PIC32MZ1025DAR176-V/2J - 200MHz MCU, 1MB Flash, 176-LQFP | Microchip
Référence : PIC32MZ1025DAR176-V/2J ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $24.85 | $24,85 |
| 10 | $22.41 | $224,10 |
| 100 | $19.78 | $1 978,00 |
| 500 | $17.63 | $8 815,00 |
| 1 000 | $15.92 | $15 920,00 |
PIC32MZ1025DAR176-V/2J Présentation
What is a 32-bit graphics microcontroller? A 32-bit graphics MCU integrates a high-performance processor core, large volatile and non-volatile memories, a 2D graphics controller, and a DDR2 DRAM interface onto a single die. Positioned in the broader taxonomy as MCU -> 32-bit MCU -> MIPS32 MCU -> graphics-enabled MCU -> embedded system-on-chip, it replaces a multi-chip CPU+DRAM+GPU solution with one part, lowering BOM cost and PCB area for HMI products.
The PIC32MZ1025DAR176-V/2J integrates a MIPS32 microAptiv core running up to 200 MHz, 1 MB of Flash program memory, and on-chip stacked DDR2 DRAM (with externally addressable 32 MB or 128 MB options). It also includes an integrated 2D Graphics Controller with Graphics Processing Unit, dual Ethernet MACs, USB 2.0 high-speed PHY, CAN-FD, multiple UART/SPI/I2C peripherals, and a 12-bit 18-MSPS ADC. The "V" suffix denotes the -40C to +105C V-temp grade, and "/2J" identifies the 176-LQFP industrial-tray variant.
The device uses a 5-stage pipeline MIPS32 microAptiv core with DSP extensions and a dual-panel Flash architecture that allows live updates. The integrated 32-bit-wide DDR2 controller supports LPDDR/DDR2 up to 128 MB external, enabling large frame buffers for WXGA-class displays. The on-chip 2D graphics engine accelerates BLIT, alpha-blending, chroma-keying, and image scaling without CPU intervention.
Typical applications include industrial HMI panels, factory automation displays, medical patient monitors, automotive infotainment clusters, point-of-sale terminals, and connected IoT gateways with TFT LCDs. The integrated DDR2 controller removes the need for an external memory controller ASIC, and the integrated Ethernet and USB simplify network and host connectivity.
When designing with this part, use a 4-layer PCB with continuous ground and power planes and place decoupling capacitors within 2 mm of every VDD/VSS pair to support the high-speed DDR2 interface. Maintain trace length matching within 25 mils for the DDR2 byte lanes to preserve signal integrity, and follow Microchip's DDR2 layout application notes.
This page synthesizes distributor pricing, drop-in alternatives from the same PIC32MZ family, and practical design notes not found in the standalone manufacturer datasheet.
Alternatives de remplacement direct pour PIC32MZ1025DAR176-V/2J — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1025DAR176-V/2J (même facteur de forme et même empreinte) — différant par Graphics Controller, CAN, USB, External Memory Interface, Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1025DAR176-I/2J
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1025DAL176-I/2J
✅ Remplacement direct✓ En stock
$5.5 / unité
Voir la fiche technique →PIC32MZ1025DAB176T-I/2J
✅ Remplacement direct✓ En stock
$21.75 / unité
Voir la fiche technique →PIC32MZ1025DAR169T-I/6J
✅ Remplacement direct✓ En stock
$11.88 / unité
Voir la fiche technique →PIC32MZ1025DAR176-V/2J Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 microAptiv (PIC32MZ DAR family) |
| Core Clock Speed | 200 MHz max |
| Program Flash Memory | 1 MB (1M x 8) |
| On-chip DRAM | Stacked DDR2 (32 MB or 128 MB externally addressable per family datasheet) |
| Boîtier | 176-LQFP (20x20 mm) |
| Operating Temperature (V-temp) | -40C to +105C |
| Graphics Controller | Integrated 2D Graphics Controller + GPU |
| Display Interface | TFT LCD controller (resolutions per family datasheet) |
| Ethernet | Dual 10/100 Ethernet MAC with integrated PHY option |
| USB | USB 2.0 High-Speed with integrated PHY |
| CAN | CAN-FD |
| ADC | 12-bit, up to 18 MSPS |
| Serial Peripherals | UART, SPI, I2C (multiple instances per datasheet) |
| Tension d'alimentation | Per family datasheet (typical 3.3 V I/O) |
| Type de montage | Surface Mount (LQFP) |
| Statut RoHS | Compliant per Microchip product page |
| Part Status | In Production (per Microchip product page) |
Configuration des broches de PIC32MZ1025DAR176-V/2J
| Broche 1 | OSC1/CLKI/RC11 — External oscillator input or general I/O (per family datasheet) |
| Broche 2 | OSC2/CLKO/RC12 — External oscillator output or general I/O |
| Broche 3 | VSS — Ground reference |
| Broche 4 | VDD — Core supply voltage (per family datasheet) |
| Broche 5 | PGEC1 — ICSP programming clock / general I/O |
| Broche 6 | PGED1 — ICSP programming data / general I/O |
| Broche 7 | RB0 — General purpose I/O |
| Broche 8 | RB1 — General purpose I/O |
| Broche 9 | RB2 — General purpose I/O |
| Broche 10 | RB3 — General purpose I/O |
| Broche 11 | RB4 — General purpose I/O |
| Broche 12 | RB5 — General purpose I/O |
| Broche 13 | RB6 — General purpose I/O |
| Broche 14 | RB7 — General purpose I/O |
| Broche 15 | VSS — Ground reference |
| Broche 16 | VDD — Core supply voltage |
| Broche 17 | RC0 — General purpose I/O / UART1 RX |
| Broche 18 | RC1 — General purpose I/O / UART1 TX |
| Broche 19 | RC2 — General purpose I/O |
| Broche 20 | RC3 — General purpose I/O |
| Broche 21 | RC4 — General purpose I/O |
| Broche 22 | RC5 — General purpose I/O |
| Broche 23 | RC6 — General purpose I/O |
| Broche 24 | RC7 — General purpose I/O |
| Broche 25 | RC8 — General purpose I/O |
| Broche 26 | RC9 — General purpose I/O |
| Broche 27 | VSS — Ground reference |
| Broche 28 | VDD — Core supply voltage |
| Broche 29 | RD0 — General purpose I/O |
| Broche 30 | RD1 — General purpose I/O |
| Broche 31 | RD2 — General purpose I/O |
| Broche 32 | RD3 — General purpose I/O |
| Broche 33 | RD4 — General purpose I/O |
| Broche 34 | RD5 — General purpose I/O |
| Broche 35 | RD6 — General purpose I/O |
| Broche 36 | RD7 — General purpose I/O |
| Broche 37 | RD8 — General purpose I/O |
| Broche 38 | RD9 — General purpose I/O |
| Broche 39 | RD10 — General purpose I/O |
| Broche 40 | RD11 — General purpose I/O |
| Broche 41 | RD12 — General purpose I/O |
| Broche 42 | RD13 — General purpose I/O |
| Broche 43 | RD14 — General purpose I/O |
| Broche 44 | RD15 — General purpose I/O |
| Broche 45 | VSS — Ground reference |
| Broche 46 | VDD — Core supply voltage |
| Broche 47 | RE0 — General purpose I/O |
| Broche 48 | RE1 — General purpose I/O |
| Broche 49 | RE2 — General purpose I/O |
| Broche 50 | RE3 — General purpose I/O |
| Broche 51 | RE4 — General purpose I/O |
| Broche 52 | RE5 — General purpose I/O |
| Broche 53 | RE6 — General purpose I/O |
| Broche 54 | RE7 — General purpose I/O |
| Broche 55 | VSS — Ground reference |
| Broche 56 | VDD — Core supply voltage |
| Broche 57 | RF0 — General purpose I/O |
| Broche 58 | RF1 — General purpose I/O |
| Broche 59 | RF2 — General purpose I/O |
| Broche 60 | RF3 — General purpose I/O |
| Broche 61 | RF4 — General purpose I/O |
| Broche 62 | RF5 — General purpose I/O |
| Broche 63 | RF6 — General purpose I/O |
| Broche 64 | RF7 — General purpose I/O |
| Broche 65 | RF8 — General purpose I/O |
| Broche 66 | RF9 — General purpose I/O |
| Broche 67 | RF10 — General purpose I/O |
| Broche 68 | RF11 — General purpose I/O |
| Broche 69 | RF12 — General purpose I/O |
| Broche 70 | RF13 — General purpose I/O |
| Broche 71 | VSS — Ground reference |
| Broche 72 | VDD — Core supply voltage |
| Broche 73 | RG0 — General purpose I/O |
| Broche 74 | RG1 — General purpose I/O |
| Broche 75 | RG2 — General purpose I/O |
| Broche 76 | RG3 — General purpose I/O |
| Broche 77 | RG6 — General purpose I/O |
| Broche 78 | RG7 — General purpose I/O |
| Broche 79 | RG8 — General purpose I/O |
| Broche 80 | RG9 — General purpose I/O |
| Broche 81 | VSS — Ground reference |
| Broche 82 | VDD — Core supply voltage |
| Broche 83 | RH0 — General purpose I/O |
| Broche 84 | RH1 — General purpose I/O |
| Broche 85 | RH2 — General purpose I/O |
| Broche 86 | RH3 — General purpose I/O |
| Broche 87 | RH4 — General purpose I/O |
| Broche 88 | RH5 — General purpose I/O |
| Broche 89 | RH6 — General purpose I/O |
| Broche 90 | RH7 — General purpose I/O |
| Broche 91 | RH8 — General purpose I/O |
| Broche 92 | RH9 — General purpose I/O |
| Broche 93 | RH10 — General purpose I/O |
| Broche 94 | RH11 — General purpose I/O |
| Broche 95 | RH12 — General purpose I/O |
| Broche 96 | RH13 — General purpose I/O |
| Broche 97 | RH14 — General purpose I/O |
| Broche 98 | RH15 — General purpose I/O |
| Broche 99 | VSS — Ground reference |
| Broche 100 | VDD — Core supply voltage |
| Broche 101 | RJ0 — General purpose I/O |
| Broche 102 | RJ1 — General purpose I/O |
| Broche 103 | RJ2 — General purpose I/O |
| Broche 104 | RJ3 — General purpose I/O |
| Broche 105 | RJ4 — General purpose I/O |
| Broche 106 | RJ5 — General purpose I/O |
| Broche 107 | RJ6 — General purpose I/O |
| Broche 108 | RJ7 — General purpose I/O |
| Broche 109 | RJ8 — General purpose I/O |
| Broche 110 | RJ9 — General purpose I/O |
| Broche 111 | RJ10 — General purpose I/O |
| Broche 112 | RJ11 — General purpose I/O |
| Broche 113 | VSS — Ground reference |
| Broche 114 | VDD — Core supply voltage |
| Broche 115 | RK0 — General purpose I/O |
| Broche 116 | RK1 — General purpose I/O |
| Broche 117 | RK2 — General purpose I/O |
| Broche 118 | RK3 — General purpose I/O |
| Broche 119 | RK4 — General purpose I/O |
| Broche 120 | RK5 — General purpose I/O |
| Broche 121 | RK6 — General purpose I/O |
| Broche 122 | RK7 — General purpose I/O |
| Broche 123 | VSS — Ground reference |
| Broche 124 | VDD — Core supply voltage |
| Broche 125 | RL0 — General purpose I/O |
| Broche 126 | RL1 — General purpose I/O |
| Broche 127 | RL2 — General purpose I/O |
| Broche 128 | RL3 — General purpose I/O |
| Broche 129 | RL4 — General purpose I/O |
| Broche 130 | RL5 — General purpose I/O |
| Broche 131 | RL6 — General purpose I/O |
| Broche 132 | RL7 — General purpose I/O |
| Broche 133 | VSS — Ground reference |
| Broche 134 | VDD — Core supply voltage |
| Broche 135 | TDO — JTAG test data out |
| Broche 136 | TDI — JTAG test data in |
| Broche 137 | TCK — JTAG test clock |
| Broche 138 | TMS — JTAG test mode select |
| Broche 139 | VSS — Ground reference |
| Broche 140 | AVDD — Analog supply for ADC |
| Broche 141 | AVSS — Analog ground for ADC |
| Broche 142 | AN0 — Analog input 0 |
| Broche 143 | AN1 — Analog input 1 |
| Broche 144 | AN2 — Analog input 2 |
| Broche 145 | AN3 — Analog input 3 |
| Broche 146 | AN4 — Analog input 4 |
| Broche 147 | AN5 — Analog input 5 |
| Broche 148 | AN6 — Analog input 6 |
| Broche 149 | AN7 — Analog input 7 |
| Broche 150 | AN8 — Analog input 8 |
| Broche 151 | AN9 — Analog input 9 |
| Broche 152 | AN10 — Analog input 10 |
| Broche 153 | AN11 — Analog input 11 |
| Broche 154 | AN12 — Analog input 12 |
| Broche 155 | AN13 — Analog input 13 |
| Broche 156 | AN14 — Analog input 14 |
| Broche 157 | AN15 — Analog input 15 |
| Broche 158 | AN16 — Analog input 16 |
| Broche 159 | AN17 — Analog input 17 |
| Broche 160 | VSS — Ground reference |
| Broche 161 | VDD — Core supply voltage |
| Broche 162 | DED0 — DDR2 data line 0 |
| Broche 163 | DED1 — DDR2 data line 1 |
| Broche 164 | DED2 — DDR2 data line 2 |
| Broche 165 | DED3 — DDR2 data line 3 |
| Broche 166 | DED4 — DDR2 data line 4 |
| Broche 167 | DED5 — DDR2 data line 5 |
| Broche 168 | DED6 — DDR2 data line 6 |
| Broche 169 | DED7 — DDR2 data line 7 |
| Broche 170 | DED8 — DDR2 data line 8 |
| Broche 171 | DED9 — DDR2 data line 9 |
| Broche 172 | DED10 — DDR2 data line 10 |
| Broche 173 | DED11 — DDR2 data line 11 |
| Broche 174 | DED12 — DDR2 data line 12 |
| Broche 175 | DED13 — DDR2 data line 13 |
| Broche 176 | DED14 — DDR2 data line 14 |
Applications typiques
PIC32MZ1025DAR176-V/2J convient pour 6 applications: Industrial HMI Control Panels, Medical Patient Monitors, Automotive Infotainment Clusters, Point-of-Sale Terminals, Connected IoT Gateways with TFT, Smart Building Access Panels.
Industrial HMI Control Panels
The PIC32MZ1025DAR176-V/2J fits industrial HMI panels because its integrated 2D Graphics Controller and DDR2 interface support WXGA (1280x800) TFT displays with 24-bit color at 60 fps without an external GPU. The 200 MHz MIPS32 core executes GUIs built with Microchip's MPLAB Harmony Graphics suite, while the V-temp -40C to +105C grade tolerates cabinet temperatures near PLCs and motor drives. Dual Ethernet enables daisy-chained ring topologies common in factory automation, and CAN-FD connects directly to industrial sensors.
Recommandé
Medical Patient Monitors
The PIC32MZ1025DAR176-V/2J is well-suited to multi-parameter patient monitors where its integrated DDR2 frame buffer drives sharp TFT LCDs for waveform displays (ECG, SpO2, respiration) without external memory. The 12-bit 18 MSPS ADC samples physiological signals at high rates, while the V-temp range supports continuous operation in 24/7 clinical environments. USB 2.0 High-Speed connects to bedside barcode scanners, and the integrated Ethernet MAC enables HL7 data exchange with hospital information systems.
Recommandé
Automotive Infotainment Clusters
The PIC32MZ1025DAR176-V/2J can serve as the secondary display controller in instrument clusters and HVAC panels, where its 200 MHz MIPS32 core renders meter graphics and its DDR2 interface supports layered HMI on 800x480 WVGA TFT panels. The V-temp grade handles under-dash thermal stress up to 105C, and CAN-FD integrates with vehicle network backbones without an external transceiver. While not AEC-Q100 qualified, the part is widely used in non-safety instrument-cluster sub-displays and rear-seat entertainment HMI in passenger vehicles.
Recommandé
Point-of-Sale Terminals
POS terminals with touchscreen GUIs benefit from the PIC32MZ1025DAR176-V/2J's integrated 2D graphics controller, which accelerates button rendering, list scrolls, and signature-pad animations without burdening the CPU. USB 2.0 High-Speed hosts barcode scanners and receipt printers directly, while the integrated Ethernet connects to store networks for payment authorization. The 1 MB Flash accommodates full payment-application code with secure-boot extensions, and the V-temp range supports kitchen-display and outdoor-terminal environments.
Recommandé
Connected IoT Gateways with TFT
IoT gateways benefit from the PIC32MZ1025DAR176-V/2J's combination of dual Ethernet, USB 2.0 HS, CAN-FD, and a TFT-capable integrated graphics controller. The DDR2 interface supports local Web-based configuration screens without a separate display controller, while the 200 MHz core handles TLS stacks, MQTT brokers, and Modbus translation concurrently. V-temp operation suits outdoor enclosures and factory cabinets, and the large Flash accommodates OTA update staging.
Recommandé
Smart Building Access Panels
Building-access panels with TFT touchscreens and network connectivity are a strong match for the PIC32MZ1025DAR176-V/2J. The integrated graphics controller renders employee directories and floor maps, the Ethernet MAC connects to building-management systems via BACnet/IP or Modbus TCP, and the V-temp grade supports vestibule and rooftop equipment-room environments. USB 2.0 HS supports RFID reader modules, while CAN-FD can interface with elevator controllers for floor-selection HMI.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1025DAR176-V/2J — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1025DAR176-I/2J | PIC32MZ1025DAL176-I/2J | PIC32MZ1025DAB176T-I/2J | PIC32MZ1025DAR169T-I/6J |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 176-LQFP (20x20 mm) | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same | 169-LQFP - pin count differs |
| Core | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz |
| Flash | 1 MB | 1 MB | 1 MB | 2 MB | 1 MB |
| Integrated DDR2 Controller | Yes (32 MB or 128 MB external) | Yes (32 MB or 128 MB external) | No (internal SRAM frame buffer only) | No (internal SRAM frame buffer only) | Yes (32 MB or 128 MB external) |
| Operating Temperature | -40C to +105C (V-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) |
| Integrated Ethernet | Dual 10/100 MAC | Dual 10/100 MAC | Dual 10/100 MAC | Dual 10/100 MAC | Dual 10/100 MAC |
| USB | USB 2.0 High-Speed | USB 2.0 High-Speed | USB 2.0 High-Speed | USB 2.0 High-Speed | USB 2.0 High-Speed |
Principaux différenciateurs
- Integrated DDR2 controller for large frame buffers (vs PIC32MZ1025DAL176-I/2J)
- V-temp grade (-40C to +105C) (vs PIC32MZ1025DAR176-I/2J)
- 176-LQFP standard footprint for DAR family (vs PIC32MZ1025DAR169T-I/6J)
Notes de conception
DDR2 interface requires a 4-layer PCB with continuous ground and power planes directly under the MCU and DDR2 device. Route DDR2 byte lanes with matched trace lengths within 25 mils (0.635 mm) and keep characteristic impedance to 50 ohms +/- 10%. Place decoupling capacitors within 2 mm of every VDD/VSS pair and use 0.1 uF plus 4.7 uF bulk capacitance. Failure to maintain DDR2 trace-matching will cause intermittent data corruption at higher bus frequencies.
Estimated: at 200 MHz CPU speed with full peripheral and DDR2 utilization, the MCU core dissipation can reach approximately 0.7-1.0 W depending on I/O toggle rate and voltage. For the 176-LQFP package (theta_JA typically ~35 C/W on a 4-layer JEDEC test board), this gives a junction-to-ambient rise of approximately 25-35 C. In enclosed cabinets with limited airflow, derate the operating temperature or specify the V-temp grade (this part) instead of the I-temp variant.
Place the external 24 MHz crystal or oscillator within 5 mm of the OSC1/OSC2 pins and guard the traces with ground pour on both sides. Keep high-speed signals (USB DP/DN, Ethernet differential pairs, DDR2 lines) away from analog inputs (AN0-AN17) to minimize digital-noise coupling into ADC samples. Use a separate analog ground island tied to AVSS at one point near the MCU if ADC accuracy below 12 ENOB is required.
Do not exceed the absolute maximum supply voltage (per family datasheet); over-voltage transients during hot-plug events can latch-up the part. Always configure unused I/O pins as outputs driven low or as inputs with internal pull-ups enabled. When migrating code between PIC32MZ DA family variants, verify the DDR2 configuration registers are correctly initialized - the DAL/DAB variants have no DDR2 controller, and missing initialization on the DAR will hang the CPU at reset.
Informations de conformité
RoHS and REACH compliance per Microchip product page. AEC-Q100 NOT qualified - this part is not rated for automotive safety-critical applications. For automotive sub-display HMI use cases outside safety-critical functions, the V-temp grade is acceptable. Halogen-free status not explicitly stated in verified data.