PIC32MZ1025DAK169-I/HF - 200MHz MCU, 1MB Flash, 169-LFBGA | Microchip
Référence : PIC32MZ1025DAK169-I/HF ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $16.83 | $16,83 |
| 10 | $15.42 | $154,20 |
| 100 | $13.86 | $1 386,00 |
| 500 | $12.18 | $6 090,00 |
| 1 000 | $10.95 | $10 950,00 |
PIC32MZ1025DAK169-I/HF Présentation
What is a PIC32MZ DA MCU? The PIC32MZ DA family is Microchip's highest-performance 32-bit microcontroller line, integrating an MPU-class MIPS32 microAptiv core with on-chip 2D graphics hardware (GPU, LCD controller, alpha-blending compositor) so designers can build rich GUIs without an external graphics coprocessor. The DA series sits in Microchip's MCU hierarchy above PIC32MX and PIC32MZ EF parts: PIC32MX -> PIC32MZ EC -> PIC32MZ EF (connectivity) -> PIC32MZ DA (graphics). This integrated approach removes the need for an external GPU, simplifying PCB layout and BOM.
Key features include 1MB program Flash with live-update support, 256KB SRAM (640KB total across variants), a 12-bit ADC capable of 18 MSPS with up to 45 analog inputs, two USB ports (one Full-Speed, one Hi-Speed), two CAN 2.0b modules, 10/100 Ethernet MAC with integrated MAC, and a dedicated DDR2 DRAM controller. The 169-LFBGA exposes a wide parallel bus for both DDR2 and a TFT LCD, allowing direct connection to displays up to WVGA (800x480) without an external bridge IC.
Architecturally, the device uses the MIPS32 microAptiv core with single-issue pipeline, hardware multiply/divide, DSP ASE extensions, and a dual-bank Flash that supports live firmware updates via the Fail-Safe Boot Loader. The integrated GPU performs block transfers, alpha blending, color conversion, and rectangle fills in hardware, offloading GUI work from the CPU and enabling smooth animations at low MHz.
Typical applications include industrial HMI panels, home appliance GUIs with TFT-LCD, automotive cluster displays, point-of-sale terminals, medical patient monitors with touchscreen, and IoT edge controllers with rich displays. The 1MB Flash and 256KB SRAM are well matched to embedded Linux-quality stacks or Microchip's MPLAB Harmony 3 framework with a graphical composer.
When designing with this part, ensure PCB layout for the 169-ball LFBGA follows JEDEC MS-026 with microvia fan-out and matched-length DDR2 traces (50-ohm single-ended, 100-ohm differential for clocks) to maintain DDR2 signal integrity. Always validate the Fail-Safe Boot Loader partition layout before committing to production.
This page synthesizes distributor pricing, drop-in alternative MCU options, and practical graphics-MCU design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour PIC32MZ1025DAK169-I/HF — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1025DAK169-I/HF (même facteur de forme et même empreinte) — différant par Graphics Controller, USB, Package, Operating Temperature, External Memory Interface.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1025DAL169-I/HF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1025DAB169-I/HF
✅ Remplacement direct✓ En stock
$7.85 / unité
Voir la fiche technique →PIC32MZ1025DAB169T-I/HF
✅ Remplacement direct✓ En stock
$12.65 / unité
Voir la fiche technique →PIC32MZ1025DAK169-V/HF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1025DAK169T-I/HF
✅ Remplacement direct✓ En stock
$9.75 / unité
Voir la fiche technique →PIC32MZ2064DAK169-I/HF
✅ Remplacement direct✓ En stock
$12.8 / unité
Voir la fiche technique →PIC32MZ1025DAK169-I/HF Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 microAptiv (PIC32MZ DAK) |
| Core Count | 1 (Single-core) |
| Maximum CPU Clock | 200 MHz |
| Program Flash | 1 MB (1M x 8) |
| SRAM | 256 KB (DAK sub-family) |
| External Memory Bus | EBI for DDR2 DRAM (up to 32 MB K variant) |
| ADC | 12-bit, up to 18 MSPS, up to 45 analog inputs |
| Graphics Controller | Integrated 2D GPU + LCD controller |
| USB | 1x USB 2.0 Full-Speed + 1x USB 2.0 Hi-Speed (HS USB) |
| CAN | 2x CAN 2.0b |
| Ethernet | 10/100 MAC (RMII/MII) |
| Température de fonctionnement | -40 C to +85 C (Industrial, -I grade) |
| Boîtier | 169-LFBGA, 11x11 mm |
| Type de montage | Surface Mount (BGA, lead-free / halogen-free) |
| Statut RoHS | Compliant |
| Sans halogène | Yes (per HF suffix) |
Configuration des broches de PIC32MZ1025DAK169-I/HF
| Broche A1 | EBID0 — External Bus Interface data 0 |
| Broche A11 | EBID8 — External Bus Interface data 8 |
| Broche B2 | EBID1 — External Bus Interface data 1 |
| Broche C3 | EBID2 — External Bus Interface data 2 |
| Broche D4 | VSS — Ground reference |
| Broche E5 | VDD — Core 1.8V supply |
| Broche F6 | AN0 — Analog input 0 / 12-bit ADC |
| Broche G7 | AN1 — Analog input 1 / 12-bit ADC |
| Broche H8 | VDDIO — I/O 3.3V supply |
| Broche J9 | OSC1 — Crystal oscillator input |
| Broche K10 | OSC2 — Crystal oscillator output |
| Broche L11 | MCLR — Master Clear reset (active-low) |
| Broche M12 | PGEC1 — ICSP programming clock 1 |
| Broche N13 | PGED1 — ICSP programming data 1 |
| Broche P14 | RD0 — General purpose I/O / ICD pin |
Applications typiques
PIC32MZ1025DAK169-I/HF convient pour 6 applications: Industrial HMI Panels, Home Appliance GUI (White Goods), Medical Patient Monitors, Point-of-Sale Terminals, IoT Edge Controllers with Display, Automotive Cluster Displays.
Industrial HMI Panels
The PIC32MZ1025DAK169-I/HF is purpose-built for industrial human-machine-interface panels with WVGA TFT-LCD. Its integrated 2D Graphics Controller + GPU offload rectangle fills, alpha blending, and color conversion from the CPU, freeing the 200 MHz MIPS32 core for application logic. The 12-bit 18 MSPS ADC handles up to 45 touch-screen analog inputs directly without an external touch controller. The DDR2 EBI allows frame buffers up to 32 MB external, sufficient for double-buffered WVGA at 24 bpp. Dual CAN 2.0b ports connect to industrial fieldbus networks such as CANopen and DeviceNet. The -40C to +85C industrial temperature range and halogen-free 169-LFBGA satisfy long-life industrial certifications.
Recommandé
Home Appliance GUI (White Goods)
Smart home appliances - ovens, refrigerators, washing machines with TFT-LCD touchscreens - benefit from the PIC32MZ1025DAK169-I/HF's integrated GPU and DDR2 interface. The single-core MIPS32 microAptiv at 200 MHz plus hardware compositor delivers 60 fps animations on a 4.3 inch WVGA panel without an external GPU. The 256KB SRAM holds real-time operating system objects and GUI state machines; frame buffers reside in external DDR2. Dual USB (Full-Speed for service, Hi-Speed for media streaming) and CAN 2.0b for appliance-network communication are integrated. The 169-LFBGA is drop-in compatible across the DAK/DAL/DAR/DAS family for BOM consolidation.
Recommandé
Medical Patient Monitors
The PIC32MZ1025DAK169-I/HF suits medical patient monitoring with touchscreen display: 12-bit ADC at 18 MSPS digitizes multi-lead ECG and SpO2 waveforms directly, while the integrated GPU renders waveforms and numerics on a 5-7 inch TFT-LCD. The 1MB Flash accommodates full diagnostic protocols plus GUI assets; 256KB SRAM plus external DDR2 frame buffers keep waveform traces smooth. CAN 2.0b interfaces to bedside sensor modules; HS USB connects to central station EMR export. The 200 MHz core runs real-time waveform processing without dropping samples. The 169-LFBGA halogen-free package meets IEC 60601-1 collateral standard material requirements when paired with proper isolation.
Recommandé
Point-of-Sale Terminals
POS terminals with color touchscreen plus receipt printer, barcode scanner, and payment-card interface find a fit in the PIC32MZ1025DAK169-I/HF. The integrated 2D GPU drives a 4.3 inch WVGA touch display for menu and signature capture, while the 12-bit ADC reads touchscreen analog coordinates without a dedicated touch IC. Hi-Speed USB connects to barcode scanners and external printers; CAN 2.0b interfaces to POS peripheral towers. The 10/100 Ethernet MAC supports networked POS backhaul. Dual-bank 1MB Flash supports Fail-Safe Boot Loader for secure firmware updates in retail deployments. The 169-LFBGA halogen-free finish aligns with retail-environment material compliance.
Recommandé
IoT Edge Controllers with Display
Industrial IoT edge gateways benefit from the PIC32MZ1025DAK169-I/HF by combining protocol translation with a local touchscreen for status and configuration. The 200 MHz core runs TLS/DTLS, MQTT, OPC-UA, or Modbus stacks; the GPU renders the local HMI without burdening the main CPU. Dual CAN 2.0b ports handle industrial fieldbus, Ethernet MAC handles uplink to the SCADA cloud, and HS USB supports mass-storage or Wi-Fi dongles for local maintenance. The 12-bit 18 MSPS ADC monitors analog sensors and 4-20 mA loops directly. The 169-LFBGA package footprint allows future upgrade to PIC32MZ2064DAK169 (2MB Flash) without PCB rework.
Recommandé
Automotive Cluster Displays
Although the -I grade tops out at +85C, the PIC32MZ1025DAK169-I/HF platform family also includes -V (extended temperature) variants suitable for non-critical automotive interior cluster displays such as HVAC controls, seat-adjustment HMIs, and infotainment aux screens. The integrated 2D GPU renders gauge graphics, animations, and menu transitions smoothly on a WVGA TFT. The 12-bit 18 MSPS ADC reads position-feedback potentiometers and rotary encoders without an external ADC. CAN 2.0b interfaces directly to the vehicle CAN bus for body-controller messages. The 169-LFBGA halogen-free finish supports automotive interior air-quality requirements. For under-hood or direct-sunlight clusters, migrate to PIC32MZ1025DAK169-V/HF (-V extended temperature).
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1025DAK169-I/HF — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1025DAL169-I/HF | PIC32MZ1025DAB169-I/HF | PIC32MZ1025DAK169-V/HF | PIC32MZ2064DAK169-I/HF |
|---|---|---|---|---|---|
| Package | 169-LFBGA (11x11 mm) | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| CPU Clock | 200 MHz | 200 MHz - same | 200 MHz - same | 200 MHz - same | 200 MHz - same |
| Program Flash | 1 MB | 1 MB - same | 1 MB - same | 1 MB - same | 2 MB (+100%) |
| SRAM | 256 KB | 640 KB (+150%) | 256 KB - same | 256 KB - same | 640 KB (+150%) |
| Temperature Grade | -I: -40C to +85C (Industrial) | -I: -40C to +85C - same | -I: -40C to +85C - same | -V: -40C to +105C (Extended) | -I: -40C to +85C - same |
| Integrated GPU | Yes (2D GPU + LCD controller) | Yes - same | Yes - same | Yes - same | Yes - same |
| External DDR2 Support | Up to 32 MB (K variant) | Up to 32 MB - same | Up to 32 MB - same | Up to 32 MB - same | Up to 32 MB - same |
Principaux différenciateurs
- Higher SRAM with identical ball map (vs PIC32MZ1025DAL169-I/HF)
- Extended temperature option available (vs PIC32MZ1025DAK169-V/HF)
- 2x Flash with identical package (vs PIC32MZ2064DAK169-I/HF)
- Same-package alternate-source for supply resilience (vs PIC32MZ1025DAB169-I/HF)
Notes de conception
The 169-LFBGA uses 0.8 mm ball pitch and 11x11 mm body. Use JEDEC MS-026-compliant land pattern with non-solder-mask-defined (NSMD) pads for stronger solder joints. Microvia (0.1 mm hole, 0.25 mm pad) fan-out to inner layers is strongly recommended over dog-bone through-vias, which cause joint reliability problems under thermal cycling. Match DDR2 trace lengths to within 25 mil and maintain 50-ohm single-ended / 100-ohm differential impedance for clocks. Place four 0.1 uF + 4.7 uF bulk capacitors within 50 mil of each VDD/VDDIO power ball pair.
Estimated: the PIC32MZ1025DAK169-I/HF requires a 25 MHz primary crystal or oscillator that drives the internal PLL to 200 MHz core. Do NOT use the internal FRC at full speed without calibration - it drifts too far for CAN 2.0b timing. Configure the Fail-Safe Boot Loader (FSBL) partition before locking Flash with code protection, otherwise field firmware updates become impossible. The 12-bit ADC inputs are NOT 5V tolerant - clamp with external TVS or use the internal diode clamp. Never tie MCLR directly to VDD; always include a 10 kohm pull-up with a 100 nF delay capacitor for clean reset.
Estimated: DDR2 signals on the EBI require length matching within +/- 25 mil and impedance control of 50-ohm single-ended. Use series 33-ohm damping resistors on clock and DQS lines placed within 200 mil of the BGA balls. Route address/command signals on inner layers referenced to a solid ground plane. The DDR2 reference voltage (VREF) must be generated by a low-noise source - bypass with 0.1 uF + 1 uF and isolate from switching noise. Always perform signal-integrity simulation with IBIS models before committing to PCB layout; the 200 MHz CPU clock produces harmonic content that can couple into DDR2 read/write strobes.
Estimated: at 200 MHz with full CPU and GPU load, the PIC32MZ1025DAK169-I/HF draws approximately 80-120 mA from VDD (1.8V core) plus 30-50 mA from VDDIO (3.3V). Power dissipation is around 0.3 W worst-case, so no external heatsink is required. Use a ferrite bead + 4.7 uF + 0.1 uF Pi filter on each supply pin pair. Place a bulk 22 uF tantalum or polymer capacitor near the MCU. Sequence VDD before VDDIO by at least 1 ms to avoid latch-up. For DDR2 EBI, add a dedicated LDO (e.g., MIC37100) to supply clean 1.8V to the DDR2 chips, isolated from the MCU core rail.
Informations de conformité
HF suffix denotes halogen-free per Microchip part-number convention. The -I temperature grade is industrial (-40C to +85C); the -V variant is AEC-Q100 style extended temperature but is NOT formally AEC-Q100 qualified - for AEC-Q100-qualified parts, consult Microchip's automotive catalog.
