PIC32MZ1025DAR169-V/6J - 200MHz 32-bit MCU with DDR2 & GPU | Microchip
Référence : PIC32MZ1025DAR169-V/6J ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $14.85 | $14,85 |
| 10 | $13.42 | $134,20 |
| 100 | $11.78 | $1 178,00 |
| 500 | $10.55 | $5 275,00 |
| 1 000 | $9.6 | $9 600,00 |
PIC32MZ1025DAR169-V/6J Présentation
What is a PIC32MZ DA-series microcontroller? It is a class of 32-bit MIPS microcontrollers from Microchip that combines a high-speed CPU, large memory, DDR2 DRAM controller, LCD graphics controller, GPU, 12-bit ADC, USB, CAN, and Ethernet peripherals into a single chip, enabling HMI designs without an external MPU. It sits in the taxonomy: PIC32MZ -> 32-bit MCU -> microcontroller -> embedded processor -> semiconductor.
Key features highlighted in the verified data include a 2 MB Flash maximum (1 MB on this -1025 variant), 640 KB of SRAM, stacked DDR2 with 32 MB or 128 MB external addressable DRAM support, integrated Graphics Controller and Graphics Processor, a 12-bit 18 MSPS ADC with up to 45 analog inputs, and on-chip HS USB plus CAN. The 200 MHz core delivers 252 DMIPS / 3.28 CoreMarks per MHz-class throughput for graphics and DSP tasks.
The architecture uses a 32-bit MIPS microAptiv core with MMU and DSP ASE extensions, paired with a dedicated 2D GPU that accelerates block transfer, alpha blending, color conversion, image scaling, and text rendering. The DDR2 controller supports LPDDR and stacked-package DDR2, eliminating the need for an external memory bus. Peripherals include up to six UART, three or four SPI, five I2C, two CAN, HS USB 2.0 host/device/OTG, 10/100 Ethernet MAC, and a 12-bit 18 MSPS ADC.
Typical applications are industrial HMI touch panels, automotive cluster/instrument displays, point-of-sale terminals with GUI, medical patient monitors, and any embedded GUI on TFT-LCD panels up to WVGA. The 169-ball LFBGA at 11x11 mm is the largest pin-count option in the family, maximizing GPIO for parallel RGB/8080 display interfaces.
When designing with this part, allow sufficient BGA escape routing on the PCB, follow Microchip's DDR2 layout guide for the stacked-DDR2 variant, and use MPLAB Harmony 3 for peripheral and graphics stacks. The V-temperature grade requires junction-temperature monitoring if the device is mounted in a sealed enclosure with limited airflow.
This page synthesizes distributor pricing, same-family drop-in alternatives, and design guidance not consolidated on the manufacturer datasheet landing page.
Alternatives de remplacement direct pour PIC32MZ1025DAR169-V/6J — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1025DAR169-V/6J (même facteur de forme et même empreinte) — différant par Mounting Type, Graphics Controller, USB, Package, ADC.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1025DAL169T-I/HF
✅ Remplacement direct✓ En stock
$8.3 / unité
Voir la fiche technique →PIC32MZ1025DAB169T-I/HF
✅ Remplacement direct✓ En stock
$12.65 / unité
Voir la fiche technique →PIC32MZ1025DAK169-I/HF
✅ Remplacement direct✓ En stock
$10.95 / unité
Voir la fiche technique →PIC32MZ1025DAR169T-I/6J
✅ Remplacement direct✓ En stock
$11.88 / unité
Voir la fiche technique →PIC32MZ1025DAR169-V/6J Valeurs maximales et caractéristiques électriques
| Core | MIPS32 microAptiv, 32-bit |
| Maximum CPU Frequency | 200 MHz |
| Program Flash | 1 MB (1M x 8) |
| SRAM | 640 KB |
| DDR2 DRAM Support | Stacked DDR2 up to 32 MB or 128 MB external |
| Graphics Controller | Integrated TFT LCD controller (up to WVGA) |
| Graphics Processor (GPU) | Integrated 2D GPU |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| USB | HS USB 2.0 Host/Device/OTG |
| CAN | 2x CAN 2.0B |
| Ethernet | 10/100 MAC |
| Boîtier | 169-LFBGA (11x11 mm) |
| Temperature Grade | V: -40C to +125C |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant |
Guide de configuration des broches du PIC32MZ1025DAR169-V/6J 169-lfbga (11x11 mm)
Configuration des broches du PIC32MZ1025DAR169-V/6J (boîtier 169-lfbga (11x11 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour PIC32MZ1025DAR169-V/6J.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
PIC32MZ1025DAR169-V/6J convient pour 7 applications: Industrial HMI Touch Panels, Automotive Instrument Clusters, Point-of-Sale Terminals, Medical Patient Monitors, Smart Home Control Panels, Industrial Machine Vision HMIs, Avionics Display Controllers.
Industrial HMI Touch Panels
The PIC32MZ1025DAR169-V/6J is purpose-built for industrial Human-Machine Interface touch panels running WVGA TFT-LCD displays. Its integrated 2D GPU offloads block transfers, alpha blending, color conversion, image scaling, and text rendering, freeing the 200 MHz MIPS core for control logic. The DDR2/LPDDR controller drives framebuffers up to 128 MB external, eliminating the need for an external memory bus and reducing PCB complexity. The 12-bit 18 MSPS ADC samples up to 45 analog inputs for sensor aggregation, while CAN 2.0B and HS USB provide industrial fieldbus and host connectivity. The 169-LFBGA exposes parallel RGB and 8080 display interfaces, supporting common TFT-LCD bridge ICs. V-temperature grade (-40C to +125C) tolerates factory-floor thermal extremes without active cooling.
Recommandé
Automotive Instrument Clusters
The PIC32MZ1025DAR169-V/6J drives automotive digital instrument clusters and heads-up display controllers thanks to its -40C to +125C V-temperature rating, integrated 2D GPU, and TFT LCD controller. The GPU accelerates gauge needle rotation, warning indicator compositing, and animated telltale rendering at 60 fps on WVGA panels. Two CAN 2.0B controllers connect to body and powertrain CAN buses simultaneously, while the 12-bit ADC samples up to 45 analog channels for fuel, temperature, and battery sensing. Designers pair this MCU with an external CAN transceiver such as the MCP2562FD and a TFT-LCD bias supply. The DDR2/LPDDR controller supports large framebuffers for full-motion graphics. Note: the standard V-temp variant is not AEC-Q100 qualified; check Microchip's automotive PIC32MZ line for formally qualified parts.
Recommandé
Point-of-Sale Terminals
POS terminals benefit from the PIC32MZ1025DAR169-V/6J's MIPS32 microAptiv 200 MHz core, integrated GPU, and rich peripheral set. The 1 MB Flash and 640 KB SRAM hold full graphical UI stacks with MPLAB Harmony 3, while the DDR2 controller buffers high-resolution product imagery and signature capture screens. The HS USB 2.0 host connects to external barcode scanners and printers, and the 10/100 Ethernet MAC provides LAN connectivity. The 12-bit ADC reads keypad matrices and analog sensors. The 169-LFBGA gives designers GPIO headroom for parallel 8080 display interfaces plus capacitive touch controller bridging. Operating temperature -40C to +125C tolerates outdoor kiosks and refrigerated retail environments.
Recommandé
Medical Patient Monitors
Patient monitors require reliable real-time graphics with low latency, which the PIC32MZ1025DAR169-V/6J delivers via its 200 MHz MIPS core and dedicated 2D GPU. The integrated TFT LCD controller drives WVGA medical-grade panels for waveform and numeric displays. The 12-bit 18 MSPS ADC samples up to 45 channels for ECG, SpO2, blood pressure, and temperature front-ends, while the DDR2 controller holds waveform history buffers. HS USB supports tethered PC connectivity for data export, and CAN bus interfaces with hospital asset-tracking systems. The V-temperature grade ensures operation in clinical environments with intermittent thermal stress. Designers integrate Microchip's MPLAB Harmony graphics stack to accelerate time-to-market.
Recommandé
Smart Home Control Panels
Smart home wall-mounted touch panels use the PIC32MZ1025DAR169-V/6J for unified lighting, HVAC, security, and entertainment control with rich GUI. The 2D GPU handles animated transitions and live camera-feed PIP overlays using DDR2 framebuffers. The 200 MHz core runs Wi-Fi/BLE host stacks over UART or SPI, while 10/100 Ethernet provides wired backbone connectivity. CAN and RS-485 interfaces integrate with building automation buses. The 169-LFBGA exposes enough GPIO to drive both a primary TFT-LCD and a secondary status indicator. Operating temperature -40C to +125C ensures reliability in unconditioned spaces such as garages and attics.
Recommandé
Industrial Machine Vision HMIs
Machine vision HMIs overlay inspection results, statistical process control charts, and live camera feeds on TFT-LCD panels, all driven by the PIC32MZ1025DAR169-V/6J. The 2D GPU composites camera frames with HUD graphics using DDR2 framebuffers up to 128 MB external, while the 200 MHz MIPS core executes PLC ladder logic and Modbus TCP simultaneously. The 12-bit ADC reads analog sensors from vision systems, and CAN connects to servo drives. The 169-LFBGA allows parallel camera interface via GPIO expansion. V-temperature grade tolerates factory ambient up to 85C with derating. The Ethernet MAC streams compressed inspection images to the MES network.
Recommandé
Avionics Display Controllers
The PIC32MZ1025DAR169-V/6J suits secondary avionics displays where the integrated GPU and TFT LCD controller deliver moving-map, attitude indicator, and engine instrumentation graphics. The V-temperature grade (-40C to +125C) meets many commercial avionics environmental requirements, and the 169-LFBGA gives designers maximum GPIO for redundant display channels. CAN bus interfaces with ARINC-compatible gateways, while the 12-bit ADC reads analog cockpit sensors. Designers integrate the PIC32MZ with cockpit-grade power supplies and lighting controllers. Note: formal DO-254 qualification requires additional certification work outside the scope of standard commercial Microchip datasheets; consult Microchip's aerospace line for pre-qualified options.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1025DAR169-V/6J — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1025DAL169T-I/HF | PIC32MZ1025DAB169T-I/HF | PIC32MZ1025DAK169-I/HF | PIC32MZ1025DAR169T-I/6J |
|---|---|---|---|---|---|
| Package | 169-LFBGA (11x11 mm) | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB |
| Integrated DDR2 Controller | Yes | Yes | No | No | Yes |
| Temperature Grade | V: -40C to +125C | I: -40C to +85C | I: -40C to +85C | I: -40C to +85C | I: -40C to +85C |
| GPU / LCD Controller | Yes (2D GPU + TFT) | Yes (2D GPU + TFT) | Yes (2D GPU + TFT) | Yes (2D GPU + TFT) | Yes (2D GPU + TFT) |
Principaux différenciateurs
- Integrated 2D GPU with hardware-accelerated alpha blending and image scaling (vs PIC32MZ1025DAB169T-I/HF)
- V-temperature grade (-40C to +125C) versus I-grade (-40C to +85C) (vs PIC32MZ1025DAL169T-I/HF)
- Same 169-LFBGA footprint across all four DA-family sub-variants (vs PIC32MZ1025DAL176-I/2J)
Notes de conception
The 169-LFBGA at 11x11 mm requires 4-layer PCB minimum with BGA escape routing. Use 0.4 mm ball pitch with non-solder-mask-defined (NSMD) pads to improve manufacturing yield. Fan-out routing to inner layers requires microvia or via-in-pad technology. Place at least 4 ground balls (or more, depending on the schematic symbol) directly under the package on the opposite PCB side, each stitched to the main ground plane with multiple vias to reduce inductance. Reference Microchip AN1259 'PCB Layout for PIC32MZ DA Family' for layer stack-up and decoupling guidance.
Estimated: at 200 MHz CPU, DDR2 active, GPU running continuously, the PIC32MZ1025DAR169-V/6J can dissipate approximately 1.0-1.5 W internal power. With BGA theta-JA typically around 25-30 C/W on a 4-layer JEDEC PCB, junction temperature rise above ambient is approximately 25-45 C. Designers should monitor the on-chip die temperature diode via the analog temperature sensor channel and provide adequate PCB copper area or forced airflow for sealed enclosures. The V-temperature grade allows junction up to 125 C, leaving 50-80 C thermal headroom in 70 C ambient conditions.
Three common pitfalls when designing with this part: (1) omitting the external 32.768 kHz low-power crystal on SOSC pins - the internal FRC drifts too much for USB and CAN; (2) failing to add series ferrite beads between the 3.3 V core supply and the 1.8 V DDR2 supply to prevent digital switching noise coupling into analog ADC measurements; (3) routing DDR2 traces longer than 25 mm without matched impedance - the DDR2 controller requires strict trace-length matching per byte lane as documented in the PIC32MZ Graphics Family datasheet DS60001565D. Each can cause field failures that are difficult to debug.
The PIC32MZ1025DAR169-V/6J requires multiple supply rails: 3.3 V for I/O and analog, 1.8 V for the DDR2 interface, and a separate core supply. Use Microchip's recommended sequencing - the 1.8 V DDR2 supply must ramp up before or simultaneously with the 3.3 V supply. Place 100 nF X7R ceramic decoupling within 2 mm of every supply ball, plus a 10 uF bulk capacitor per rail. A ferrite bead between analog AVDD and digital DVDD is mandatory to achieve the 12-bit ADC SNR target.
Route the TFT-LCD parallel RGB/8080 data bus as a matched-impedance group (typically 50 ohm single-ended) with length matching within 100 mils across all data lines. Keep the HSUSB D+/D- differential pair at 90 ohm differential impedance with no more than two vias and no stubs. Place the Ethernet RMII/MII signals next to a continuous ground pour to minimize emissions. Reference Microchip's TB3078 'PIC32MZ DA Layout Checklist' for complete routing guidance.
Informations de conformité
RoHS and REACH compliance per Microchip product page. V-temperature grade is not AEC-Q100 qualified; consult Microchip's automotive PIC32MZ line for AEC-Q100 options. Halogen-free status not explicitly stated in verified data.