RTAX250SL-CQ208V - 250K-Gate Rad-Tolerant FPGA | Actel/Microsemi
Référence : RTAX250SL-CQ208V ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1 | $1,00 |
| 10 | $1 | $10,00 |
| 100 | $1 | $100,00 |
| 500 | $1 | $500,00 |
| 1 000 | $1 | $1 000,00 |
RTAX250SL-CQ208V Présentation
A radiation-tolerant FPGA is a field-programmable gate array engineered to survive and operate in the harsh radiation environments of space, where single-event effects (SEE) and total ionizing dose (TID) can corrupt or destroy commercial silicon. Within the power-management-free programmable logic hierarchy, the RTAX-S/SL family sits at the top of Actel's space-grade offering, descended from the AX commercial accelerator architecture and qualified for satellite, planetary probe, and launch-vehicle avionics applications.
Key features include 250,000 equivalent system gates organized around 4,224 logic cells (2,816 CLBs), embedded SRAM blocks with built-in FIFO control logic, segmentable clock resources, chip-wide highway routing, and carry logic for arithmetic functions. The 0.15 um antifuse-based CMOS process provides true single-chip, live-at-power-up operation without external configuration devices - a critical reliability advantage in orbit where boot-time configuration reads are vulnerable to SEUs.
The device operates from a 1.5V nominal core supply across a military temperature range of -55C to +125C, with system performance demonstrated at up to 649 MHz in the RTAX250S family. The RTAX250SL variant adds SEU-hardened flip-flop options and improved radiation tolerance parameters for the most demanding LEO, MEO, and GEO missions.
Typical applications include satellite payload data processing, telemetry/telecommand interfaces, bus controllers, spacecraft attitude-control systems, and reconfigurable glue logic replacing multiple MIL-STD ASICs and SSI/MSI devices.
Design consideration: prototype using the footprint-compatible RTAX250SL-1CQ208PROTO flash-based adaptor approach with the EDIF netlist and pinout converter methodology described in the manufacturer's application note Prototyping for RTAX-S and RTAX-SL Devices, then migrate to the flight unit.
This page synthesizes distributor availability data, drop-in alternatives, and design guidance not consolidated in the manufacturer datasheet.
Alternatives de remplacement direct pour RTAX250SL-CQ208V — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec RTAX250SL-CQ208V (même facteur de forme et même empreinte) — différant par Family, Package, Core Supply Voltage, Configuration, Radiation Tolerance.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
RTAX250S-CQ208V
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →RTAX250S-CQ208PROTO
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →RTAX250SL-1CQ208PROTO
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →RTAX250SL-1CQ208V
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2720 / unité
Voir la fiche technique →RTAX250SL-CQ208V Valeurs maximales et caractéristiques électriques
| Programmable Logic Type | Radiation-Tolerant FPGA (antifuse, live at power-up) |
| System Gates | 250000 gates |
| Logic Cells | 4224 |
| CLBs | 2816 |
| Process Technology | 0.15 um CMOS |
| Core Supply Voltage | 1.5 V nominal |
| Température de fonctionnement | -55C to +125C |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Maximum Frequency (family) | 649 MHz |
| Boîtier | 208-Pin CQFP (ceramic quad flat pack) |
| Radiation Qualification Suffix | V (radiation qualified, space flight grade) |
| Configuration | Single-chip, live-at-power-up (no external boot device) |
| Clocking | Segmentable clocks, chip-wide highway routing |
| Special Logic | Carry logic for arithmetic; SEU-hardened flip-flops (SL variant) |
| Type de montage | Surface Mount |
| Family | RTAX-S/SL and RTAX-DSP Radiation-Tolerant FPGAs |
Guide de configuration des broches du RTAX250SL-CQ208V 208-pin cqfp (ceramic quad flat pack)
Configuration des broches du RTAX250SL-CQ208V (boîtier 208-pin cqfp (ceramic quad flat pack)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour RTAX250SL-CQ208V.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
RTAX250SL-CQ208V convient pour 6 applications: Satellite Payload Data Processing, Spacecraft Telemetry and Telecommand Interface, Attitude Control and Platform Avionics, Launch Vehicle Electronics, Reconfigurable Glue Logic Replacing ASIC/SSI-MSI, Design Prototyping and Netlist Migration.
Satellite Payload Data Processing
The RTAX250SL-CQ208V fits satellite payload processing because it combines 250,000 gates and 4,224 logic cells with embedded SRAM blocks featuring built-in FIFO control logic, enabling on-orbit data formatting, buffering, and compression pipelines in a single radiation-tolerant device. Its antifuse, live-at-power-up architecture eliminates configuration readout vulnerabilities to single-event upsets, a key reliability consideration for payloads that must function immediately after launch-vehicle separation. In a typical payload chain, the FPGA bridges high-rate sensor or downlink interfaces to the spacecraft bus, using chip-wide highway routing for wide data paths and carry logic for arithmetic such as CRC and framing. The 1.5V core supply keeps dynamic power low, conserving limited spacecraft power margin, while the -55C to +125C range and V-grade screening cover eclipse cycling and flight qualification requirements.
Recommandé
Spacecraft Telemetry and Telecommand Interface
For telemetry/telecommand (TM/TC) interfaces, the RTAX250SL-CQ208V provides deterministic, single-chip logic that implements CCSDS-style framing, channel coding support structures, and bus protocols without external configuration memory - the live-at-power-up property ensures the TM/TC path is operational the instant spacecraft power is applied. The 208-pin CQFP package offers sufficient I/O for parallel status buses, redundant UART/MIL-STD-1553-style links, and discrete commands, while SEU-hardened flip-flop options in the SL variant protect state machines that control critical uplink decoding. Segmentable clock resources let designers build independent timing domains for the command decoder and telemetry encoder sides. Designers should budget for triple-module redundancy in software-voted control registers and use the manufacturer's prototyping methodology (footprint-compatible PROTO adaptor plus EDIF pinout converter) to validate the interface timing before committing flight antifuse parts.
Recommandé
Attitude Control and Platform Avionics
Spacecraft attitude-control electronics benefit from the RTAX250SL-CQ208V's combination of deterministic antifuse logic and military-grade -55C to +125C operation. The device typically implements sensor-interface glue logic for star trackers, reaction-wheel and magnetorquer drive timing, and safe-mode watchdog functions that must never depend on a configuration-load sequence. Its 2,816 CLBs and carry logic support real-time arithmetic such as PID-loop preprocessing and pulse-width modulation generation with deterministic latency, which is essential for control-loop stability analysis. The SL variant's SEU-hardened flip-flops reduce the probability that a single-event upset corrupts a control state, complementing system-level voting. Because the RTAX-S family is pin-migratable across densities within package families, teams can upsize platform logic later using Microchip's footprint-compatible adaptor board and EDIF pinout converter methodology without redesigning the avionics motherboard.
Recommandé
Launch Vehicle Electronics
Launch-vehicle flight electronics face extreme vibration, wide thermal excursions, and short but radiation-relevant trajectories, all of which the ceramic CQFP-208 packaged RTAX250SL-CQ208V addresses: the ceramic package provides mechanical robustness suited to high-shock environments, and the -55C to +125C rating covers ascent thermal profiles. The antifuse fabric is inherently immune to configuration upsets, so sequencer and flight-termination-adjacent logic stays valid through the entire powered flight. With 250K gates, designers can integrate redundant command decoders, event timers, and bus bridges that historically required multiple MIL-spec SSI/MSI devices, reducing board area, mass, and solder-joint count - a direct reliability gain. The live-at-power-up characteristic simplifies power-on sequencing during countdown hold and recycle scenarios. Prototype the design on the CQ208PROTO footprint device before flight-lot screening.
Recommandé
Reconfigurable Glue Logic Replacing ASIC/SSI-MSI
A primary economic use of RTAX250SL-CQ208V is consolidating legacy MIL-STD ASICs and obsoleted SSI/MSI glue logic into one rad-tolerant, single-chip device. The RTAX-S/SL family was explicitly built on Microsemi's commercial Accelerator (AX) architecture, giving ASIC-like density - 250,000 system gates - with FPGA lead times and no mask charges. Embedded SRAM with FIFO control replaces external dual-port RAM and FIFO devices, and chip-wide highway routing handles wide bus interconnect that once consumed dozens of 54-series parts. For programs maintaining legacy spacecraft and ground equipment, replacing a dying ASIC requires only a netlist re-implementation in Libero plus the documented footprint-migration flow. The V-qualified CQFP-208 unit then sustains depots for years. Estimated board-level gains commonly include lower static power than multi-device TTL stacks and elimination of configuration-memory failure modes.
Recommandé
Design Prototyping and Netlist Migration
Microchip's sanctioned RTAX development flow makes the RTAX250SL-CQ208V design cycle safer: engineers first implement the design on a footprint-compatible adaptor board using flash-based reprogrammable silicon (Aldec/Microchip ProASIC3E-based prototyping solutions), then convert the EDIF netlist and pinout with the documented converter tool for migration to the antifuse flight device. The RTAX250SL-1CQ208PROTO and RTAX250S-CQ208PROTO orderable parts share the exact CQ208 footprint, so the same PCB that hosts prototype units accepts the flight CQ208V without rework. This methodology, described in the application note Prototyping for RTAX-S and RTAX-SL Devices, catches functional and timing issues while flight silicon is on order, de-risking long space-program schedules. It also enables firmware-like iteration during integration tests that antifuse flight parts cannot support directly.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour RTAX250SL-CQ208V — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | RTAX250S-CQ208V | RTAX250S-CQ208PROTO | RTAX250SL-1CQ208PROTO | RTAX250SL-1CQ208V |
|---|---|---|---|---|---|
| Package | 208-Pin CQFP (CQ208V) | 208-Pin CQFP - same | 208-Pin CQFP - same | 208-Pin CQFP - same | 208-Pin CQFP - same |
| Brand | Actel (Microsemi / Microchip Technology) | Actel (Microsemi) | Actel (Microsemi) | Actel (Microsemi) | Actel (Microsemi) |
| System Gates | 250000 gates | 250000 gates | 250000 gates | 250000 gates | 250000 gates |
| Logic Cells / CLBs | 4224 / 2816 | 4224 / 2816 | 4224 / 2816 | 4224 / 2816 | 4224 / 2816 |
| Core Supply Voltage | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal |
| Operating Temperature | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C |
| Radiation Qualification | V suffix (radiation qualified, flight grade) | V suffix (flight grade, base RTAX-S rad level) | PROTO flow (not flight-screened) | PROTO flow (not flight-screened) | V suffix (flight grade, SL rad level) |
| Speed Grade | Standard | Standard | Standard (PROTO) | -1 (faster, PROTO) | -1 (faster) |
| Configuration | Antifuse, live-at-power-up, single chip | Antifuse, live-at-power-up | Antifuse, live-at-power-up | Antifuse, live-at-power-up | Antifuse, live-at-power-up |
Principaux différenciateurs
- SEU-hardened flip-flops for harsh radiation environments (vs RTAX250S-CQ208V)
- Flight-qualified (V suffix) screening flow (vs RTAX250SL-1CQ208PROTO)
- Antifuse live-at-power-up configuration (vs RTAX250SL-1CQ208V (same die))
Notes de conception
RTAX-S/SL flight devices use one-time-programmable antifuse technology: once programmed, the part cannot be reconfigured, and a netlist error means scrapping a flight-graded unit. Always complete functional, timing, and radiation-mode validation on the footprint-compatible PROTO device (RTAX250SL-1CQ208PROTO) using the EDIF netlist and pinout converter flow from the application note Prototyping for RTAX-S and RTAX-SL Devices before programming the flight CQ208V. Order flight parts with long lead time in parallel with prototyping, not after.
Design for SEU resilience at the system level, not just the device level. Although the SL variant offers SEU-hardened flip-flops, control registers and state machines should use triple-module redundancy (TMR) in the RTL with voter logic, and configuration-independent antifuse routing should be exploited for safety-critical paths. Apply Microchip's recommended SEU mitigation guidelines from the RTAX-S/SL datasheet when choosing between the RTAX250S and RTAX250SL dies for your orbit profile (LEO versus GEO radiation dose rates).
The RTAX250SL-CQ208V runs from a 1.5V nominal core supply; ensure the spacecraft power distribution provides clean 1.5V and proper I/O bank rails with local decoupling at the CQFP-208 power pins. Space-qualified ceramic CQFP packages have low thermal conductivity paths, so estimated junction temperature rise should be verified against your mission thermal model using the datasheet power-estimation methodology, especially for high-utilization designs near the 250K-gate ceiling operating through +125C ambient extremes.
Informations de conformité
Space-grade ceramic-package device; environmental compliance declarations were not present in the retrieved distributor data. Consult Microchip product compliance documentation for this orderable MPN.
