RTAX250SL-CQ208V - 250K-Gate Rad-Tolerant FPGA | Actel/Microsemi
MPN: RTAX250SL-CQ208V ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1 | $1.00 |
| 10 | $1 | $10.00 |
| 100 | $1 | $100.00 |
| 500 | $1 | $500.00 |
| 1,000 | $1 | $1,000.00 |
Drop-in alternatives for RTAX250SL-CQ208V — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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RTAX250S-CQ208V
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View Datasheet →RTAX250S-CQ208PROTO
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View Datasheet →RTAX250SL-1CQ208PROTO
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View Datasheet →RTAX250SL-1CQ208V
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$2720 / Unit
View Datasheet →RTAX250SL-CQ208V Maximum Ratings & Electrical Characteristics
| Programmable Logic Type | Radiation-Tolerant FPGA (antifuse, live at power-up) |
| System Gates | 250000 gates |
| Logic Cells | 4224 |
| CLBs | 2816 |
| Process Technology | 0.15 um CMOS |
| Core Supply Voltage | 1.5 V nominal |
| Operating Temperature | -55C to +125C |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Maximum Frequency (family) | 649 MHz |
| Package | 208-Pin CQFP (ceramic quad flat pack) |
| Radiation Qualification Suffix | V (radiation qualified, space flight grade) |
| Configuration | Single-chip, live-at-power-up (no external boot device) |
| Clocking | Segmentable clocks, chip-wide highway routing |
| Special Logic | Carry logic for arithmetic; SEU-hardened flip-flops (SL variant) |
| Mounting Type | Surface Mount |
| Family | RTAX-S/SL and RTAX-DSP Radiation-Tolerant FPGAs |
RTAX250SL-CQ208V 208-pin cqfp (ceramic quad flat pack) Pin Configuration Guide
Complete pinout information for RTAX250SL-CQ208V (208-pin cqfp (ceramic quad flat pack) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX250SL-CQ208V.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX250SL-CQ208V is suitable for 6 applications: Satellite Payload Data Processing, Spacecraft Telemetry and Telecommand Interface, Attitude Control and Platform Avionics, Launch Vehicle Electronics, Reconfigurable Glue Logic Replacing ASIC/SSI-MSI, Design Prototyping and Netlist Migration.
Satellite Payload Data Processing
The RTAX250SL-CQ208V fits satellite payload processing because it combines 250,000 gates and 4,224 logic cells with embedded SRAM blocks featuring built-in FIFO control logic, enabling on-orbit data formatting, buffering, and compression pipelines in a single radiation-tolerant device. Its antifuse, live-at-power-up architecture eliminates configuration readout vulnerabilities to single-event upsets, a key reliability consideration for payloads that must function immediately after launch-vehicle separation. In a typical payload chain, the FPGA bridges high-rate sensor or downlink interfaces to the spacecraft bus, using chip-wide highway routing for wide data paths and carry logic for arithmetic such as CRC and framing. The 1.5V core supply keeps dynamic power low, conserving limited spacecraft power margin, while the -55C to +125C range and V-grade screening cover eclipse cycling and flight qualification requirements.
Recommended
Spacecraft Telemetry and Telecommand Interface
For telemetry/telecommand (TM/TC) interfaces, the RTAX250SL-CQ208V provides deterministic, single-chip logic that implements CCSDS-style framing, channel coding support structures, and bus protocols without external configuration memory - the live-at-power-up property ensures the TM/TC path is operational the instant spacecraft power is applied. The 208-pin CQFP package offers sufficient I/O for parallel status buses, redundant UART/MIL-STD-1553-style links, and discrete commands, while SEU-hardened flip-flop options in the SL variant protect state machines that control critical uplink decoding. Segmentable clock resources let designers build independent timing domains for the command decoder and telemetry encoder sides. Designers should budget for triple-module redundancy in software-voted control registers and use the manufacturer's prototyping methodology (footprint-compatible PROTO adaptor plus EDIF pinout converter) to validate the interface timing before committing flight antifuse parts.
Recommended
Attitude Control and Platform Avionics
Spacecraft attitude-control electronics benefit from the RTAX250SL-CQ208V's combination of deterministic antifuse logic and military-grade -55C to +125C operation. The device typically implements sensor-interface glue logic for star trackers, reaction-wheel and magnetorquer drive timing, and safe-mode watchdog functions that must never depend on a configuration-load sequence. Its 2,816 CLBs and carry logic support real-time arithmetic such as PID-loop preprocessing and pulse-width modulation generation with deterministic latency, which is essential for control-loop stability analysis. The SL variant's SEU-hardened flip-flops reduce the probability that a single-event upset corrupts a control state, complementing system-level voting. Because the RTAX-S family is pin-migratable across densities within package families, teams can upsize platform logic later using Microchip's footprint-compatible adaptor board and EDIF pinout converter methodology without redesigning the avionics motherboard.
Recommended
Launch Vehicle Electronics
Launch-vehicle flight electronics face extreme vibration, wide thermal excursions, and short but radiation-relevant trajectories, all of which the ceramic CQFP-208 packaged RTAX250SL-CQ208V addresses: the ceramic package provides mechanical robustness suited to high-shock environments, and the -55C to +125C rating covers ascent thermal profiles. The antifuse fabric is inherently immune to configuration upsets, so sequencer and flight-termination-adjacent logic stays valid through the entire powered flight. With 250K gates, designers can integrate redundant command decoders, event timers, and bus bridges that historically required multiple MIL-spec SSI/MSI devices, reducing board area, mass, and solder-joint count - a direct reliability gain. The live-at-power-up characteristic simplifies power-on sequencing during countdown hold and recycle scenarios. Prototype the design on the CQ208PROTO footprint device before flight-lot screening.
Recommended
Reconfigurable Glue Logic Replacing ASIC/SSI-MSI
A primary economic use of RTAX250SL-CQ208V is consolidating legacy MIL-STD ASICs and obsoleted SSI/MSI glue logic into one rad-tolerant, single-chip device. The RTAX-S/SL family was explicitly built on Microsemi's commercial Accelerator (AX) architecture, giving ASIC-like density - 250,000 system gates - with FPGA lead times and no mask charges. Embedded SRAM with FIFO control replaces external dual-port RAM and FIFO devices, and chip-wide highway routing handles wide bus interconnect that once consumed dozens of 54-series parts. For programs maintaining legacy spacecraft and ground equipment, replacing a dying ASIC requires only a netlist re-implementation in Libero plus the documented footprint-migration flow. The V-qualified CQFP-208 unit then sustains depots for years. Estimated board-level gains commonly include lower static power than multi-device TTL stacks and elimination of configuration-memory failure modes.
Recommended
Design Prototyping and Netlist Migration
Microchip's sanctioned RTAX development flow makes the RTAX250SL-CQ208V design cycle safer: engineers first implement the design on a footprint-compatible adaptor board using flash-based reprogrammable silicon (Aldec/Microchip ProASIC3E-based prototyping solutions), then convert the EDIF netlist and pinout with the documented converter tool for migration to the antifuse flight device. The RTAX250SL-1CQ208PROTO and RTAX250S-CQ208PROTO orderable parts share the exact CQ208 footprint, so the same PCB that hosts prototype units accepts the flight CQ208V without rework. This methodology, described in the application note Prototyping for RTAX-S and RTAX-SL Devices, catches functional and timing issues while flight silicon is on order, de-risking long space-program schedules. It also enables firmware-like iteration during integration tests that antifuse flight parts cannot support directly.
Recommended
Recommended Products Summary
Engineering reference data for RTAX250SL-CQ208V — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX250S-CQ208V | RTAX250S-CQ208PROTO | RTAX250SL-1CQ208PROTO | RTAX250SL-1CQ208V |
|---|---|---|---|---|---|
| Package | 208-Pin CQFP (CQ208V) | 208-Pin CQFP - same | 208-Pin CQFP - same | 208-Pin CQFP - same | 208-Pin CQFP - same |
| Brand | Actel (Microsemi / Microchip Technology) | Actel (Microsemi) | Actel (Microsemi) | Actel (Microsemi) | Actel (Microsemi) |
| System Gates | 250000 gates | 250000 gates | 250000 gates | 250000 gates | 250000 gates |
| Logic Cells / CLBs | 4224 / 2816 | 4224 / 2816 | 4224 / 2816 | 4224 / 2816 | 4224 / 2816 |
| Core Supply Voltage | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal |
| Operating Temperature | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C |
| Radiation Qualification | V suffix (radiation qualified, flight grade) | V suffix (flight grade, base RTAX-S rad level) | PROTO flow (not flight-screened) | PROTO flow (not flight-screened) | V suffix (flight grade, SL rad level) |
| Speed Grade | Standard | Standard | Standard (PROTO) | -1 (faster, PROTO) | -1 (faster) |
| Configuration | Antifuse, live-at-power-up, single chip | Antifuse, live-at-power-up | Antifuse, live-at-power-up | Antifuse, live-at-power-up | Antifuse, live-at-power-up |
Key Differentiators
- SEU-hardened flip-flops for harsh radiation environments (vs RTAX250S-CQ208V)
- Flight-qualified (V suffix) screening flow (vs RTAX250SL-1CQ208PROTO)
- Antifuse live-at-power-up configuration (vs RTAX250SL-1CQ208V (same die))
Design Notes
RTAX-S/SL flight devices use one-time-programmable antifuse technology: once programmed, the part cannot be reconfigured, and a netlist error means scrapping a flight-graded unit. Always complete functional, timing, and radiation-mode validation on the footprint-compatible PROTO device (RTAX250SL-1CQ208PROTO) using the EDIF netlist and pinout converter flow from the application note Prototyping for RTAX-S and RTAX-SL Devices before programming the flight CQ208V. Order flight parts with long lead time in parallel with prototyping, not after.
Design for SEU resilience at the system level, not just the device level. Although the SL variant offers SEU-hardened flip-flops, control registers and state machines should use triple-module redundancy (TMR) in the RTL with voter logic, and configuration-independent antifuse routing should be exploited for safety-critical paths. Apply Microchip's recommended SEU mitigation guidelines from the RTAX-S/SL datasheet when choosing between the RTAX250S and RTAX250SL dies for your orbit profile (LEO versus GEO radiation dose rates).
The RTAX250SL-CQ208V runs from a 1.5V nominal core supply; ensure the spacecraft power distribution provides clean 1.5V and proper I/O bank rails with local decoupling at the CQFP-208 power pins. Space-qualified ceramic CQFP packages have low thermal conductivity paths, so estimated junction temperature rise should be verified against your mission thermal model using the datasheet power-estimation methodology, especially for high-utilization designs near the 250K-gate ceiling operating through +125C ambient extremes.
Compliance Information
Space-grade ceramic-package device; environmental compliance declarations were not present in the retrieved distributor data. Consult Microchip product compliance documentation for this orderable MPN.
