PIC32MZ2064DAS169T-I/6J - 200MHz 32-bit MCU, 2MB Flash, Graphics | Microchip
Référence : PIC32MZ2064DAS169T-I/6J ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.42 | $18,42 |
| 10 | $16.85 | $168,50 |
| 100 | $14.32 | $1 432,00 |
| 500 | $12.1 | $6 050,00 |
| 1 000 | $10.85 | $10 850,00 |
PIC32MZ2064DAS169T-I/6J Présentation
What is a PIC32MZ Graphics MCU? PIC32MZ DA series microcontrollers are Microchip's high-performance 32-bit MCU family that combines MPU-class compute with the simplicity of an MCU. In the broader taxonomy they sit between traditional 32-bit microcontrollers and low-power MPUs, bringing on-chip peripherals (DDR2 controller, GPU, LCD controller, crypto engine) that historically required an external processor-plus-memory subsystem. The DAS family suffix indicates the stacked-DDR2 variant designed for embedded graphics and HMI workloads.
Key differentiating features of the PIC32MZ2064DAS169T-I/6J include: 2 MB Flash with 640 KB SRAM plus 32 MB on-chip DDR2; integrated Graphics Processing Unit and LCD controller; 12-bit 18 MSPS ADC with up to 45 input channels; CAN 2.0B and Hi-Speed USB 2.0; MIPS32 microAptiv core with 200 MHz maximum clock; and an extended industrial operating temperature range of -40C to +85C. The 169-LFBGA package provides high-density I/O for graphics bus and parallel external memory expansion.
Architecturally, the part leverages a MIPS32 microAptiv single-core implementation with hardware multiply/divide and a tightly-coupled DMA fabric feeding both the system bus and the on-chip DDR2 memory controller. This eliminates the need for an external SDRAM chip and shortens the signal path between the CPU and framebuffer memory, which directly improves GUI rendering latency and reduces PCB complexity.
Typical applications for PIC32MZ2064DAS169T-I/6J include industrial HMI panels, automotive instrument clusters, medical patient monitors, smart appliance touch interfaces, point-of-sale terminals, and avionics/rail HMIs. Its combination of integrated graphics and DDR2 in a single BGA package makes it a strong fit when PCB real estate is constrained but a rich graphical UI is required.
When designing in this part, pay close attention to the LFBGA-169 footprint (11x11 mm, 0.8 mm pitch). Microchip recommends 6-layer stack-up with impedance-controlled DDR2 routing and a continuous ground plane beneath the BGA. The internal DDR2 requires careful PCB layout - keep trace lengths matched within the controller's tolerance and follow the DDR2 power-decoupling network from the datasheet reference schematic.
This page synthesizes real-time distributor pricing, drop-in same-package alternatives from the PIC32MZ DA family, and practical PCB layout/design guidance that goes beyond what is captured in the manufacturer datasheet alone.
Alternatives de remplacement direct pour PIC32MZ2064DAS169T-I/6J — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ2064DAS169T-I/6J (même facteur de forme et même empreinte) — différant par Core Architecture, Graphics Controller, CAN, USB, ADC.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ2064DAS169T-V/6J
✅ Remplacement direct✓ En stock
$6.42 / unité
Voir la fiche technique →PIC32MZ2064DAS169-I/6J
✅ Remplacement direct✓ En stock
$11.94 / unité
Voir la fiche technique →PIC32MZ2025DAS169-V/6J
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$16.85 / unité
Voir la fiche technique →PIC32MZ1064DAB169-I/HF
✅ Remplacement direct✓ En stock
$12.4 / unité
Voir la fiche technique →PIC32MZ2064DAA169
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ2064DAS169T-I/6J Valeurs maximales et caractéristiques électriques
| Core | MIPS32 microAptiv (single-core) |
| Core Size | 32-bit |
| Maximum CPU Speed | 200 MHz |
| Program Memory (Flash) | 2 MB (2M x 8) |
| RAM (SRAM) | 640 KB |
| On-chip DRAM | 32 MB DDR2 (stacked) |
| Graphics Controller | Integrated |
| Graphics Processor (GPU) | Integrated |
| ADC | 12-bit, up to 18 MSPS |
| Analog Inputs | Up to 45 channels |
| CAN | Yes (CAN 2.0B) |
| Hi-Speed USB | Yes (USB 2.0 HS) |
| Supply Voltage (Vcc/Vdd) | 1.7 V to 1.9 V |
| Température de fonctionnement | -40C to +85C (industrial) |
| Boîtier | 169-LFBGA (11x11 mm) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Guide de configuration des broches du PIC32MZ2064DAS169T-I/6J 169-lfbga (11x11 mm)
Configuration des broches du PIC32MZ2064DAS169T-I/6J (boîtier 169-lfbga (11x11 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour PIC32MZ2064DAS169T-I/6J.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
PIC32MZ2064DAS169T-I/6J convient pour 6 applications: Industrial HMI Touch Panels, Automotive Instrument Clusters, Medical Patient Monitors, Point-of-Sale Terminals, Smart Appliance Touch Interfaces, Building Automation and IoT Gateways.
Industrial HMI Touch Panels
The PIC32MZ2064DAS169T-I/6J's 200 MHz MIPS32 microAptiv core and integrated Graphics Controller with GPU deliver smooth UI rendering for industrial touch panels. The stacked 32 MB DDR2 provides ample framebuffer for 800x480 to 1024x600 WVGA TFTs without an external SDRAM chip, simplifying PCB layout and BOM. The 12-bit 18 MSPS ADC with up to 45 analog inputs handles multiple analog sensor channels (temperature, pressure, current sensing) in parallel, while CAN 2.0B connects directly to factory automation busses. Industrial -40C to +85C operation and the 169-LFBGA footprint make it a fit for sealed panel-mount HMI enclosures.
Recommandé
Automotive Instrument Clusters
For automotive instrument clusters, the PIC32MZ2064DAS169T-I/6J provides the graphics horsepower for analog-style or fully digital dashboards while keeping PCB area small. The integrated GPU accelerates gauge rendering and animations, and the 32 MB stacked DDR2 holds framebuffers and 3D-like needle textures. The CAN 2.0B controller interfaces with the vehicle bus, while the 12-bit ADC reads analog position sensors. Note: the I-temp grade is -40C to +85C, so for cabin or under-hood designs with extended thermal range, the V-temp variant is recommended; for AEC-Q100-qualified automotive designs, Microchip's PIC32MZ DAW family is the dedicated automotive line.
Recommandé
Medical Patient Monitors
The PIC32MZ2064DAS169T-I/6J suits multi-parameter patient monitors where a clear graphical display of vitals (ECG, SpO2, NIBP) is required. Its 12-bit 18 MSPS ADC with up to 45 channels can digitize multiple bio-signal channels concurrently, while the integrated GPU draws waveforms and trend graphs efficiently. The 32 MB DDR2 framebuffer is large enough for full-motion displays, and CAN 2.0B connectivity enables integration with hospital asset tracking systems. The 169-LFBGA 11x11 mm package also supports compact handheld designs; medical designers should follow IEC 60601 isolation and EMC guidance around the BGA's exposed thermal pad.
Recommandé
Point-of-Sale Terminals
POS terminals benefit from the PIC32MZ2064DAS169T-I/6J's Hi-Speed USB 2.0 (for peripherals like printers and barcode scanners), CAN bus (for cash-drawer or scale integration in some markets), and integrated GPU for fast product imagery and animated promotions. The 2 MB Flash stores localized UI and signage content, while the 32 MB stacked DDR2 holds full-screen product graphics without external SDRAM, reducing PCB cost. The -40C to +85C industrial temperature range ensures reliable operation in store environments with fluctuating temperatures.
Recommandé
Smart Appliance Touch Interfaces
The PIC32MZ2064DAS169T-I/6J is an excellent fit for premium smart-appliance touch interfaces - refrigerators, ovens, washing machines - where a high-resolution color display is paired with capacitive touch and Wi-Fi/BLE co-processors. The integrated GPU produces smooth UI transitions, and the 32 MB DDR2 holds large icon and animation libraries without external SDRAM. The 12-bit ADC monitors temperature sensors and analog feedback loops. The 1.7-1.9 V core supply can be generated from a small buck regulator, simplifying power tree design in space-constrained appliance enclosures.
Recommandé
Building Automation and IoT Gateways
Building-automation and IoT-gateway designs leverage the PIC32MZ2064DAS169T-I/6J's CAN bus for BACnet or CANopen building networks, plus the integrated graphics to drive local color touch panels. The 200 MHz MIPS32 core can run BACnet/IP stacks alongside the HMI, and the 32 MB DDR2 holds configuration screens and trend graphs. Hi-Speed USB 2.0 supports commissioning via thumb drive, and the 12-bit ADC reads analog sensors (light, CO2, humidity). The -40C to +85C range handles unconditioned electrical rooms and outdoor enclosures when paired with conformal coating.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ2064DAS169T-I/6J — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ2064DAS169T-V/6J | PIC32MZ2064DAS169-I/6J | PIC32MZ2025DAS169-V/6J | PIC32MZ1064DAB169-I/HF | PIC32MZ2064DAA169 |
|---|---|---|---|---|---|---|
| Package | 169-LFBGA (11x11 mm) | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-BGA (9x9 mm) - same ball count, different footprint | 169-LFBGA (11x11 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Speed | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz |
| Flash | 2 MB | 2 MB | 2 MB | 2 MB | 1 MB (-50%) | 2 MB |
| SRAM | 640 KB | 640 KB | 640 KB | 525 KB (-18%) | 256 KB (-60%) | 640 KB |
| Stacked DDR2 | 32 MB | 32 MB | 32 MB | 32 MB | None (external SDRAM required) | None (external SDRAM required) |
| Operating Temperature | -40C to +85C (I) | -40C to +105C (V) | -40C to +85C (I) | -40C to +105C (V) | -40C to +85C (I) | -40C to +85C (I) |
| Packaging Format | Tape & Reel | Tape & Reel | Tray | Tape & Reel | Tray | Tray/T&R (varies) |
Principaux différenciateurs
- Integrated 32 MB stacked DDR2 eliminates external SDRAM chip (vs PIC32MZ2064DAA169)
- Industrial temperature grade (-40C to +85C) with full graphics performance (vs PIC32MZ2064DAS169T-V/6J)
- 200 MHz microAptiv core with hardware crypto engine (vs PIC32MZ2064DAG169)
Notes de conception
The 169-LFBGA (11x11 mm, 0.8 mm pitch) requires 6-layer PCB stack-up with continuous ground plane under the BGA. Use laser-drilled microvias or 0.2 mm via-in-pad for inner-row balls; route DDR2 signals with matched lengths within the controller's tolerance per the PIC32MZ Graphics datasheet reference schematic. Estimated: at 0.8 mm pitch, escape routing needs ~0.15 mm trace width and 0.15 mm spacing - confirm with PCB fab capabilities before tape-out.
The PIC32MZ2064DAS169T-I/6J operates from a 1.7 V to 1.9 V core supply; this is typically generated by an external switching regulator placed near the BGA. Decoupling must follow the datasheet's reference network: bulk 22 uF + 100 nF + 1 nF per supply pin group. The stacked DDR2 shares this rail - add 10 uF decoupling adjacent to each DDR2 power ball. Estimated: at 200 MHz core speed, peak core current reaches ~300 mA under graphics load; verify with bench measurement.
The 169-LFBGA has its thermal pad as the primary heat-dissipation path. Microchip recommends 25-30 thermal vias in the pad array connecting to internal copper planes. At 200 MHz CPU + GPU rendering, junction temperature can rise 15-20 C above ambient; keep the BGA away from board-edge heat sources. For sealed enclosures, validate with a thermocouple on the BGA top during worst-case GUI workload.
Common PIC32MZ DA pitfalls: (1) the /6J suffix designates the 169-LFBGA - do not confuse with /2J (176-LQFP) or /HF (different BGA); (2) the stacked DDR2 is internal and is NOT externally addressable in addition - external SDRAM cannot be added; (3) programming requires MPLAB-X with Harmony 3 framework; legacy MPLAB 8 projects need migration. Always order the matching PIC32MZ DA family programming/debug header for development.
Informations de conformité
RoHS compliant per Microchip product page. Standard industrial grade only - NOT AEC-Q100 qualified; for AEC-Q100 automotive applications use Microchip's PIC32MZ DAW automotive family.