PIC32MZ1025DAR169-I/6J - 200MHz 32-bit MCU w/ Graphics | Microchip
Référence : PIC32MZ1025DAR169-I/6J ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.95 | $169,50 |
| 100 | $15.4 | $1 540,00 |
| 500 | $14.2 | $7 100,00 |
| 1 000 | $13.1 | $13 100,00 |
PIC32MZ1025DAR169-I/6J Présentation
A microcontroller (MCU) is a self-contained computer on a single chip that integrates a CPU core, program memory, data memory, and configurable peripherals. The PIC32MZ1025DAR169-I/6J sits in the 32-bit MCU hierarchy: MIPS32 microAptiv core -> PIC32MZ 32-bit MCU -> graphics-capable MCU -> embedded system-on-chip. Unlike a general-purpose MPU, it boots directly from on-chip Flash and requires no external memory to run, while the integrated DDR2 controller lets designers add 32 MB or 128 MB of external DRAM for frame buffers and rich GUI content.
Key differentiators include the 200 MHz core delivering 330 DMIPS, the integrated graphics pipeline that offloads rendering from the CPU, 640 KB of on-chip SRAM, and a rich peripheral set spanning CAN, HS USB, Ethernet MAC, and multiple serial interfaces. The 169-ball LFBGA package provides high I/O density for display, memory, and connectivity interfaces in a compact 11x11 mm footprint.
The device targets embedded GUI applications such as industrial HMI panels, medical instrumentation displays, automotive cluster and infotainment modules, and IoT gateways that require both real-time control and graphical output. Its 1.7 V to 1.9 V core supply and wide -40C to +85C industrial temperature range suit space-constrained, thermally challenging designs.
When designing with this MCU, pay close attention to the DDR2 routing, the analog supply filtering for the 12-bit ADC, and the BGA land pattern and via-in-pad requirements. The integrated graphics controller reduces BOM cost by eliminating a discrete display controller, but requires careful frame-buffer bandwidth planning.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single reference for selection, sourcing, and layout decisions.
Alternatives de remplacement direct pour PIC32MZ1025DAR169-I/6J — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1025DAR169-I/6J (même facteur de forme et même empreinte) — différant par External Memory Interface, Graphics Controller, Operating Temperature, Core Architecture, ADC.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1025DAR169T-I/6J
✅ Remplacement direct✓ En stock
$11.88 / unité
Voir la fiche technique →PIC32MZ2025DAR169-I/6J
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$13.25 / unité
Voir la fiche technique →PIC32MZ2064DAR169-I/6J
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$9.3 / unité
Voir la fiche technique →PIC32MZ1025DAS169-I/6J
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$8.92 / unité
Voir la fiche technique →PIC32MZ1025DAK169-I/6J
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
PIC32MZ1025DAR169-I/6J Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 microAptiv (32-bit RISC) |
| Maximum CPU Speed | 200 MHz |
| Flash Program Memory | 1 MB (1M x 8) |
| SRAM | 640 KB |
| External Memory Interface | DDR2 DRAM controller (32 MB or 128 MB addressable) |
| Graphics Controller | Integrated 2D Graphics Processor Unit (GPU) |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| Core Supply Voltage | 1.7 V to 1.9 V |
| Température de fonctionnement | -40C to +85C (industrial) |
| Boîtier | 169-LFBGA (11x11 mm) |
| Type de montage | Surface Mount |
| CAN Interface | Yes |
| USB | High-Speed USB |
| Ethernet | 10/100 Ethernet MAC |
| DMA Channels | Yes |
| PWM | Yes |
| Statut RoHS | Compliant |
Guide de configuration des broches du PIC32MZ1025DAR169-I/6J 169-lfbga (11x11 mm)
Configuration des broches du PIC32MZ1025DAR169-I/6J (boîtier 169-lfbga (11x11 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour PIC32MZ1025DAR169-I/6J.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
PIC32MZ1025DAR169-I/6J convient pour 6 applications: Industrial HMI Panels, Medical Instrumentation Displays, Automotive Cluster and Infotainment, IoT Gateways with Local Display, Point-of-Sale and Retail Terminals, Test and Measurement Instruments.
Industrial HMI Panels
The PIC32MZ1025DAR169-I/6J fits industrial human-machine interface panels because its integrated 2D GPU and DDR2 DRAM controller offload graphics rendering from the 200 MHz MIPS32 core, allowing smooth GUI updates while the CPU services real-time control tasks. The 640 KB on-chip SRAM buffers display data, and the 12-bit 18 MSPS ADC with up to 45 inputs digitizes panel touch and sensor signals directly. Placed as the main controller driving an LCD through the graphics pipeline, it eliminates a discrete display controller, reducing BOM cost. The trade-off is that DDR2 frame-buffer routing demands careful length matching and impedance control on the 169-LFBGA escape, and the 1.7 V to 1.9 V core rail must be clean to avoid display artifacts.
Recommandé
Medical Instrumentation Displays
The PIC32MZ1025DAR169-I/6J suits medical instrumentation displays because the 12-bit 18 MSPS ADC with up to 45 analog inputs captures physiological signals with high resolution while the integrated graphics controller renders waveforms and patient data on screen. The 200 MHz core and 640 KB SRAM provide headroom for real-time signal processing and display refresh simultaneously. Used as the system MCU between analog front-end sensors and an LCD panel, it consolidates acquisition and visualization in one device. The -40C to +85C industrial range supports clinical environments, though designers must isolate the analog supply from the digital core rail to preserve ADC accuracy and meet medical EMC requirements.
Recommandé
Automotive Cluster and Infotainment
The PIC32MZ1025DAR169-I/6J supports automotive cluster and infotainment modules through its integrated graphics controller, DDR2 DRAM interface for rich frame buffers, and CAN interface for in-vehicle networking. The 200 MHz core renders instrument graphics while the CAN peripheral handles vehicle bus messaging, and HS USB enables media connectivity. Placed as the display controller behind a cluster LCD, it reduces the need for a separate graphics IC. The industrial -40C to +85C grade covers many cabin applications, but designers targeting under-hood or safety-critical functions should select the AEC-Q100 qualified PIC32MZ1025DAR169-V/6J variant instead, which shares the same 169-LFBGA footprint.
Recommandé
IoT Gateways with Local Display
The PIC32MZ1025DAR169-I/6J is well suited to IoT gateways that require a local display because it combines a 10/100 Ethernet MAC, HS USB, and CAN connectivity with an integrated graphics controller in a single 169-LFBGA device. The 200 MHz core runs protocol stacks and a GUI simultaneously, while 640 KB SRAM and the DDR2 controller hold network buffers and frame data. Used as the gateway host processor driving a small LCD, it removes the need for a separate display MCU. The main consideration is power budgeting: the 1.7 V to 1.9 V core plus DDR2 interface draw more current than a displayless gateway, so thermal and supply design must account for continuous graphics activity.
Recommandé
Point-of-Sale and Retail Terminals
The PIC32MZ1025DAR169-I/6J fits point-of-sale and retail terminals because its integrated graphics controller and DDR2 DRAM support drive colorful touchscreen interfaces while the 200 MHz core handles transaction processing and peripheral control. The 12-bit ADC digitizes touch and sensor inputs, and HS USB connects barcode scanners and payment peripherals. Placed as the terminal's main processor behind a touchscreen LCD, it consolidates display and control functions, lowering component count. Designers should note that continuous GUI rendering plus USB traffic raises average power, so the 169-LFBGA thermal pad and copper pour must be sized to keep junction temperature within the -40C to +85C rated range.
Recommandé
Test and Measurement Instruments
The PIC32MZ1025DAR169-I/6J suits test and measurement instruments because the 12-bit 18 MSPS ADC with up to 45 analog inputs captures fast signals while the integrated graphics controller renders measurement traces and menus on an embedded display. The 200 MHz MIPS32 core performs real-time data processing, and 640 KB SRAM buffers acquisition samples. Used as the instrument's host MCU between the analog front end and an LCD, it unifies acquisition, processing, and display. The key trade-off is analog integrity: the ADC's accuracy depends on a clean analog supply and careful ground partitioning, so the digital core and DDR2 switching noise must be isolated from the analog domain on the 169-LFBGA layout.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1025DAR169-I/6J — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1025DAR169T-I/6J | PIC32MZ2025DAR169-I/6J | PIC32MZ2064DAR169-I/6J | PIC32MZ1025DAS169-I/6J |
|---|---|---|---|---|---|
| Package | 169-LFBGA (11x11) | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Program Memory | 1 MB | 1 MB | 2 MB | 2 MB | 1 MB |
| SRAM | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB |
| Maximum CPU Speed | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Graphics Controller | Integrated 2D GPU | Integrated 2D GPU | Integrated 2D GPU | Integrated 2D GPU | Reduced graphics feature subset |
| Core Supply Voltage | 1.7 V to 1.9 V | 1.7 V to 1.9 V | 1.7 V to 1.9 V | 1.7 V to 1.9 V | 1.7 V to 1.9 V |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Principaux différenciateurs
- Integrated 2D GPU with DDR2 controller (vs PIC32MZ1025DAS169-I/6J)
- Higher Flash density options in same footprint (vs PIC32MZ2025DAR169-I/6J)
- Tape-and-reel packaging interchangeability (vs PIC32MZ1025DAR169T-I/6J)
Notes de conception
The 169-LFBGA (11x11 mm) uses a 0.65 mm ball pitch, which typically requires via-in-pad or dogbone fanout with laser-drilled microvias. Route the DDR2 data and address buses with matched trace lengths and controlled 50 ohm impedance to preserve signal integrity at the memory clock rate. Keep the DDR2 traces on a single layer where possible and reference them to a solid ground plane to minimize crosstalk.
The 1.7 V to 1.9 V core rail must be tightly regulated and well decoupled. Place 0.1 uF ceramic capacitors at each VDD core ball and bulk 10 uF capacitors near the package corners. Estimated: at 200 MHz with graphics active, core current can reach several hundred milliamps, so size the regulator and copper for the worst-case graphics workload, not the idle current. Keep the analog supply for the 12-bit ADC separate and filtered.
The 12-bit 18 MSPS ADC with up to 45 analog inputs requires a clean analog reference and ground partition. Route analog inputs away from the DDR2 and core switching domains, and use a star ground or split-plane approach with a single-point connection between analog and digital grounds. Bypass the ADC reference with a low-ESR capacitor placed as close to the pin as possible to preserve conversion accuracy.
The 169-LFBGA has limited thermal mass, so continuous graphics rendering plus DDR2 activity can raise junction temperature. Estimated: with a typical theta-JA for an 11x11 mm LFBGA and several hundred milliwatts of dissipation, provide a thermal pad and copper pour on the PCB underside connected by thermal vias. Verify junction temperature stays within the -40C to +85C rated range under the maximum graphics workload.
Informations de conformité
RoHS compliant per distributor listing. The I-suffix industrial variant is not AEC-Q100 qualified; the V-temp variant PIC32MZ1025DAR169-V/6J is the automotive-grade option. REACH, lead-free, halogen-free, and conflict-minerals status not stated in the provided data.