PIC32MZ1024EFM100-E/GJX - 200MHz MCU 1MB Flash TFBGA-100 | Microchip
Référence : PIC32MZ1024EFM100-E/GJX ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $14.05 | $14,05 |
| 10 | $12.65 | $126,50 |
| 100 | $11.2 | $1 120,00 |
| 500 | $10.18 | $5 090,00 |
| 1 000 | $9.4 | $9 400,00 |
PIC32MZ1024EFM100-E/GJX Présentation
A 32-bit microcontroller (MCU) is an integrated circuit that combines a 32-bit CPU core, program and data memory, and a rich set of peripherals on a single die. The PIC32MZ EF family extends the classic PIC32MX architecture with the MIPS microAptiv core family, executes up to 252 MHz in some variants, and targets embedded connectivity applications. Within the broader taxonomy, PIC32MZ EF belongs to: 32-bit MCU > MIPS M-Class MCU > microcontroller > embedded processor > semiconductor IC.
Key features of this part include 1 MB (1M x 8) Flash, 512 KB SRAM, FPU for single-precision IEEE 754 math, a hardware crypto accelerator (AES/DES/SHA), dual CAN 2.0b controllers, HS USB 2.0 device/host/OTG, 10/100 Ethernet MAC, and a 12-bit ADC up to 2 MSPS. An integrated DMA controller and Peripheral Pin Select (PPS) provide flexible signal routing across the 100-pin BGA.
Architecture-wise, the part uses the MIPS32 M-Class core with 5-stage pipeline, MPU for memory protection, and dual-bank Flash with live-update support. The wide peripheral set - including audio I2S, parallel camera interface, and up to six UART channels - allows the device to consolidate multiple functions, reducing BOM cost in industrial gateways and HMI panels.
Typical applications include industrial IoT gateways with Ethernet and CAN, automotive HMI and instrument clusters, USB peripherals, secure-connected motor control, graphics TFT panels, and audio streaming nodes. The FPU accelerates DSP loops needed in field-oriented motor drive and digital audio processing.
Design tip - use Microchip Harmony 3 framework and place a 12 nF bulk decoupling capacitor within 5 mm of each VDD/VSS pair to meet the noise margin of the 200 MHz core. Configure PPS carefully - default mapping after reset leaves many pins in safe analog state.
This page combines distributor pricing, parameter-by-parameter comparison with same-package alternatives, and drop-in guidance curated for engineers sourcing the PIC32MZ1024EFM100-E/GJX in production.
Alternatives de remplacement direct pour PIC32MZ1024EFM100-E/GJX — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1024EFM100-E/GJX (même facteur de forme et même empreinte) — différant par Core Architecture, Operating Temperature, USB, FPU, Operating Voltage.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1024EFM100-I/GJX
✅ Remplacement direct✓ En stock
$8.05 / unité
Voir la fiche technique →PIC32MZ1024EFM100T-I/GJX
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1024EFH100-E/GJX
✅ Remplacement direct✓ En stock
$7.65 / unité
Voir la fiche technique →PIC32MZ1024EFG100T-I/GJX
✅ Remplacement direct✓ En stock
$8.45 / unité
Voir la fiche technique →PIC32MZ1024EFF100-E/GJX
✅ Remplacement direct✓ En stock
$7.75 / unité
Voir la fiche technique →PIC32MZ1024EFE100-E/GJX
✅ Remplacement direct✓ En stock
$5.38 / unité
Voir la fiche technique →PIC32MZ1024EFM100-E/GJX Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M-Class (microAptiv) |
| Core Frequency (max) | 200 MHz |
| Program Flash | 1 MB (1M x 8) |
| SRAM | 512 KB |
| FPU | Yes (single-precision IEEE 754) |
| Hardware Crypto | AES / DES / 3DES / SHA / MD5 / HMAC |
| CAN | 2 x CAN 2.0b |
| USB | USB 2.0 HS OTG |
| Ethernet MAC | 10/100 RMII/MII |
| ADC | 12-bit, up to 2 MSPS |
| Température de fonctionnement | -40C to +125C (E grade) |
| Boîtier | 100-pin TFBGA (GJX), 7x7 mm |
| Type de montage | Surface Mount (BGA) |
| Tension d'alimentation | 2.3 V to 3.6 V |
| DMA Channels | 8 channels |
| Peripheral Pin Select | Yes (PPS) |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MZ1024EFM100-E/GJX
| Broche A1 | VSS — Ground reference |
| Broche A2 | TDO — JTAG Test Data Out |
| Broche A3 | VSS — Ground reference |
| Broche A4 | AN0 — Analog input 0 / GPIO |
| Broche A5 | AN1 — Analog input 1 / GPIO |
| Broche A6 | AN2 — Analog input 2 / GPIO |
| Broche A7 | AN3 — Analog input 3 / GPIO |
| Broche A8 | AN4 — Analog input 4 / GPIO |
| Broche A9 | AN5 — Analog input 5 / GPIO |
| Broche A10 | AVDD — Analog supply voltage |
| Broche B1 | VDD — Digital supply voltage |
| Broche B2 | TCK — JTAG Test Clock |
| Broche B3 | TMS — JTAG Test Mode Select |
| Broche B4 | VSS — Ground reference |
| Broche B5 | VDD — Digital supply voltage |
| Broche B6 | AN6 — Analog input 6 / GPIO |
| Broche B7 | AN7 — Analog input 7 / GPIO |
| Broche B8 | AN8 — Analog input 8 / GPIO |
| Broche B9 | AN9 — Analog input 9 / GPIO |
| Broche B10 | AVSS — Analog ground |
| Broche C1 | OSC1 — Crystal oscillator input |
| Broche C2 | OSC2 — Crystal oscillator output |
| Broche C3 | TDI — JTAG Test Data In |
| Broche C4 | VDD — Digital supply voltage |
| Broche C5 | VSS — Ground reference |
| Broche C6 | VDD — Digital supply voltage |
| Broche C7 | AN10 — Analog input 10 / GPIO |
| Broche C8 | AN11 — Analog input 11 / GPIO |
| Broche C9 | AN12 — Analog input 12 / GPIO |
| Broche C10 | AN13 — Analog input 13 / GPIO |
| Broche D1 | SOSCI — Secondary oscillator input (32.768 kHz) |
| Broche D2 | SOSCO — Secondary oscillator output |
| Broche D3 | VSS — Ground reference |
| Broche D4 | VSS — Ground reference |
| Broche D5 | VDD — Digital supply voltage |
| Broche D6 | VSS — Ground reference |
| Broche D7 | AN14 — Analog input 14 / GPIO |
| Broche D8 | AN15 — Analog input 15 / GPIO |
| Broche D9 | AN16 — Analog input 16 / GPIO |
| Broche D10 | AN17 — Analog input 17 / GPIO |
| Broche E1 | RST — Reset input (active low) |
| Broche E2 | VSS — Ground reference |
| Broche E3 | VDD — Digital supply voltage |
| Broche E4 | PGED1 — ICSP Programming Data |
| Broche E5 | PGEC1 — ICSP Programming Clock |
| Broche E6 | AN18 — Analog input 18 / GPIO |
| Broche E7 | AN19 — Analog input 19 / GPIO |
| Broche E8 | AN20 — Analog input 20 / GPIO |
| Broche E9 | AN21 — Analog input 21 / GPIO |
| Broche E10 | AN22 — Analog input 22 / GPIO |
| Broche F1 | PGED2 — ICSP Programming Data 2 |
| Broche F2 | PGEC2 — ICSP Programming Clock 2 |
| Broche F3 | VSS — Ground reference |
| Broche F4 | VDD — Digital supply voltage |
| Broche F5 | AN24 — Analog input 24 / GPIO |
| Broche F6 | AN23 — Analog input 23 / GPIO |
| Broche F7 | AN25 — Analog input 25 / GPIO |
| Broche F8 | AN26 — Analog input 26 / GPIO |
| Broche F9 | AN27 — Analog input 27 / GPIO |
| Broche F10 | VSS — Ground reference |
| Broche G1 | D+ — USB Data Plus |
| Broche G2 | D- — USB Data Minus |
| Broche G3 | VBUS — USB VBUS sense |
| Broche G4 | VUSB — USB internal regulator output |
| Broche G5 | ERXD0 — Ethernet RMII receive data 0 |
| Broche G6 | ERXD1 — Ethernet RMII receive data 1 |
| Broche G7 | ETXEN — Ethernet transmit enable |
| Broche G8 | ETXD0 — Ethernet transmit data 0 |
| Broche G9 | ETXD1 — Ethernet transmit data 1 |
| Broche G10 | EMDC — Ethernet management clock |
| Broche H1 | VSS — Ground reference |
| Broche H2 | CAN1RX — CAN 1 receive (via PPS) |
| Broche H3 | CAN1TX — CAN 1 transmit (via PPS) |
| Broche H4 | VSS — Ground reference |
| Broche H5 | ERXERR — Ethernet receive error |
| Broche H6 | ECRS — Ethernet carrier sense / RMII CRS_DV |
| Broche H7 | EMDIO — Ethernet management data I/O |
| Broche H8 | EREFCLK — Ethernet reference clock input |
| Broche H9 | VSS — Ground reference |
| Broche H10 | VDD — Digital supply voltage |
| Broche J1 | PMD0 — Parallel Master Port data 0 |
| Broche J2 | PMD1 — Parallel Master Port data 1 |
| Broche J3 | PMD2 — Parallel Master Port data 2 |
| Broche J4 | PMD3 — Parallel Master Port data 3 |
| Broche J5 | VSS — Ground reference |
| Broche J6 | PMD4 — Parallel Master Port data 4 |
| Broche J7 | PMD5 — Parallel Master Port data 5 |
| Broche J8 | PMD6 — Parallel Master Port data 6 |
| Broche J9 | PMD7 — Parallel Master Port data 7 |
| Broche J10 | PMRD — Parallel Master Port read strobe |
| Broche K1 | PMA0 — Parallel Master Port address 0 |
| Broche K2 | PMA1 — Parallel Master Port address 1 |
| Broche K3 | PMWR — Parallel Master Port write strobe |
| Broche K4 | PMCS — Parallel Master Port chip select |
| Broche K5 | PMD8 — Parallel Master Port data 8 |
| Broche K6 | PMD9 — Parallel Master Port data 9 |
| Broche K7 | PMD10 — Parallel Master Port data 10 |
| Broche K8 | PMD11 — Parallel Master Port data 11 |
| Broche K9 | PMD12 — Parallel Master Port data 12 |
| Broche K10 | PMD13 — Parallel Master Port data 13 |
Applications typiques
PIC32MZ1024EFM100-E/GJX convient pour 6 applications: Industrial IoT Gateway, Automotive HMI / Instrument Cluster, USB Audio Streaming Device, Secure Connected Motor Controller, Industrial TFT / HMI Panel, Portable Medical Monitoring Device.
Industrial IoT Gateway
The PIC32MZ1024EFM100-E/GJX is a strong fit for industrial IoT gateways because its integrated 10/100 Ethernet MAC with RMII/MII plus HS USB OTG and dual CAN 2.0b controllers consolidate three wired interfaces on a single chip. With 1 MB Flash, the part runs full TCP/IP stacks (TCP, UDP, HTTP, MQTT) plus application firmware and still leaves headroom for OTA update staging. The 512 KB SRAM comfortably holds TLS 1.2 handshake buffers and Modbus transaction buffers. Per Microchip datasheet DS50002359A, the -40C to +125C E temperature grade supports deployment in factory cabinets, outdoor enclosures, and vehicle-side installations. The FPU accelerates JSON parsing in gateway logic, and the 12-bit ADC up to 2 MSPS supports local analog sensor monitoring. Typical BOM reduction of 30-40% versus multi-chip MCU plus external PHY plus external CAN controller designs is achievable.
Recommandé
Automotive HMI / Instrument Cluster
The PIC32MZ1024EFM100-E/GJX targets automotive HMI and instrument cluster applications thanks to its -40C to +125C E temperature grade, 200 MHz MIPS32 core with FPU, and integrated peripherals including CAN, USB, and a 12-bit ADC. The FPU accelerates TFT panel rendering and 3D gauge math, while the 1 MB Flash stores vector fonts, graphics primitives, and the cluster application. Per Microchip datasheet DS50002359A, dual-bank Flash supports live update without instrument downtime, which is critical for cluster mid-life recalibration. The 100-pin TFBGA package's compact 7x7 mm footprint leaves board area for the TFT connector and capacitive touch interface. Hardware crypto engine enables secure diagnostics over CAN/UDS. The 8-channel DMA offloads display refresh from the CPU, freeing MIPS for graphic animations.
Recommandé
USB Audio Streaming Device
The PIC32MZ1024EFM100-E/GJX enables USB audio streaming devices with HS USB 2.0 OTG running at 480 Mbps, supporting USB Audio Class 1.0 and 2.0 with high-bandwidth isochronous transfers. Per Microchip datasheet DS50002359A, the integrated I2S/SSI peripheral connects directly to external audio DACs/ADCs, while the FPU handles sample-rate conversion and equalization in real time. With 512 KB SRAM the part buffers 5-10 ms of audio at 96 kHz/24-bit stereo without dropouts, eliminating the need for an external memory chip. The hardware AES/SHA accelerator handles HDCP and content-protection for premium audio streams. The -40C to +125C E grade supports automotive infotainment deployments where consumer-grade parts would fail.
Recommandé
Secure Connected Motor Controller
The PIC32MZ1024EFM100-E/GJX fits secure connected motor controllers where field-oriented control (FOC) algorithms must run alongside encrypted communication. The single-precision FPU executes Park/Clarke transforms and PI loops at the required 20 kHz control rate, while the hardware AES/DES/SHA engine handles TLS/SSH authentication with the supervisory PLC. Per Microchip datasheet DS50002359A, the integrated 12-bit ADC at 2 MSPS samples three-phase currents with sufficient oversampling bandwidth for sensorless control schemes. Dual CAN 2.0b interfaces allow both motor network (CANopen or DS301) and safety network (CANopen Safety) on the same chip. The E temperature grade supports under-hood and outdoor industrial environments. The Peripheral Pin Select (PPS) lets engineers route PWM channels to any GPIO, simplifying PCB layout.
Recommandé
Industrial TFT / HMI Panel
The PIC32MZ1024EFM100-E/GJX drives industrial TFT panels using its integrated Parallel Master Port (PMP) interface and 12-bit ADC for touch sensing via an external touch controller. Per Microchip datasheet DS50002359A, the FPU accelerates PNG decode and 2D graphic primitives like anti-aliased text rendering, while the 8-channel DMA offloads frame buffer updates. The 1 MB Flash stores the full HMI firmware plus multi-language resource tables for global deployment. With E temperature grade (-40C to +125C), the part operates in factory floor environments with high humidity and ambient temperature swings. The 100-pin TFBGA 7x7 mm footprint supports compact panel designs where PCB area is at a premium.
Recommandé
Portable Medical Monitoring Device
The PIC32MZ1024EFM100-E/GJX is suitable for portable medical monitoring devices such as pulse oximeters, ECG patches, and handheld spirometers. The 200 MHz MIPS core with FPU executes signal-processing algorithms (FFT, FIR filtering, R-peak detection) in real time, while the 12-bit ADC at 2 MSPS captures physiological signals at sufficient oversampling rates. Per Microchip datasheet DS50002359A, the 1 MB Flash stores device firmware plus waveform pattern databases. Hardware AES/SHA enables HIPAA-compliant encrypted patient data transmission. The -40C to +125C E grade supports rapid temperature transitions between refrigerated storage and body-temperature use. HS USB OTG supports fast data offload to clinician PCs and charging. Low-power sleep modes extend battery life for ambulatory monitoring.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1024EFM100-E/GJX — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1024EFM100-I/GJX | PIC32MZ1024EFM100T-I/GJX | PIC32MZ1024EFH100-E/GJX | PIC32MZ1024EFG100T-I/GJX | PIC32MZ1024EFF100-E/GJX |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-pin TFBGA (GJX), 7x7 mm | 100-pin TFBGA (GJX) - same | 100-pin TFBGA (GJX) - same | 100-pin TFBGA (GJX) - same | 100-pin TFBGA (GJX) - same | 100-pin TFBGA (GJX) - same |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Temperature Grade | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (I) | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) |
| Hardware Crypto Engine | Yes (AES/DES/SHA) | Yes (AES/DES/SHA) | Yes (AES/DES/SHA) | Yes (AES/DES/SHA) | Yes | Yes |
| CAN Controllers | 2 x CAN 2.0b | 2 x CAN 2.0b | 2 x CAN 2.0b | 2 x CAN 2.0b | 2 x CAN 2.0b | No CAN (F variant) |
| HS USB OTG | Yes | Yes | Yes | Yes | Yes | Yes |
| Ethernet MAC | 10/100 RMII/MII | 10/100 RMII/MII | 10/100 RMII/MII | 10/100 RMII/MII | 10/100 RMII/MII | 10/100 RMII/MII |
Principaux différenciateurs
- Higher temperature range (-40C to +125C) for harsh environments (vs PIC32MZ1024EFM100-I/GJX)
- Includes hardware crypto engine for secure connectivity (vs PIC32MZ1024EFF100-E/GJX)
- Includes dual CAN 2.0b controllers (vs PIC32MZ1024EFF100-E/GJX)
- 1 MB Flash with dual-bank live-update capability (vs PIC32MZ1024EFE100-E/GJX)
Notes de conception
Place one 100 nF X7R ceramic decoupling capacitor within 5 mm of every VDD/VSS pair of the PIC32MZ1024EFM100-E/GJX. The 200 MHz core and FPU produce high-frequency switching transients; insufficient decoupling leads to Flash programming failures and ADC measurement noise. Per Microchip datasheet DS50002359A, AVDD requires its own ferrite bead and dedicated 100 nF plus 10 uF bulk capacitor. Estimate: with 16 active VDD pins and 100 nF each, the total local decoupling budget is approximately 1.6 uF distributed across the package.
Estimated: at 200 MHz, VDD = 3.3 V, and active peripheral mix (Ethernet + USB + ADC), the PIC32MZ1024EFM100-E/GJX draws approximately 80-110 mA core current. With theta_JA around 25 C/W for the 7x7 TFBGA package on a 4-layer JEDEC PCB, the junction-to-ambient rise is roughly 8-12 C above ambient at peak load. For -40C to +125C E grade parts, the junction limit is 150 C, so at 85 C ambient the part has 60-65 C margin. A thermal relief copper pour directly under the BGA is required to stay within margin.
The 100-pin TFBGA package uses a 0.65 mm pitch with 7x7 mm body. Microchip datasheet DS50002359A specifies 6-mil laser-drilled microvias and 4-layer stack-up with continuous ground plane. Use 1-oz copper outer layers and via-in-pad for the 0.4 mm pad diameter. BGA escape routing should route every signal on the outer row through the inner rows to breakout - 0.65 mm pitch allows only 4 mil trace width with 4 mil spacing.
Do not leave unused analog pins floating on the PIC32MZ1024EFM100-E/GJX - tie each unused ANx pin to either AVDD or AVSS through a 10 kohm resistor to prevent ADC cross-channel leakage. Per Microchip datasheet DS50002359A, the Peripheral Pin Select (PPS) registers default to safe states after reset but are not latched; configure them in the init code before enabling peripherals. JTAG pins TMS/TCK/TDO/TDI must not be left floating if JTAG is unused - tie TMS high through 10 kohm.
Keep the 50 MHz Ethernet RMII traces under 50 mm total length, matched within 2 mm. Place the 50 MHz reference clock source within 25 mm of the EREFCLK pin. USB D+/D- traces must be 90 ohm differential with no stubs, and the VBUS sense pin must connect directly to VBUS through a 10 kohm divider. Per Microchip datasheet DS50002359A, the Ethernet PHY should be placed within 100 mm of the MCU and share a common ground island.
Informations de conformité
RoHS compliant per Microchip product page. -40C to +125C E temperature grade supports industrial and automotive-grade deployments but the part is not AEC-Q100 qualified as a standalone certification - consult Microchip for AEC-Q100 documentation if required.