RTAX2000S-1CGS624V - 2M-Gate Rad-Tolerant FPGA | Microchip
MPN: RTAX2000S-1CGS624V ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4850 | $4,850.00 |
| 10 | $4620 | $46,200.00 |
| 100 | $4380 | $438,000.00 |
| 500 | $4150 | $2,075,000.00 |
| 1,000 | $3950 | $3,950,000.00 |
Drop-in alternatives for RTAX2000S-1CGS624V — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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RTAX2000SL-1CGS624V
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View Datasheet →RTAX2000S-1CG624V
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RTAX2000SL-1CGS624E
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$10750 / Unit
View Datasheet →RTAX2000SL-1CGS624EV
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View Datasheet →RTAX2000S-1CG624PROTO
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View Datasheet →RTAX2000S-CGS624V
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View Datasheet →RTAX2000S-1CGS624V Maximum Ratings & Electrical Characteristics
| Family | RTAX-S Radiation-Tolerant FPGA |
| Equivalent System Gates | 2,000,000 |
| Configurable Logic Blocks (CLBs) | 21,504 |
| Total Logic Cells | 32,256 |
| ASIC Gate Capacity (companion) | 250,000 gates |
| Core Supply Voltage (nominal) | 1.5 V |
| Core Supply Voltage Range | 1.425 V to 1.575 V |
| Logic Family | CMOS |
| Speed Grade | -1 |
| Operating Temperature | -55C to +125C |
| Package | CG624 Ceramic Column Grid Array (CCGA), 624 balls |
| Mounting Type | Surface Mount |
| Programming Technology | Antifuse (one-time programmable) |
| SEU Hardening | SEU-hardened registers, immune to single-event upsets |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Configuration | Live at power-up, single-chip (no external config device) |
RTAX2000S-1CGS624V cg624 ceramic column grid array (ccga), 624 balls Pin Configuration Guide
Complete pinout information for RTAX2000S-1CGS624V (cg624 ceramic column grid array (ccga), 624 balls package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX2000S-1CGS624V.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX2000S-1CGS624V is suitable for 6 applications: Satellite Payload Data Processing, Spacecraft Bus Control and Telemetry, Orbital Instrument Interfaces, Launch Vehicle Avionics, Deep-Space Mission Electronics, FPGA Prototyping and Board Bring-Up.
Satellite Payload Data Processing
The RTAX2000S-1CGS624V fits payload data processing because 2,000,000 system gates and 21,504 CLBs absorb high-throughput framing, compression, and channelization functions in a single SEU-tolerant device. Its embedded SRAM with built-in FIFO control buffers payload data streams without external FIFO chips, reducing parts count on a reliability-critical board. Placed between the payload sensor chain and the downlink formatter, the antifuse configuration eliminates the scrubber and configuration memory that SRAM FPGAs require, removing a full failure mode; the -1 speed grade sustains typical payload clock rates while keeping the 1.5V core power low enough for spacecraft power budgets.
Recommended
Spacecraft Bus Control and Telemetry
Spacecraft bus controllers need deterministic, live-at-power-up logic - exactly what the RTAX2000S-1CGS624V provides. Because its antifuse configuration is present the instant power is applied, telemetry acquisition, mode control, and safe-mode sequencing operate from the first millisecond without boot delay, a decisive advantage over SRAM FPGAs during power transients or safe-mode recovery. The 32,256-cell architecture with segmentable clock conditioning supports multiple independent clock domains for OBC interfaces, and the SEU-hardened registers keep control state valid through single-event upsets without full TMR, freeing roughly half the logic capacity that TMR would otherwise consume on a 2M-gate device.
Recommended
Orbital Instrument Interfaces
Scientific instruments in orbit - imagers, spectrometers, particle detectors - demand glueless interfaces between sensor front ends and onboard processing. The RTAX2000S-1CGS624V dedicates a large I/O count within its 624-ball CCGA package, enabling wide parallel sensor buses, multiple LVDS-class interfaces, and power/ground integrity in one package. Its 1.5V CMOS core keeps dissipation low inside thermally constrained instruments, while the -55C to +125C operating range covers eclipse-to-sunlit thermal cycling. Chip-wide highway routing simplifies distributing instrument timing across the die, and the SEU-hardened flip-flops protect acquisition counters and detector state machines against latch-up-free single-event effects at typical LEO LET thresholds.
Recommended
Launch Vehicle Avionics
Launch avionics face extreme vibration, short missions, and total ionizing dose accumulated through the atmosphere - the RTAX2000S-1CGS624V addresses all three. The ceramic column grid array package survives mechanical shock and thermal excursion better than plastic BGA alternatives, and the -55C to +125C range covers unconditioned avionics bays. With 2M gates, one device integrates flight sequencing, redundancy voting, and telemetry encoding, replacing multiple glue ASICs whose radiation qualification would otherwise be required. Live-at-power-up operation guarantees sequencer availability at ignition power application, and hardened registers maintain flight-state variables through the natural radiation environment without software intervention.
Recommended
Deep-Space Mission Electronics
Deep-space missions accumulate far higher TID than LEO missions, making device-level radiation tolerance the first line of defense. The RTAX2000SL variant sharing the RTAX2000S-1CGS624V footprint provides enhanced radiation characteristics for such trajectories, and designs can migrate between S and SL parts on the same PCB as mission requirements firm up. The 2,000,000-gate capacity hosts autonomous fault management, science data preprocessing, and spacecraft autonomy logic needed when light-delay rules out ground intervention. Antifuse immunity to configuration upsets matters especially in heavy-ion environments beyond Earth's magnetosphere, where SRAM configuration scrubbing would otherwise consume scarce uplink and processor bandwidth continuously.
Recommended
FPGA Prototyping and Board Bring-Up
Flight boards carrying the RTAX2000S-1CGS624V can be developed and debugged before flight units arrive by using prototype-screening parts in the same CG624 footprint, such as RTAX2000S-1CG624PROTO, or the Aldec ACT-H3K-CG624 adaptor that mimics the CG624 ball pattern with an A3PE3000 commercial FPGA. Because the adaptor and prototype parts preserve the footprint, PCB layout, signal integrity, and power distribution are validated against the real flight configuration. The 1.5V core supply and I/O banking carry over directly, so timing closure work in Microchip Libero SoC transfers with only screening-level re-verification when flight devices are installed.
Recommended
Recommended Products Summary
Engineering reference data for RTAX2000S-1CGS624V — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX2000SL-1CGS624V | RTAX2000S-1CG624V | RTAX2000S-1CG624PROTO |
|---|---|---|---|---|
| Package | CG624 CCGA (624 balls) | CG624 CCGA - same | CG624 CCGA - same | CG624 CCGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 2,000,000 | 2,000,000 | 2,000,000 | 2,000,000 |
| Speed Grade | -1 | -1 | -1 | -1 |
| Core Supply | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) |
| Radiation Performance | RTAX-S standard rad-tolerant | Enhanced (SL) | Standard (S) | Standard (S), prototype flow |
| Operating Temperature | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C |
| Intended Use | Flight production | Flight production (harsher environments) | Flight production | Prototyping / board bring-up only |
Key Differentiators
- SEU-hardened registers without full TMR (vs RTAX2000S-1CG624V)
- Antifuse configuration immunity vs SRAM FPGAs (vs A3PE3000-1FGG896I)
- 2M-gate density in a single chip (vs RTAX250S-1LG624V)
Design Notes
Hold the 1.5V core within 1.425V-1.575V under all load transients. Estimated: a 2M-gate antifuse design toggling at moderate activity can draw on the order of 1-3A of core current; with a 50mOhm power distribution path, a 2A step yields only 100mV droop, but a poorly decoupled rail can exceed the 75mV tolerance band. Use a point-of-load space-grade regulator with remote sense, plus bulk ceramic capacitance near the CCGA power balls and at least 0.1uF per power pair distributed across the package.
The CG624 ceramic column grid array requires controlled reflow profiles and column-inspection per your solderability process - ceramic CCGAs have CTE mismatch with FR-4, so specify a low-CTE or thick-copper-stiffened PCB for flight assemblies and verify with X-ray after assembly. Keep the escape fanout symmetric to avoid warpage, and follow Microchip application guidance for RTAX-S CCGA land patterns; prototype with RTAX2000S-1CG624PROTO parts or the Aldec ACT-H3K-CG624 adaptor before committing flight hardware.
Antifuse devices are one-time programmable: an uncorrectable design error after programming scraps the device, so complete full timing simulation and formal verification in Microchip Libero SoC before committing to programming. Also remember that SEU-hardened registers reduce but do not eliminate the need for mitigation - critical control state machines should still be reviewed for single-point failures. Do not exceed 1.575V on the core even transiently during brown-out recovery; sequence I/O rails before core per the RTAX-S power-up guidance.
Compliance Information
Space-grade ceramic-package devices are frequently exempt from RoHS lead-free mandates (ceramic package hermeticity requires leaded seal materials); verify exemption status with Microchip for your program. No compliance data was present in the provided sources.
