PIC32MZ1024EFK100T-E/GJX - 200MHz 32-bit MCU 1MB Flash TFBGA-100 | Microchip
Référence : PIC32MZ1024EFK100T-E/GJX ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $22.5 | $22,50 |
| 10 | $20.85 | $208,50 |
| 100 | $18.9 | $1 890,00 |
| 500 | $16.95 | $8 475,00 |
| 1 000 | $14.5 | $14 500,00 |
PIC32MZ1024EFK100T-E/GJX Présentation
An MCU (microcontroller unit) is a single-chip computer that integrates a CPU core, program memory (Flash), working memory (SRAM), and a rich set of peripherals (ADCs, timers, communication controllers). Within the broader taxonomy, the PIC32MZ EF family sits at the top of Microchip's 32-bit PIC32 portfolio, between the lower-tier PIC32MX and the multimedia-focused PIC32MZ DA family. EF specifically denotes the Embedded Connectivity with Floating Point Unit variant, optimized for industrial IoT, motor control, graphics/HMI, and automotive connectivity applications.
Key features include 200 MHz core speed delivering up to 330 DMIPS, dual-panel Flash supporting live firmware updates, a 12-bit 5 MSPS ADC with up to 48 channels, eight UART, six SPI, four I2C, two CAN, USB 2.0 high-speed OTG, and Ethernet 10/100 MAC with MII/RMII. The 32-bit MIPS microAptiv core enables deterministic interrupt response and DSP-class math, while the integrated crypto accelerators and true random number generator (TRNG) make secure connected designs practical without external security ICs.
The PIC32MZ EF architecture combines a 7-stage pipeline, branch prediction, and tightly-coupled instruction/data paths to sustain high code-density throughput. The 1 MB dual-panel Flash allows concurrent read/execute during erase/program of the alternate panel, enabling fail-safe field firmware upgrades. The TFBGA-100 (7x7 mm) package exposes 78 GPIO plus the full peripheral set while keeping PCB footprint small for space-constrained designs.
Typical applications include industrial IoT gateways, automotive body and connectivity ECUs, motor control and inverter drive boards, graphics/HMI touch terminals, and USB/Ethernet-connected medical devices. The integrated peripherals eliminate many external components, reducing BOM cost and board area in connected embedded products.
When designing with the PIC32MZ1024EFK100T-E/GJX, note that the automotive -40C to +125C range requires thermal-aware PCB layout (the TFBGA has limited heat dissipation). Decouple every VDD/VSS pair with 100 nF X7R ceramic placed within 2 mm of the balls, and follow Microchip's IBIS models for SDRAM/QSPI signal integrity on high-speed buses.
This page synthesizes distributor stock data, drop-in same-package alternatives from the PIC32MZ family, and practical design notes not found on the standalone manufacturer product page.
Alternatives de remplacement direct pour PIC32MZ1024EFK100T-E/GJX — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1024EFK100T-E/GJX (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, ADC, Core Architecture, FPU.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1024EFE100T-E/GJX
✅ Remplacement direct✓ En stock
$7.95 / unité
Voir la fiche technique →PIC32MZ1024EFF100T-E/GJX
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1024EFG100T-E/GJX
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1024EFK100-E/GJX
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ0512EFK100T-E/GJX
✅ Remplacement direct✓ En stock
$9.8 / unité
Voir la fiche technique →PIC32MZ1024EFH100T-E/GJX
✅ Remplacement direct✓ En stock
$9.9 / unité
Voir la fiche technique →PIC32MZ1024EFK100T-E/GJX Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M-Class microAptiv (PIC32MZ EF) |
| Core Speed | 200 MHz |
| DMIPS | 330 DMIPS |
| Program Flash | 1 MB (1024 KB) |
| SRAM | 256 KB |
| FPU | IEEE 754-compliant single and double precision |
| Operating Voltage | 2.3 V to 3.6 V |
| Température de fonctionnement | -40C to +125C (automotive /E grade) |
| Boîtier | 100-TFBGA (7x7 mm) |
| Nombre de broches | 100 |
| GPIO | 78 |
| ADC | 12-bit, up to 5 MSPS, up to 48 channels |
| Crypto Engine | AES, DES, 3DES, SHA-1/SHA-256 with TRNG |
| USB | USB 2.0 High-Speed OTG |
| Ethernet | 10/100 MAC with MII/RMII |
| CAN | 2x CAN 2.0B |
| UART | 8x |
| SPI | 6x |
| I2C | 4x |
| AEC-Q100 | Qualified (/E temperature grade) |
| Type de montage | Surface Mount (BGA) |
| Niveau MSL | 3 (168 hours) |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MZ1024EFK100T-E/GJX
| Broche A1 | VSS — Ground reference |
| Broche A2 | EBIA0 — External bus interface address |
| Broche A3 | EBID0 — External bus interface data |
| Broche A4 | VSS — Ground |
| Broche A5 | EBID2 — External bus interface data |
| Broche A6 | EBID5 — External bus interface data |
| Broche A7 | EBID7 — External bus interface data |
| Broche A8 | EBIA1 — External bus interface address |
| Broche A9 | VSS — Ground |
| Broche A10 | EBIA2 — External bus interface address |
| Broche B1 | RG0 — General purpose I/O |
| Broche B2 | RG1 — General purpose I/O |
| Broche B3 | VSS — Ground |
| Broche B4 | VDD — Core logic supply |
| Broche B5 | EBID1 — External bus interface data |
| Broche B6 | EBID3 — External bus interface data |
| Broche B7 | EBID6 — External bus interface data |
| Broche B8 | EBID8 — External bus interface data |
| Broche B9 | EBIA3 — External bus interface address |
| Broche B10 | EBIA4 — External bus interface address |
| Broche C1 | RG2 — General purpose I/O |
| Broche C2 | RG3 — General purpose I/O |
| Broche C3 | RG4 — General purpose I/O |
| Broche C4 | RG5 — General purpose I/O |
| Broche C5 | VSS — Ground |
| Broche C6 | VDD — Core logic supply |
| Broche C7 | EBID4 — External bus interface data |
| Broche C8 | EBID9 — External bus interface data |
| Broche C9 | EBID10 — External bus interface data |
| Broche C10 | EBIA5 — External bus interface address |
| Broche D1 | RG6 — General purpose I/O |
| Broche D2 | RG7 — General purpose I/O |
| Broche D3 | RG8 — General purpose I/O |
| Broche D4 | RG9 — General purpose I/O |
| Broche D5 | OSC1 — Primary oscillator input |
| Broche D6 | VDD — Core logic supply |
| Broche D7 | VSS — Ground |
| Broche D8 | EBID11 — External bus interface data |
| Broche D9 | EBID12 — External bus interface data |
| Broche D10 | EBID13 — External bus interface data |
| Broche E1 | RF0 — General purpose I/O |
| Broche E2 | RF1 — General purpose I/O |
| Broche E3 | RB0 — General purpose I/O / PGED1 |
| Broche E4 | RB1 — General purpose I/O / PGEC1 |
| Broche E5 | OSC2 — Primary oscillator output |
| Broche E6 | VDD — Core logic supply |
| Broche E7 | VSS — Ground |
| Broche E8 | EBID14 — External bus interface data |
| Broche E9 | EBID15 — External bus interface data |
| Broche E10 | EBIA6 — External bus interface address |
| Broche F1 | RB2 — General purpose I/O |
| Broche F2 | RB3 — General purpose I/O |
| Broche F3 | RB4 — General purpose I/O |
| Broche F4 | RB5 — General purpose I/O |
| Broche F5 | AVDD — Analog supply |
| Broche F6 | AVSS — Analog ground |
| Broche F7 | RB6 — General purpose I/O / PGED2 |
| Broche F8 | RB7 — General purpose I/O / PGEC2 |
| Broche F9 | EBIA7 — External bus interface address |
| Broche F10 | EBIA8 — External bus interface address |
| Broche G1 | RD0 — General purpose I/O |
| Broche G2 | RD1 — General purpose I/O |
| Broche G3 | RD2 — General purpose I/O |
| Broche G4 | RD3 — General purpose I/O |
| Broche G5 | RD4 — General purpose I/O |
| Broche G6 | RD5 — General purpose I/O |
| Broche G7 | RD6 — General purpose I/O |
| Broche G8 | RD7 — General purpose I/O |
| Broche G9 | EBIA9 — External bus interface address |
| Broche G10 | EBIA10 — External bus interface address |
| Broche H1 | RC0 — General purpose I/O |
| Broche H2 | RC1 — General purpose I/O |
| Broche H3 | RC2 — General purpose I/O |
| Broche H4 | VDD — Core logic supply |
| Broche H5 | VSS — Ground |
| Broche H6 | RC3 — General purpose I/O |
| Broche H7 | RC4 — General purpose I/O |
| Broche H8 | RC5 — General purpose I/O |
| Broche H9 | RC6 — General purpose I/O |
| Broche H10 | RC7 — General purpose I/O |
| Broche J1 | RA0 — General purpose I/O |
| Broche J2 | RA1 — General purpose I/O |
| Broche J3 | RA2 — General purpose I/O |
| Broche J4 | RA3 — General purpose I/O |
| Broche J5 | RA4 — General purpose I/O |
| Broche J6 | RA5 — General purpose I/O |
| Broche J7 | RA6 — General purpose I/O |
| Broche J8 | RA7 — General purpose I/O |
| Broche J9 | RE0 — General purpose I/O |
| Broche J10 | RE1 — General purpose I/O |
| Broche K1 | VSS — Ground |
| Broche K2 | VDD — Core logic supply |
| Broche K3 | RA8 — General purpose I/O |
| Broche K4 | RA9 — General purpose I/O |
| Broche K5 | RA10 — General purpose I/O |
| Broche K6 | RA11 — General purpose I/O |
| Broche K7 | RA12 — General purpose I/O |
| Broche K8 | RA13 — General purpose I/O |
| Broche K9 | RA14 — General purpose I/O |
| Broche K10 | RA15 — General purpose I/O |
Applications typiques
PIC32MZ1024EFK100T-E/GJX convient pour 6 applications: Automotive Body & Connectivity ECU, Industrial IoT Gateway, Motor Control & Inverter Drive, Graphics HMI Touch Terminal, Medical Device Connectivity Module, USB-Peripheral Embedded Host.
Automotive Body & Connectivity ECU
The PIC32MZ1024EFK100T-E/GJX is AEC-Q100 qualified to -40C to +125C and integrates 2x CAN 2.0B, USB 2.0 HS OTG, and 10/100 Ethernet MAC, making it ideal for in-vehicle body controllers, gateway ECUs, and telematics control units. With 1 MB dual-panel Flash the part supports fail-safe OTA firmware updates in the field without bricking the ECU. The hardware Crypto Engine accelerates TLS/DTLS handshakes for V2X and remote diagnostics, while the 200 MHz MIPS core and DSP extensions process sensor fusion algorithms in real time. Operating voltage 2.3V to 3.6V matches the 12V-battery-derived automotive rails after the LDO.
Recommandé
Industrial IoT Gateway
The PIC32MZ1024EFK100T-E/GJX's combination of 10/100 Ethernet, USB HS OTG, dual CAN, 8 UART and 6 SPI lets a single MCU bridge multiple industrial fieldbuses (Modbus, CANopen, RS-485, RS-232) into TCP/IP. The 256 KB SRAM is large enough for TLS session buffers and MQTT payload queues, while the Crypto Engine handles AES-128/256 hardware acceleration for secure cloud uplinks. The 200 MHz MIPS microAptiv core runs lwIP TCP/IP, FreeRTOS, or Harmony stacks concurrently without bottleneck. The TFBGA-100 7x7 mm package keeps the gateway board compact for DIN-rail mounting.
Recommandé
Motor Control & Inverter Drive
The PIC32MZ1024EFK100T-E/GJX excels at field-oriented control (FOC) for PMSM, BLDC, and ACIM motors thanks to its 200 MHz MIPS core with single-cycle MAC, four 64-bit accumulators, and saturating/fractional math. The 12-bit 5 MSPS ADC with up to 48 channels samples three-phase currents plus DC-bus voltage synchronously to the PWM, achieving sub-microsecond control-loop latency. Dual CAN enables CiA 402 drive profile communication, while the 1 MB Flash stores field-weakening and MTPA lookup tables. The automotive temperature grade also suits outdoor industrial drives and pump controllers.
Recommandé
Graphics HMI Touch Terminal
The PIC32MZ1024EFK100T-E/GJX drives parallel RGB TFT panels up to WVGA through its PMP/EPMP peripheral, while the 200 MHz core executes Microchip's MPLAB Harmony graphics library with sufficient throughput for 60 fps button/label rendering. The 256 KB SRAM provides frame buffers for small QVGA panels without external memory; for larger panels the 6 SPI instances drive QSPI PSRAM. The 12-bit ADC supports 4-wire resistive touch, and USB HS OTG enables firmware update via USB stick in factory-floor terminals. The TFBGA-100 7x7 mm footprint suits slim-panel mounting.
Recommandé
Medical Device Connectivity Module
The PIC32MZ1024EFK100T-E/GJX's hardware Crypto Engine, TRNG, and AES/SHA accelerators make it well-suited for medical devices requiring secure data transmission, such as patient monitors, infusion pumps, and portable diagnostic equipment communicating over Wi-Fi/Bluetooth add-on modules or wired Ethernet. The 1 MB dual-panel Flash supports FDA-compliant fail-safe firmware updates required for IEC 62304 risk management. The 12-bit ADC with 48 channels handles multi-sensor patient data acquisition, while USB HS OTG enables fast local data export to clinician tablets. Operating temperature -40C to +125C supports sterilization environments and refrigerated storage.
Recommandé
USB-Peripheral Embedded Host
The PIC32MZ1024EFK100T-E/GJX's integrated USB 2.0 High-Speed OTG controller with integrated PHY simplifies designs for USB host, device, and On-The-Go roles. Applications include USB mass-storage data loggers, USB HID touch panels, USB CDC virtual COM port bridges, and USB audio class devices. The 200 MHz MIPS core handles USB stack, FAT file system, and user application concurrently. The Crypto Engine secures USB-encrypted data transfers. The 100-pin TFBGA package and 256 KB SRAM also leave headroom for LCD displays and keypad scanning in handheld instruments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1024EFK100T-E/GJX — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1024EFE100T-E/GJX | PIC32MZ1024EFF100T-E/GJX | PIC32MZ1024EFG100T-E/GJX | PIC32MZ1024EFH100T-E/GJX | PIC32MZ0512EFK100T-E/GJX | PIC32MZ1024EFK100-E/GJX |
|---|---|---|---|---|---|---|---|
| Package | 100-TFBGA (7x7 mm) | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| Core Speed | 200 MHz | 200 MHz - same | 200 MHz - same | 200 MHz - same | 200 MHz - same | 200 MHz - same | 200 MHz - same |
| Flash | 1 MB (1024 KB) dual-panel | 1 MB dual-panel | 1 MB dual-panel | 1 MB single-panel | 1 MB single-panel | 512 KB dual-panel (-50%) | 1 MB dual-panel - same |
| SRAM | 256 KB | 256 KB - same | 256 KB - same | 256 KB - same | 256 KB - same | 256 KB - same | 256 KB - same |
| Crypto Engine | Yes (AES/DES/SHA + TRNG) | No (-crypto engine) | Yes - same | Yes - same | Yes - same | Yes - same | Yes - same |
| Temperature Grade | -40C to +125C (Automotive /E) | -40C to +125C (Automotive /E) - same | -40C to +125C (Automotive /E) - same | -40C to +125C (Automotive /E) - same | -40C to +125C (Automotive /E) - same | -40C to +125C (Automotive /E) - same | -40C to +125C (Automotive /E) - same |
| AEC-Q100 | Yes | Yes - same | Yes - same | Yes - same | Yes - same | Yes - same | Yes - same |
| Packaging | Tape & Reel | Tape & Reel | Tape & Reel | Tape & Reel | Tape & Reel | Tape & Reel | Tray |
Principaux différenciateurs
- Dual-panel Flash for fail-safe OTA updates (vs PIC32MZ1024EFH100T-E/GJX)
- Integrated hardware Crypto Engine with TRNG (vs PIC32MZ1024EFE100T-E/GJX)
- AEC-Q100 automotive grade /E temperature descriptor (vs Industrial /I grade PIC32MZ1024EFG100T-I/GJX)
Notes de conception
Place one 100 nF X7R ceramic decoupling capacitor within 2 mm of every VDD/VSS ball pair on the TFBGA-100 footprint. Add four 4.7 uF bulk capacitors at each TFBGA corner. The 0.65 mm ball pitch demands laser-drilled microvias and via-in-pad is recommended for the inner-row VDD balls to minimize inductance. Follow Microchip's TB3116 'PIC32MZ EF PCB Layout Checklist' for stack-up guidance (4-layer minimum, dedicated ground plane on layer 2, VDD on layer 3).
Estimated: at 200 MHz MIPS core and typical industrial workload, the PIC32MZ1024EFK100T-E/GJX draws ~120 mA from 3.3V. The TFBGA-100 7x7 mm package has a theta_JA of approximately 28 C/W on a standard 4-layer JEDEC test board, giving a 50C junction rise over ambient. At 125C ambient this leaves ~10C margin. For closed enclosures, mount thermal vias under the central ground balls to a copper pour on the opposite side. The /E automotive grade guarantees operation up to 125C junction temperature.
Do not skip the 32.768 kHz secondary crystal on SOSC pins when using the RTCC - omitting it causes calendar drift. The dual-panel Flash feature requires explicit bootloader configuration in the FBCON0 register; many engineers forget to enable it and lose live-update capability. For USB HS OTG at 480 Mbps, keep the D+/D- traces length-matched within 150 mil and maintain 90 ohm differential impedance. The Crypto Engine needs a separate enabled fuse bit (CFGCON0.ECCCON); uninitialized engines cause BusError exceptions during AES calls.
The 12-bit 5 MSPS ADC achieves its full SNR only when the analog supply (AVDD) is filtered from the noisy digital VDD with a ferrite bead and 10 uF/100 nF Pi filter. Use the dedicated AVSS pin for analog ground return, not a shared ground via. For high-speed EBI traces to external SDRAM or QSPI PSRAM, keep trace length under 50 mm and use 50 ohm single-ended impedance with series 33 ohm source termination on clock lines.
Informations de conformité
AEC-Q100 qualified per /E automotive temperature descriptor -40C to +125C. RoHS and REACH compliant per Microchip product page. Lead-free and halogen-free per Microchip environmental statement.