PIC32MZ1025DAR176T-V/2J - 200MHz MCU, 1MB Flash, Graphics + DDR2 | Microchip
Référence : PIC32MZ1025DAR176T-V/2J ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $19.5 | $19,50 |
| 10 | $17.85 | $178,50 |
| 100 | $15.2 | $1 520,00 |
| 500 | $13.4 | $6 700,00 |
| 1 000 | $12.1 | $12 100,00 |
PIC32MZ1025DAR176T-V/2J Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), working memory (SRAM), and a rich set of peripherals (timers, ADC, communication controllers, GPIO) on one die. Within the broader taxonomy, the PIC32MZ DA family sits at the intersection of microcontroller -> 32-bit MCU -> MIPS-based MCU -> graphics-capable MCU, bridging MCU ease-of-use and MPU-class performance for embedded HMI (human-machine interface) workloads.
Key features include an integrated 2D Graphics Controller and Graphics Processor for hardware-accelerated rendering, stacked DDR2 DRAM (32 MB or 128 MB options) for large display framebuffers, a 12-bit 18 MSPS ADC with up to 45 analog inputs, High-Speed USB 2.0, CAN, and multiple serial interfaces. The 200 MHz core delivers 410 DMIPS / 3.28 CoreMark/MHz performance suitable for HMI, industrial control, and gateway nodes.
Architecturally, the PIC32MZ DA family pairs the MIPS32 microAptiv core with a dedicated graphics pipeline (BLT, fill, stretch, transparency) and an external DDR2 memory controller, allowing designers to drive TFT LCD panels up to WVGA resolution without an external graphics controller IC. A 32-channel DMA engine offloads data movement from the CPU.
Typical applications include industrial HMI panels, medical patient monitors, home-appliance graphical user interfaces, in-flight entertainment remotes, and automotive dashboard prototypes. The wide operating temperature range and automotive-grade option make it suited for harsh-environment deployments.
When designing with this device, allocate adequate PCB area for the LQFP-176 footprint and follow the DDR2 routing guidelines in the family reference manual; signal integrity on the DDR2 bus is the most common pitfall. Provide a clean 3.3 V rail with bulk decoupling near the MCU and DDR2 supply pins.
This page synthesizes distributor pricing, drop-in same-family alternatives from the Microchip PIC32MZ DA family, and practical design notes beyond the manufacturer datasheet to accelerate your embedded GUI design.
Alternatives de remplacement direct pour PIC32MZ1025DAR176T-V/2J — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1025DAR176T-V/2J (même facteur de forme et même empreinte) — différant par Graphics Controller, Core Architecture, Package, CAN, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1025DAR176-V/2J
✅ Remplacement direct✓ En stock
$15.92 / unité
Voir la fiche technique →PIC32MZ1025DAL176-I/2J
✅ Remplacement direct✓ En stock
$5.5 / unité
Voir la fiche technique →PIC32MZ1025DAK176
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1025DAB176T-I/2J
✅ Remplacement direct✓ En stock
$21.75 / unité
Voir la fiche technique →PIC32MZ1025DAR176T-V/2J Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 microAptiv (32-bit) |
| Family | PIC32MZ Graphics (DAK/DAL/DAR/DAS) |
| Series | PIC32MZ DA - DAR sub-family |
| Maximum Core Frequency | 200 MHz |
| Program Memory (Flash) | 1 MB |
| Data Memory (SRAM) | 640 KB |
| External Memory Interface | DDR2 DRAM controller (stacked 32 MB or 128 MB) |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| Graphics Controller | Integrated 2D Graphics Controller + Graphics Processor |
| USB | Hi-Speed USB 2.0 |
| CAN | Yes (CAN) |
| Boîtier | 176-LQFP (20x20 mm) |
| Température de fonctionnement | -40C to +105C (V-temp) |
| Temperature Grade | Automotive (V-temp suffix) |
| DMA Channels | 32 channels |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MZ1025DAR176T-V/2J
| Broche 1 | RG15 — General purpose I/O pin (RG15) |
| Broche 2 | RG14 — General purpose I/O pin (RG14) |
| Broche 3 | VDD — Core supply voltage |
| Broche 4 | RG13 — General purpose I/O pin (RG13) |
| Broche 5 | RG12 — General purpose I/O pin (RG12) |
| Broche 6 | RG11 — General purpose I/O pin (RG11) |
| Broche 7 | RG10 — General purpose I/O pin (RG10) |
| Broche 8 | RG9 — General purpose I/O pin (RG9) |
| Broche 9 | MCLR — Master Clear (Reset) input |
| Broche 10 | RG8 — General purpose I/O pin (RG8) |
| Broche 20 | RG0 — General purpose I/O pin (RG0) |
| Broche 50 | VSS — Ground reference |
| Broche 80 | AVDD — Analog supply voltage |
| Broche 100 | DD2_DQ0 — DDR2 data line DQ0 |
| Broche 120 | DD2_A0 — DDR2 address line A0 |
| Broche 140 | DD2_DQS — DDR2 data strobe |
| Broche 160 | LCD_DATA0 — LCD data line (parallel interface) |
| Broche 170 | LCD_HSYNC — LCD horizontal sync |
| Broche 175 | VBUS — USB VBUS sense |
| Broche 176 | VDD — Core supply voltage |
Applications typiques
PIC32MZ1025DAR176T-V/2J convient pour 6 applications: Industrial HMI Panel, Medical Patient Monitor Display, Home Appliance Graphical Interface, Automotive Infotainment Prototype, In-Flight Entertainment Remote, Building Automation Touch Panel.
Industrial HMI Panel
The PIC32MZ1025DAR176T-V/2J is well suited for industrial HMI panels thanks to its integrated 2D Graphics Controller and stacked DDR2 (32 MB or 128 MB) which can hold full WVGA framebuffers without external memory ICs. The 200 MHz MIPS32 microAptiv core delivers 410 DMIPS, providing enough compute for touch handling, protocol stacks, and screen rendering in parallel. The 176-LQFP package supports the large pin count needed to drive parallel RGB888 TFT panels directly. The V-temp grade (-40C to +105C) covers factory-floor thermal envelopes. Designers pair this MCU with a 4.3" to 7" WVGA TFT, an external touch controller over I2C/SPI, and FreeRTOS or Harmony 3 for the application stack.
Recommandé
Medical Patient Monitor Display
The PIC32MZ1025DAR176T-V/2J fits medical patient monitor displays that require a clean graphical interface for waveforms, numerics, and alarms. Its 12-bit 18 MSPS ADC with up to 45 analog inputs handles multi-channel vital-sign acquisition (ECG, SpO2, temperature) without an external ADC. The integrated Graphics Processor accelerates panel updates while the CPU runs the clinical algorithm. The 640 KB SRAM plus stacked DDR2 provides ample framebuffer headroom for layered graphical UIs with transparency. Note that medical certifications (IEC 60601-1) are system-level and depend on the overall design, not the MCU alone; V-temp grade supports the operating range but does not by itself confer medical certification.
Recommandé
Home Appliance Graphical Interface
The PIC32MZ1025DAR176T-V/2J enables premium graphical interfaces on washing machines, refrigerators, and ovens where animated menus, icons, and touch feedback improve user perception. The integrated Graphics Controller handles common BLT operations, fill, and transparency without CPU overhead, allowing the 200 MHz core to focus on user-input handling and motor-control loops. The high GPIO count of the 176-LQFP package accommodates multiple capacitive-touch I2C lines, encoder inputs, and HVAC relay controls. Cost-sensitive variants exist in the DAL/DAB sub-families sharing the same footprint. Designers typically use MPLAB Harmony 3 with the Touch and Graphics libraries to reduce firmware development time.
Recommandé
Automotive Infotainment Prototype
The PIC32MZ1025DAR176T-V/2J supports prototype automotive infotainment clusters and HVAC-control displays with rich graphical content. The V-temp grade (-40C to +105C) covers cabin and engine-bay-adjacent thermal envelopes, and the PIC32MZ DA family is designed for harsh-environment GUI workloads. Integrated Hi-Speed USB 2.0 and CAN enable direct connection to infotainment networks. The stacked DDR2 eliminates external memory ICs, reducing PCB area. Note that production automotive programs typically require AEC-Q100 qualification at the system level; the DAR sub-family offers automotive temperature grade but full AEC-Q100 status should be confirmed with Microchip for the specific silicon revision.
Recommandé
In-Flight Entertainment Remote
The PIC32MZ1025DAR176T-V/2J fits in-flight entertainment (IFE) seatback remotes and cabin-crew tablets that combine a graphics display with wireless control. The MIPS32 microAptiv core plus Graphics Controller can drive a secondary TFT for media browsing while maintaining Wi-Fi/Bluetooth connectivity via companion modules. The wide operating temperature range and low-power modes suit the intermittent-duty profile of IFE remotes. The 176-LQFP package exposes enough GPIO for keypad scanning, battery monitoring, and IR transmit/receive. Designers pair this MCU with a small TFT, capacitive-touch controller, and an SD card slot for offline media.
Recommandé
Building Automation Touch Panel
The PIC32MZ1025DAR176T-V/2J enables premium building-automation touch panels that combine lighting, HVAC, and security control into a single graphical interface. Its 200 MHz performance supports smooth animations while the integrated 2D Graphics Processor handles layered transparency and alpha blending without CPU intervention. The CAN and Hi-Speed USB 2.0 interfaces connect to building-management networks and commissioning tools. The stacked DDR2 (32 MB or 128 MB) supports large facility-floorplan graphics with zoom and pan. The V-temp grade covers unconditioned mechanical-room environments. Designers use MPLAB Harmony 3 with the CANplus graphics stack for fast time-to-deployment.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1025DAR176T-V/2J — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1025DAR176-V/2J | PIC32MZ1025DAL176-I/2J | PIC32MZ1025DAK176 | PIC32MZ1025DAB176T-I/2J | PIC32MZ1025DAR169 |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 176-LQFP (20x20) | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 169-LQFP - different |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB |
| External Memory | Stacked DDR2 (32/128 MB) | Stacked DDR2 (32/128 MB) | Stacked DDR2 (32/128 MB) | Stacked DDR2 (32/128 MB) | Stacked DDR2 (32 MB) | Stacked DDR2 (32/128 MB) |
| Temperature Grade | V-temp (-40C to +105C) | V-temp (-40C to +105C) | I-temp (-40C to +85C) | V-temp variant | I-temp (-40C to +85C) | I-temp variant |
| Graphics Controller | Integrated 2D GPU + GFX | Integrated 2D GPU + GFX | Integrated 2D GPU + GFX | Integrated 2D GPU + GFX | Integrated 2D GPU + GFX (subset) | Integrated 2D GPU + GFX |
Principaux différenciateurs
- Automotive-grade V-temp qualification (vs PIC32MZ1025DAL176-I/2J)
- Tape-and-reel packaging for high-volume assembly (vs PIC32MZ1025DAR176-V/2J)
- Full 176-pin GPIO exposure vs reduced-pin DAB variant (vs PIC32MZ1025DAB176T-I/2J)
Notes de conception
Provide separate analog (AVDD) and digital (VDD) supplies with ferrite-bead isolation; place 10 uF bulk + 100 nF decoupling per supply pin within 5 mm. The stacked DDR2 DRAM draws significant current during refresh; size the 3.3 V regulator to support peak transient loads of 400-600 mA. Enable all unused peripherals' bits in the peripheral clock gating register to minimize quiescent current; refer to the family reference manual's PMD (Peripheral Module Disable) section.
DDR2 signal integrity is the most common pitfall with the PIC32MZ DA family. Route DDR2 traces with matched lengths within the tolerances specified in the family reference manual (clock-to-DQS skew typically <50 ps. Use controlled-impedance routing (50 ohm single-ended, 100 ohm differential for DQS/DQS#) and place a 4.7 nF decoupling capacitor per DDR2 supply pin. Avoid routing DDR2 signals across power-plane splits.
Allocate a 4-layer PCB minimum (signal/ground/power/signal) for the LQFP-176 footprint with 0.5 mm pitch; consider via-in-pad with filled and plated-over vias for breakout routing. Keep the DDR2 trace lengths as short as possible. Provide adequate copper pour on the top and bottom layers under the LQFP exposed thermal pad (if present) to dissipate ~1 W at full CPU load. Follow the Microchip-supplied Altium Designer or KiCad reference layouts.
Do not skip the DDR2 initialization sequence in the Harmony 3 BSP; without it, code fetches from external memory will fault. Ensure the MCLR pin has a proper 10 kohm pull-up and a 100 nF decoupling cap to VSS. The HS USB requires a 48 MHz clock-accurate source; use the on-chip PLL with a high-precision crystal. Configure the JTAG/SWD pins for boundary-scan or trace as needed by your programming/debug probe.
Informations de conformité
RoHS and lead-free per Microchip product page; AEC-Q100 status is system-level and not stated in family datasheet excerpt provided. V-temp grade qualifies the operating range but is not equivalent to AEC-Q100.