RTAX2000S-1CGS624V - 2M-Gate Rad-Tolerant FPGA | Microchip
Référence : RTAX2000S-1CGS624V ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4850 | $4 850,00 |
| 10 | $4620 | $46 200,00 |
| 100 | $4380 | $438 000,00 |
| 500 | $4150 | $2 075 000,00 |
| 1 000 | $3950 | $3 950 000,00 |
RTAX2000S-1CGS624V Présentation
A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the ionizing radiation environments of space flight, where single-event upsets (SEUs) and total ionizing dose (TID) would corrupt or destroy standard commercial silicon. Within the power/semiconductor hierarchy, the RTAX-S family sits under radiation-tolerant programmable logic, alongside flash-based and antifuse-based space FPGAs, and is a direct descendant of the commercial Actel Axcelerator family architecture.
Key features include SEU-hardened flip-flops that eliminate the need for triple-module redundancy (TMR) in many designs, embedded SRAM blocks with built-in FIFO control logic, segmentable clock conditioning circuitry, and chip-wide highway routing. The family reaches up to four million equivalent system gates, and the RTAX2000S additionally provides about 250,000 ASIC gates of companion capacity per Microchip USA data. Live-at-power-up operation and a true single-chip form factor remove the external configuration device required by SRAM FPGAs, increasing board-level reliability.
The device is fabricated on a CMOS process and programmed via antifuse technology, which is inherently immune to configuration upsets - a decisive advantage in orbit where configuration scrubbing is costly. Performance is preserved at high density, making the RTAX2000S suitable as the main payload processing element.
Typical applications include satellite payload data processing, spacecraft bus control and telemetry, orbital instrument interfaces, and launch-vehicle avionics - anywhere high gate counts must coexist with proven radiation tolerance.
Designers should plan I/O bank voltage budgets early: the CG624 package dedicates hundreds of balls to I/O and power, and supply rails must stay within the 1.425V-1.575V core window under all load transients.
This page synthesizes verified distributor data, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour RTAX2000S-1CGS624V — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec RTAX2000S-1CGS624V (même facteur de forme et même empreinte) — différant par Package, Configuration, Embedded Memory, Equivalent System Gates, Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
RTAX2000SL-1CGS624V
✅ Remplacement direct✓ En stock
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Voir la fiche technique →RTAX2000S-1CG624V
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
RTAX2000SL-1CGS624E
✅ Remplacement direct✓ En stock
$10750 / unité
Voir la fiche technique →RTAX2000SL-1CGS624EV
✅ Remplacement direct✓ En stock
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Voir la fiche technique →RTAX2000S-1CG624PROTO
✅ Remplacement direct✓ En stock
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Voir la fiche technique →RTAX2000S-CGS624V
✅ Remplacement direct✓ En stock
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Voir la fiche technique →RTAX2000S-1CGS624V Valeurs maximales et caractéristiques électriques
| Family | RTAX-S Radiation-Tolerant FPGA |
| Equivalent System Gates | 2,000,000 |
| Configurable Logic Blocks (CLBs) | 21,504 |
| Total Logic Cells | 32,256 |
| ASIC Gate Capacity (companion) | 250,000 gates |
| Core Supply Voltage (nominal) | 1.5 V |
| Core Supply Voltage Range | 1.425 V to 1.575 V |
| Logic Family | CMOS |
| Speed Grade | -1 |
| Température de fonctionnement | -55C to +125C |
| Boîtier | CG624 Ceramic Column Grid Array (CCGA), 624 balls |
| Type de montage | Surface Mount |
| Programming Technology | Antifuse (one-time programmable) |
| SEU Hardening | SEU-hardened registers, immune to single-event upsets |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Configuration | Live at power-up, single-chip (no external config device) |
Guide de configuration des broches du RTAX2000S-1CGS624V cg624 ceramic column grid array (ccga), 624 balls
Configuration des broches du RTAX2000S-1CGS624V (boîtier cg624 ceramic column grid array (ccga), 624 balls). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour RTAX2000S-1CGS624V.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
RTAX2000S-1CGS624V convient pour 6 applications: Satellite Payload Data Processing, Spacecraft Bus Control and Telemetry, Orbital Instrument Interfaces, Launch Vehicle Avionics, Deep-Space Mission Electronics, FPGA Prototyping and Board Bring-Up.
Satellite Payload Data Processing
The RTAX2000S-1CGS624V fits payload data processing because 2,000,000 system gates and 21,504 CLBs absorb high-throughput framing, compression, and channelization functions in a single SEU-tolerant device. Its embedded SRAM with built-in FIFO control buffers payload data streams without external FIFO chips, reducing parts count on a reliability-critical board. Placed between the payload sensor chain and the downlink formatter, the antifuse configuration eliminates the scrubber and configuration memory that SRAM FPGAs require, removing a full failure mode; the -1 speed grade sustains typical payload clock rates while keeping the 1.5V core power low enough for spacecraft power budgets.
Recommandé
Spacecraft Bus Control and Telemetry
Spacecraft bus controllers need deterministic, live-at-power-up logic - exactly what the RTAX2000S-1CGS624V provides. Because its antifuse configuration is present the instant power is applied, telemetry acquisition, mode control, and safe-mode sequencing operate from the first millisecond without boot delay, a decisive advantage over SRAM FPGAs during power transients or safe-mode recovery. The 32,256-cell architecture with segmentable clock conditioning supports multiple independent clock domains for OBC interfaces, and the SEU-hardened registers keep control state valid through single-event upsets without full TMR, freeing roughly half the logic capacity that TMR would otherwise consume on a 2M-gate device.
Recommandé
Orbital Instrument Interfaces
Scientific instruments in orbit - imagers, spectrometers, particle detectors - demand glueless interfaces between sensor front ends and onboard processing. The RTAX2000S-1CGS624V dedicates a large I/O count within its 624-ball CCGA package, enabling wide parallel sensor buses, multiple LVDS-class interfaces, and power/ground integrity in one package. Its 1.5V CMOS core keeps dissipation low inside thermally constrained instruments, while the -55C to +125C operating range covers eclipse-to-sunlit thermal cycling. Chip-wide highway routing simplifies distributing instrument timing across the die, and the SEU-hardened flip-flops protect acquisition counters and detector state machines against latch-up-free single-event effects at typical LEO LET thresholds.
Recommandé
Launch Vehicle Avionics
Launch avionics face extreme vibration, short missions, and total ionizing dose accumulated through the atmosphere - the RTAX2000S-1CGS624V addresses all three. The ceramic column grid array package survives mechanical shock and thermal excursion better than plastic BGA alternatives, and the -55C to +125C range covers unconditioned avionics bays. With 2M gates, one device integrates flight sequencing, redundancy voting, and telemetry encoding, replacing multiple glue ASICs whose radiation qualification would otherwise be required. Live-at-power-up operation guarantees sequencer availability at ignition power application, and hardened registers maintain flight-state variables through the natural radiation environment without software intervention.
Recommandé
Deep-Space Mission Electronics
Deep-space missions accumulate far higher TID than LEO missions, making device-level radiation tolerance the first line of defense. The RTAX2000SL variant sharing the RTAX2000S-1CGS624V footprint provides enhanced radiation characteristics for such trajectories, and designs can migrate between S and SL parts on the same PCB as mission requirements firm up. The 2,000,000-gate capacity hosts autonomous fault management, science data preprocessing, and spacecraft autonomy logic needed when light-delay rules out ground intervention. Antifuse immunity to configuration upsets matters especially in heavy-ion environments beyond Earth's magnetosphere, where SRAM configuration scrubbing would otherwise consume scarce uplink and processor bandwidth continuously.
Recommandé
FPGA Prototyping and Board Bring-Up
Flight boards carrying the RTAX2000S-1CGS624V can be developed and debugged before flight units arrive by using prototype-screening parts in the same CG624 footprint, such as RTAX2000S-1CG624PROTO, or the Aldec ACT-H3K-CG624 adaptor that mimics the CG624 ball pattern with an A3PE3000 commercial FPGA. Because the adaptor and prototype parts preserve the footprint, PCB layout, signal integrity, and power distribution are validated against the real flight configuration. The 1.5V core supply and I/O banking carry over directly, so timing closure work in Microchip Libero SoC transfers with only screening-level re-verification when flight devices are installed.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour RTAX2000S-1CGS624V — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | RTAX2000SL-1CGS624V | RTAX2000S-1CG624V | RTAX2000S-1CG624PROTO |
|---|---|---|---|---|
| Package | CG624 CCGA (624 balls) | CG624 CCGA - same | CG624 CCGA - same | CG624 CCGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 2,000,000 | 2,000,000 | 2,000,000 | 2,000,000 |
| Speed Grade | -1 | -1 | -1 | -1 |
| Core Supply | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) |
| Radiation Performance | RTAX-S standard rad-tolerant | Enhanced (SL) | Standard (S) | Standard (S), prototype flow |
| Operating Temperature | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C |
| Intended Use | Flight production | Flight production (harsher environments) | Flight production | Prototyping / board bring-up only |
Principaux différenciateurs
- SEU-hardened registers without full TMR (vs RTAX2000S-1CG624V)
- Antifuse configuration immunity vs SRAM FPGAs (vs A3PE3000-1FGG896I)
- 2M-gate density in a single chip (vs RTAX250S-1LG624V)
Notes de conception
Hold the 1.5V core within 1.425V-1.575V under all load transients. Estimated: a 2M-gate antifuse design toggling at moderate activity can draw on the order of 1-3A of core current; with a 50mOhm power distribution path, a 2A step yields only 100mV droop, but a poorly decoupled rail can exceed the 75mV tolerance band. Use a point-of-load space-grade regulator with remote sense, plus bulk ceramic capacitance near the CCGA power balls and at least 0.1uF per power pair distributed across the package.
The CG624 ceramic column grid array requires controlled reflow profiles and column-inspection per your solderability process - ceramic CCGAs have CTE mismatch with FR-4, so specify a low-CTE or thick-copper-stiffened PCB for flight assemblies and verify with X-ray after assembly. Keep the escape fanout symmetric to avoid warpage, and follow Microchip application guidance for RTAX-S CCGA land patterns; prototype with RTAX2000S-1CG624PROTO parts or the Aldec ACT-H3K-CG624 adaptor before committing flight hardware.
Antifuse devices are one-time programmable: an uncorrectable design error after programming scraps the device, so complete full timing simulation and formal verification in Microchip Libero SoC before committing to programming. Also remember that SEU-hardened registers reduce but do not eliminate the need for mitigation - critical control state machines should still be reviewed for single-point failures. Do not exceed 1.575V on the core even transiently during brown-out recovery; sequence I/O rails before core per the RTAX-S power-up guidance.
Informations de conformité
Space-grade ceramic-package devices are frequently exempt from RoHS lead-free mandates (ceramic package hermeticity requires leaded seal materials); verify exemption status with Microchip for your program. No compliance data was present in the provided sources.
