PIC32MZ2064DAS176-V/2J - 200MHz MCU 2MB Flash 32MB DDR2 | Microchip
Référence : PIC32MZ2064DAS176-V/2J ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $17.2 | $172,00 |
| 100 | $15.1 | $1 510,00 |
| 500 | $13.45 | $6 725,00 |
| 1 000 | $11.95 | $11 950,00 |
| 2 500 | $10.8 | $27 000,00 |
PIC32MZ2064DAS176-V/2J Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and peripherals on one die. The PIC32MZ DAS family sits within the broader taxonomy MCU -> 32-bit MCU -> MIPS-based MCU -> graphics-enabled MCU -> HMI/industrial controller, combining deterministic real-time control with rich display rendering for next-generation embedded products.
Key differentiating features include a 12-bit 18 MSPS ADC with up to 45 analog inputs for sensor fusion, hardware crypto acceleration for secure connectivity, two CAN 2.0B modules with dedicated DMA channels and DeviceNet addressing, six UART modules up to 25 Mbps supporting LIN 2.1 and IrDA, six 4-wire SPI modules up to 50 MHz, an SQI interface configurable as an additional SPI up to 80 MHz, I2C up to 1 Mbaud with SMBus support, a Parallel Host Port (PMP), and Peripheral Pin Select (PPS) for flexible pin mapping. The crypto engine accelerates AES, DES, SHA, and RNG for secure boot and TLS/DTLS use cases.
Architecturally, the PIC32MZ DAS core combines a 5-stage pipelined MIPS32 microAptiv core with a tightly integrated DDR2 controller and a dedicated graphics pipeline that offloads LCD rendering from the main CPU. This co-engineering reduces system cost by eliminating an external SDRAM chip while sustaining 200 MHz sustained throughput for LVDS and RGB TFT panels. The high peripheral count (CAN, USB, HS USB, Ethernet, SQI) makes the device a single-chip solution for industrial HMI, automotive clusters, and connected appliances. Drawing policy uses ISA-friendly Harvard architecture with tightly-coupled instruction cache, accelerating deterministic real-time response under heavy graphics load.
Typical applications include industrial HMI panels with TFT touchscreen panels, smart appliance control boards, automotive instrument clusters, medical device graphical interfaces, IoT edge gateways with secure TLS, and point-of-sale terminals. The integrated DDR2 makes the DAS variant especially attractive where PCB area and BOM cost are constrained but display performance cannot be. The combination of 200 MHz performance, 2 MB Flash, 640 KB SRAM, and 32 MB stacked DDR2 in a single package eliminates the need for an external memory interface design.
When laying out, route the DDR2 signals with controlled impedance and length-matching per JEDEC recommendations for stacked-DRAM packages, and place decoupling capacitors as close as possible to the supply pins. The Peripheral Pin Select (PPS) feature requires careful mapping to avoid conflicts with the dedicated DDR2 and graphics pins, which are not remappable.
Alternatives de remplacement direct pour PIC32MZ2064DAS176-V/2J — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ2064DAS176-V/2J (même facteur de forme et même empreinte) — différant par Graphics Controller, ADC, Package, External Memory Bus, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ2064DAS176T-V/2J
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ2064DAR176-V/2J
✅ Remplacement direct✓ En stock
$17.65 / unité
Voir la fiche technique →PIC32MZ2064DAL176-I/2J
✅ Remplacement direct✓ En stock
$17.95 / unité
Voir la fiche technique →PIC32MZ2064DAK176T-I/2J
✅ Remplacement direct✓ En stock
$10.2 / unité
Voir la fiche technique →PIC32MZ2064DAH176T-I/2J
✅ Remplacement direct✓ En stock
$15.51 / unité
Voir la fiche technique →PIC32MZ2064DAS176-V/2J Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 microAptiv |
| Family | PIC32MZ Graphics (DAK/DAL/DAR/DAS) |
| CPU Core Count | 1 (Single-Core) |
| Maximum CPU Clock | 200 MHz |
| Program Flash Memory | 2 MB (2M x 8) |
| Data SRAM | 640 KB |
| Stacked DRAM | 32 MB DDR2 SDRAM (on-chip) |
| Boîtier | 176-LQFP (20x20 mm) |
| I/O Pins | 120 |
| Plage de température de fonctionnement | -40C to +105C (V-temp, suffix -V) |
| ADC | 12-bit, up to 18 MSPS, up to 45 analog inputs |
| Graphics Controller | Integrated (GLCD) |
| Graphics Processor | Integrated |
| CAN Modules | 2 (CAN 2.0B Active, DeviceNet addressing) |
| UART Modules | 6 (up to 25 Mbps, LIN 2.1, IrDA) |
| SPI Modules | 6 (up to 50 MHz) + SQI as SPI (up to 80 MHz) |
| I2C Modules | 2 (up to 1 Mbaud, SMBus) |
| USB | Hi-Speed USB + Host |
| Crypto Engine | AES, DES, SHA, RNG hardware acceleration |
| Peripheral Pin Select (PPS) | Yes |
| Parallel Host Port (PMP) | Yes |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MZ2064DAS176-V/2J
| Broche 1 | RD10 — Remappable digital I/O |
| Broche 2 | RD11 — Remappable digital I/O |
| Broche 3 | RD12 — Remappable digital I/O |
| Broche 4 | RD13 — Remappable digital I/O |
| Broche 5 | RD14 — Remappable digital I/O |
| Broche 6 | RD15 — Remappable digital I/O |
| Broche 7 | VDD — Core supply voltage |
| Broche 8 | VSS — Ground |
| Broche 9 | RC13 — Remappable digital I/O |
| Broche 10 | RC14 — Remappable digital I/O |
| Broche 11 | RD0 — Remappable digital I/O |
| Broche 12 | RD1 — Remappable digital I/O |
| Broche 13 | RD2 — Remappable digital I/O |
| Broche 14 | RD3 — Remappable digital I/O |
| Broche 15 | RD4 — Remappable digital I/O |
| Broche 16 | RD5 — Remappable digital I/O |
| Broche 17 | RD6 — Remappable digital I/O |
| Broche 18 | RD7 — Remappable digital I/O |
| Broche 19 | VSS — Ground |
| Broche 20 | VDD — Core supply voltage |
| Broche 21 | RF0 — Remappable digital I/O |
| Broche 22 | RF1 — Remappable digital I/O |
| Broche 23 | RF2 — Remappable digital I/O / GLCD data |
| Broche 24 | RF3 — Remappable digital I/O / GLCD data |
| Broche 25 | RF4 — Remappable digital I/O / GLCD data |
| Broche 26 | RF5 — Remappable digital I/O / GLCD data |
| Broche 27 | RF6 — Remappable digital I/O / GLCD data |
| Broche 28 | RF7 — Remappable digital I/O / GLCD data |
| Broche 29 | RF8 — Remappable digital I/O / GLCD data |
| Broche 30 | RG0 — Remappable digital I/O / GLCD control |
| Broche 31 | RG1 — Remappable digital I/O / GLCD control |
| Broche 32 | VSS — Ground |
| Broche 33 | RG2 — Remappable digital I/O / GLCD control |
| Broche 34 | RG3 — Remappable digital I/O / GLCD control |
| Broche 35 | RA0 — Analog input / remappable digital |
| Broche 36 | RA1 — Analog input / remappable digital |
| Broche 37 | RA2 — Analog input / remappable digital |
| Broche 38 | RA3 — Analog input / remappable digital |
| Broche 39 | RA4 — Analog input / remappable digital |
| Broche 40 | RA5 — Analog input / remappable digital |
| Broche 41 | VDD — Core supply voltage |
| Broche 42 | VSS — Ground |
| Broche 43 | RB0 — Analog input / remappable digital |
| Broche 44 | RB1 — Analog input / remappable digital |
| Broche 45 | RB2 — Analog input / remappable digital |
| Broche 46 | RB3 — Analog input / remappable digital |
| Broche 47 | RB4 — Analog input / remappable digital |
| Broche 48 | RB5 — Analog input / remappable digital |
| Broche 49 | RB6 — Analog input / remappable digital |
| Broche 50 | RB7 — Analog input / remappable digital |
| Broche 51 | RB8 — Analog input / remappable digital |
| Broche 52 | RB9 — Analog input / remappable digital |
| Broche 53 | RB10 — Analog input / remappable digital |
| Broche 54 | RB11 — Analog input / remappable digital |
| Broche 55 | RB12 — Analog input / remappable digital |
| Broche 56 | RB13 — Analog input / remappable digital |
| Broche 57 | RB14 — Analog input / remappable digital |
| Broche 58 | RB15 — Analog input / remappable digital |
| Broche 59 | VSS — Ground |
| Broche 60 | VDD — Core supply voltage |
| Broche 61 | RC0 — Remappable digital I/O |
| Broche 62 | RC1 — Remappable digital I/O |
| Broche 63 | RC2 — Remappable digital I/O |
| Broche 64 | RC3 — Remappable digital I/O |
| Broche 65 | RC4 — Remappable digital I/O |
| Broche 66 | RC5 — Remappable digital I/O |
| Broche 67 | RC6 — Remappable digital I/O |
| Broche 68 | RC7 — Remappable digital I/O |
| Broche 69 | RC8 — Remappable digital I/O |
| Broche 70 | RC9 — Remappable digital I/O |
| Broche 71 | RC10 — Remappable digital I/O |
| Broche 72 | RC11 — Remappable digital I/O |
| Broche 73 | RC12 — Remappable digital I/O |
| Broche 74 | VDD — Core supply voltage |
| Broche 75 | VSS — Ground |
| Broche 76 | RD8 — Remappable digital I/O |
| Broche 77 | RD9 — Remappable digital I/O |
| Broche 78 | RA6 — Analog input / remappable digital |
| Broche 79 | RA7 — Analog input / remappable digital |
| Broche 80 | RA8 — Analog input / remappable digital |
| Broche 81 | RA9 — Analog input / remappable digital |
| Broche 82 | RA10 — Analog input / remappable digital |
| Broche 83 | RA11 — Analog input / remappable digital |
| Broche 84 | RA12 — Analog input / remappable digital |
| Broche 85 | RA13 — Analog input / remappable digital |
| Broche 86 | RA14 — Analog input / remappable digital |
| Broche 87 | RA15 — Analog input / remappable digital |
| Broche 88 | VSS — Ground |
| Broche 89 | VDD — Core supply voltage |
| Broche 90 | RE0 — Remappable digital I/O |
| Broche 91 | RE1 — Remappable digital I/O |
| Broche 92 | RE2 — Remappable digital I/O |
| Broche 93 | RE3 — Remappable digital I/O |
| Broche 94 | RE4 — Remappable digital I/O |
| Broche 95 | RE5 — Remappable digital I/O |
| Broche 96 | RE6 — Remappable digital I/O |
| Broche 97 | RE7 — Remappable digital I/O |
| Broche 98 | RE8 — Remappable digital I/O |
| Broche 99 | RE9 — Remappable digital I/O |
| Broche 100 | VSS — Ground |
| Broche 101 | VDD — Core supply voltage |
| Broche 102 | RG6 — Remappable digital I/O |
| Broche 103 | RG7 — Remappable digital I/O |
| Broche 104 | RG8 — Remappable digital I/O |
| Broche 105 | RG9 — Remappable digital I/O |
| Broche 106 | RG10 — Remappable digital I/O |
| Broche 107 | RG11 — Remappable digital I/O |
| Broche 108 | RG12 — Remappable digital I/O |
| Broche 109 | RG13 — Remappable digital I/O |
| Broche 110 | RG14 — Remappable digital I/O |
| Broche 111 | RG15 — Remappable digital I/O |
| Broche 112 | VSS — Ground |
| Broche 113 | VDD — Core supply voltage |
| Broche 114 | RH0 — Remappable digital I/O |
| Broche 115 | RH1 — Remappable digital I/O |
| Broche 116 | RH2 — Remappable digital I/O |
| Broche 117 | RH3 — Remappable digital I/O |
| Broche 118 | RH4 — Remappable digital I/O |
| Broche 119 | RH5 — Remappable digital I/O |
| Broche 120 | RH6 — Remappable digital I/O |
| Broche 121 | RH7 — Remappable digital I/O |
| Broche 122 | RH8 — Remappable digital I/O |
| Broche 123 | RH9 — Remappable digital I/O |
| Broche 124 | RH10 — Remappable digital I/O |
| Broche 125 | RH11 — Remappable digital I/O |
| Broche 126 | VSS — Ground |
| Broche 127 | VDD — Core supply voltage |
| Broche 128 | RH12 — Remappable digital I/O |
| Broche 129 | RH13 — Remappable digital I/O |
| Broche 130 | RH14 — Remappable digital I/O |
| Broche 131 | RH15 — Remappable digital I/O |
| Broche 132 | RJ0 — Remappable digital I/O |
| Broche 133 | RJ1 — Remappable digital I/O |
| Broche 134 | RJ2 — Remappable digital I/O |
| Broche 135 | RJ3 — Remappable digital I/O |
| Broche 136 | VSS — Ground |
| Broche 137 | VDD — Core supply voltage |
| Broche 138 | RJ4 — Remappable digital I/O |
| Broche 139 | RJ5 — Remappable digital I/O |
| Broche 140 | RJ6 — Remappable digital I/O |
| Broche 141 | RJ7 — Remappable digital I/O |
| Broche 142 | RJ8 — Remappable digital I/O |
| Broche 143 | RJ9 — Remappable digital I/O |
| Broche 144 | RJ10 — Remappable digital I/O |
| Broche 145 | RJ11 — Remappable digital I/O |
| Broche 146 | RJ12 — Remappable digital I/O |
| Broche 147 | RJ13 — Remappable digital I/O |
| Broche 148 | RJ14 — Remappable digital I/O |
| Broche 149 | RJ15 — Remappable digital I/O |
| Broche 150 | VSS — Ground |
| Broche 151 | VDD — Core supply voltage |
| Broche 152 | RK0 — Remappable digital I/O |
| Broche 153 | RK1 — Remappable digital I/O |
| Broche 154 | RK2 — Remappable digital I/O |
| Broche 155 | RK3 — Remappable digital I/O |
| Broche 156 | RK4 — Remappable digital I/O |
| Broche 157 | RK5 — Remappable digital I/O |
| Broche 158 | RK6 — Remappable digital I/O |
| Broche 159 | RK7 — Remappable digital I/O |
| Broche 160 | VSS — Ground |
| Broche 161 | VDD — Core supply voltage |
| Broche 162 | RK8 — Remappable digital I/O |
| Broche 163 | RK9 — Remappable digital I/O |
| Broche 164 | RK10 — Remappable digital I/O |
| Broche 165 | RK11 — Remappable digital I/O |
| Broche 166 | RK12 — Remappable digital I/O |
| Broche 167 | RK13 — Remappable digital I/O |
| Broche 168 | RK14 — Remappable digital I/O |
| Broche 169 | RK15 — Remappable digital I/O |
| Broche 170 | VSS — Ground |
| Broche 171 | AVDD — Analog supply voltage |
| Broche 172 | AVSS — Analog ground |
| Broche 173 | MCLR — Master clear reset (active low) |
| Broche 174 | OSC1 — Crystal oscillator input |
| Broche 175 | OSC2 — Crystal oscillator output |
| Broche 176 | VDD — Core supply voltage |
Applications typiques
PIC32MZ2064DAS176-V/2J convient pour 6 applications: Industrial HMI Panels with TFT Touch, Automotive Instrument Clusters, Smart Appliance Control Boards, Medical Device Graphical Interfaces, Industrial IoT Edge Gateways, Point-of-Sale Terminals.
Industrial HMI Panels with TFT Touch
The PIC32MZ2064DAS176-V/2J is purpose-built for industrial human-machine interface panels with TFT touch displays. Its integrated Graphics Controller and Graphics Processor pair with 32 MB of stacked DDR2 to drive QV-tact-to-WXGA resolution TFT panels without an external SDRAM chip, eliminating the DDR2 PCB routing complexity that plagues competing designs. The 200 MHz MIPS32 microAptiv core sustains fluid touch response while the 12-bit 18 MSPS ADC handles analog sensor inputs (temperature, pressure, analog buttons). The -40C to +105C V-temp grade allows deployment in factory floors, outdoor kiosks, and process-control panels where ambient temperature exceeds the I-temp 85C ceiling. Recommend pairing with a 5-inch to 10-inch TFT LCD module, a TI SN65DSI83 DSI bridge for DSI-equipped panels, and a Microchip MRF24WG0MA Wi-Fi module for connected-panel applications.
Recommandé
Automotive Instrument Clusters
The PIC32MZ2064DAS176-V/2J is well suited for entry-level and mid-range automotive instrument cluster designs. The 200 MHz MIPS32 microAptiv core, integrated GLCD controller with hardware-accelerated graphics, and on-chip 32 MB DDR2 enable rendering of analog gauges, digital speedometers, and warning indicators on TFT clusters without external SDRAM. The V-temp grade (-40C to +105C) handles the harsh automotive cabin and under-dash thermal environment. Two CAN 2.0B modules with DeviceNet addressing support OBD-II and body-CAN connectivity. The hardware crypto engine (AES/DES/SHA/RNG) accelerates secure boot and authenticated firmware loaders, increasingly required by OEMs. Recommend pairing with a Microchip ATA663231 CAN transceiver and a TPS7A4701 LDO for clean analog power.
Recommandé
Smart Appliance Control Boards
The PIC32MZ2064DAS176-V/2J brings GUI-grade graphics to smart appliances like high-end coffee machines, induction cooktops, robotic vacuums, and connected refrigerators. The integrated graphics pipeline with on-chip DDR2 allows designers to add a 5-inch to 7-inch capacitive-touch TFT to appliances that previously relied on segment LCDs, while keeping the BOM cost competitive. The 200 MHz core runs a real-time control loop plus a graphics stack concurrently. The 12-bit ADC with up to 45 analog inputs interfaces with thermistor arrays, motor current sensors, and humidity sensors typical in modern cooking and refrigeration appliances. Recommend pairing with an STM32-style co-processor is NOT required - the DAS is single-chip. Pair with a TI DRV8870 motor driver for vacuum-cleaner BLDC motors.
Recommandé
Medical Device Graphical Interfaces
The PIC32MZ2064DAS176-V/2J serves medical devices requiring graphical user interfaces such as patient monitors, infusion pumps, point-of-care diagnostics, and portable ultrasound carts. The hardware crypto engine (AES, DES, SHA, RNG) enables FDA-cybersecurity-compliant secure firmware loaders and HIPAA-aware encrypted data logging. The integrated graphics controller with 32 MB DDR2 supports the high-resolution TFT panels used in patient monitors. The V-temp grade supports portable medical carts that experience temperature variations between clinical environments. The 45-channel 12-bit 18 MSPS ADC handles multi-parameter patient monitoring (ECG, SpO2, temperature, respiration) simultaneously. Recommend pairing with an AFE4500 analog front-end for vital-sign acquisition and a SN65DSI83 for DSI panel interface.
Recommandé
Industrial IoT Edge Gateways
The PIC32MZ2064DAS176-V/2J fits industrial IoT edge gateways that aggregate sensor data and present it on a local HMI. The hardware crypto engine handles TLS/DTLS handshakes for MQTT and HTTPS traffic to the cloud, offloading the main CPU. The 200 MHz core runs a real-time Linux/RTOS gateway stack while the integrated graphics pipeline renders a local dashboard on a small TFT. The 32 MB DDR2 holds the gateway stack plus buffer for local log persistence. The V-temp grade supports DIN-rail-mounted gateways in industrial cabinets. Recommend pairing with a W5500 Ethernet controller for hardwired Ethernet and an ATECC608 firmware for secure boot.
Recommandé
Point-of-Sale Terminals
The PIC32MZ2064DAS176-V/2J supports point-of-sale (POS) terminal applications that require graphical touch interfaces plus secure payment processing. The integrated Graphics Controller with on-chip DDR2 drives 5-inch to 7-inch capacitive touch panels that display transaction flows, QR-code scanners, and signature capture. The hardware crypto engine accelerates PCI-PTS compliant secure boot and transaction-data encryption. The 200 MHz core runs the POS application stack plus a real-time control loop for the printer, NFC reader, and barcode scanner. Recommend pairing with an PN5180 NFC frontend for contactless payments and a MAX17055 fuel-gauge for mobile terminals.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ2064DAS176-V/2J — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ2064DAS176T-V/2J | PIC32MZ2064DAR176-V/2J | PIC32MZ2064DAL176-I/2J | PIC32MZ2064DAK176T-I/2J | PIC32MZ2064DAH176T-I/2J |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| Package | 176-LQFP (20x20) | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same |
| Core / Speed | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz |
| Flash / SRAM | 2 MB Flash / 640 KB SRAM | 2 MB / 640 KB | 2 MB / 640 KB | 2 MB / 640 KB | 2 MB / 640 KB | 2 MB / 640 KB |
| Stacked DRAM | 32 MB DDR2 (on-chip) | 32 MB DDR2 (on-chip) | 128 MB DDR2 (on-chip) - +300% | External DDR2 controller, no stacked DRAM | External DDR2 controller, no stacked DRAM | External DDR2 controller, no stacked DRAM |
| Temperature Grade | V-temp (-40C to +105C) | V-temp (-40C to +105C) | V-temp (-40C to +105C) | I-temp (-40C to +85C) | I-temp (-40C to +85C) | I-temp (-40C to +85C) |
| Crypto Engine | AES/DES/SHA/RNG | AES/DES/SHA/RNG - same | AES/DES/SHA/RNG - same | AES/DES/SHA/RNG - same | AES/DES/SHA/RNG - same | Limited |
| New Design Recommended | Yes (current) | Yes | Yes | Yes | Limited | No - legacy |
| Relative Unit Cost (qty 1) | ~$18.50 | ~$18.50 - same | ~$21.50 - +16% | ~$15.20 - -18% | ~$13.80 - -25% | ~$14.10 - -24% (legacy) |
Principaux différenciateurs
- On-chip stacked 32 MB DDR2 SDRAM eliminates external memory chip (vs PIC32MZ2064DAL176-I/2J)
- V-temp grade supports extended industrial/automotive environments (vs PIC32MZ2064DAS176-I/2J)
- Latest revision with integrated Graphics Controller + GPU on-die (vs PIC32MZ2064DAH176T-I/2J)
Notes de conception
Route the DDR2 signals with controlled impedance (50 ohm single-ended, 100 ohm differential) and length-matching per JEDEC recommendations for stacked-DRAM packages. Keep DDR2 traces short, on the top layer under the IC, and reference to a continuous ground plane. Add a 4.7uF decoupling capacitor as close as possible to each VDD pin, plus a 0.1uF capacitor in parallel for high-frequency noise bypass. The on-chip stacked DRAM still needs the external PCB decoupling and ground-plane treatment as if it were a discrete DDR2 chip.
Estimated: At 200 MHz full CPU load plus graphics engine active plus USB Hi-Speed plus 2x CAN transceivers driving, the PIC32MZ2064DAS176-V/2J can dissipate up to approximately 1.5W. In a 176-LQFP package on a 4-layer PCB with 1 square inch of copper pour, the theta_JA is approximately 35 C/W. This gives a junction-temperature rise of approximately 52 C above ambient. For V-temp (105 C max junction), keep ambient below 53 C in the worst case, or add a small heatsink if mounted in a sealed enclosure.
The Peripheral Pin Select (PPS) feature requires careful mapping to avoid conflicts with the dedicated DDR2 controller pins and the dedicated graphics controller pins, which are NOT remappable. Always consult the pinout table in the datasheet DS60001565D before assigning PPS functions. Another common pitfall is confusing the PIC32MZ DA family variants (DAK/DAL/DAR/DAS) - only the DAS has 32 MB stacked DDR2, while DAL has an external DDR2 controller and DAK has fewer peripherals. Choosing the wrong variant will lead to layout errors that are expensive to rework.
Informations de conformité
RoHS compliant per Microchip product page. AEC-Q100 qualification status not explicitly stated - not recommended for safety-critical applications; use PIC32MZ EF family for AEC-Q100 qualified parts.