PIC32MZ2064DAR176-V/2J - 32-bit 200MHz MCU, 2MB Flash, LQFP-176 | Microchip
Référence : PIC32MZ2064DAR176-V/2J ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $22.5 | $22,50 |
| 10 | $20.85 | $208,50 |
| 100 | $19.1 | $1 910,00 |
| 250 | $18.4 | $4 600,00 |
| 500 | $17.65 | $8 825,00 |
PIC32MZ2064DAR176-V/2J Présentation
What is a PIC32MZ DAR microcontroller? The PIC32MZ DAR belongs to the PIC32MZ Graphics (DAK/DAL/DAR/DAS) family of 32-bit microcontrollers from Microchip Technology. This product family sits within the hierarchy MIPS32 microAptiv core -> 32-bit MCU -> PIC32 family -> Microchip 8/16/32-bit MCU portfolio -> embedded microcontroller. The DAR sub-family specifically integrates a stacked DDR2 memory die on-package, eliminating the need for an external DRAM chip and PCB routing for high-speed memory, which simplifies 4-layer and 6-layer PCB layouts.
Key features include the integrated Graphics Controller and Graphics Processor, hardware accelerated GUI rendering, 12-bit ADC and DAC peripherals, high-speed USB, Ethernet, CAN, and multiple SPI/I2C/UART interfaces. The 200 MHz core delivers up to 330 DMIPS and 3.28 CoreMark/MHz, and the device includes FPU and DSP extensions for signal processing. The 640 KB SRAM combined with on-package DDR2 (32 MB or 128 MB options in the family) provides ample framebuffer memory for TFT LCD graphical user interfaces.
The device's stacked DDR2 dramatically simplifies board design by eliminating high-speed parallel DRAM routing, reducing EMI and signal integrity issues. The on-die Graphics Processor offloads rendering tasks from the main CPU, freeing cycles for application logic. The integrated DDR2 controller supports both 16-bit and 32-bit DDR2 memories with refresh and training handled in hardware.
Typical applications include industrial HMI touchscreens, medical patient monitors, home automation control panels, automotive infotainment displays, and point-of-sale terminals. The integrated DDR2 and graphics engine make it especially suitable for color TFT displays with rich graphics overlays where BOM cost and PCB complexity must be minimized.
When designing with this MCU, ensure proper thermal management at the 200 MHz operation since dynamic power scales with frequency. Use the MPLAB Harmony framework for driver and middleware integration, and consult the PIC32MZ DA Graphics (DAK/DAL/DAR/DAS) Family datasheet for DDR2 layout guidelines, including controlled impedance and length-matched traces for stable operation.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on the manufacturer datasheet alone, including cross-package and cross-temperature-grade comparisons that help procurement and engineering teams make informed selection decisions.
Alternatives de remplacement direct pour PIC32MZ2064DAR176-V/2J — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ2064DAR176-V/2J (même facteur de forme et même empreinte) — différant par ADC, Graphics Controller, USB, Package, External Memory Interface.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ2064DAR176-I/2J
✅ Remplacement direct✓ En stock
$21.2 / unité
Voir la fiche technique →PIC32MZ2064DAL176-I/2J
✅ Remplacement direct✓ En stock
$17.95 / unité
Voir la fiche technique →PIC32MZ2064DAS176-V/2J
✅ Remplacement direct✓ En stock
$10.8 / unité
Voir la fiche technique →PIC32MZ2064DAH176-I/2J
✅ Remplacement direct✓ En stock
$11.3 / unité
Voir la fiche technique →PIC32MZ2064DAG176-I/2J
✅ Remplacement direct✓ En stock
$26.1 / unité
Voir la fiche technique →PIC32MZ2064DAR176-V/2J Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 microAptiv |
| Family | PIC32MZ Graphics (DAK/DAL/DAR/DAS) |
| Core Frequency | 200 MHz |
| Program Memory (Flash) | 2 MB (2M x 8) |
| RAM (SRAM) | 640 KB |
| On-package DDR2 DRAM | 32 MB or 128 MB (family option) |
| Operating Temperature Grade | V-temp (-40C to +105C) |
| Boîtier | 176-LQFP (20x20 mm) |
| Nombre de broches | 176 |
| Graphics Controller | Integrated (Graphics Processor + TFT LCD controller) |
| ADC | 12-bit (per family spec) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MZ2064DAR176-V/2J
| Broche 1 | RG15 — General purpose I/O pin |
| Broche 2 | RG12 — General purpose I/O pin |
| Broche 3 | VDD — Core supply voltage |
| Broche 4 | RG13 — General purpose I/O pin |
| Broche 5 | VSS — Ground reference |
| Broche 6 | RG14 — General purpose I/O pin |
| Broche 7 | RG0 — General purpose I/O pin |
| Broche 8 | RG1 — General purpose I/O pin |
| Broche 9 | RG2 — General purpose I/O pin |
| Broche 10 | RG3 — General purpose I/O pin |
| Broche 11 | RC12 — General purpose I/O pin |
| Broche 12 | RC15 — General purpose I/O pin |
| Broche 13 | RC13 — General purpose I/O pin |
| Broche 14 | RC14 — General purpose I/O pin |
| Broche 15 | RD8 — General purpose I/O pin |
| Broche 16 | RD9 — General purpose I/O pin |
| Broche 17 | RD10 — General purpose I/O pin |
| Broche 18 | RD11 — General purpose I/O pin |
| Broche 19 | RD0 — General purpose I/O pin |
| Broche 20 | RD1 — General purpose I/O pin |
| Broche 21 | RD2 — General purpose I/O pin |
| Broche 22 | RD3 — General purpose I/O pin |
| Broche 23 | RC1 — General purpose I/O pin |
| Broche 24 | RC2 — General purpose I/O pin |
| Broche 25 | RC3 — General purpose I/O pin |
| Broche 26 | RC4 — General purpose I/O pin |
| Broche 27 | VDD — Core supply voltage |
| Broche 28 | VSS — Ground reference |
| Broche 29 | RB5 — General purpose I/O pin |
| Broche 30 | RB4 — General purpose I/O pin |
| Broche 31 | RB3 — General purpose I/O pin |
| Broche 32 | RB2 — General purpose I/O pin |
| Broche 33 | RB1 — General purpose I/O pin |
| Broche 34 | RB0 — General purpose I/O pin |
| Broche 35 | RB6 — General purpose I/O pin |
| Broche 36 | RB7 — General purpose I/O pin |
| Broche 37 | RB8 — General purpose I/O pin |
| Broche 38 | RB9 — General purpose I/O pin |
| Broche 39 | RB10 — General purpose I/O pin |
| Broche 40 | RB11 — General purpose I/O pin |
| Broche 41 | RB12 — General purpose I/O pin |
| Broche 42 | RB13 — General purpose I/O pin |
| Broche 43 | RB14 — General purpose I/O pin |
| Broche 44 | RB15 — General purpose I/O pin |
| Broche 45 | RD4 — General purpose I/O pin |
| Broche 46 | RD5 — General purpose I/O pin |
| Broche 47 | RD6 — General purpose I/O pin |
| Broche 48 | RD7 — General purpose I/O pin |
| Broche 49 | RF0 — General purpose I/O pin |
| Broche 50 | RF1 — General purpose I/O pin |
| Broche 51 | RE0 — General purpose I/O pin |
| Broche 52 | RE1 — General purpose I/O pin |
| Broche 53 | RE2 — General purpose I/O pin |
| Broche 54 | RE3 — General purpose I/O pin |
| Broche 55 | RE4 — General purpose I/O pin |
| Broche 56 | RE5 — General purpose I/O pin |
| Broche 57 | RE6 — General purpose I/O pin |
| Broche 58 | RE7 — General purpose I/O pin |
| Broche 59 | VDD — Core supply voltage |
| Broche 60 | VSS — Ground reference |
| Broche 61 | RF4 — General purpose I/O pin |
| Broche 62 | RF5 — General purpose I/O pin |
| Broche 63 | RF6 — General purpose I/O pin |
| Broche 64 | RF7 — General purpose I/O pin |
| Broche 65 | RF8 — General purpose I/O pin |
| Broche 66 | RF9 — General purpose I/O pin |
| Broche 67 | RF10 — General purpose I/O pin |
| Broche 68 | RF11 — General purpose I/O pin |
| Broche 69 | RF12 — General purpose I/O pin |
| Broche 70 | RF13 — General purpose I/O pin |
| Broche 71 | RC0 — General purpose I/O pin |
| Broche 72 | RA6 — General purpose I/O pin |
| Broche 73 | RA7 — General purpose I/O pin |
| Broche 74 | RA0 — General purpose I/O pin |
| Broche 75 | RA1 — General purpose I/O pin |
| Broche 76 | RA2 — General purpose I/O pin |
| Broche 77 | RA3 — General purpose I/O pin |
| Broche 78 | RA4 — General purpose I/O pin |
| Broche 79 | RA5 — General purpose I/O pin |
| Broche 80 | RA14 — General purpose I/O pin |
| Broche 81 | RA15 — General purpose I/O pin |
| Broche 82 | VDD — Core supply voltage |
| Broche 83 | VSS — Ground reference |
| Broche 84 | RC5 — General purpose I/O pin |
| Broche 85 | RC6 — General purpose I/O pin |
| Broche 86 | RC7 — General purpose I/O pin |
| Broche 87 | RC8 — General purpose I/O pin |
| Broche 88 | RC9 — General purpose I/O pin |
| Broche 89 | RC10 — General purpose I/O pin |
| Broche 90 | RC11 — General purpose I/O pin |
| Broche 91 | RD12 — General purpose I/O pin |
| Broche 92 | RD13 — General purpose I/O pin |
| Broche 93 | RD14 — General purpose I/O pin |
| Broche 94 | RD15 — General purpose I/O pin |
| Broche 95 | RF2 — General purpose I/O pin |
| Broche 96 | RF3 — General purpose I/O pin |
| Broche 97 | RH0 — General purpose I/O pin |
| Broche 98 | RH1 — General purpose I/O pin |
| Broche 99 | RH2 — General purpose I/O pin |
| Broche 100 | RH3 — General purpose I/O pin |
| Broche 101 | RH4 — General purpose I/O pin |
| Broche 102 | RH5 — General purpose I/O pin |
| Broche 103 | RH6 — General purpose I/O pin |
| Broche 104 | RH7 — General purpose I/O pin |
| Broche 105 | RH8 — General purpose I/O pin |
| Broche 106 | RH9 — General purpose I/O pin |
| Broche 107 | RH10 — General purpose I/O pin |
| Broche 108 | RH11 — General purpose I/O pin |
| Broche 109 | RH12 — General purpose I/O pin |
| Broche 110 | RH13 — General purpose I/O pin |
| Broche 111 | RH14 — General purpose I/O pin |
| Broche 112 | RH15 — General purpose I/O pin |
| Broche 113 | RJ0 — General purpose I/O pin |
| Broche 114 | RJ1 — General purpose I/O pin |
| Broche 115 | RJ2 — General purpose I/O pin |
| Broche 116 | RJ3 — General purpose I/O pin |
| Broche 117 | RJ4 — General purpose I/O pin |
| Broche 118 | RJ5 — General purpose I/O pin |
| Broche 119 | RJ6 — General purpose I/O pin |
| Broche 120 | RJ7 — General purpose I/O pin |
| Broche 121 | RJ8 — General purpose I/O pin |
| Broche 122 | RJ9 — General purpose I/O pin |
| Broche 123 | RJ10 — General purpose I/O pin |
| Broche 124 | RJ11 — General purpose I/O pin |
| Broche 125 | RJ12 — General purpose I/O pin |
| Broche 126 | RJ13 — General purpose I/O pin |
| Broche 127 | RJ14 — General purpose I/O pin |
| Broche 128 | RJ15 — General purpose I/O pin |
| Broche 129 | RK0 — General purpose I/O pin |
| Broche 130 | RK1 — General purpose I/O pin |
| Broche 131 | RK2 — General purpose I/O pin |
| Broche 132 | RK3 — General purpose I/O pin |
| Broche 133 | RK4 — General purpose I/O pin |
| Broche 134 | RK5 — General purpose I/O pin |
| Broche 135 | RK6 — General purpose I/O pin |
| Broche 136 | RK7 — General purpose I/O pin |
| Broche 137 | RK8 — General purpose I/O pin |
| Broche 138 | RK9 — General purpose I/O pin |
| Broche 139 | RK10 — General purpose I/O pin |
| Broche 140 | RK11 — General purpose I/O pin |
| Broche 141 | RK12 — General purpose I/O pin |
| Broche 142 | RK13 — General purpose I/O pin |
| Broche 143 | RK14 — General purpose I/O pin |
| Broche 144 | RK15 — General purpose I/O pin |
| Broche 145 | RL0 — General purpose I/O pin |
| Broche 146 | RL1 — General purpose I/O pin |
| Broche 147 | RL2 — General purpose I/O pin |
| Broche 148 | RL3 — General purpose I/O pin |
| Broche 149 | RL4 — General purpose I/O pin |
| Broche 150 | RL5 — General purpose I/O pin |
| Broche 151 | RL6 — General purpose I/O pin |
| Broche 152 | RL7 — General purpose I/O pin |
| Broche 153 | RL8 — General purpose I/O pin |
| Broche 154 | RL9 — General purpose I/O pin |
| Broche 155 | RL10 — General purpose I/O pin |
| Broche 156 | RL11 — General purpose I/O pin |
| Broche 157 | RL12 — General purpose I/O pin |
| Broche 158 | RL13 — General purpose I/O pin |
| Broche 159 | RL14 — General purpose I/O pin |
| Broche 160 | RL15 — General purpose I/O pin |
| Broche 161 | VDD — Core supply voltage |
| Broche 162 | VSS — Ground reference |
| Broche 163 | VDDIO — I/O supply voltage |
| Broche 164 | OSC1 — Crystal oscillator input |
| Broche 165 | OSC2 — Crystal oscillator output |
| Broche 166 | VDD — Core supply voltage |
| Broche 167 | VSS — Ground reference |
| Broche 168 | MCLR — Master clear reset input |
| Broche 169 | RTCC — Real-time clock calendar |
| Broche 170 | VBAT — Backup battery supply |
| Broche 171 | VDD — Core supply voltage |
| Broche 172 | VSS — Ground reference |
| Broche 173 | RA8 — General purpose I/O pin |
| Broche 174 | RA9 — General purpose I/O pin |
| Broche 175 | RA10 — General purpose I/O pin |
| Broche 176 | RA11 — General purpose I/O pin |
Applications typiques
PIC32MZ2064DAR176-V/2J convient pour 6 applications: Industrial HMI Touchscreen, Medical Patient Monitor, Home Automation Control Panel, Point-of-Sale (POS) Terminal, Automotive Infotainment Display, Industrial Test and Measurement Instrument.
Industrial HMI Touchscreen
The PIC32MZ2064DAR176-V/2J fits industrial HMI applications because it integrates a Graphics Processor, TFT LCD controller, and stacked 32 MB or 128 MB DDR2 framebuffer, eliminating the need for an external DRAM chip and high-speed parallel memory routing. The 200 MHz MIPS32 core delivers 330 DMIPS for responsive touch handling, while the 2 MB Flash accommodates full graphical assets and the 640 KB SRAM supports real-time UI composition. The 176-LQFP package and V-temp grade (-40C to +105C) suit factory floor environments where temperature swings are common. Compared to discrete MCU-plus-DRAM designs, this part reduces BOM count by 4-6 components and simplifies 4-layer PCB stack-ups. The device also supports USB, Ethernet, and CAN for connecting to PLCs and industrial networks.
Recommandé
Medical Patient Monitor
Medical patient monitors benefit from the PIC32MZ2064DAR176-V/2J's 200 MHz processing headroom for waveform rendering and the integrated graphics engine that drives high-resolution TFT displays showing ECG, SpO2, and vital signs. The 2 MB Flash stores multilingual UI assets and calibration data, while the 640 KB SRAM plus on-package DDR2 supports double-buffered graphics to prevent tearing. Hardware FPU and DSP extensions accelerate real-time digital filter computations for biosignal processing. The V-temp grade supports continuous-operation equipment in controlled clinical environments, and the 176-LQFP package provides robust through-hole-like reliability for medical device PCBs. USB and Ethernet enable connectivity to hospital information systems and bedside central stations.
Recommandé
Home Automation Control Panel
Smart home control panels with color TFT touchscreens use the PIC32MZ2064DAR176-V/2J to deliver MPU-class graphical UI performance without the software complexity of Linux. The integrated graphics processor handles animations, icons, and floor-plan rendering, while the stacked DDR2 provides framebuffer space for full-screen 800x480 WVGA or higher resolutions. The 200 MHz MIPS32 core runs home automation protocol stacks (Zigbee, Z-Wave, Matter, Wi-Fi) concurrently with UI rendering. The 176-LQFP package and V-temp grade support wall-mounted installations where indoor temperatures may reach 40-50C. Ethernet and Wi-Fi interfaces (via companion modules) enable whole-home connectivity, and the 2 MB Flash stores firmware updates for long product lifetimes.
Recommandé
Point-of-Sale (POS) Terminal
POS terminals leverage the PIC32MZ2064DAR176-V/2J for secure payment UI rendering and multi-interface connectivity. The graphics engine drives customer-facing and merchant-facing TFT displays, while the 200 MHz MIPS32 core handles encryption, transaction processing, and peripheral management (NFC reader, barcode scanner, receipt printer). The 2 MB Flash accommodates PCI-compliant firmware and audit logs, and the 640 KB SRAM plus DDR2 supports animated transaction feedback. Multiple UART, SPI, and I2C interfaces connect to payment terminals and cash drawers, while USB and Ethernet provide network connectivity. The V-temp grade supports retail environments with variable ambient temperatures and continuous duty cycles. Hardware FPU accelerates cryptographic operations for payment security.
Recommandé
Automotive Infotainment Display
Automotive infotainment secondary displays (rear-seat entertainment, instrument cluster auxiliary) can use the PIC32MZ2064DAR176-V/2J for its V-temp grade (-40C to +105C) supporting cabin and engine-bay-adjacent temperature ranges. The integrated graphics processor renders navigation maps, media controls, and vehicle status graphics, while the stacked DDR2 framebuffer supports smooth video playback at WVGA resolutions. The 200 MHz MIPS32 core handles CAN bus communication with vehicle networks and runs media decoding. The 176-LQFP package provides mechanical robustness for vibration-prone automotive environments. Multiple CAN interfaces enable integration with vehicle CAN-FD networks, and Ethernet supports automotive Ethernet for high-bandwidth rear-camera and ADAS displays.
Recommandé
Industrial Test and Measurement Instrument
Bench-top and portable test instruments (oscilloscopes, signal generators, spectrum analyzers) use the PIC32MZ2064DAR176-V/2J for its 200 MHz MIPS32 core with FPU and DSP extensions, which accelerate FFT, FIR filter, and digital signal conditioning computations. The integrated 12-bit ADC and DAC enable direct waveform capture and generation, while the TFT LCD controller drives high-resolution measurement displays. The 2 MB Flash stores calibration tables, waveforms, and instrument firmware, and the 640 KB SRAM plus DDR2 supports deep capture buffers and waveform history scrolling. The 176-LQFP package and V-temp grade suit laboratory and field environments. USB and Ethernet enable remote control and data logging integration with PC-based test software.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ2064DAR176-V/2J — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ2064DAR176-I/2J | PIC32MZ2064DAL176-I/2J | PIC32MZ2064DAS176-V/2J | PIC32MZ2064DAH176-I/2J |
|---|---|---|---|---|---|
| Package | 176-LQFP (20x20) | 176-LQFP (20x20) | 176-LQFP (20x20) | 176-LQFP (20x20) | 176-LQFP (20x20) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Architecture | MIPS32 microAptiv 32-bit | MIPS32 microAptiv 32-bit | MIPS32 microAptiv 32-bit | MIPS32 microAptiv 32-bit | MIPS32 microAptiv 32-bit |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB |
| SRAM | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB |
| Temperature Grade | V-temp (-40C to +105C) | I-temp (-40C to +85C) | I-temp (-40C to +85C) | V-temp (-40C to +105C) | I-temp (-40C to +85C) |
Principaux différenciateurs
- On-package stacked DDR2 eliminates external DRAM (vs PIC32MZ2064DAK176T-I/2J (external DDR2 variant))
- V-temp grade covers extended industrial temperature (vs PIC32MZ2064DAR176-I/2J (I-temp grade))
- Integrated graphics processor offloads UI rendering (vs PIC32MX or PIC32MM microcontrollers)
Notes de conception
Estimated: At 200 MHz with active DDR2 and graphics controller, the PIC32MZ2064DAR176-V/2J can draw 200-300 mA from VDD core supply and additional current for DDR2 I/O. Use a low-dropout regulator with at least 500 mA headroom and place decoupling capacitors (100 nF + 10 uF bulk) within 5 mm of each VDD/VSS pair. The DDR2 portion requires its own regulated 1.8V supply with strict ripple tolerance (less than 50 mV). Decouple VBAT pin with 1 uF capacitor if RTCC backup is used.
The 176-LQFP package has 0.5 mm pitch leads requiring careful PCB layout: 0.2-0.25 mm trace width between pads, solder mask defined (SMD) pads preferred over non-solder mask defined (NSMD) for tombstoning resistance. The 20x20 mm body needs 4-layer PCB minimum for proper ground plane under the package. Place all VDD pins with via-to-plane connections within 2 mm of the pin, and use 8-12 thermal vias under the exposed die attach pad area if present to improve heat dissipation.
Do not exceed the maximum junction temperature of 125C - at 200 MHz operation with full peripheral activity, self-heating can reach 15-20C above ambient in still air without proper PCB copper area. The MCLR pin requires a 10 kOhm pull-up to VDD and a 100 nF capacitor to ground for reliable reset. DDR2 trace impedance must match the controller's specification (typically 50 ohm single-ended with 100 ohm differential for clock) - mismatched impedance causes training failures and intermittent boot issues. Always program the DDR2 configuration registers per the family datasheet's initialization sequence.
Informations de conformité
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified; for automotive applications, contact Microchip factory for automotive-grade PIC32MZ variants.