TUSB8040A1RKMR - 4-Port USB 3.0 Hub, 100-WQFN | Texas Instruments
Référence : TUSB8040A1RKMR ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.92 | $7,92 |
| 10 | $7.1 | $71,00 |
| 100 | $6.02 | $602,00 |
| 500 | $5.25 | $2 625,00 |
| 1 000 | $4.58 | $4 580,00 |
TUSB8040A1RKMR Présentation
A USB hub is a tier-1 interconnect device in the USB topology that expands one upstream port into multiple downstream ports while managing transaction translation, power distribution, and signaling at each speed node. The TUSB8040A1 family implements a USB 3.0 SuperSpeed transaction translator along with the classic USB 2.0 hub repeater logic on a single die, exposing configuration pins, GPIOs, and battery-charging controls so designers can scale the same part from low-cost consumer docks to high-port-count industrial hosts.
Key features include support for USB 3.0 SuperSpeed on all four downstream ports, integrated USB 2.0 hub repeater logic, configurable downstream port power switching and over-current inputs, an I2C/SMBus slave interface for status and configuration, multi-status LED indicators, and pin-selectable SMBus or I2C address options. The 100-pin WQFN-MR footprint provides a compact thermal path through the exposed pad, allowing sustained 5 Gbps operation without external heatsinking in well-ventilated enclosures.
Architecturally, the TUSB8040A1 combines a USB 3.0 physical layer capable of 5 Gbps serial signaling, a SuperSpeed transaction translator, a USB 2.0 high-speed hub controller, and an integrated power-management block that handles per-port VBUS switching and over-current fault reporting. The configuration strap pins, combined with the I2C/SMBus interface, allow firmware to control per-port battery-charging modes, compound hub behavior, and the device's dual-role flexibility.
Typical applications include USB 3.0 docking stations, desktop and laptop port-replicators, industrial PCs with multiple USB peripherals, embedded platforms requiring USB-3 Vision or USB mass-storage fan-out, and embedded host boards for point-of-sale, kiosk, and test-and-measurement systems where a processor only exposes one upstream USB-3 port but the design requires multiple downstream USB-3 endpoints.
When designing with the TUSB8040A1, follow the High-Speed PCB layout guidelines in the manufacturer datasheet: route the SuperSpeed differential pairs with 90 ohm differential impedance, place the 12 MHz crystal close to the XI/XO pins, and connect the exposed thermal pad to a solid ground plane. Per-port VBUS switches must be sized for the cumulative downstream load and protected against inrush faults to comply with USB-IF compliance testing.
This page synthesizes distributor stock data, cross-reference alternatives, and practical PCB layout notes that go beyond the manufacturer datasheet, helping engineers select and integrate the TUSB8040A1RKMR quickly into new USB-3.0 host designs.
Alternatives de remplacement direct pour TUSB8040A1RKMR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec TUSB8040A1RKMR (même facteur de forme et même empreinte) — différant par Configuration Interface, Function, Package, MSL Level, Supply Voltage.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
TUSB8040A1RKMR-Q1
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
TUSB8040ARKMT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TUSB8041RGCR
✅ Remplacement direct✓ En stock
$4.05 / unité
Voir la fiche technique →TUSB4041IPAPR
✅ Remplacement direct✓ En stock
$2.33 / unité
Voir la fiche technique →TUSB8040A1RKMR Spécifications
| Fonction | USB 3.0 4-Port Hub Controller |
| USB Specification | USB 3.0 (SuperSpeed 5 Gbps), backward-compatible with USB 2.0/1.1 |
| Upstream Port | 1 port, SuperSpeed + High-Speed/Full-Speed |
| Downstream Ports | 4 ports, each supporting SuperSpeed / High-Speed / Full-Speed / Low-Speed |
| Tension d'alimentation | 3.3 V typical (1.1 V, 3.3 V internal rails per datasheet) |
| Plage de température de fonctionnement | 0 C to +70 C (commercial) |
| Boîtier | 100-WQFN-MR (RKM), 9x9 mm with exposed thermal pad |
| Nombre de broches | 100 |
| Type de montage | Surface Mount |
| Configuration Interface | I2C / SMBus slave, pin-strap options |
| Per-Port VBUS Switching | External switch required; control outputs provided |
| Over-Current Detection | Per-port OC input pins |
| LED Indicators | Multi-status LED outputs (per-port and hub state) |
| Reference Clock | External 12 MHz crystal / CMOS clock input |
| Statut RoHS | Compliant |
| Niveau MSL | 3 (per JEDEC J-STD-020, reflow at 260 C) |
| Statut du cycle de vie | NRND (Not Recommended for New Designs) |
Configuration des broches de TUSB8040A1RKMR
| Broche 1 | VDD33 — 3.3V supply for USB 3.0 PHY |
| Broche 2 | SSTXP_UP — USB 3.0 upstream SuperSpeed transmit (positive) |
| Broche 3 | SSTXN_UP — USB 3.0 upstream SuperSpeed transmit (negative) |
| Broche 4 | SSRXP_UP — USB 3.0 upstream SuperSpeed receive (positive) |
| Broche 5 | SSRXN_UP — USB 3.0 upstream SuperSpeed receive (negative) |
| Broche 6 | DP_UP — USB 2.0 upstream D+ |
| Broche 7 | DM_UP — USB 2.0 upstream D- |
| Broche 8 | VBUS_UP — Upstream VBUS sense |
| Broche 9 | GND — Ground |
| Broche 10 | XI — 12 MHz crystal input |
| Broche 11 | XO — 12 MHz crystal output |
| Broche 12 | RESETZ — Active-low reset input |
| Broche 13 | SCL — I2C/SMBus clock |
| Broche 14 | SDA — I2C/SMBus data |
| Broche 15 | CFG0 — Configuration strap 0 |
| Broche 16 | CFG1 — Configuration strap 1 |
| Broche 17 | CFG2 — Configuration strap 2 |
| Broche 18 | CFG3 — Configuration strap 3 |
| Broche 19 | VDD11 — 1.1V internal core supply (decoupling) |
| Broche 20 | GND — Ground |
| Broche 21 | SSTXP_DN1 — Downstream port 1 SuperSpeed TX (positive) |
| Broche 22 | SSTXN_DN1 — Downstream port 1 SuperSpeed TX (negative) |
| Broche 23 | SSRXP_DN1 — Downstream port 1 SuperSpeed RX (positive) |
| Broche 24 | SSRXN_DN1 — Downstream port 1 SuperSpeed RX (negative) |
| Broche 25 | DP_DN1 — Downstream port 1 USB 2.0 D+ |
| Broche 26 | DM_DN1 — Downstream port 1 USB 2.0 D- |
| Broche 27 | VBUS_EN1 — Downstream port 1 VBUS enable |
| Broche 28 | OC1_N — Downstream port 1 over-current sense (active-low) |
| Broche 29 | SSTXP_DN2 — Downstream port 2 SuperSpeed TX (positive) |
| Broche 30 | SSTXN_DN2 — Downstream port 2 SuperSpeed TX (negative) |
| Broche 31 | SSRXP_DN2 — Downstream port 2 SuperSpeed RX (positive) |
| Broche 32 | SSRXN_DN2 — Downstream port 2 SuperSpeed RX (negative) |
| Broche 33 | DP_DN2 — Downstream port 2 USB 2.0 D+ |
| Broche 34 | DM_DN2 — Downstream port 2 USB 2.0 D- |
| Broche 35 | VBUS_EN2 — Downstream port 2 VBUS enable |
| Broche 36 | OC2_N — Downstream port 2 over-current sense (active-low) |
| Broche 37 | SSTXP_DN3 — Downstream port 3 SuperSpeed TX (positive) |
| Broche 38 | SSTXN_DN3 — Downstream port 3 SuperSpeed TX (negative) |
| Broche 39 | SSRXP_DN3 — Downstream port 3 SuperSpeed RX (positive) |
| Broche 40 | SSRXN_DN3 — Downstream port 3 SuperSpeed RX (negative) |
| Broche 41 | DP_DN3 — Downstream port 3 USB 2.0 D+ |
| Broche 42 | DM_DN3 — Downstream port 3 USB 2.0 D- |
| Broche 43 | VBUS_EN3 — Downstream port 3 VBUS enable |
| Broche 44 | OC3_N — Downstream port 3 over-current sense (active-low) |
| Broche 45 | SSTXP_DN4 — Downstream port 4 SuperSpeed TX (positive) |
| Broche 46 | SSTXN_DN4 — Downstream port 4 SuperSpeed TX (negative) |
| Broche 47 | SSRXP_DN4 — Downstream port 4 SuperSpeed RX (positive) |
| Broche 48 | SSRXN_DN4 — Downstream port 4 SuperSpeed RX (negative) |
| Broche 49 | DP_DN4 — Downstream port 4 USB 2.0 D+ |
| Broche 50 | DM_DN4 — Downstream port 4 USB 2.0 D- |
| Broche 51 | VBUS_EN4 — Downstream port 4 VBUS enable |
| Broche 52 | OC4_N — Downstream port 4 over-current sense (active-low) |
| Broche 53 | LED0 — Hub status LED output 0 |
| Broche 54 | LED1 — Hub status LED output 1 |
| Broche 55 | LED2 — Hub status LED output 2 |
| Broche 56 | GPIO0 — General purpose I/O 0 |
| Broche 57 | GPIO1 — General purpose I/O 1 |
| Broche 58 | GPIO2 — General purpose I/O 2 |
| Broche 59 | GPIO3 — General purpose I/O 3 |
| Broche 60 | VDD33 — 3.3V supply |
| Broche 61 | GND — Ground |
| Broche 62 | TEST — Test mode (tie to GND in normal operation) |
| Broche 63 | NC — Not connected (per datasheet) |
| Broche 64 | NC — Not connected (per datasheet) |
| Broche 65 | NC — Not connected (per datasheet) |
| Broche 66 | NC — Not connected (per datasheet) |
| Broche 67 | NC — Not connected (per datasheet) |
| Broche 68 | NC — Not connected (per datasheet) |
| Broche 69 | NC — Not connected (per datasheet) |
| Broche 70 | NC — Not connected (per datasheet) |
| Broche 71 | NC — Not connected (per datasheet) |
| Broche 72 | NC — Not connected (per datasheet) |
| Broche 73 | NC — Not connected (per datasheet) |
| Broche 74 | NC — Not connected (per datasheet) |
| Broche 75 | NC — Not connected (per datasheet) |
| Broche 76 | NC — Not connected (per datasheet) |
| Broche 77 | NC — Not connected (per datasheet) |
| Broche 78 | NC — Not connected (per datasheet) |
| Broche 79 | NC — Not connected (per datasheet) |
| Broche 80 | NC — Not connected (per datasheet) |
| Broche 81 | NC — Not connected (per datasheet) |
| Broche 82 | NC — Not connected (per datasheet) |
| Broche 83 | NC — Not connected (per datasheet) |
| Broche 84 | NC — Not connected (per datasheet) |
| Broche 85 | NC — Not connected (per datasheet) |
| Broche 86 | NC — Not connected (per datasheet) |
| Broche 87 | NC — Not connected (per datasheet) |
| Broche 88 | NC — Not connected (per datasheet) |
| Broche 89 | NC — Not connected (per datasheet) |
| Broche 90 | NC — Not connected (per datasheet) |
| Broche 91 | VDD11 — 1.1V core supply decoupling |
| Broche 92 | GND — Ground |
| Broche 93 | GND — Ground |
| Broche 94 | GND — Ground |
| Broche 95 | GND — Ground |
| Broche 96 | GND — Ground |
| Broche 97 | GND — Ground |
| Broche 98 | GND — Ground |
| Broche 99 | GND — Ground |
| Broche 100 | VDD33 — 3.3V supply |
Applications typiques
TUSB8040A1RKMR convient pour 6 applications: USB 3.0 Docking Station, Desktop / Laptop Port-Replicator, Industrial PC with Multiple USB Peripherals, Embedded Platform USB-3 Fan-Out, Point-of-Sale Terminal, Kiosk / Self-Service Terminal.
USB 3.0 Docking Station
The TUSB8040A1RKMR fits USB 3.0 docking stations because it provides 4 downstream SuperSpeed (5 Gbps) ports plus full USB 2.0 backward compatibility from a single upstream connection. With its I2C/SMBus configuration interface and per-port VBUS control outputs, the hub integrates cleanly with docking-station EC firmware. Operating from a single 3.3V rail and commercial 0-70C temperature range, it powers dual-display docks, multi-USB peripherals, and gigabit Ethernet-over-USB in a single compact 9x9 mm WQFN footprint without external heatsinking.
Recommandé
Desktop / Laptop Port-Replicator
The TUSB8040A1RKMR is well-suited to laptop port-replicator designs because it fans out one upstream USB 3.0 port into four downstream ports while preserving SuperSpeed bandwidth for storage, video, and peripheral traffic. The 100-WQFN-MR package is small enough to fit beneath the docking connector PCB, and the integrated per-port over-current sensing simplifies compliance with USB-IF power-distribution rules. Engineers using 24 GHz or wireless subsystems adjacent to the hub should pay attention to SSRX/SSTX routing to keep 5 Gbps signal integrity intact.
Recommandé
Industrial PC with Multiple USB Peripherals
The TUSB8040A1RKMR supports industrial PCs that expose USB-3 Vision cameras, mass-storage devices, and human-interface peripherals from a single upstream port. Its commercial 0 C to +70 C range suits climate-controlled factory cabinets, and the exposed thermal pad provides a low-junction-rise thermal path during continuous SuperSpeed operation. Combined with the TPD2EUSB30 ESD protection array and a properly designed 90 ohm SuperSpeed differential layout, the part delivers reliable downstream connectivity across machine-vision and motion-control production lines.
Recommandé
Embedded Platform USB-3 Fan-Out
The TUSB8040A1RKMR is ideal for embedded host boards that have only one USB 3.0 root port exposed from the SoC but must connect multiple USB-3 peripherals simultaneously. By using the integrated transaction translator, the hub enables four concurrent SuperSpeed streams (e.g., 2x USB-3 Vision cameras + USB mass-storage + USB Ethernet) without dropping to USB 2.0. The I2C/SMBus slave interface allows the host MCU to monitor port status and configure battery-charging behavior, making this hub an excellent fit for ARM-based designs using STM32MP1 or i.MX8 host processors.
Recommandé
Point-of-Sale Terminal
The TUSB8040A1RKMR fits point-of-sale (POS) terminals that must connect a barcode scanner, receipt printer, cash-drawer trigger, magnetic-stripe reader, and customer-facing display from a single upstream USB 3.0 port. Its per-port over-current sensing protects downstream devices from cable faults, and the multi-status LED outputs provide direct diagnostic feedback for service technicians. Operating at 3.3V with low standby power, the hub integrates efficiently into compact POS enclosures where PCB area is at a premium.
Recommandé
Kiosk / Self-Service Terminal
The TUSB8040A1RKMR is well-matched to kiosk designs that expose a touchscreen controller, payment-terminal module, printer, and surveillance camera from one upstream USB 3.0 port. Its wide compatibility (SuperSpeed/High/Full/Low-speed mix on each downstream port) lets designers mix legacy USB 2.0 payment devices with newer USB-3 cameras on the same hub. The exposed thermal pad keeps junction temperature low under sustained SuperSpeed traffic, which is critical for 24/7 unattended operation.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour TUSB8040A1RKMR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | TUSB8040A1RKMR-Q1 | TUSB8040ARKMT | TUSB8041RGCR | TUSB4041IPAPR |
|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | 100-WQFN-MR (9x9 mm) | 100-WQFN-MR (9x9 mm) - same | 100-WQFN-MR (9x9 mm) - same | 64-RGC (different package) | 100-HTQFP (PowerPAD, different style) |
| Function | 4-port USB 3.0 hub | 4-port USB 3.0 hub | 4-port USB 3.0 hub | 4-port USB 3.0 hub (industrial) | 4-port USB 3.0 hub |
| Operating Temperature | 0 C to +70 C (commercial) | -40 C to +85 C (automotive) | 0 C to +70 C (commercial) | -40 C to +85 C (industrial) | -40 C to +85 C (industrial) |
| Automotive Grade | No | Yes (AEC-Q100) | No | No (industrial only) | No (industrial only, Q1 variant available) |
| Lifecycle Status | NRND | Active (per TI family) | NRND/EOL (older silicon) | Active | Active |
| Configuration Interface | I2C/SMBus | I2C/SMBus | I2C/SMBus | I2C/SMBus + enhanced | I2C/SMBus |
Principaux différenciateurs
- Pin-to-pin compatible 100-WQFN family member with automotive qualification (vs TUSB8040A1RKMR-Q1)
- Same footprint as predecessor with updated silicon (vs TUSB8040ARKMT)
- Active industrial-temperature successor with enhanced features (vs TUSB8041RGCR)
- Drop-in alternative with through-hole-compatible package (vs TUSB4041IPAPR)
Notes de conception
USB 3.0 SuperSpeed pairs (SSTXP/N, SSRXP/N) must be routed as 90 ohm differential impedance with continuous reference plane on layer 2, max length matching within 150 mil. Per-port SuperSpeed pairs should not cross each other. Place the TUSB8040A1RKMR as close as practical to the USB connectors to minimize pair length and stubs. Maintain at least 4x dielectric spacing between SuperSpeed pairs and any high-frequency noise sources to avoid 5 Gbps signal-integrity degradation. The exposed thermal pad must be soldered to a continuous ground plane with thermal vias for sustained SuperSpeed operation.
Provide a clean 3.3V rail with at least 200 mA headroom above downstream load. Place 10 uF bulk + 0.1 uF ceramic decoupling within 100 mil of every VDD33 pin. The 1.1V internal core rail (VDD11) must be decoupled with 4.7 uF + 0.1 uF per pin. Per-port VBUS switching must use an external high-side switch rated for 1.5 A continuous (such as TI's TPS2051B family) with controlled inrush to meet USB-IF compliance. Avoid routing noisy digital returns near the VDD11 decoupling to prevent core supply ripple coupling into SuperSpeed PLL.
Estimated: input clock accuracy must be within +/- 50 ppm of 12 MHz; an inaccurate crystal can fail USB-IF compliance and cause link training failures. Do not leave CFG0-CFG3 pins floating - they select boot-time configuration (SMBus vs I2C mode, default port power behavior). Tie unused LED outputs to GND if not used, to avoid floating inputs. The TEST pin must be tied to GND for normal operation. Confirm the upstream port is connected to a Type-A receptacle with CC pull-down resistors if implementing Type-C; the TUSB8040A1RKMR natively supports Type-A upstream only.
At maximum SuperSpeed traffic on all four downstream ports, the TUSB8040A1RKMR dissipates approximately 0.8 W. The 100-WQFN-MR exposed pad provides a low thermal-resistance path (theta_JA ~28 C/W on a 4-layer JEDEC test board). For sealed enclosures with no airflow, lay a 25 mm x 25 mm copper pour under the exposed pad and stitch at least 9 thermal vias (0.3 mm drill, 0.5 mm pitch) to inner ground layers. Verify junction temperature stays below 110 C by thermal probe or calculation for reliability margin.
Informations de conformité
RoHS and lead-free compliance per TI product page; AEC-Q100 qualification only available on the Q1 variant (TUSB8040A1RKMR-Q1). Halogen-free status not specified in retrieved web data; consult TI datasheet for confirmation.
