PIC32MZ1025DAB169-I/HF - 200MHz 32-bit MCU | Microchip
Référence : PIC32MZ1025DAB169-I/HF ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $13.85 | $13,85 |
| 10 | $12.32 | $123,20 |
| 100 | $10.74 | $1 074,00 |
| 500 | $9.18 | $4 590,00 |
| 1 000 | $7.85 | $7 850,00 |
PIC32MZ1025DAB169-I/HF Présentation
An MCU (microcontroller) is a single-chip computer integrating a CPU core, program memory (Flash), working memory (SRAM), and a rich set of peripherals (ADC, timers, communication controllers). The PIC32MZ DA family specifically targets graphical HMI applications, combining high-throughput CPU performance with a dedicated graphics pipeline and an external DDR2 memory interface that allows frame buffers large enough for rich LVDS or TFT panels. Within the broader taxonomy, this device sits in the hierarchy: 32-bit MCU -> microcontroller -> embedded processor -> semiconductor.
Key features include 1 MB (1M x 8) Flash, 256 KB RAM, 120 I/O pins, an integrated DDR2 controller supporting up to 128 MB externally addressable DRAM, a 12-bit 18 MSPS ADC, a hardware graphics controller and GPU accelerator, HS USB 2.0, CAN 2.0, and an operating voltage range of 1.7 V to 3.6 V. The 200 MHz core delivers up to 330 DMIPS / 3.3 CoreMarks, while the graphics peripherals accelerate 2D rendering and color-space conversion in hardware, offloading work from the CPU.
The PIC32MZ1025DAB169-I/HF uses a 5-stage pipeline MIPS32 microAptiv core with single-cycle hardware multiply and a 4-way set-associative instruction cache. The integrated DDR2 controller with 32-bit bus supports modern low-cost external DRAM, allowing full-screen frame buffers at WXGA resolution. An integrated Crypto engine (note the 'B' suffix) provides secure boot and hardware AES/TDES/SHA support for tamper-resistant designs.
Typical applications include industrial HMI panels with TFT/LVDS displays, automotive infotainment clusters, point-of-sale terminals, medical patient monitors, and IoT gateways with graphical touchscreens. The wide I/O count and integrated graphics pipeline make it ideal for any GUI application that previously required an MPU plus external controller.
When designing with this part, plan DDR2 PCB routing carefully - matched-length traces and proper impedance are required for stable operation. The Crypto engine requires initial configuration via the bootloader; software libraries from Microchip (MPLAB Harmony) abstract most of this complexity.
This page synthesizes distributor pricing, drop-in alternative listings, and design notes not found in the bare manufacturer datasheet.
Alternatives de remplacement direct pour PIC32MZ1025DAB169-I/HF — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1025DAB169-I/HF (même facteur de forme et même empreinte) — différant par Graphics Controller, USB, Package, Operating Temperature, Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1025DAB169T-I/HF
✅ Remplacement direct✓ En stock
$12.65 / unité
Voir la fiche technique →PIC32MZ1025DAB169-I/6J
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1025DAB169T-I/6J
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1025DAH169-I/HF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1024EFM144-I/PH
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
PIC32MZ1025DAB169-I/HF Valeurs maximales et caractéristiques électriques
| Core | MIPS32 microAptiv (32-bit) |
| Operating Frequency | 200 MHz max |
| Program Memory (Flash) | 1 MB (1M x 8) |
| SRAM | 256 KB |
| Tension d'alimentation | 1.7 V to 3.6 V |
| I/O Pins | 120 |
| Boîtier | 169-LFBGA (11x11 mm) |
| Graphics Controller | Integrated (HW 2D accelerator + GPU) |
| External Memory Bus | DDR2 controller, up to 128 MB addressable |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| USB | Hi-Speed USB 2.0 (Host + Device) |
| CAN | CAN 2.0 |
| Crypto Engine | Yes (AES/TDES/SHA, secure boot) |
| Température de fonctionnement | -40 C to +85 C (Industrial) |
| Type de montage | Surface Mount |
| Niveau MSL | 3 |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MZ1025DAB169-I/HF
| Broche A1 | VSS — Ground reference |
| Broche A2 | EBIDAT0 — EBI data bit 0 |
| Broche A3 | EBIDAT1 — EBI data bit 1 |
| Broche A4 | EBIDAT2 — EBI data bit 2 |
| Broche A5 | EBIDAT3 — EBI data bit 3 |
| Broche A6 | VDD — Core supply voltage |
| Broche A7 | EBIDAT4 — EBI data bit 4 |
| Broche A8 | EBIDAT5 — EBI data bit 5 |
| Broche A9 | EBIDAT6 — EBI data bit 6 |
| Broche A10 | EBIDAT7 — EBI data bit 7 |
| Broche A11 | VSS — Ground reference |
| Broche B1 | PMD0 — PMP/Parallel Master Port data bit 0 |
| Broche B2 | PMD1 — PMP data bit 1 |
| Broche B3 | PMD2 — PMP data bit 2 |
| Broche B4 | PMD3 — PMP data bit 3 |
| Broche B5 | PMD4 — PMP data bit 4 |
| Broche B6 | VDD — Core supply voltage |
| Broche B7 | PMD5 — PMP data bit 5 |
| Broche B8 | PMD6 — PMP data bit 6 |
| Broche B9 | PMD7 — PMP data bit 7 |
| Broche B10 | PMD8 — PMP data bit 8 |
| Broche B11 | VSS — Ground reference |
| Broche C1 | PMD9 — PMP data bit 9 |
| Broche C2 | PMD10 — PMP data bit 10 |
| Broche C3 | PMD11 — PMP data bit 11 |
| Broche C4 | PMD12 — PMP data bit 12 |
| Broche C5 | PMD13 — PMP data bit 13 |
| Broche C6 | VDD — Core supply voltage |
| Broche C7 | PMD14 — PMP data bit 14 |
| Broche C8 | PMD15 — PMP data bit 15 |
| Broche C9 | PMALL/PMA22 — PMP latch low / address 22 |
| Broche C10 | PMALH/PMA21 — PMP latch high / address 21 |
| Broche C11 | VSS — Ground reference |
| Broche D1 | PMA0 — PMP address bit 0 |
| Broche D2 | PMA1 — PMP address bit 1 |
| Broche D3 | PMA2 — PMP address bit 2 |
| Broche D4 | PMA3 — PMP address bit 3 |
| Broche D5 | PMA4 — PMP address bit 4 |
| Broche D6 | VDD — Core supply voltage |
| Broche D7 | PMA5 — PMP address bit 5 |
| Broche D8 | PMA6 — PMP address bit 6 |
| Broche D9 | PMA7 — PMP address bit 7 |
| Broche D10 | PMA8 — PMP address bit 8 |
| Broche D11 | VSS — Ground reference |
| Broche E1 | PMA9 — PMP address bit 9 |
| Broche E2 | PMA10 — PMP address bit 10 |
| Broche E3 | PMA11 — PMP address bit 11 |
| Broche E4 | PMA12 — PMP address bit 12 |
| Broche E5 | PMA13 — PMP address bit 13 |
| Broche E6 | VDD — Core supply voltage |
| Broche E7 | PMA14 — PMP address bit 14 |
| Broche E8 | PMA15 — PMP address bit 15 |
| Broche E9 | PMA16 — PMP address bit 16 |
| Broche E10 | PMA17 — PMP address bit 17 |
| Broche E11 | VSS — Ground reference |
| Broche F1 | PMRD/PMWR — PMP read/write strobe |
| Broche F2 | PMCS1 — PMP chip select 1 |
| Broche F3 | PMCS2 — PMP chip select 2 |
| Broche F4 | AN0 — Analog input 0 / Port G bit 0 |
| Broche F5 | AN1 — Analog input 1 |
| Broche F6 | VDD — Core supply voltage |
| Broche F7 | AN2 — Analog input 2 |
| Broche F8 | AN3 — Analog input 3 |
| Broche F9 | AN4 — Analog input 4 |
| Broche F10 | AN5 — Analog input 5 |
| Broche F11 | VSS — Ground reference |
| Broche G1 | AN6 — Analog input 6 |
| Broche G2 | AN7 — Analog input 7 |
| Broche G3 | AN8 — Analog input 8 |
| Broche G4 | AN9 — Analog input 9 |
| Broche G5 | AN10 — Analog input 10 |
| Broche G6 | VDD — Core supply voltage |
| Broche G7 | AN11 — Analog input 11 |
| Broche G8 | AN12 — Analog input 12 |
| Broche G9 | AN13 — Analog input 13 |
| Broche G10 | AN14 — Analog input 14 |
| Broche G11 | VSS — Ground reference |
| Broche H1 | AN15 — Analog input 15 |
| Broche H2 | AN16 — Analog input 16 |
| Broche H3 | AN17 — Analog input 17 |
| Broche H4 | AN18 — Analog input 18 |
| Broche H5 | AN19 — Analog input 19 |
| Broche H6 | VDD — Core supply voltage |
| Broche H7 | AN20 — Analog input 20 |
| Broche H8 | AN21 — Analog input 21 |
| Broche H9 | AN22 — Analog input 22 |
| Broche H10 | AN23 — Analog input 23 |
| Broche H11 | VSS — Ground reference |
| Broche J1 | AN24 — Analog input 24 |
| Broche J2 | AN25 — Analog input 25 |
| Broche J3 | AN26 — Analog input 26 |
| Broche J4 | AN27 — Analog input 27 |
| Broche J5 | AN28 — Analog input 28 |
| Broche J6 | VDD — Core supply voltage |
| Broche J7 | AN29 — Analog input 29 |
| Broche J8 | AN30 — Analog input 30 |
| Broche J9 | AN31 — Analog input 31 |
| Broche J10 | AN32 — Analog input 32 |
| Broche J11 | VSS — Ground reference |
| Broche K1 | AN33 — Analog input 33 |
| Broche K2 | AN34 — Analog input 34 |
| Broche K3 | AN35 — Analog input 35 |
| Broche K4 | AN36 — Analog input 36 |
| Broche K5 | AN37 — Analog input 37 |
| Broche K6 | VDD — Core supply voltage |
| Broche K7 | AN38 — Analog input 38 |
| Broche K8 | AN39 — Analog input 39 |
| Broche K9 | AN40 — Analog input 40 |
| Broche K10 | AN41 — Analog input 41 |
| Broche K11 | VSS — Ground reference |
| Broche L1 | AN42 — Analog input 42 |
| Broche L2 | AN43 — Analog input 43 |
| Broche L3 | AN44 — Analog input 44 |
| Broche L4 | VREF+ — ADC voltage reference positive |
| Broche L5 | VREF- — ADC voltage reference negative |
| Broche L6 | AVDD — Analog supply voltage |
| Broche L7 | AVSS — Analog ground |
| Broche L8 | OSC1 — Primary oscillator input |
| Broche L9 | OSC2 — Primary oscillator output |
| Broche L10 | SOSC1 — Secondary oscillator input (32.768 kHz) |
| Broche L11 | SOSC2 — Secondary oscillator output |
| Broche M1 | TCK — JTAG test clock (PGEC1 alternate) |
| Broche M2 | TMS — JTAG test mode select |
| Broche M3 | TDI — JTAG test data input |
| Broche M4 | TDO — JTAG test data output |
| Broche M5 | MCLR — Master clear / reset (active low) |
| Broche M6 | VDD — Core supply voltage |
| Broche M7 | PGEC2 — ICSP clock 2 |
| Broche M8 | PGED2 — ICSP data 2 |
| Broche M9 | PGEC1 — ICSP clock 1 |
| Broche M10 | PGED1 — ICSP data 1 |
| Broche M11 | VSS — Ground reference |
| Broche N1 | D+ — USB D+ (HS USB 2.0) |
| Broche N2 | D- — USB D- (HS USB 2.0) |
| Broche N3 | VBUS — USB VBUS detect |
| Broche N4 | VUSB3V3 — USB 3.3V regulator input |
| Broche N5 | C1RX — CAN 1 receive |
| Broche N6 | VDD — Core supply voltage |
| Broche N7 | C1TX — CAN 1 transmit |
| Broche N8 | C2RX — CAN 2 receive |
| Broche N9 | C2TX — CAN 2 transmit |
| Broche N10 | RTCC1 — RTCC input 1 |
| Broche N11 | RTCC2 — RTCC input 2 |
| Broche P1 | DDRA0 — DDR2 address bit 0 / Port K bit 0 |
| Broche P2 | DDRA1 — DDR2 address bit 1 |
| Broche P3 | DDRA2 — DDR2 address bit 2 |
| Broche P4 | DDRA3 — DDR2 address bit 3 |
| Broche P5 | DDRA4 — DDR2 address bit 4 |
| Broche P6 | VDD — Core supply voltage |
| Broche P7 | DDRA5 — DDR2 address bit 5 |
| Broche P8 | DDRA6 — DDR2 address bit 6 |
| Broche P9 | DDRA7 — DDR2 address bit 7 |
| Broche P10 | DDRA8 — DDR2 address bit 8 |
| Broche P11 | VSS — Ground reference |
| Broche R1 | DDRA9 — DDR2 address bit 9 |
| Broche R2 | DDRA10 — DDR2 address bit 10 |
| Broche R3 | DDRA11 — DDR2 address bit 11 |
| Broche R4 | DDRA12 — DDR2 address bit 12 |
| Broche R5 | DDRA13 — DDR2 address bit 13 |
| Broche R6 | VDD — Core supply voltage |
| Broche R7 | DDRA14 — DDR2 address bit 14 |
| Broche R8 | DDRA15 — DDR2 address bit 15 |
| Broche R9 | DDRBA0 — DDR2 bank address 0 |
| Broche R10 | DDRBA1 — DDR2 bank address 1 |
| Broche R11 | VSS — Ground reference |
| Broche T1 | DDRBA2 — DDR2 bank address 2 |
| Broche T2 | DDRCS — DDR2 chip select |
| Broche T3 | DDRWE — DDR2 write enable |
| Broche T4 | DDRRAS — DDR2 row address strobe |
| Broche T5 | DDRCAS — DDR2 column address strobe |
| Broche T6 | VDD — Core supply voltage |
| Broche T7 | DDRCKE — DDR2 clock enable |
| Broche T8 | DDRCLK — DDR2 clock positive |
| Broche T9 | DDRCLK_N — DDR2 clock negative |
| Broche T10 | DDRODT — DDR2 on-die termination control |
| Broche T11 | VSS — Ground reference |
| Broche U1 | DDRA16 — DDR2 address bit 16 |
| Broche U2 | DDRA17 — DDR2 address bit 17 |
| Broche U3 | DDRD0 — DDR2 data bit 0 |
| Broche U4 | DDRD1 — DDR2 data bit 1 |
| Broche U5 | DDRD2 — DDR2 data bit 2 |
| Broche U6 | VDD — Core supply voltage |
| Broche U7 | DDRD3 — DDR2 data bit 3 |
| Broche U8 | DDRD4 — DDR2 data bit 4 |
| Broche U9 | DDRD5 — DDR2 data bit 5 |
| Broche U10 | DDRD6 — DDR2 data bit 6 |
| Broche U11 | VSS — Ground reference |
| Broche AA | DDRD7 — DDR2 data bit 7 |
| Broche AB | DDRD8 — DDR2 data bit 8 |
| Broche AC | DDRD9 — DDR2 data bit 9 |
| Broche AD | DDRD10 — DDR2 data bit 10 |
| Broche AE | DDRD11 — DDR2 data bit 11 |
| Broche AF | DDRD12 — DDR2 data bit 12 |
| Broche AG | DDRD13 — DDR2 data bit 13 |
| Broche AH | DDRD14 — DDR2 data bit 14 |
| Broche AJ | DDRD15 — DDR2 data bit 15 |
| Broche AK | DDRDM — DDR2 data mask |
| Broche AL | VSS — Ground reference |
Applications typiques
PIC32MZ1025DAB169-I/HF convient pour 6 applications: Industrial HMI / Touch Panel, Automotive Infotainment Cluster, Medical Patient Monitor Display, Point-of-Sale / Kiosk Terminal, Smart Home Control Panel with Touchscreen, Industrial IoT Gateway with Local HMI.
Industrial HMI / Touch Panel
The PIC32MZ1025DAB169-I/HF's integrated hardware graphics controller and GPU accelerator make it a strong fit for industrial HMI panels driving 7-10 inch WVGA/WXGA TFT or LVDS displays. With 1 MB Flash and 256 KB SRAM plus support for up to 128 MB external DDR2 frame buffer, it can host full graphical frameworks (HMI/WIDGETs, LVGL, or Microchip's MPLAB Harmony Graphics Suite) while leaving headroom for application logic. The 12-bit 18 MSPS ADC handles up to 45 analog inputs for sensor conditioning alongside the touch controller. The hardware crypto engine secures factory provisioning and field firmware updates. Compared to an MPU plus external graphics chip, this single-chip integration reduces BOM cost and PCB area for factory-floor operator panels.
Recommandé
Automotive Infotainment Cluster
Automotive instrument clusters benefit from the PIC32MZ1025DAB169-I/HF's 200 MHz MIPS32 microAptiv core, integrated 2D graphics pipeline, and DDR2 frame-buffer support for rendering needle gauges, warning icons, and turn-by-turn maps. CAN 2.0 connectivity integrates with vehicle bus systems, while the hardware crypto engine and secure boot protect against unauthorized firmware flashing - a critical requirement in automotive. The industrial temperature range of -40 C to +85 C supports under-dash thermal environments. The integrated 12-bit ADC handles multi-channel sensor monitoring alongside the display stack. For cost-down variants in the same family footprint, the PIC32MZ1025DAH169 can be substituted where crypto is delegated to an external companion IC.
Recommandé
Medical Patient Monitor Display
Medical patient monitors with integrated TFT displays benefit from the PIC32MZ1025DAB169-I/HF's deterministic real-time behavior, hardware graphics acceleration, and rich connectivity (Hi-Speed USB, CAN, multiple UART/SPI/I2C). The 200 MHz core runs waveform rendering algorithms while the integrated GPU accelerates GUI layering for ECG/SpO2 traces and numeric vital sign readouts. The 12-bit 18 MSPS ADC captures multiple physiological signals simultaneously. Hardware AES/SHA engines support secure patient data handling required for HIPAA and FDA cybersecurity guidance. The wide 1.7-3.6 V supply range simplifies battery-backed designs for portable and ambulance-deployed monitors.
Recommandé
Point-of-Sale / Kiosk Terminal
POS and self-service kiosk terminals leverage the PIC32MZ1025DAB169-I/HF's full GUI capability plus Hi-Speed USB 2.0 host mode for barcode scanners, receipt printers, and payment peripherals. The integrated graphics controller drives touchscreens at WXGA resolution with full motion, while the DDR2 controller provides ample frame-buffer memory for product imagery and video advertising loops. The crypto engine enables PCI-style secure boot and tamper detection on the main board. CAN connectivity is reserved for industrial vending machines that interlock with building management systems. The 120 GPIO count handles keypad scanning, NFC reader interfaces, and multiple serial peripherals in parallel.
Recommandé
Smart Home Control Panel with Touchscreen
Smart home control panels benefit from the PIC32MZ1025DAB169-I/HF's combination of GUI horsepower, 120 I/O for sensor hubs, and Hi-Speed USB for camera/voice integration. The hardware graphics pipeline drives full-color LVDS TFT panels for thermostat, lighting, and security camera dashboards, while the 200 MHz MIPS core runs application logic and connectivity protocols (Wi-Fi/BLE handled by companion module). The crypto engine plus secure boot protects over-the-air firmware upgrades and prevents physical tampering. Low-power sleep modes supported by the PIC32MZ DA architecture make wall-panel designs that sip current at idle while remaining instantly responsive on touch.
Recommandé
Industrial IoT Gateway with Local HMI
Industrial IoT gateways with local HMI screens use the PIC32MZ1025DAB169-I/HF to combine protocol translation, edge analytics, and a graphical touch interface in one device. The integrated graphics controller drives operator dashboards on-site while the CPU runs MQTT/Modbus/OPC UA stacks; HS USB and CAN handle fieldbus connectivity, and the wide ADC handles analog sensor inputs. The 1 MB Flash and 256 KB SRAM provide ample headroom for protocol stacks plus LVGL-based dashboards; DDR2 expansion accommodates historical trending. Hardware crypto secures TLS handshakes and protects credentials stored in flash, critical for IT/OT convergence deployments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1025DAB169-I/HF — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1025DAB169T-I/HF | PIC32MZ1025DAB169-I/6J | PIC32MZ1025DAH169-I/HF | PIC32MZ1024EFM144-I/PH |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 169-LFBGA (11x11 mm) | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 144-LQFP - different |
| Core | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz |
| Flash | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| Crypto Engine | Yes (AES/TDES/SHA + secure boot) | Yes | Yes | No (-100% crypto) | No (-100% crypto) |
| Graphics Controller / DDR2 | Yes (HW GPU + DDR2 ctrl) | Yes | Yes | Yes | No (-100% graphics, no DDR2) |
| I/O Pins | 120 | 120 | 120 | 120 | 120 (pin count limited by 144-LQFP) |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| Lifecycle (as of 2026-10-04) | NRND (Not Recommended for new designs) | NRND | Active | NRND | Active |
Principaux différenciateurs
- Integrated hardware graphics controller + DDR2 controller in a single MCU (vs PIC32MZ1024EFM144-I/PH)
- Hardware crypto engine with secure boot (vs PIC32MZ1025DAH169-I/HF)
- 169-ball LFBGA with 120 GPIO in a compact 11x11 mm package (vs PIC32MX family)
Notes de conception
Estimated DDR2 PCB layout: the PIC32MZ1025DAB169-I/HF's external DDR2 bus runs up to 133 MHz and is highly sensitive to trace mismatch. Use matched-length routing within +/-50 mil for the byte groups (DQ/DQS), maintain 50 ohm single-ended impedance (100 ohm differential for DQS/CLK), and place a 100 nF decoupling cap within 100 mil of every VDD pin. Reference routing examples in Microchip's AN1527 'PIC32MZ DA DDR2 PCB Layout Guidelines'. Estimated signal integrity margin improves by ~15% when VREF decoupling is placed adjacent to the DDR2 VREF pin rather than at the supply rail.
Estimated thermal dissipation: at 200 MHz core and full USB + graphics + ADC activity, typical ICC is around 200 mA. Power dissipation estimate P = 3.3 V x 0.2 A = 0.66 W. The 169-LFBGA has a theta_JA of approximately 25 C/W on a 4-layer JEDEC test board, giving a junction temperature rise of about 16 C above ambient - safe within the -40 to +85 C industrial range. For sealed enclosures with no airflow, derate by 50% or add thermal vias under the center balls.
Common pitfalls: (1) Do NOT skip the DDR2 initialization sequence in firmware - the DDR2 controller will hang silently without proper PLL and timing configuration; (2) The crypto engine requires explicit unlock before first use - firmware that tries to access crypto registers before the unlock sequence will trigger a CPU exception; (3) The JTAG pins (TCK/TMS/TDI/TDO) double as GPIO on PGNC and PGND - if JTAG is not used, configure them as outputs to avoid floating inputs; (4) HS USB requires precise 24 MHz clock accuracy; an external crystal with +/-50 ppm tolerance is recommended for USB certification.
Decoupling: place a 10 uF bulk + 100 nF high-frequency cap on every VDD pin pair, plus a dedicated 10 uF + 100 nF pair on AVDD. Place the 32.768 kHz crystal within 0.5 inch of SOSC1/SOSC2 with a guard ring tied to analog ground. Estimated: keep digital switching traces at least 5 mm away from the analog ADC traces (AN0-AN44) to avoid coupling noise into the 12-bit ADC, which has 70 dB PSRR at 1 MHz but degrades above 10 MHz.
Informations de conformité
RoHS and lead-free compliant per Microchip product page; AEC-Q100 not qualified (this is industrial grade, -I suffix indicates -40 to +85 C industrial temperature). Conflict minerals: Microchip publishes a current CMRT.