RTAX250SL-LG624V - 250K-Gate Rad-Tolerant FPGA | Microchip
부품 번호: RTAX250SL-LG624V ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2500 | $2,500.00 |
| 10 | $2250 | $22,500.00 |
| 100 | $2000 | $200,000.00 |
| 500 | $1800 | $900,000.00 |
| 1,000 | $1620 | $1,620,000.00 |
RTAX250SL-LG624V 개요
A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the radiation environment of space, where total ionizing dose (TID), single-event latchup (SEL), and single-event upset (SEU) would disable a commercial device. Within the power hierarchy of semiconductors, the RTAX250SL sits in the programmable logic category - FPGA -> programmable logic IC -> digital IC - and is the flight-proven choice for space-flight payloads.
Key features include anti-fuse one-time-programmable configuration that is live at power-up with no configuration memory to upset, 250,000 equivalent system gates built on a 0.15 um CMOS process, embedded SRAM blocks with built-in FIFO control logic, segmentable clock resources, chip-wide highway routing, and carry logic for arithmetic functions. The RTAX-SL variant adds radiation-hardened SEU mitigation for the fabric.
Architecturally, the RTAX-S/SL family is based on the commercial Axcelerator architecture, giving system designers a high-performance logic fabric with proven space heritage. Unlike SRAM-based FPGAs from Xilinx or Intel/Altera, the anti-fuse technology provides inherent immunity to configuration upsets, making a single chip sufficient for many missions without external configuration devices.
Typical applications include satellite payload data processing, spacecraft bus control, telemetry and telecommand interfaces, and sensor data formatting in low-Earth-orbit and deep-space missions.
Design consideration: as a one-time-programmable anti-fuse device, all functional verification must be completed in prototype units before flight-part programming; the same package and timing apply to PROTO and flight grades.
This page synthesizes verified distributor data, drop-in family alternatives, pricing tiers, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: RTAX250SL-LG624V — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: RTAX250SL-LG624V (동일 폼 팩터 및 풋프린트) — 차이점: Package, Family, Radiation Tolerance, Equivalent System Gates, Core Supply Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
RTAX250SL-1LG624V
✅ 드롭인✓ 재고 있음
$950 / 개
데이터시트 보기 →RTAX250SL-LG624B
✅ 드롭인✓ 재고 있음
$2380 / 개
데이터시트 보기 →RTAX250SL-1CG624E
✅ 드롭인✓ 재고 있음
$1 / 개
데이터시트 보기 →RTAX250S-LG624V
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →RTAX250S-1LG624V
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →RTAX250S-LG624B
✅ 드롭인✓ 재고 있음
$2350 / 개
데이터시트 보기 →RTAX250S-CG624E
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →RTAX250SL-CG624B
✅ 드롭인✓ 재고 있음
$3950 / 개
데이터시트 보기 →RTAX250SL-LG624V 최대 정격 & 전기적 특성
| Equivalent System Gates | 250000 gates |
| Configurable Logic Blocks (CLBs) | 2816 |
| Logic Cells | 4224 |
| Process Technology | 0.15 um CMOS |
| Core Supply Voltage | 1.5 V |
| User I/O | 248 |
| 패키지 | 624-pin LGA (LG624) |
| Family | RTAX-S/SL and RTAX-DSP Radiation-Tolerant FPGAs |
| Program Technology | Anti-fuse, one-time programmable |
| Configuration | Live at power-up, single chip |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Clocking | Segmentable clocks, chip-wide highway routing |
| Radiation Tolerance | Radiation-tolerant, SEU-mitigated (SL variant) |
| 실장 유형 | Surface Mount |
RTAX250SL-LG624V 624-pin lga (lg624) 핀 구성 가이드
RTAX250SL-LG624V(624-pin lga (lg624) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: RTAX250SL-LG624V.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
RTAX250SL-LG624V 적합 용도: 6 애플리케이션s: Satellite Payload Data Processing, Spacecraft Bus Control, Telemetry and Telecommand Interfaces, Sensor Data Acquisition and Formatting, Deep-Space Mission Electronics, Launch Vehicle Avionics.
Satellite Payload Data Processing
The RTAX250SL-LG624V provides 250,000 gates of SEU-mitigated logic for onboard payload data formatting, compression, and channelization in LEO and deep-space missions. Its anti-fuse configuration is live at power-up with no configuration memory to upset, so the FPGA becomes functional the instant spacecraft power is applied - a critical property for autonomous spacecraft recovery sequences. The 248 user I/O accommodate high-speed payload interfaces, while embedded SRAM blocks with built-in FIFO control buffer data streams between payload sensors and downlink electronics. At a 1.5V core, power consumption remains within the budget of power-limited satellites, and the radiation-tolerant 0.15 um CMOS fabric withstands the total ionizing dose of typical multi-year missions.
추천
Spacecraft Bus Control
In spacecraft bus electronics, the RTAX250SL-LG624V implements command decoders, housekeeping-telemetry gathering, power-switching control, and watchdog functions. Its true single-chip form factor removes the need for external configuration PROMs, reducing board area and eliminating a common failure mode in bus controller cards. Segmentable clock resources let designers isolate timing domains between the processor interface and critical control logic, and chip-wide highway routing ensures predictable inter-block delays. Because the fabric is SEU-mitigated in the SL variant, transient upsets from cosmic rays are corrected without a full configuration reload, keeping the bus alive during solar particle events. The 624-pin LGA ceramic package supports reliable solder-column attachment to spacecraft PCBs.
추천
Telemetry and Telecommand Interfaces
The RTAX250SL-LG624V suits TM/TC front-end designs where 248 user I/O drive MIL-STD-1553, SpaceWire, and UART-class interfaces. Embedded SRAM with FIFO control logic decouples asynchronous telemetry streams from the downlink formatter, and carry logic accelerates CRC and convolutional encoding in the transmit chain. Its anti-fuse fabric does not lose configuration during single-event upsets, so the command receiver never goes blind - essential for a spacecraft that must respond to ground commands at all times. At a nominal 1.5V core and 0.15 um CMOS, quiescent power is low enough for eclipse-period operation, and the flight-grade V package is qualified for the thermal cycling of orbital environments.
추천
Sensor Data Acquisition and Formatting
Imaging, radiation-monitoring, and science payloads use the RTAX250SL-LG624V to capture high-rate sensor data, apply gain/offset correction, and packetize frames for downlink. The 4224-cell fabric with carry logic implements fixed-point DSP pipelines, while embedded FIFOs absorb burst-rate mismatches between the sensor interface and the formatter. Designers choose the SL variant because its SEU-mitigation prevents single-event upsets from corrupting science data mid-frame. The 624-pin package provides enough I/O to connect parallel sensor buses directly without external deserializers. Prototype (PROTO) units in the same package family allow full functional validation on flight-representative hardware before committing the one-time-programmable flight device.
추천
Deep-Space Mission Electronics
For missions beyond Earth orbit, the RTAX250SL-LG624V offers radiation tolerance that commercial FPGAs cannot match. Anti-fuse configuration memory is structurally immune to SEU, and the qualified CMOS fabric withstands the cumulative TID of multi-year interplanetary cruises. The chip requires no configuration reload after a solar particle event, and its low 1.5V core draw preserves scarce radioisotope or solar power budgets. Engineers typically pair the FPGA with rad-hard memory and a processor, using the RTAX250SL for glue logic, co-processing, and interface bridging. Flight heritage of the RTAX-S/SL family across numerous NASA and ESA programs reduces qualification risk for new deep-space instruments.
추천
Launch Vehicle Avionics
Launch vehicle flight computers and avionics boxes deploy the RTAX250SL-LG624V for sequencing, redundancy voting, and interface consolidation during the few minutes of boosted flight. Live-at-power-up anti-fuse configuration guarantees the device operates immediately upon battery activation without a configuration load cycle. The SEU-mitigated SL fabric maintains correct operation through the harsher radiation of low-altitude passes and South Atlantic Anomaly transits for orbital insertions. Its 248 I/O link triple-modular-redundancy voters, discrete commands, and telemetry encoders on one device, while the 624-pin ceramic LGA survives launch vibration when properly staked. Engineering-grade E units support pre-flight avionics verification at lower cost.
추천
추천 제품 요약
엔지니어링 참조 데이터: RTAX250SL-LG624V — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | RTAX250SL-1LG624V | RTAX250SL-1CG624E | RTAX250S-LG624V |
|---|---|---|---|---|
| Package | 624-pin LGA (LG624) | 624-pin LGA (LG624) - same | 624-pin CGA (CG624) - same footprint class | 624-pin LGA (LG624) - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent Gates | 250000 | 250000 | 250000 | 250000 |
| CLBs | 2816 | 2816 | 2816 | 2816 |
| Speed Grade | Standard | 1 (faster) | 1 (faster) | Standard |
| SEU-Mitigated SL Fabric | Yes | Yes | Yes | No (S variant) |
| Qualification Grade | V (flight) | V (flight) | E (engineering) | V (flight) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
주요 차별점
- SL variant with SEU-mitigated fabric (vs RTAX250S-LG624V)
- Faster speed grade available at same footprint (vs RTAX250SL-1LG624V)
- Flight-grade qualification in standard LGA (vs RTAX250SL-1CG624E)
설계 노트
The RTAX250SL is anti-fuse one-time-programmable: once programmed, the design cannot be changed. Complete all functional, timing, and radiation-protocol verification on PROTO or E-grade engineering units (e.g., RTAX250SL-1CQ208PROTO or RTAX250SL-1CG624E) before programming flight devices. Per the Microchip RTAX-S/SL datasheet, PROTO units have the same timing attributes as flight units, so timing sign-off on prototypes is valid for flight parts.
Power the 1.5V core and I/O supplies in the sequence specified in the RTAX-S/SL datasheet, with bulk and 0.1uF decoupling capacitors placed at each supply pin group of the 624-pin package. Estimated: with 248 I/O toggling at moderate rates, I/O dynamic power dominates; use the Microchip (Libero/MacroModel) power estimator early in design to size the spacecraft power budget, and verify against datasheet power tables before thermal design freeze.
The ceramic LGA (LG624) package uses solder-column attachment on flight boards. Follow the Microchip RTAX-S/SL datasheet land-pattern and IPC-class solder-column assembly guidance used for ceramic CGA/LGA devices, including board-level thermal-cycle qualification for the mission profile. Do not substitute a plastic-ball land pattern; ceramic package coplanarity and column geometry require the documented footprint and staking during launch vibration environments.
규정 준수 정보
Space-flight hermetic ceramic packages typically follow military/space qualification rather than commercial RoHS declarations; consult Microchip product documentation for specific compliance certificates.
