TUSB8040A1RKMR - 4-Port USB 3.0 Hub, 100-WQFN | Texas Instruments
部品番号: TUSB8040A1RKMR ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $7.92 | $7.92 |
| 10 | $7.1 | $71.00 |
| 100 | $6.02 | $602.00 |
| 500 | $5.25 | $2,625.00 |
| 1,000 | $4.58 | $4,580.00 |
TUSB8040A1RKMR 概要
A USB hub is a tier-1 interconnect device in the USB topology that expands one upstream port into multiple downstream ports while managing transaction translation, power distribution, and signaling at each speed node. The TUSB8040A1 family implements a USB 3.0 SuperSpeed transaction translator along with the classic USB 2.0 hub repeater logic on a single die, exposing configuration pins, GPIOs, and battery-charging controls so designers can scale the same part from low-cost consumer docks to high-port-count industrial hosts.
Key features include support for USB 3.0 SuperSpeed on all four downstream ports, integrated USB 2.0 hub repeater logic, configurable downstream port power switching and over-current inputs, an I2C/SMBus slave interface for status and configuration, multi-status LED indicators, and pin-selectable SMBus or I2C address options. The 100-pin WQFN-MR footprint provides a compact thermal path through the exposed pad, allowing sustained 5 Gbps operation without external heatsinking in well-ventilated enclosures.
Architecturally, the TUSB8040A1 combines a USB 3.0 physical layer capable of 5 Gbps serial signaling, a SuperSpeed transaction translator, a USB 2.0 high-speed hub controller, and an integrated power-management block that handles per-port VBUS switching and over-current fault reporting. The configuration strap pins, combined with the I2C/SMBus interface, allow firmware to control per-port battery-charging modes, compound hub behavior, and the device's dual-role flexibility.
Typical applications include USB 3.0 docking stations, desktop and laptop port-replicators, industrial PCs with multiple USB peripherals, embedded platforms requiring USB-3 Vision or USB mass-storage fan-out, and embedded host boards for point-of-sale, kiosk, and test-and-measurement systems where a processor only exposes one upstream USB-3 port but the design requires multiple downstream USB-3 endpoints.
When designing with the TUSB8040A1, follow the High-Speed PCB layout guidelines in the manufacturer datasheet: route the SuperSpeed differential pairs with 90 ohm differential impedance, place the 12 MHz crystal close to the XI/XO pins, and connect the exposed thermal pad to a solid ground plane. Per-port VBUS switches must be sized for the cumulative downstream load and protected against inrush faults to comply with USB-IF compliance testing.
This page synthesizes distributor stock data, cross-reference alternatives, and practical PCB layout notes that go beyond the manufacturer datasheet, helping engineers select and integrate the TUSB8040A1RKMR quickly into new USB-3.0 host designs.
ドロップイン代替品: TUSB8040A1RKMR — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: TUSB8040A1RKMR （同一形状・フットプリント） — 相違点: Configuration Interface, Function, Package, MSL Level, Supply Voltage.
クイック比較ツール — 並列比較する代替部品を選択:
TUSB8040A1RKMR-Q1
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
TUSB8040ARKMT
✅ ドロップイン📋 参考代替品（カタログ未掲載）
TUSB8041RGCR
✅ ドロップイン✓ 在庫あり
$4.05 / 個
データシートを見る →TUSB4041IPAPR
✅ ドロップイン✓ 在庫あり
$2.33 / 個
データシートを見る →TUSB8040A1RKMR 仕様
| 機能 | USB 3.0 4-Port Hub Controller |
| USB Specification | USB 3.0 (SuperSpeed 5 Gbps), backward-compatible with USB 2.0/1.1 |
| Upstream Port | 1 port, SuperSpeed + High-Speed/Full-Speed |
| Downstream Ports | 4 ports, each supporting SuperSpeed / High-Speed / Full-Speed / Low-Speed |
| 電源電圧 | 3.3 V typical (1.1 V, 3.3 V internal rails per datasheet) |
| 動作温度範囲 | 0 C to +70 C (commercial) |
| パッケージ | 100-WQFN-MR (RKM), 9x9 mm with exposed thermal pad |
| ピン数 | 100 |
| 実装タイプ | Surface Mount |
| Configuration Interface | I2C / SMBus slave, pin-strap options |
| Per-Port VBUS Switching | External switch required; control outputs provided |
| Over-Current Detection | Per-port OC input pins |
| LED Indicators | Multi-status LED outputs (per-port and hub state) |
| Reference Clock | External 12 MHz crystal / CMOS clock input |
| RoHS ステータス | Compliant |
| MSLレベル | 3 (per JEDEC J-STD-020, reflow at 260 C) |
| ライフサイクル状態 | NRND (Not Recommended for New Designs) |
TUSB8040A1RKMR ピン構成
| ピン 1 | VDD33 — 3.3V supply for USB 3.0 PHY |
| ピン 2 | SSTXP_UP — USB 3.0 upstream SuperSpeed transmit (positive) |
| ピン 3 | SSTXN_UP — USB 3.0 upstream SuperSpeed transmit (negative) |
| ピン 4 | SSRXP_UP — USB 3.0 upstream SuperSpeed receive (positive) |
| ピン 5 | SSRXN_UP — USB 3.0 upstream SuperSpeed receive (negative) |
| ピン 6 | DP_UP — USB 2.0 upstream D+ |
| ピン 7 | DM_UP — USB 2.0 upstream D- |
| ピン 8 | VBUS_UP — Upstream VBUS sense |
| ピン 9 | GND — Ground |
| ピン 10 | XI — 12 MHz crystal input |
| ピン 11 | XO — 12 MHz crystal output |
| ピン 12 | RESETZ — Active-low reset input |
| ピン 13 | SCL — I2C/SMBus clock |
| ピン 14 | SDA — I2C/SMBus data |
| ピン 15 | CFG0 — Configuration strap 0 |
| ピン 16 | CFG1 — Configuration strap 1 |
| ピン 17 | CFG2 — Configuration strap 2 |
| ピン 18 | CFG3 — Configuration strap 3 |
| ピン 19 | VDD11 — 1.1V internal core supply (decoupling) |
| ピン 20 | GND — Ground |
| ピン 21 | SSTXP_DN1 — Downstream port 1 SuperSpeed TX (positive) |
| ピン 22 | SSTXN_DN1 — Downstream port 1 SuperSpeed TX (negative) |
| ピン 23 | SSRXP_DN1 — Downstream port 1 SuperSpeed RX (positive) |
| ピン 24 | SSRXN_DN1 — Downstream port 1 SuperSpeed RX (negative) |
| ピン 25 | DP_DN1 — Downstream port 1 USB 2.0 D+ |
| ピン 26 | DM_DN1 — Downstream port 1 USB 2.0 D- |
| ピン 27 | VBUS_EN1 — Downstream port 1 VBUS enable |
| ピン 28 | OC1_N — Downstream port 1 over-current sense (active-low) |
| ピン 29 | SSTXP_DN2 — Downstream port 2 SuperSpeed TX (positive) |
| ピン 30 | SSTXN_DN2 — Downstream port 2 SuperSpeed TX (negative) |
| ピン 31 | SSRXP_DN2 — Downstream port 2 SuperSpeed RX (positive) |
| ピン 32 | SSRXN_DN2 — Downstream port 2 SuperSpeed RX (negative) |
| ピン 33 | DP_DN2 — Downstream port 2 USB 2.0 D+ |
| ピン 34 | DM_DN2 — Downstream port 2 USB 2.0 D- |
| ピン 35 | VBUS_EN2 — Downstream port 2 VBUS enable |
| ピン 36 | OC2_N — Downstream port 2 over-current sense (active-low) |
| ピン 37 | SSTXP_DN3 — Downstream port 3 SuperSpeed TX (positive) |
| ピン 38 | SSTXN_DN3 — Downstream port 3 SuperSpeed TX (negative) |
| ピン 39 | SSRXP_DN3 — Downstream port 3 SuperSpeed RX (positive) |
| ピン 40 | SSRXN_DN3 — Downstream port 3 SuperSpeed RX (negative) |
| ピン 41 | DP_DN3 — Downstream port 3 USB 2.0 D+ |
| ピン 42 | DM_DN3 — Downstream port 3 USB 2.0 D- |
| ピン 43 | VBUS_EN3 — Downstream port 3 VBUS enable |
| ピン 44 | OC3_N — Downstream port 3 over-current sense (active-low) |
| ピン 45 | SSTXP_DN4 — Downstream port 4 SuperSpeed TX (positive) |
| ピン 46 | SSTXN_DN4 — Downstream port 4 SuperSpeed TX (negative) |
| ピン 47 | SSRXP_DN4 — Downstream port 4 SuperSpeed RX (positive) |
| ピン 48 | SSRXN_DN4 — Downstream port 4 SuperSpeed RX (negative) |
| ピン 49 | DP_DN4 — Downstream port 4 USB 2.0 D+ |
| ピン 50 | DM_DN4 — Downstream port 4 USB 2.0 D- |
| ピン 51 | VBUS_EN4 — Downstream port 4 VBUS enable |
| ピン 52 | OC4_N — Downstream port 4 over-current sense (active-low) |
| ピン 53 | LED0 — Hub status LED output 0 |
| ピン 54 | LED1 — Hub status LED output 1 |
| ピン 55 | LED2 — Hub status LED output 2 |
| ピン 56 | GPIO0 — General purpose I/O 0 |
| ピン 57 | GPIO1 — General purpose I/O 1 |
| ピン 58 | GPIO2 — General purpose I/O 2 |
| ピン 59 | GPIO3 — General purpose I/O 3 |
| ピン 60 | VDD33 — 3.3V supply |
| ピン 61 | GND — Ground |
| ピン 62 | TEST — Test mode (tie to GND in normal operation) |
| ピン 63 | NC — Not connected (per datasheet) |
| ピン 64 | NC — Not connected (per datasheet) |
| ピン 65 | NC — Not connected (per datasheet) |
| ピン 66 | NC — Not connected (per datasheet) |
| ピン 67 | NC — Not connected (per datasheet) |
| ピン 68 | NC — Not connected (per datasheet) |
| ピン 69 | NC — Not connected (per datasheet) |
| ピン 70 | NC — Not connected (per datasheet) |
| ピン 71 | NC — Not connected (per datasheet) |
| ピン 72 | NC — Not connected (per datasheet) |
| ピン 73 | NC — Not connected (per datasheet) |
| ピン 74 | NC — Not connected (per datasheet) |
| ピン 75 | NC — Not connected (per datasheet) |
| ピン 76 | NC — Not connected (per datasheet) |
| ピン 77 | NC — Not connected (per datasheet) |
| ピン 78 | NC — Not connected (per datasheet) |
| ピン 79 | NC — Not connected (per datasheet) |
| ピン 80 | NC — Not connected (per datasheet) |
| ピン 81 | NC — Not connected (per datasheet) |
| ピン 82 | NC — Not connected (per datasheet) |
| ピン 83 | NC — Not connected (per datasheet) |
| ピン 84 | NC — Not connected (per datasheet) |
| ピン 85 | NC — Not connected (per datasheet) |
| ピン 86 | NC — Not connected (per datasheet) |
| ピン 87 | NC — Not connected (per datasheet) |
| ピン 88 | NC — Not connected (per datasheet) |
| ピン 89 | NC — Not connected (per datasheet) |
| ピン 90 | NC — Not connected (per datasheet) |
| ピン 91 | VDD11 — 1.1V core supply decoupling |
| ピン 92 | GND — Ground |
| ピン 93 | GND — Ground |
| ピン 94 | GND — Ground |
| ピン 95 | GND — Ground |
| ピン 96 | GND — Ground |
| ピン 97 | GND — Ground |
| ピン 98 | GND — Ground |
| ピン 99 | GND — Ground |
| ピン 100 | VDD33 — 3.3V supply |
主な用途
TUSB8040A1RKMR の用途: 6 件s: USB 3.0 Docking Station, Desktop / Laptop Port-Replicator, Industrial PC with Multiple USB Peripherals, Embedded Platform USB-3 Fan-Out, Point-of-Sale Terminal, Kiosk / Self-Service Terminal.
USB 3.0 Docking Station
The TUSB8040A1RKMR fits USB 3.0 docking stations because it provides 4 downstream SuperSpeed (5 Gbps) ports plus full USB 2.0 backward compatibility from a single upstream connection. With its I2C/SMBus configuration interface and per-port VBUS control outputs, the hub integrates cleanly with docking-station EC firmware. Operating from a single 3.3V rail and commercial 0-70C temperature range, it powers dual-display docks, multi-USB peripherals, and gigabit Ethernet-over-USB in a single compact 9x9 mm WQFN footprint without external heatsinking.
おすすめ
Desktop / Laptop Port-Replicator
The TUSB8040A1RKMR is well-suited to laptop port-replicator designs because it fans out one upstream USB 3.0 port into four downstream ports while preserving SuperSpeed bandwidth for storage, video, and peripheral traffic. The 100-WQFN-MR package is small enough to fit beneath the docking connector PCB, and the integrated per-port over-current sensing simplifies compliance with USB-IF power-distribution rules. Engineers using 24 GHz or wireless subsystems adjacent to the hub should pay attention to SSRX/SSTX routing to keep 5 Gbps signal integrity intact.
おすすめ
Industrial PC with Multiple USB Peripherals
The TUSB8040A1RKMR supports industrial PCs that expose USB-3 Vision cameras, mass-storage devices, and human-interface peripherals from a single upstream port. Its commercial 0 C to +70 C range suits climate-controlled factory cabinets, and the exposed thermal pad provides a low-junction-rise thermal path during continuous SuperSpeed operation. Combined with the TPD2EUSB30 ESD protection array and a properly designed 90 ohm SuperSpeed differential layout, the part delivers reliable downstream connectivity across machine-vision and motion-control production lines.
おすすめ
Embedded Platform USB-3 Fan-Out
The TUSB8040A1RKMR is ideal for embedded host boards that have only one USB 3.0 root port exposed from the SoC but must connect multiple USB-3 peripherals simultaneously. By using the integrated transaction translator, the hub enables four concurrent SuperSpeed streams (e.g., 2x USB-3 Vision cameras + USB mass-storage + USB Ethernet) without dropping to USB 2.0. The I2C/SMBus slave interface allows the host MCU to monitor port status and configure battery-charging behavior, making this hub an excellent fit for ARM-based designs using STM32MP1 or i.MX8 host processors.
おすすめ
Point-of-Sale Terminal
The TUSB8040A1RKMR fits point-of-sale (POS) terminals that must connect a barcode scanner, receipt printer, cash-drawer trigger, magnetic-stripe reader, and customer-facing display from a single upstream USB 3.0 port. Its per-port over-current sensing protects downstream devices from cable faults, and the multi-status LED outputs provide direct diagnostic feedback for service technicians. Operating at 3.3V with low standby power, the hub integrates efficiently into compact POS enclosures where PCB area is at a premium.
おすすめ
Kiosk / Self-Service Terminal
The TUSB8040A1RKMR is well-matched to kiosk designs that expose a touchscreen controller, payment-terminal module, printer, and surveillance camera from one upstream USB 3.0 port. Its wide compatibility (SuperSpeed/High/Full/Low-speed mix on each downstream port) lets designers mix legacy USB 2.0 payment devices with newer USB-3 cameras on the same hub. The exposed thermal pad keeps junction temperature low under sustained SuperSpeed traffic, which is critical for 24/7 unattended operation.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: TUSB8040A1RKMR — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | TUSB8040A1RKMR-Q1 | TUSB8040ARKMT | TUSB8041RGCR | TUSB4041IPAPR |
|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | 100-WQFN-MR (9x9 mm) | 100-WQFN-MR (9x9 mm) - same | 100-WQFN-MR (9x9 mm) - same | 64-RGC (different package) | 100-HTQFP (PowerPAD, different style) |
| Function | 4-port USB 3.0 hub | 4-port USB 3.0 hub | 4-port USB 3.0 hub | 4-port USB 3.0 hub (industrial) | 4-port USB 3.0 hub |
| Operating Temperature | 0 C to +70 C (commercial) | -40 C to +85 C (automotive) | 0 C to +70 C (commercial) | -40 C to +85 C (industrial) | -40 C to +85 C (industrial) |
| Automotive Grade | No | Yes (AEC-Q100) | No | No (industrial only) | No (industrial only, Q1 variant available) |
| Lifecycle Status | NRND | Active (per TI family) | NRND/EOL (older silicon) | Active | Active |
| Configuration Interface | I2C/SMBus | I2C/SMBus | I2C/SMBus | I2C/SMBus + enhanced | I2C/SMBus |
主な差別化要因
- Pin-to-pin compatible 100-WQFN family member with automotive qualification （vs TUSB8040A1RKMR-Q1)
- Same footprint as predecessor with updated silicon （vs TUSB8040ARKMT)
- Active industrial-temperature successor with enhanced features （vs TUSB8041RGCR)
- Drop-in alternative with through-hole-compatible package （vs TUSB4041IPAPR)
設計ノート
USB 3.0 SuperSpeed pairs (SSTXP/N, SSRXP/N) must be routed as 90 ohm differential impedance with continuous reference plane on layer 2, max length matching within 150 mil. Per-port SuperSpeed pairs should not cross each other. Place the TUSB8040A1RKMR as close as practical to the USB connectors to minimize pair length and stubs. Maintain at least 4x dielectric spacing between SuperSpeed pairs and any high-frequency noise sources to avoid 5 Gbps signal-integrity degradation. The exposed thermal pad must be soldered to a continuous ground plane with thermal vias for sustained SuperSpeed operation.
Provide a clean 3.3V rail with at least 200 mA headroom above downstream load. Place 10 uF bulk + 0.1 uF ceramic decoupling within 100 mil of every VDD33 pin. The 1.1V internal core rail (VDD11) must be decoupled with 4.7 uF + 0.1 uF per pin. Per-port VBUS switching must use an external high-side switch rated for 1.5 A continuous (such as TI's TPS2051B family) with controlled inrush to meet USB-IF compliance. Avoid routing noisy digital returns near the VDD11 decoupling to prevent core supply ripple coupling into SuperSpeed PLL.
Estimated: input clock accuracy must be within +/- 50 ppm of 12 MHz; an inaccurate crystal can fail USB-IF compliance and cause link training failures. Do not leave CFG0-CFG3 pins floating - they select boot-time configuration (SMBus vs I2C mode, default port power behavior). Tie unused LED outputs to GND if not used, to avoid floating inputs. The TEST pin must be tied to GND for normal operation. Confirm the upstream port is connected to a Type-A receptacle with CC pull-down resistors if implementing Type-C; the TUSB8040A1RKMR natively supports Type-A upstream only.
At maximum SuperSpeed traffic on all four downstream ports, the TUSB8040A1RKMR dissipates approximately 0.8 W. The 100-WQFN-MR exposed pad provides a low thermal-resistance path (theta_JA ~28 C/W on a 4-layer JEDEC test board). For sealed enclosures with no airflow, lay a 25 mm x 25 mm copper pour under the exposed pad and stitch at least 9 thermal vias (0.3 mm drill, 0.5 mm pitch) to inner ground layers. Verify junction temperature stays below 110 C by thermal probe or calculation for reliability margin.
コンプライアンス情報
RoHS and lead-free compliance per TI product page; AEC-Q100 qualification only available on the Q1 variant (TUSB8040A1RKMR-Q1). Halogen-free status not specified in retrieved web data; consult TI datasheet for confirmation.
