PIC32MZ1025DAB176T-I/2J - 200MHz 32-Bit MCU, 1MB Flash, Graphics LCD | Microchip
Référence : PIC32MZ1025DAB176T-I/2J ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $34.72 | $34,72 |
| 10 | $30.85 | $308,50 |
| 100 | $27.5 | $2 750,00 |
| 500 | $24.1 | $12 050,00 |
| 1 000 | $21.75 | $21 750,00 |
PIC32MZ1025DAB176T-I/2J Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, peripherals, and I/O on one die. The PIC32MZ DA series belongs to the application-specific MCU class, targeting Human-Machine Interface (HMI) and embedded graphics applications. Within the broader taxonomy, an MCU falls under microcontrollers (ICs) -> semiconductors -> integrated circuits. The 32-bit MIPS32 microAptiv core delivers 3.28 CoreMarks/MHz and supports DSP instructions for signal conditioning alongside RTOS workloads.
Key differentiating specifications include a 12-bit 18 MSPS ADC module with up to 45 analog inputs, dual CAN 2.0b controllers, Hi-Speed USB 2.0 (480 Mbps) with integrated PHY, and external DDR2 DRAM addressing up to 32 MB or 128 MB depending on variant. The integrated Graphics LCD controller supports resolutions up to WVGA (800x480) without external graphics RAM, while 120 GPIO pins provide generous connectivity for display, touch, and communication peripherals.
The architecture pairs a 5-stage pipeline MIPS32 microAptiv core with hardware multiply/divide and a dedicated Graphics Processor Unit for 2D operations. An 8-channel hardware DMA engine offloads memory transfers, and the 200 MHz system clock provides 3.28 DMIPS/MHz headroom for control loops. The DDR2 interface (when externally populated) enables frame buffer storage for high-resolution GUIs.
Typical applications include industrial HMI panels with touchscreens, automotive infotainment and cluster displays, medical patient-monitoring displays, point-of-sale terminals, and IoT gateways with graphical diagnostics. The integrated graphics pipeline removes the need for an external GPU, reducing BOM cost and PCB area for color TFT designs.
Design considerations include careful DDR2 PCB layout (matched impedance, length-matched traces), provision for an external 32.768 kHz crystal for RTCC, and proper decoupling of the 3.3 V core supply with bulk and ceramic capacitors. The exposed thermal pad must be soldered to a sufficient copper pour to dissipate power and provide mechanical stability.
This page synthesizes verified distributor pricing across DigiKey, Mouser, and Octopart, packages drop-in 176-LQFP alternatives from the same PIC32MZ DA family, and presents design notes not found in the manufacturer datasheet - including cross-brand evaluation criteria for engineers considering STM32 or NXP i.MX alternatives.
Alternatives de remplacement direct pour PIC32MZ1025DAB176T-I/2J — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1025DAB176T-I/2J (même facteur de forme et même empreinte) — différant par Graphics Controller, USB, Package, CAN, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1025DAB176-I/2J
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1025DAG176T-I/2J
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1025DAL176-I/2J
✅ Remplacement direct✓ En stock
$5.5 / unité
Voir la fiche technique →PIC32MZ1025DAB176T-I/2J Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 microAptiv |
| Core Width | 32-bit |
| Fréquence d'horloge maximale | 200 MHz |
| Performance | 3.28 DMIPS/MHz, 3.28 CoreMark/MHz |
| Program Memory (Flash) | 1 MB (1M x 8) |
| Data RAM (SRAM) | 256 KB |
| External Memory Interface | DDR2 DRAM up to 32 MB or 128 MB (variant dependent) |
| Graphics Controller | Integrated 2D Graphics Processor + LCD Controller |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| Tension d'alimentation | 3.3 V (2.2 V min, 3.6 V max) |
| I/O Pins | 120 GPIO |
| Communication | 2x CAN 2.0b, Hi-Speed USB 2.0 (with PHY), UART, SPI, I2C |
| DMA Channels | 8 channels |
| Température de fonctionnement | -40C to +85C (Industrial) |
| Boîtier | 176-LQFP (20x20 mm) with Exposed Pad |
| Type de montage | Surface Mount |
| Niveau MSL | 3 (per JEDEC J-STD-020) |
| Statut RoHS | Compliant |
| Pitch | 0.5 mm |
| Largeur du bus de données | 32-bit |
Guide de configuration des broches du PIC32MZ1025DAB176T-I/2J 176-lqfp (20x20 mm) with exposed pad
Configuration des broches du PIC32MZ1025DAB176T-I/2J (boîtier 176-lqfp (20x20 mm) with exposed pad). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour PIC32MZ1025DAB176T-I/2J.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
PIC32MZ1025DAB176T-I/2J convient pour 6 applications: Industrial HMI Touch Panel, Automotive Infotainment Display, Medical Patient Monitoring Display, Point-of-Sale Terminal, IoT Gateway with Graphical Diagnostics, Smart Home Control Hub.
Industrial HMI Touch Panel
The PIC32MZ1025DAB176T-I/2J is ideal for industrial HMI touch panels thanks to its integrated 2D Graphics Processor and LCD controller that drive color TFTs up to WVGA (800x480) without an external GPU. The 200 MHz MIPS32 microAptiv core renders emWin or Microchip's MPLAB Harmony Graphics stacks while leaving CPU headroom for application logic and Modbus/TCP communications. Its 120 GPIO pins provide ample connections for capacitive touch controllers, RGB LEDs, and buzzer drivers; the 12-bit 18 MSPS ADC with 45 analog inputs handles sensor monitoring. The 176-LQFP exposed pad aids thermal dissipation in sealed IP65 enclosures, and -40C to +85C industrial temperature rating supports factory-floor deployment. The dual CAN 2.0b ports integrate cleanly with industrial CANopen networks used in PLCs and motor drives.
Recommandé
Automotive Infotainment Display
For automotive infotainment and cluster displays, the PIC32MZ1025DAB176T-I/2J delivers MPU-class graphics performance with MCU simplicity, rendering instrument clusters, climate control screens, and rear-seat entertainment UIs. The 200 MHz core, integrated graphics controller, and DDR2 interface support up to 128 MB external frame buffer for smooth 60 fps animations. Hi-Speed USB 2.0 with integrated PHY enables direct connection to smartphone projection stacks (CarPlay/Android Auto bridging) and mass storage. Dual CAN-FD-ready controllers integrate with vehicle bus networks, and 120 GPIO provide abundant connections for backlight drivers, rotary encoders, and audio codecs. The -40C to +85C temperature range suits cabin-mounted units; AEC-Q100 grade 3 parts are available for higher-tier designs.
Recommandé
Medical Patient Monitoring Display
The PIC32MZ1025DAB176T-I/2J powers bedside patient monitoring displays where its 12-bit 18 MSPS ADC with 45 analog inputs captures multi-lead ECG, SpO2, and respiration waveforms. The integrated graphics controller renders real-time waveforms, trend graphs, and alarm dashboards on color TFT panels up to WVGA. The 200 MHz core runs MQX RTOS or Harmony 3 frameworks for deterministic medical task scheduling. Hi-Speed USB supports patient record export and barcode scanner integration, while CAN 2.0b links to bedside asset tracking. The industrial temperature range, 176-LQFP exposed-pad package, and RoHS compliance meet medical device safety and environmental requirements. The 1 MB Flash accommodates full protocol stacks plus UI assets.
Recommandé
Point-of-Sale Terminal
The PIC32MZ1025DAB176T-I/2J serves POS terminals where integrated graphics drives the operator touchscreen and customer-facing display from a single MCU. The DDR2 interface buffers product images and signature capture screens; 256 KB SRAM handles transaction buffering. Hi-Speed USB connects receipt printers, barcode readers, and cash drawer interfaces; dual CAN buses support networked POS backbones. The 120 GPIO easily drives keypad matrices, magnetic-stripe readers, and NFC indicator LEDs. The 200 MHz MIPS32 core runs TLS stacks and payment-terminal application code, with the 1 MB Flash storing firmware plus EMVCo libraries. Industrial temperature grade suits kitchen and outdoor retail environments.
Recommandé
IoT Gateway with Graphical Diagnostics
For IoT gateways that need local HMI plus wireless aggregation, the PIC32MZ1025DAB176T-I/2J combines Cortex-class peripherals connectivity with on-chip graphics to drive local status TFT displays. The 8-channel DMA offloads sensor polling, the 12-bit ADC monitors analog sensors, and Hi-Speed USB connects WiFi/LTE modules for cloud uplinks. Dual CAN 2.0b buses integrate with industrial IoT and building automation networks; the 1 MB Flash fits TLS, MQTT, and WiFi/BLE host stacks plus graphics UI. The 200 MHz MIPS32 core runs edge analytics on local telemetry. Industrial temperature and exposed-pad 176-LQFP support DIN-rail or wall-mount gateway enclosures.
Recommandé
Smart Home Control Hub
The PIC32MZ1025DAB176T-I/2J fits smart-home control hubs where its integrated graphics renders room-floorplan UIs, security camera thumbnails, and energy dashboards on a wall-mounted touch display. The 200 MHz core runs Z-Wave, Zigbee, or Matter protocol stacks; 120 GPIO drive relay boards and sensor inputs. Hi-Speed USB and dual CAN link to subsystem controllers and cloud connectivity modules. The 1 MB Flash supports a full Linux-class IoT framework with graphics, and the 176-LQFP package suits slim wall-mount enclosures. The integrated graphics LCD pipeline saves time by removing the need for a separate GPU SoC, reducing BOM cost and PCB area.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1025DAB176T-I/2J — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1025DAB176-I/2J | PIC32MZ1025DAG176T-I/2J | PIC32MZ1025DAL176-I/2J |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 176-LQFP (20x20) | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same |
| Core / Clock | MIPS32 microAptiv / 200 MHz | MIPS32 microAptiv / 200 MHz | MIPS32 microAptiv / 200 MHz | MIPS32 microAptiv / 200 MHz |
| Flash / SRAM | 1 MB / 256 KB | 1 MB / 256 KB | 2 MB / 256 KB | 1 MB / 256 KB |
| Graphics Controller | Yes (integrated GPU + LCD) | Yes (same) | Yes (same) | Lower feature subset |
| ADC | 12-bit, 18 MSPS, 45 inputs | 12-bit, 18 MSPS, 45 inputs | 12-bit, 18 MSPS, 45 inputs | 12-bit, 18 MSPS, 45 inputs |
| Communication | 2x CAN, Hi-Speed USB, UART/SPI/I2C | Same | Same | Same |
| GPIO | 120 | 120 | 120 | 120 |
| Packaging Form | Tape & Reel | Tray | Tape & Reel | Tray |
Principaux différenciateurs
- Tape and Reel packaging for SMT production lines (vs PIC32MZ1025DAB176-I/2J)
- 2x Flash memory for richer content (vs PIC32MZ1025DAG176T-I/2J)
- Reduced-cost lower-graphics variant (vs PIC32MZ1025DAL176-I/2J)
- Integrated DDR2 for up to 128 MB external memory (vs EF family MCUs)
Notes de conception
The 176-LQFP exposed thermal pad MUST be soldered to a continuous copper pour on the PCB for thermal dissipation and electrical grounding. Microchip recommends at least 16 thermal vias in a 4x4 grid under the pad, each 0.2-0.3 mm drill with 1 oz plating, to reduce junction-to-ambient thermal resistance. Insufficient thermal vias will trigger thermal shutdown under sustained GPU + USB activity at industrial temperatures.
Provide a clean 3.3 V supply with bulk + decoupling. Use a 10 uF tantalum or ceramic bulk capacitor near the IC, plus 0.1 uF and 10 nF ceramic capacitors within 2 mm of each VDDGND pair. The 200 MHz core has high transient current demand during graphics rendering; an inadequate decoupling network causes Vcore droop that triggers brown-out resets. Place ferrite beads between analog and digital supplies to keep ADC noise below 1 LSB.
DDR2 interface requires strict impedance matching and length-matched traces. Follow JEDEC DDR2 layout guidelines: 50 ohm single-ended, 100 ohm differential, +/- 25 mil length matching on byte lanes. Keep DDR2 traces away from switching power and clock signals. Failure to follow DDR2 layout rules causes intermittent DDR2 training errors, visible as display artifacts or system crashes during heavy graphics use.
PPS (Peripheral Pin Select) must be configured at startup or peripherals will not function. Do not assume default pin mappings - the PIC32MZ DA family uses PPS to map UART, SPI, I2C, and timers to GPIO. Incorrect PPS configuration is the most common bring-up issue. Also note the 32.768 kHz crystal for RTCC requires specific load capacitance; refer to datasheet section for crystal selection.
The Hi-Speed USB 2.0 signals (DP, DN) require 90 ohm differential routing with matched length within 150 mil. Place the USB connector within 50 mm of the IC, with proper ESD protection (e.g., USBLC6-2SC6) at the connector. Use a common-mode choke for EMI suppression. The integrated USB PHY simplifies design but does not eliminate the need for proper signal integrity and EMI control.
Informations de conformité
RoHS and REACH compliant per Microchip product page. Standard industrial grade is not AEC-Q100 qualified; for automotive applications use AEC-Q100 grade variants or PIC32MK/SAMC families.
