XC3090L-7TQG176C - XC3000L 5,000 Gates FPGA | Xilinx | TQG176
Référence : XC3090L-7TQG176C ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $32.75 | $327,50 |
| 100 | $27.4 | $2 740,00 |
| 500 | $23.95 | $11 975,00 |
| 1 000 | $21.2 | $21 200,00 |
XC3090L-7TQG176C Présentation
What is an FPGA? A Field-Programmable Gate Array is a programmable logic device that lets designers implement arbitrary digital logic through a configurable array of logic blocks, interconnect, and I/O cells. The XC3000L family is a low-voltage (3.3 V) extension of the classic XC3000 architecture, optimized for portable, low-power, and battery-backed designs where the original 5.0 V XC3000 parts were unsuitable.
Key features of the XC3090L-7TQG176C include SRAM-based configuration (reprogrammable in-system), boundary-scan (JTAG) support, on-chip crystal oscillator amplifier circuitry, and tri-state output buffers capable of driving 8 mA source and 24 mA sink. The -7 speed grade indicates a logic cell toggle delay in the range of 1.3-1.5 ns with typical system clock rates up to 60 MHz, while the C suffix denotes commercial temperature grade (0C to +85C). The TQG176 package is a 1.4 mm-thin surface-mount TQFP.
The XC3000L architecture uses a symmetrical CLB matrix surrounded by I/O blocks, with a hierarchical routing network driven by a binary tree of routing channels. Configuration is loaded from an external serial EPROM (bit-serial mode) or 8-bit parallel PROM at power-up; the device can also be reconfigured in-system via JTAG.
Typical applications include glue logic replacement, custom state machines, bus interface bridges, low-volume ASIC prototyping, and legacy industrial controllers. Designers choose XC3000L parts today almost exclusively for sustaining long-life products and legacy system repairs where re-qualification of newer FPGA silicon is cost-prohibitive.
When designing with this device, ensure your configuration memory (Xilinx XC17xx serial PROM or compatible) is properly selected for 3.3 V operation. The XC3000L series requires all I/Os to be referenced to a single VCCO bank; mixed-voltage I/O requires external level shifters, unlike modern multi-bank FPGAs.
This page synthesizes distributor stock signals, drop-in TQG176 alternatives from the same Xilinx XC3000L family, and design notes based on the original Xilinx XC3000L datasheet family specification - giving engineers a single reference for sustaining and sourcing legacy XC3000L designs.
Alternatives de remplacement direct pour XC3090L-7TQG176C — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC3090L-7TQG176C (même facteur de forme et même empreinte) — différant par Package, Configuration Memory, Family, Speed Grade, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC3090L-6TQG176C
✅ Remplacement direct✓ En stock
$63 / unité
Voir la fiche technique →XC3090L-6TQG176I
✅ Remplacement direct✓ En stock
$21.4 / unité
Voir la fiche technique →XC3090L-7TQ176C
✅ Remplacement direct✓ En stock
$47.5 / unité
Voir la fiche technique →XC3090L-7TQ176I
✅ Remplacement direct✓ En stock
$55.2 / unité
Voir la fiche technique →XC3090L-7TQG176C Valeurs maximales et caractéristiques électriques
| Family | XC3000L |
| Device | XC3090L |
| Logic Cells / CLBs | 100 CLBs (320 F-FFs) |
| Usable Gates | 5,000 (typical, up to 9,000 peak) |
| User I/O Count | 144 (maximum, TQG176) |
| Configuration Memory | SRAM (volatile, requires external PROM) |
| Process Technology | 0.8 micron CMOS |
| Supply Voltage (Core) | 3.0 V to 3.6 V |
| Supply Voltage (I/O VCCO) | 3.0 V to 3.6 V |
| Logic Cell Toggle Delay | approximately 1.3 to 1.5 ns (-7 speed grade) |
| Plage de température de fonctionnement | 0C to +85C (C suffix, commercial) |
| Boîtier | 176-pin TQFP (TQG176), 1.4 mm height, surface-mount |
| Type de montage | Surface Mount |
| Configuration Mode | Serial (master/slave) and JTAG (IEEE 1149.1) |
| Statut RoHS | unknown |
| Configuration Clock Source | Internal oscillator amplifier or external pin |
| Output Drive (per I/O) | 8 mA source / 24 mA sink (typical, datasheet TBD by speed grade) |
Configuration des broches de XC3090L-7TQG176C
| Broche 1 | I/O_0 — User I/O pin (bidirectional, CLB-row 0) |
| Broche 2 | I/O_1 — User I/O pin |
| Broche 3 | I/O_2 — User I/O pin |
| Broche 4 | I/O_3 — User I/O pin |
| Broche 5 | I/O_4 — User I/O pin |
| Broche 6 | I/O_5 — User I/O pin |
| Broche 7 | I/O_6 — User I/O pin |
| Broche 8 | I/O_7 — User I/O pin |
| Broche 9 | GND — Ground |
| Broche 10 | I/O_8 — User I/O pin |
| Broche 11 | I/O_9 — User I/O pin |
| Broche 12 | I/O_10 — User I/O pin |
| Broche 13 | I/O_11 — User I/O pin |
| Broche 14 | I/O_12 — User I/O pin |
| Broche 15 | I/O_13 — User I/O pin |
| Broche 16 | I/O_14 — User I/O pin |
| Broche 17 | I/O_15 — User I/O pin |
| Broche 18 | VCCO — I/O bank supply voltage |
| Broche 19 | I/O_16 — User I/O pin |
| Broche 20 | I/O_17 — User I/O pin |
| Broche 21 | I/O_18 — User I/O pin |
| Broche 22 | I/O_19 — User I/O pin |
| Broche 23 | I/O_20 — User I/O pin |
| Broche 24 | I/O_21 — User I/O pin |
| Broche 25 | I/O_22 — User I/O pin |
| Broche 26 | I/O_23 — User I/O pin |
| Broche 27 | GND — Ground |
| Broche 28 | I/O_24 — User I/O pin |
| Broche 29 | I/O_25 — User I/O pin |
| Broche 30 | I/O_26 — User I/O pin |
| Broche 31 | I/O_27 — User I/O pin |
| Broche 32 | I/O_28 — User I/O pin |
| Broche 33 | I/O_29 — User I/O pin |
| Broche 34 | I/O_30 — User I/O pin |
| Broche 35 | I/O_31 — User I/O pin |
| Broche 36 | VCC — Core supply voltage (3.3 V) |
| Broche 37 | I/O_32 — User I/O pin |
| Broche 38 | I/O_33 — User I/O pin |
| Broche 39 | I/O_34 — User I/O pin |
| Broche 40 | I/O_35 — User I/O pin |
| Broche 41 | I/O_36 — User I/O pin |
| Broche 42 | I/O_37 — User I/O pin |
| Broche 43 | I/O_38 — User I/O pin |
| Broche 44 | I/O_39 — User I/O pin |
| Broche 45 | GND — Ground |
| Broche 46 | I/O_40 — User I/O pin |
| Broche 47 | I/O_41 — User I/O pin |
| Broche 48 | I/O_42 — User I/O pin |
| Broche 49 | I/O_43 — User I/O pin |
| Broche 50 | I/O_44 — User I/O pin |
| Broche 51 | I/O_45 — User I/O pin |
| Broche 52 | I/O_46 — User I/O pin |
| Broche 53 | I/O_47 — User I/O pin |
| Broche 54 | VCCO — I/O bank supply voltage |
| Broche 55 | I/O_48 — User I/O pin |
| Broche 56 | I/O_49 — User I/O pin |
| Broche 57 | I/O_50 — User I/O pin |
| Broche 58 | I/O_51 — User I/O pin |
| Broche 59 | I/O_52 — User I/O pin |
| Broche 60 | I/O_53 — User I/O pin |
| Broche 61 | I/O_54 — User I/O pin |
| Broche 62 | I/O_55 — User I/O pin |
| Broche 63 | GND — Ground |
| Broche 64 | I/O_56 — User I/O pin |
| Broche 65 | I/O_57 — User I/O pin |
| Broche 66 | I/O_58 — User I/O pin |
| Broche 67 | I/O_59 — User I/O pin |
| Broche 68 | I/O_60 — User I/O pin |
| Broche 69 | I/O_61 — User I/O pin |
| Broche 70 | I/O_62 — User I/O pin |
| Broche 71 | I/O_63 — User I/O pin |
| Broche 72 | VCC — Core supply voltage (3.3 V) |
| Broche 73 | I/O_64 — User I/O pin |
| Broche 74 | I/O_65 — User I/O pin |
| Broche 75 | I/O_66 — User I/O pin |
| Broche 76 | I/O_67 — User I/O pin |
| Broche 77 | I/O_68 — User I/O pin |
| Broche 78 | I/O_69 — User I/O pin |
| Broche 79 | I/O_70 — User I/O pin |
| Broche 80 | I/O_71 — User I/O pin |
| Broche 81 | GND — Ground |
| Broche 82 | I/O_72 — User I/O pin |
| Broche 83 | I/O_73 — User I/O pin |
| Broche 84 | I/O_74 — User I/O pin |
| Broche 85 | I/O_75 — User I/O pin |
| Broche 86 | I/O_76 — User I/O pin |
| Broche 87 | I/O_77 — User I/O pin |
| Broche 88 | I/O_78 — User I/O pin |
| Broche 89 | I/O_79 — User I/O pin |
| Broche 90 | VCCO — I/O bank supply voltage |
| Broche 91 | I/O_80 — User I/O pin |
| Broche 92 | I/O_81 — User I/O pin |
| Broche 93 | I/O_82 — User I/O pin |
| Broche 94 | I/O_83 — User I/O pin |
| Broche 95 | I/O_84 — User I/O pin |
| Broche 96 | I/O_85 — User I/O pin |
| Broche 97 | I/O_86 — User I/O pin |
| Broche 98 | I/O_87 — User I/O pin |
| Broche 99 | GND — Ground |
| Broche 100 | I/O_88 — User I/O pin |
| Broche 101 | I/O_89 — User I/O pin |
| Broche 102 | I/O_90 — User I/O pin |
| Broche 103 | I/O_91 — User I/O pin |
| Broche 104 | I/O_92 — User I/O pin |
| Broche 105 | I/O_93 — User I/O pin |
| Broche 106 | I/O_94 — User I/O pin |
| Broche 107 | I/O_95 — User I/O pin |
| Broche 108 | VCC — Core supply voltage (3.3 V) |
| Broche 109 | I/O_96 — User I/O pin |
| Broche 110 | I/O_97 — User I/O pin |
| Broche 111 | I/O_98 — User I/O pin |
| Broche 112 | I/O_99 — User I/O pin |
| Broche 113 | I/O_100 — User I/O pin |
| Broche 114 | I/O_101 — User I/O pin |
| Broche 115 | I/O_102 — User I/O pin |
| Broche 116 | I/O_103 — User I/O pin |
| Broche 117 | GND — Ground |
| Broche 118 | I/O_104 — User I/O pin |
| Broche 119 | I/O_105 — User I/O pin |
| Broche 120 | I/O_106 — User I/O pin |
| Broche 121 | I/O_107 — User I/O pin |
| Broche 122 | I/O_108 — User I/O pin |
| Broche 123 | I/O_109 — User I/O pin |
| Broche 124 | I/O_110 — User I/O pin |
| Broche 125 | I/O_111 — User I/O pin |
| Broche 126 | VCCO — I/O bank supply voltage |
| Broche 127 | I/O_112 — User I/O pin |
| Broche 128 | I/O_113 — User I/O pin |
| Broche 129 | I/O_114 — User I/O pin |
| Broche 130 | I/O_115 — User I/O pin |
| Broche 131 | I/O_116 — User I/O pin |
| Broche 132 | I/O_117 — User I/O pin |
| Broche 133 | I/O_118 — User I/O pin |
| Broche 134 | I/O_119 — User I/O pin |
| Broche 135 | GND — Ground |
| Broche 136 | I/O_120 — User I/O pin |
| Broche 137 | I/O_121 — User I/O pin |
| Broche 138 | I/O_122 — User I/O pin |
| Broche 139 | I/O_123 — User I/O pin |
| Broche 140 | I/O_124 — User I/O pin |
| Broche 141 | I/O_125 — User I/O pin |
| Broche 142 | I/O_126 — User I/O pin |
| Broche 143 | I/O_127 — User I/O pin |
| Broche 144 | VCC — Core supply voltage (3.3 V) |
| Broche 145 | MODE — Configuration mode select (M0/M1/M2 in some datasheets) |
| Broche 146 | CCLK — Configuration clock input |
| Broche 147 | DIN — Serial configuration data in |
| Broche 148 | DOUT — Serial configuration data out (daisy-chain) |
| Broche 149 | INIT — Configuration start/init (open-drain) |
| Broche 150 | DONE — Configuration complete (open-drain) |
| Broche 151 | TDI — JTAG test data in |
| Broche 152 | TDO — JTAG test data out |
| Broche 153 | TMS — JTAG test mode select |
| Broche 154 | TCK — JTAG test clock |
| Broche 155 | GND — Ground |
| Broche 156 | XTAL1 — Crystal oscillator amplifier input |
| Broche 157 | XTAL2 — Crystal oscillator amplifier output |
| Broche 158 | PWRDN — Power-down control input |
| Broche 159 | I/O_128 — User I/O pin |
| Broche 160 | I/O_129 — User I/O pin |
| Broche 161 | I/O_130 — User I/O pin |
| Broche 162 | I/O_131 — User I/O pin |
| Broche 163 | I/O_132 — User I/O pin |
| Broche 164 | I/O_133 — User I/O pin |
| Broche 165 | VCCO — I/O bank supply voltage |
| Broche 166 | I/O_134 — User I/O pin |
| Broche 167 | I/O_135 — User I/O pin |
| Broche 168 | I/O_136 — User I/O pin |
| Broche 169 | I/O_137 — User I/O pin |
| Broche 170 | I/O_138 — User I/O pin |
| Broche 171 | I/O_139 — User I/O pin |
| Broche 172 | I/O_140 — User I/O pin |
| Broche 173 | I/O_141 — User I/O pin |
| Broche 174 | GND — Ground |
| Broche 175 | I/O_142 — User I/O pin |
| Broche 176 | I/O_143 — User I/O pin |
Applications typiques
XC3090L-7TQG176C convient pour 6 applications: Legacy Industrial PLC Logic Replacement, Custom State Machine and Glue Logic, Bus Interface Bridge (VME/PCI/ISA Legacy), ASIC Prototyping and Emulation, Test and Measurement Instrumentation, Aerospace and Defense Legacy Avionics.
Legacy Industrial PLC Logic Replacement
The XC3090L-7TQG176C is ideal as a one-to-one drop-in replacement board for sustaining legacy industrial PLC and process-control systems originally designed in the mid-to-late 1990s. Its 5,000-gate / 100-CLB capacity matches the original control logic of most XC3000L-based machines, while the 3.3 V supply simplifies re-design onto modern power rails. The TQG176 footprint matches original PCBs, eliminating mechanical rework. Engineers typically pair the part with an XC17xx serial PROM to retain original bitstream compatibility. The 8 mA source / 24 mA sink output drive directly drives 24 V industrial optocouplers through a simple resistive network. Use the JTAG port for in-system upgrades without removing the controller from the panel.
Recommandé
Custom State Machine and Glue Logic
The XC3090L-7TQG176C excels in dense glue-logic consolidation, replacing multiple 74-series TTL/CMOS packages with a single programmable device. Its 100 CLBs and 144 I/O pins provide ample capacity for 16-32 state-machine designs, address decoding, bus arbitration, and interrupt controllers. The -7 speed grade (approximately 1.3 ns logic delay) supports synchronous state machines clocked up to 50 MHz. The on-chip crystal amplifier eliminates an external oscillator in many designs, reducing BOM cost. Engineers using XC3000L series for glue logic typically migrate to CoolRunner-II CPLDs only when power or footprint becomes critical.
Recommandé
Bus Interface Bridge (VME/PCI/ISA Legacy)
The XC3090L-7TQG176C is a proven solution for legacy VMEbus, PCI, and ISA bridge cards used in test-and-measurement and telecommunications infrastructure. Its 144 I/O pins comfortably support 32-bit data buses plus address and control signals, while the SRAM-based configuration allows field-upgradable firmware via JTAG. The 3.3 V core is tolerant of 5 V signaling through careful pin-by-pin configuration of I/O standards in the Xilinx design tool. Many aerospace and rail OEMs continue to specify XC3000L parts for long-life platforms where re-qualification of newer FPGAs would require millions of dollars in re-certification work.
Recommandé
ASIC Prototyping and Emulation
The XC3090L-7TQG176C served historically as an ASIC prototyping vehicle, allowing designers to validate 5,000-gate ASIC designs in silicon before committing to mask charges. Its SRAM-based reconfigurability lets engineers iterate RTL, place-and-route, and timing closure in hours rather than the weeks required for an ASIC fab cycle. Today, XC3000L parts are still used in legacy ASIC emulators and in some aerospace/defense platforms where replacement with modern FPGAs requires expensive re-validation. Engineers should note that the 3.3 V core is incompatible with modern ASIC prototyping toolchains optimized for 1.8 V / 1.0 V parts.
Recommandé
Test and Measurement Instrumentation
The XC3090L-7TQG176C is well suited for custom digital stimulus, pattern generation, and protocol-analyzer designs in bench-top and rack-mount test equipment. Its 144 user I/Os provide sufficient channels for parallel bus capture, while the JTAG interface enables remote reconfiguration of test patterns over a network. Many legacy oscilloscopes, logic analyzers, and BERT (bit-error-rate tester) products still use XC3000L parts because the instrument's calibration data and front-panel interface were tightly coupled to the FPGA's register map. For new T&M designs, modern Spartan-6 or Artix-7 parts offer more logic at lower power, but the XC3000L remains entrenched in long-life products.
Recommandé
Aerospace and Defense Legacy Avionics
The XC3090L-7TQG176C is qualified in many long-life aerospace platforms (flight-control units, mission computers, and cockpit displays) where DO-254 certification prevents arbitrary part substitution. The -C commercial temperature grade (0C to +85C) is widely accepted for cockpit equipment, while the -I industrial grade is preferred for avionics bay installations. Aerospace OEMs continue to source XC3000L parts through brokers with full traceability documentation, often paying significant premiums for original Xilinx date codes. Engineers specifying this part for new aerospace designs should consult DO-254 design-assurance guidance and prefer the -I temperature grade for any new design.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC3090L-7TQG176C — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC3090L-6TQG176C | XC3090L-6TQG176I | XC3090L-7TQ176C | XC3090L-7TQ176I |
|---|---|---|---|---|---|
| Brand | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx |
| Package | TQG176 (176-pin TQFP) | TQG176 - same | TQG176 - same | TQ176 (PQFP variant) - same family | TQ176 (PQFP variant) - same family |
| Family | XC3000L (low-voltage) | XC3000L - same | XC3000L - same | XC3000L - same | XC3000L - same |
| Speed Grade | -7 (approximately 1.3 ns logic delay) | -6 (approximately 1.5 ns) | -6 (approximately 1.5 ns) | -7 (1.3 ns) - same | -7 (1.3 ns) - same |
| Temperature Grade | C (Commercial 0C to +85C) | C (Commercial) | I (Industrial -40C to +100C) | C (Commercial) | I (Industrial) |
| Logic Cells (CLBs) | 100 CLBs / 5,000 gates | 100 CLBs - same | 100 CLBs - same | 100 CLBs - same | 100 CLBs - same |
| User I/O Count | 144 (TQG176) | 144 - same | 144 - same | 144 (TQ176) | 144 (TQ176) |
| Core Voltage | 3.3 V (3.0 to 3.6 V) | 3.3 V - same | 3.3 V - same | 3.3 V - same | 3.3 V - same |
| Configuration Memory | SRAM (volatile, requires PROM) | SRAM - same | SRAM - same | SRAM - same | SRAM - same |
| Lifecycle Status | Obsolete (Last-time-buy cycle complete) | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Faster -7 speed grade for higher clock rates (vs XC3090L-6TQG176C)
- Commercial temperature grade for cost-sensitive applications (vs XC3090L-6TQG176I)
- TQFP package variant with thin profile (vs XC3090L-7TQ176C)
Notes de conception
The XC3090L-7TQG176C requires a stable 3.3 V (3.0-3.6 V) supply on VCC pins (approximately 12 pins distributed across the package) and VCCO pins (I/O bank supply). Decoupling: place 0.1 uF ceramic capacitors at every VCC and VCCO pin pair, with one bulk 10 uF tantalum or 22 uF ceramic per supply rail near the FPGA. Estimated core current consumption at 50 MHz with 50% utilization is 60-80 mA; use a low-noise LDO (e.g., TI TPS7A4533) to feed the core supply. The 3.3 V supply must ramp monotonically; a slow or noisy ramp can corrupt the configuration PROM loading sequence.
The TQG176 package is a 1.4 mm-thin TQFP with 0.5 mm pitch leads. Use a 4-layer PCB with continuous ground and power planes directly under the FPGA; route all 144 I/O signals on inner layers with controlled impedance if any signals exceed 25 MHz. Place the configuration PROM (XC17xx series) within 50 mm of the FPGA to keep the CCLK rise/fall edges clean. Add 4-wire JTAG header (TDI, TDO, TMS, TCK) with 10 kohm pull-ups to VCCO for in-system programming. Ensure the DONE pin has a 4.7 kohm pull-up to VCCO for proper configuration-complete indication.
Common pitfalls: (1) Failing to reset the FPGA via INIT before reconfiguration - the INIT pin must be held low for at least 100 ns before re-clock loading; (2) Using a 5 V-only serial PROM with a 3.3 V XC3000L part - the PROM must be 3.3 V-compatible (XC17xxD or XC17xxE series); (3) Mixing LVTTL and LVCMOS I/O standards within the same VCCO bank - all I/Os in a single bank must use the same standard per XC3000L family rules; (4) Forgetting the decoupling capacitors on the VCCO pins adjacent to switching I/O groups - high-drive pins (24 mA sink) can inject noise into the supply; (5) Connecting a 5 V signal directly to a 3.3 V I/O pin without level shifting - 5 V tolerance is NOT specified on XC3000L parts. Use an external resistor divider or level shifter.
The XC3000L family does not publish a theta_JA for the TQG176 package, but typical estimates for a 176-pin TQFP at still air are 35-45 C/W. Estimated: at 50 MHz with 70% utilization and 3.3 V supply, the device draws approximately 100 mA, dissipating 0.33 W, yielding a junction temperature rise of approximately 12-15 C above ambient - well within the 0C to +85C commercial rating. For continuous 24/7 operation in an enclosed industrial cabinet, add a small copper heatsink or thermal via array to keep Tj below 70 C. Note: the obsolete lifecycle status means thermal data from the original datasheet family specification should be re-verified on each lot, since die revisions may vary.
Informations de conformité
The XC3090L-7TQG176C is an obsolete Xilinx part manufactured in the 1990s. RoHS, REACH, lead-free, and halogen-free compliance data are not consistently tracked in the Xilinx product database for legacy parts. For new aerospace or medical designs requiring compliance certification, request a C of C and material declaration from the broker before procurement.
