles TLS handshake acceleration, MQTT parsing, and edge analytics simultaneously. 1 MB Flash stores full TLS stack plus application code with safe A/B update partitions. SQI enables fast external serial Flash for data logging or OTA staging.
Recommandé
Motor Control and Field-Oriented Control (FOC)
The PIC32MZ1024EFG100T-I/GJX supports FOC motor control algorithms using its DSP-enhanced MIPS M-Class core and IEEE 754 single-precision FPU. The 200 MHz clock executes single-cycle MAC operations for fast Park/Clarke transforms and PI loops. 18 MSPS 12-bit ADC samples phase currents accurately for sensorless FOC. PWM modules generate center-aligned complementary outputs for 3-phase inverter bridges in BLDC and PMSM drives.
Recommandé
Automotive Infotainment Prototypes
For automotive infotainment prototype work, the PIC32MZ1024EFG100T-I/GJX offers the 200 MHz performance to drive 800x480 WVGA displays, audio decoders, and CAN/LIN bridges. Designers can prototype UI logic on the industrial-grade part, then migrate to PIC32MZ1024EFG100T-E/GJX (AEC-Q100 friendly -40C to +125C) without PCB changes since both share the 100-TFBGA (GJX) footprint.
Recommandé
USB Audio and Hi-Speed Peripherals
The PIC32MZ1024EFG100T-I/GJX integrates a Hi-Speed USB 2.0 controller supporting USB Audio Class 2.0, USB HID, CDC, and vendor classes. The 200 MHz core handles isochronous audio streaming at 24-bit 96 kHz with low CPU overhead. 512 KB SRAM accommodates audio sample buffers. Designers building USB DACs, audio interfaces, or measurement peripherals benefit from the on-chip USB PHY reducing external component count.
Recommandé
Connected Medical Monitoring Devices
The PIC32MZ1024EFG100T-I/GJX fits connected medical monitoring such as patient monitors, infusion pumps, and portable diagnostic devices. The 200 MHz MIPS core executes signal processing for biosensor front-ends (ECG, SpO2, temperature). 1 MB Flash holds the application plus secure firmware update logic. For HIPAA-grade security requirements, PIC32MZ1024EFH100T-I/GJX offers the same footprint with on-chip Cryptographic Engine for TLS and secure boot.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1024EFG100T-I/GJX — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1024EFG100T-E/GJX | PIC32MZ1024EFH100T-I/GJX | PIC32MZ1024EFK100T-I/GJX | PIC32MZ1024EFF100T-I/GJX |
|---|---|---|---|---|---|
| Package | 100-TFBGA (GJX) 7x7 mm | 100-TFBGA (GJX) 7x7 mm - same | 100-TFBGA (GJX) 7x7 mm - same | 100-TFBGA (GJX) 7x7 mm - same | 100-TFBGA (GJX) 7x7 mm - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Frequency | 200 MHz (252 MHz max) | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 2 MB |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Cryptographic Engine | No (EFG non-crypto) | No | Yes (AES/SHA/RNG) | No | No |
| Operating Temperature | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +85C | -40C to +85C | -40C to +85C |
| USB / Ethernet / SQI | USB-HS / 10/100 ENET / SQI | USB-HS / 10/100 ENET / SQI | USB-HS / 10/100 ENET / SQI | USB-HS / 10/100 ENET / SQI | USB-HS / 10/100 ENET / SQI |
Principaux différenciateurs
- 1 MB Flash + 512 KB SRAM in compact 7x7 mm TFBGA-100 (vs PIC32MX795F512LT-80I/PF)
- Industrial-grade operating temperature -40C to +85C in this part (vs PIC32MX675F512LT-80I/PF)
- Non-crypto variant for cost-optimized designs (vs PIC32MZ1024EFH100T-I/GJX)
Notes de conception
The PIC32MZ1024EFG100T-I/GJX has separate analog and digital supply rails (AVDD/AVSS, VDD/VSS, plus VDDIO for I/O voltage). Decouple each VDD/AVDD pin with a 100 nF X7R ceramic placed within 5 mm, plus a bulk 4.7 uF-10 uF tantalum or polymer near the package. Core voltage (1.2V) is generated internally via on-chip LDO; do not back-drive. Add a ferrite bead between AVDD and VDD if analog reference noise is critical for ADC performance.
At 200 MHz full operation with USB-HS and Ethernet active, the PIC32MZ1024EFG100T-I/GJX draws around 100-130 mA from VDD. The 100-TFBGA (7x7 mm) has limited heat dissipation - recommended to add a thermal via array in the PCB land pattern, connecting the BGA balls to an internal ground plane for spreader heat-sinking. In enclosed designs, ensure ambient stays below 70C to keep junction below 85C at full load.
Use a 4-layer PCB stack-up with continuous ground plane under the TFBGA footprint. Trace the RMII/MII Ethernet signals as 50-ohm impedance-controlled pairs (length-matched within 50 mil). The 32-bit external bus requires matched trace lengths; SDRAM devices should be placed on the same PCB side within 25 mm. Keep high-speed USB D+/D- differential pair at 90 ohms with no stubs.
Do not confuse the GJX (TFBGA-100) and PF (TQFP-100) variants in your BOM - both are 100-pin but use different packages and PCB footprints. Also note that the EFG part number denotes non-crypto, while EFH includes the Cryptographic Engine. Programming/debugging uses the ICSP interface on PGECx/PGEDx pins - ensure these are brought to a 6-pin header or Tag-Connect footprint for in-system programming.
Informations de conformité
RoHS compliant per Microchip product page. Industrial -40C to +85C grade; AEC-Q100 not applicable for this I-grade part - choose E grade variants for automotive-qualified flows.
