RTAX250SL-LG624V - 250K-Gate Rad-Tolerant FPGA | Microchip
Référence : RTAX250SL-LG624V ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2500 | $2 500,00 |
| 10 | $2250 | $22 500,00 |
| 100 | $2000 | $200 000,00 |
| 500 | $1800 | $900 000,00 |
| 1 000 | $1620 | $1 620 000,00 |
RTAX250SL-LG624V Présentation
A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the radiation environment of space, where total ionizing dose (TID), single-event latchup (SEL), and single-event upset (SEU) would disable a commercial device. Within the power hierarchy of semiconductors, the RTAX250SL sits in the programmable logic category - FPGA -> programmable logic IC -> digital IC - and is the flight-proven choice for space-flight payloads.
Key features include anti-fuse one-time-programmable configuration that is live at power-up with no configuration memory to upset, 250,000 equivalent system gates built on a 0.15 um CMOS process, embedded SRAM blocks with built-in FIFO control logic, segmentable clock resources, chip-wide highway routing, and carry logic for arithmetic functions. The RTAX-SL variant adds radiation-hardened SEU mitigation for the fabric.
Architecturally, the RTAX-S/SL family is based on the commercial Axcelerator architecture, giving system designers a high-performance logic fabric with proven space heritage. Unlike SRAM-based FPGAs from Xilinx or Intel/Altera, the anti-fuse technology provides inherent immunity to configuration upsets, making a single chip sufficient for many missions without external configuration devices.
Typical applications include satellite payload data processing, spacecraft bus control, telemetry and telecommand interfaces, and sensor data formatting in low-Earth-orbit and deep-space missions.
Design consideration: as a one-time-programmable anti-fuse device, all functional verification must be completed in prototype units before flight-part programming; the same package and timing apply to PROTO and flight grades.
This page synthesizes verified distributor data, drop-in family alternatives, pricing tiers, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour RTAX250SL-LG624V — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec RTAX250SL-LG624V (même facteur de forme et même empreinte) — différant par Package, Family, Radiation Tolerance, Equivalent System Gates, Core Supply Voltage.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
RTAX250SL-1LG624V
✅ Remplacement direct✓ En stock
$950 / unité
Voir la fiche technique →RTAX250SL-LG624B
✅ Remplacement direct✓ En stock
$2380 / unité
Voir la fiche technique →RTAX250SL-1CG624E
✅ Remplacement direct✓ En stock
$1 / unité
Voir la fiche technique →RTAX250S-LG624V
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →RTAX250S-1LG624V
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →RTAX250S-LG624B
✅ Remplacement direct✓ En stock
$2350 / unité
Voir la fiche technique →RTAX250S-CG624E
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →RTAX250SL-CG624B
✅ Remplacement direct✓ En stock
$3950 / unité
Voir la fiche technique →RTAX250SL-LG624V Valeurs maximales et caractéristiques électriques
| Equivalent System Gates | 250000 gates |
| Configurable Logic Blocks (CLBs) | 2816 |
| Logic Cells | 4224 |
| Process Technology | 0.15 um CMOS |
| Core Supply Voltage | 1.5 V |
| User I/O | 248 |
| Boîtier | 624-pin LGA (LG624) |
| Family | RTAX-S/SL and RTAX-DSP Radiation-Tolerant FPGAs |
| Program Technology | Anti-fuse, one-time programmable |
| Configuration | Live at power-up, single chip |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Clocking | Segmentable clocks, chip-wide highway routing |
| Radiation Tolerance | Radiation-tolerant, SEU-mitigated (SL variant) |
| Type de montage | Surface Mount |
Guide de configuration des broches du RTAX250SL-LG624V 624-pin lga (lg624)
Configuration des broches du RTAX250SL-LG624V (boîtier 624-pin lga (lg624)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour RTAX250SL-LG624V.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
RTAX250SL-LG624V convient pour 6 applications: Satellite Payload Data Processing, Spacecraft Bus Control, Telemetry and Telecommand Interfaces, Sensor Data Acquisition and Formatting, Deep-Space Mission Electronics, Launch Vehicle Avionics.
Satellite Payload Data Processing
The RTAX250SL-LG624V provides 250,000 gates of SEU-mitigated logic for onboard payload data formatting, compression, and channelization in LEO and deep-space missions. Its anti-fuse configuration is live at power-up with no configuration memory to upset, so the FPGA becomes functional the instant spacecraft power is applied - a critical property for autonomous spacecraft recovery sequences. The 248 user I/O accommodate high-speed payload interfaces, while embedded SRAM blocks with built-in FIFO control buffer data streams between payload sensors and downlink electronics. At a 1.5V core, power consumption remains within the budget of power-limited satellites, and the radiation-tolerant 0.15 um CMOS fabric withstands the total ionizing dose of typical multi-year missions.
Recommandé
Spacecraft Bus Control
In spacecraft bus electronics, the RTAX250SL-LG624V implements command decoders, housekeeping-telemetry gathering, power-switching control, and watchdog functions. Its true single-chip form factor removes the need for external configuration PROMs, reducing board area and eliminating a common failure mode in bus controller cards. Segmentable clock resources let designers isolate timing domains between the processor interface and critical control logic, and chip-wide highway routing ensures predictable inter-block delays. Because the fabric is SEU-mitigated in the SL variant, transient upsets from cosmic rays are corrected without a full configuration reload, keeping the bus alive during solar particle events. The 624-pin LGA ceramic package supports reliable solder-column attachment to spacecraft PCBs.
Recommandé
Telemetry and Telecommand Interfaces
The RTAX250SL-LG624V suits TM/TC front-end designs where 248 user I/O drive MIL-STD-1553, SpaceWire, and UART-class interfaces. Embedded SRAM with FIFO control logic decouples asynchronous telemetry streams from the downlink formatter, and carry logic accelerates CRC and convolutional encoding in the transmit chain. Its anti-fuse fabric does not lose configuration during single-event upsets, so the command receiver never goes blind - essential for a spacecraft that must respond to ground commands at all times. At a nominal 1.5V core and 0.15 um CMOS, quiescent power is low enough for eclipse-period operation, and the flight-grade V package is qualified for the thermal cycling of orbital environments.
Recommandé
Sensor Data Acquisition and Formatting
Imaging, radiation-monitoring, and science payloads use the RTAX250SL-LG624V to capture high-rate sensor data, apply gain/offset correction, and packetize frames for downlink. The 4224-cell fabric with carry logic implements fixed-point DSP pipelines, while embedded FIFOs absorb burst-rate mismatches between the sensor interface and the formatter. Designers choose the SL variant because its SEU-mitigation prevents single-event upsets from corrupting science data mid-frame. The 624-pin package provides enough I/O to connect parallel sensor buses directly without external deserializers. Prototype (PROTO) units in the same package family allow full functional validation on flight-representative hardware before committing the one-time-programmable flight device.
Recommandé
Deep-Space Mission Electronics
For missions beyond Earth orbit, the RTAX250SL-LG624V offers radiation tolerance that commercial FPGAs cannot match. Anti-fuse configuration memory is structurally immune to SEU, and the qualified CMOS fabric withstands the cumulative TID of multi-year interplanetary cruises. The chip requires no configuration reload after a solar particle event, and its low 1.5V core draw preserves scarce radioisotope or solar power budgets. Engineers typically pair the FPGA with rad-hard memory and a processor, using the RTAX250SL for glue logic, co-processing, and interface bridging. Flight heritage of the RTAX-S/SL family across numerous NASA and ESA programs reduces qualification risk for new deep-space instruments.
Recommandé
Launch Vehicle Avionics
Launch vehicle flight computers and avionics boxes deploy the RTAX250SL-LG624V for sequencing, redundancy voting, and interface consolidation during the few minutes of boosted flight. Live-at-power-up anti-fuse configuration guarantees the device operates immediately upon battery activation without a configuration load cycle. The SEU-mitigated SL fabric maintains correct operation through the harsher radiation of low-altitude passes and South Atlantic Anomaly transits for orbital insertions. Its 248 I/O link triple-modular-redundancy voters, discrete commands, and telemetry encoders on one device, while the 624-pin ceramic LGA survives launch vibration when properly staked. Engineering-grade E units support pre-flight avionics verification at lower cost.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour RTAX250SL-LG624V — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | RTAX250SL-1LG624V | RTAX250SL-1CG624E | RTAX250S-LG624V |
|---|---|---|---|---|
| Package | 624-pin LGA (LG624) | 624-pin LGA (LG624) - same | 624-pin CGA (CG624) - same footprint class | 624-pin LGA (LG624) - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent Gates | 250000 | 250000 | 250000 | 250000 |
| CLBs | 2816 | 2816 | 2816 | 2816 |
| Speed Grade | Standard | 1 (faster) | 1 (faster) | Standard |
| SEU-Mitigated SL Fabric | Yes | Yes | Yes | No (S variant) |
| Qualification Grade | V (flight) | V (flight) | E (engineering) | V (flight) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Principaux différenciateurs
- SL variant with SEU-mitigated fabric (vs RTAX250S-LG624V)
- Faster speed grade available at same footprint (vs RTAX250SL-1LG624V)
- Flight-grade qualification in standard LGA (vs RTAX250SL-1CG624E)
Notes de conception
The RTAX250SL is anti-fuse one-time-programmable: once programmed, the design cannot be changed. Complete all functional, timing, and radiation-protocol verification on PROTO or E-grade engineering units (e.g., RTAX250SL-1CQ208PROTO or RTAX250SL-1CG624E) before programming flight devices. Per the Microchip RTAX-S/SL datasheet, PROTO units have the same timing attributes as flight units, so timing sign-off on prototypes is valid for flight parts.
Power the 1.5V core and I/O supplies in the sequence specified in the RTAX-S/SL datasheet, with bulk and 0.1uF decoupling capacitors placed at each supply pin group of the 624-pin package. Estimated: with 248 I/O toggling at moderate rates, I/O dynamic power dominates; use the Microchip (Libero/MacroModel) power estimator early in design to size the spacecraft power budget, and verify against datasheet power tables before thermal design freeze.
The ceramic LGA (LG624) package uses solder-column attachment on flight boards. Follow the Microchip RTAX-S/SL datasheet land-pattern and IPC-class solder-column assembly guidance used for ceramic CGA/LGA devices, including board-level thermal-cycle qualification for the mission profile. Do not substitute a plastic-ball land pattern; ceramic package coplanarity and column geometry require the documented footprint and staking during launch vibration environments.
Informations de conformité
Space-flight hermetic ceramic packages typically follow military/space qualification rather than commercial RoHS declarations; consult Microchip product documentation for specific compliance certificates.
