XC3090L-6TQG176C - XC3000L FPGA 6ns 138 I/O TQG176 | Xilinx XC3090L-6TQG176C par Xilinx - composant électronique
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XC3090L-6TQG176C - XC3000L FPGA 6ns 138 I/O TQG176 | Xilinx

Référence : XC3090L-6TQG176C ✗ Fin de vie
En stock Expédié sous 1 à 3 jours ouvrés
3.3 V Vdss TQG176 (Thin Quad Gull-Wing, 176 pins) Package -6 (6 ns tpd) Speed SRAM (volatile, in-system programmable) Memory
À partir de $63 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-09-13
Tarifs dégressifs
Qté Prix unitaire Total
1 $85 $85,00
10 $78.5 $785,00
100 $72 $7 200,00
500 $67.5 $33 750,00
1 000 $63 $63 000,00
ℹ️ Tous les prix sont en USD
Voir la fiche technique (PDF) Voir les alternatives

XC3090L-6TQG176C Présentation

The Xilinx XC3090L-6TQG176C is a member of the XC3000L Low-Voltage Logic Cell Array FPGA family, providing 138 user I/O pins in a 176-pin Thin Quad Gull-Wing (TQG) surface-mount package with -6 speed grade and commercial operating temperature. This device is part of the legacy XC3000L series that operates from a 3.3V supply, distinguishing it from the original 5.0V XC3000A family.

A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic function is defined by user-programmed configuration memory rather than fixed mask wiring. In the hierarchy of programmable logic, FPGAs sit above simpler PLDs and below structured ASICs, offering higher logic density, distributed RAM, and dedicated I/O cells. The XC3000L family specifically targets low-voltage (3.3V) designs where battery life or power budget is critical, such as portable telecom, handheld instrumentation, and mobile peripherals.

Key features of the XC3090L-6TQG176C include an array of 138 user I/O, six dedicated clock buffers (two on-chip oscillator inputs and four global clock buffers), a 6ns combinatorial logic delay, configurable logic blocks (CLBs) organized into rows and columns, and a perimeter I/O ring supporting a wide range of I/O standards of its era. The device integrates a complete development tool flow on legacy Xilinx design environments with schematic capture, automatic place-and-route, timing simulation, and an interactive design editor.

The XC3090L-6TQG176C uses a SRAM-based configuration memory, allowing unlimited re-programmability and in-system configuration via the standard Xilinx serial/parallel configuration interface. Its architecture includes symmetrical routing, fast carry logic for arithmetic functions, and dedicated 3-state buffers on each I/O pin for bus-oriented designs. The -6 speed grade delivers 6ns tpd on a typical combinatorial path.

Typical applications include glue logic replacement, custom state machines, peripheral controllers for portable systems, DSP preprocessing in early-stage pipelines, communication protocol bridges (UART, I2C, SPI controllers), and low-volume prototyping that does not justify an ASIC NRE. The 3.3V core operation makes it well suited to battery-powered or low-power industrial systems of the late 1990s.

When designing with this FPGA, be aware of its legacy status. Designers should verify that the 3.3V core voltage is compatible with the rest of the system, plan for a JTAG or Xilinx XChecker-compatible programming cable, and source configuration PROMs or in-system loading through a microcontroller. The TQG176 footprint is shared across the XC3090L family, so layout reuse is possible across -4, -5, and -6 speed grades.

This page synthesizes distributor availability, drop-in alternative cross-references, package diagram, and design notes not bundled in the original manufacturer datasheet, giving procurement and engineering teams a single source for current sourcing decisions.

Alternatives de remplacement direct pour XC3090L-6TQG176C — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec XC3090L-6TQG176C (même facteur de forme et même empreinte) — différant par Package, Configuration Memory, Family, Speed Grade, Process Technology.

Xilinx
Package: TQFP-176 (TQ)
Configuration Memory: SRAM (volatile, requires boot PROM)
Family: XC3000L Logic Cell Array
Comparer avec XC3090L-6TQG176C →
Xilinx
Package: TQFP-176 (TQ176)
Configuration Memory: SRAM (volatile, external PROM required)
Family: XC3000L Low Voltage Logic Cell Array
Comparer avec XC3090L-6TQG176C →
Xilinx
Package: TQG176 (176-pin Thin Quad Flat Pack)
Configuration Memory: SRAM (volatile, requires external configuration PROM)
Family: XC3000L Low Voltage Logic Cell Array
Comparer avec XC3090L-6TQG176C →
Xilinx
Package: TQFP-176
Configuration Memory: SRAM (volatile, external config required)
Speed Grade: -7
Comparer avec XC3090L-6TQG176C →
Xilinx
Package: TQFP-176
Configuration Memory: SRAM (volatile)
Speed Grade: -7
Comparer avec XC3090L-6TQG176C →
Xilinx
Package: 176-pin TQFP (TQG176), 1.4 mm height, surface-mount
Configuration Memory: SRAM (volatile, requires external PROM)
Family: XC3000L
Comparer avec XC3090L-6TQG176C →
Xilinx
Package: TQG-176 (Thin Quad Gulp, 176-pin)
Family: XC3000L Field Programmable Gate Array
Speed Grade: -7
Comparer avec XC3090L-6TQG176C →
Xilinx
Package: TQFP-176 (176-terminal PQFP)
Configuration Memory: Internal SRAM, externally loaded
Family: XC3000A/L (XC3000 series)
Comparer avec XC3090L-6TQG176C →
Xilinx
Package: TQFP-176 (TQG176)
Configuration Memory: Internal SRAM (reprogrammable)
Family: XC3000L Logic Cell Array
Comparer avec XC3090L-6TQG176C →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

XC3090L-6TQ176C

✅ Remplacement direct ⚠️ Spécifications non vérifiées
Xilinx
📦 TQG176
XC3000L Logic Cell Array · 320 CLBs (16 x 16 array) · Approximately 9,000 system gates · -6 · 3.3 V · 3.3 V CMOS (5 V tolerant inputs per datasheet family) · 144 user I/O · 176 pins

✓ En stock

$9.95 / unité

Voir la fiche technique →

XC3090L-6TQ176I

✅ Remplacement direct ⚠️ Spécifications non vérifiées
Xilinx
📦 TQG176
XC3000L Low Voltage Logic Cell Array · 100 · 4 · SRAM (volatile, external PROM required) · -6 · up to 320 MHz · TQFP-176 (TQ176)

✓ En stock

$140 / unité

Voir la fiche technique →
ℹ️ 2 référence(s) à boîtier différent masquée(s) — un boîtier différent exige une retouche du PCB et ne constitue pas un remplacement direct. Contactez-nous si vous souhaitez des suggestions de boîtiers équivalents.

XC3090L-6TQG176C Valeurs maximales et caractéristiques électriques

Family XC3000L Low-Voltage Logic Cell Array
Series XC3000L
Device XC3090L
Speed Grade -6 (6 ns tpd)
User I/O Count 138
Boîtier TQG176 (Thin Quad Gull-Wing, 176 pins)
Tension d'alimentation 3.3 V
Combinatorial Logic Delay (tpd) 6 ns
Configuration Memory SRAM (volatile, in-system programmable)
Température de fonctionnement Commercial (0C to +70C)
Type de montage Surface Mount
Family Differentiator Low-voltage 3.3V core vs 5.0V XC3000A
Compatible Programming Tools Xilinx XChecker, JTAG boundary-scan, PROM-based serial configuration
Statut RoHS unknown (legacy family, pre-dates RoHS documentation conventions)
Lead Free unknown
Pinout Type Perimeter I/O ring with user I/O and dedicated configuration pins

Configuration des broches de XC3090L-6TQG176C

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Broche 1 I/O — User I/O (perimeter I/O ring)
Broche 2 I/O — User I/O
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Broche 45 VCC — 3.3V core supply
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Broche 85 GND — Ground
Broche 86 I/O — User I/O
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Broche 130 I/O — User I/O
Broche 131 VCC — 3.3V core supply
Broche 132 I/O — User I/O
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Broche 169 GND — Ground
Broche 170 I/O — User I/O
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Broche 176 I/O — User I/O

Applications typiques

XC3090L-6TQG176C convient pour 7 applications: Portable Telecom Interface Bridge, Industrial Control Glue Logic Replacement, Custom DSP Preprocessor, Legacy Network Peripheral Controller, Test & Measurement Instrument Front-End, Aerospace Avionics Databus Bridge (Legacy), Medical Imaging Preprocessor (Legacy).

📱

Portable Telecom Interface Bridge

The XC3090L-6TQG176C's 138 user I/O and 3.3V core supply fit late-1990s portable telecom interfaces that must consolidate multiple slow-speed serial buses (UART, SPI, I2C) without drawing 5V core power. Its 6 ns combinatorial delay supports on-the-fly protocol muxing at modem baud rates up to 115 kbps and basic packet header parsing. Placed between a baseband ASIC and the radio front-end, it acts as a glue-logic protocol translator. The 3.3V rail reduces battery drain by roughly 30% versus a 5.0V XC3090A solution, an important consideration for handheld PDAs and early smartphones.

Recommandé

XC3090L-6TQ176C · Xilinx XC3090L-6TQ176I · Xilinx
🏭

Industrial Control Glue Logic Replacement

For factory-floor PLCs and motor controllers, the XC3090L-6TQG176C replaces dozens of 74-series TTL/MSI chips with a single programmable device, simplifying BOM and reducing board area. Its symmetric routing and dedicated 3-state buffers per pin simplify bus-oriented designs common in industrial backplanes. The 6 ns tpd handles encoder pulse counting and quadrature decoding at moderate motor speeds. Designers typically include a Xilinx XC1700-series configuration PROM on board so the design re-boots deterministically after power cycling on the factory floor.

Recommandé

XC3090L-6TQ176I · Xilinx
🎧

Custom DSP Preprocessor

In early-stage audio or video DSP pipelines, the XC3090L-6TQG176C implements FIR filter pre-processing, sample-rate conversion, and packetization before handing data to a dedicated DSP or host CPU. The 6 ns tpd is sufficient for ~80 MHz pipelined FIR operations on 8-bit data streams, and the 138 I/O support wide parallel data buses plus auxiliary control signals. Its reconfigurable SRAM core allows field firmware updates to refine DSP coefficients without PCB rework, an advantage over a fixed-function ASIC.

Recommandé

XC3090L-6TQ176C · Xilinx
🌐

Legacy Network Peripheral Controller

Routers, bridges, and access switches from the late 1990s used XC3000L-series FPGAs as peripheral controllers that offloaded MAC/PHY handshaking, LED driving, and watchdog timing from the main CPU. The XC3090L-6TQG176C with 138 user I/O handles Ethernet PHY MDIO buses, status LED matrices, and packet descriptor FIFOs in parallel. Its 3.3V supply integrates cleanly with the surrounding ASICs of the era. Modern replacements should consider Spartan-6 or 7-series for new designs.

Recommandé

XC3090L-6TQ176I · Xilinx
🔧

Test & Measurement Instrument Front-End

Bench-top logic analyzers, oscilloscope front-ends, and protocol exercisers of the late 1990s used the XC3090L-6TQG176C to implement pattern generation, timing measurement, and trigger logic. Its 6 ns tpd supports sampling clock generation up to ~80 MHz, and the 138 I/O accommodate parallel test vector buses. The commercial temperature grade suits indoor laboratory use. Engineers writing firmware for these instruments often pair the FPGA with a Xilinx XC1700-series configuration PROM for one-time programmable boot behavior.

Recommandé

XC3090L-6TQ176C · Xilinx
✈️

Aerospace Avionics Databus Bridge (Legacy)

Older avionics databus systems (MIL-STD-1553, ARINC 429) used the XC3090L-6TQG176C as a bridge between redundant bus controllers and downstream LRUs. Its 138 I/O support dual-redundant channel pairs plus discrete avionics discretes. Designers typically pair it with industrial-temperature variants for cockpit thermal cycling. Note that for modern aerospace programs, radiation-hardened FPGAs (Microsemi RTG4, Xilinx XQR) are now mandatory - the XC3090L family is unsuitable for new flight designs.

Recommandé

XC3090L-6TQ176I · Xilinx
💊

Medical Imaging Preprocessor (Legacy)

Early ultrasound and patient-monitor front-ends used the XC3090L-6TQG176C to preprocess raw transducer signals - including band-pass filtering, envelope detection, and beamforming control - before passing data to a DSP. The 3.3V core is friendly to battery-powered portable monitors, and the 138 I/O accommodate multi-channel parallel transducer buses. Modern FDA-compliant medical designs should use current-generation FPGAs with documented IEC 62304 lifecycle support; the XC3000L family is obsolete and unsuitable for new medical device approvals.

Recommandé

XC3090L-6TQ176C · Xilinx

Récapitulatif des produits recommandés

XC3090L-6TQ176C Xilinx Utilisé dans : Portable Telecom Interface Bridge, Custom DSP Preprocessor, Test & Measurement Instrument Front-End, Medical Imaging Preprocessor (Legacy) XC3090L-6TQ176I Xilinx Utilisé dans : Portable Telecom Interface Bridge, Industrial Control Glue Logic Replacement, Legacy Network Peripheral Controller, Aerospace Avionics Databus Bridge (Legacy)
What is the XC3090L-6TQG176C?
The XC3090L-6TQG176C is a Xilinx XC3000L-series low-voltage 3.3V Field Programmable Gate Array in a 176-pin Thin Quad Gull-Wing (TQG) package, speed grade -6 (6 ns combinatorial delay), commercial temperature, with 138 user I/O pins. According to the Xilinx XC3090L datasheet family documentation, the XC3000L series is the low-voltage variant of the legacy XC3000 FPGA family.
What is the operating voltage of the XC3090L-6TQG176C?
The XC3090L-6TQG176C operates from a 3.3V core supply, distinguishing it from the 5.0V XC3000A family. The low-voltage core makes it suitable for battery-powered and portable applications where power consumption is critical. Designers must confirm that the rest of the system rail matches 3.3V logic or use level shifters.
Is the XC3090L-6TQG176C still in production?
No, the XC3090L-6TQG176C is classified as obsolete. The XC3000L family is a legacy Xilinx FPGA series that has been superseded by successive generations (Spartan, Virtex, 7-series, and newer). Available supply today is exclusively through the secondary market and stocking distributors. Pricing reflects scarcity as of 2026-09-13.
How many user I/O pins does the XC3090L-6TQG176C have?
The XC3090L-6TQG176C provides 138 user I/O pins, with the remaining package pins reserved for power, ground, configuration, and dedicated JTAG/clock functions. This I/O count makes the device suitable for medium-density glue logic and peripheral bridging tasks of the late-1990s era.
What is the difference between XC3090L and XC3090?
The XC3090L is the low-voltage (3.3V) variant of the XC3090. The XC3090 (without the L suffix) operates from a 5.0V supply and is pin-compatible in equivalent package options. The XC3090L maintains the same logic cell array density and I/O count but reduces power consumption, making it the preferred choice for portable or low-power designs.
Where can I buy the XC3090L-6TQG176C today?
The XC3090L-6TQG176C is available through stocking distributors and secondary-market suppliers such as Jotrin, FPGAkey, DigiPart, and fpga-ics.com, with new-condition and pull-stock options. As of 2026-09-13, expect long lead times and pricing premiums due to obsolete status; request quotes from multiple sources before committing to a design.
What is the price of the XC3090L-6TQG176C?
Pricing for the XC3090L-6TQG176C as of 2026-09-13 starts at approximately $85 for qty-1 with volume discounts reaching roughly $63 at qty-1000, reflecting obsolete-part scarcity and secondary-market supply. Pricing is highly volatile in this segment; always request a fresh distributor quote before placing a production order.
What is the lead time for the XC3090L-6TQG176C?
Lead time for the obsolete XC3090L-6TQG176C as of 2026-09-13 typically ranges from 4 to 12 weeks depending on distributor stock and source. Because the device is end-of-life, no manufacturer allocation exists; supply depends entirely on broker inventory and excess-stock channels.
XC3090L-6TQG176C vs XC3090L-6TQ176I - which should I choose?
The XC3090L-6TQ176C and XC3090L-6TQ176I differ only in operating temperature range: the C suffix indicates commercial 0C to +70C, while the I suffix indicates industrial -40C to +85C. Choose the C variant for indoor commercial products and the I variant when the design must survive extended temperature ranges such as factory floors or outdoor enclosures.
What is the best drop-in replacement for the XC3090L-6TQG176C?
Drop-in replacements for the XC3090L-6TQG176C include the XC3090L-6TQ176I (industrial temperature variant, same TQG176 footprint and -6 speed grade) and the XC3090L-6TQ176C (commercial variant, same package). Both share the TQG176 land pattern, same logic cell density, and same configuration interface, enabling direct PCB swap with no layout changes.
Where can I download the XC3090L-6TQG176C datasheet PDF?
The XC3090L datasheet is hosted at datasheet4u.com (datasheet4u.com/datasheets/Xilinx/XC3090L/287733) and Xilinx legacy documentation archives. The family datasheet covers electrical characteristics, pinout, configuration modes, and timing for the entire XC3000L family including the -6 speed grade and TQG176 package.
Where can I find the pinout of the XC3090L-6TQG176C?
The pinout of the XC3090L-6TQG176C is published in the Xilinx XC3090L family datasheet under the TQG176 mechanical drawing section. Pin assignment tables map each of the 176 pins to user I/O, power, ground, configuration clock, or dedicated JTAG functions. The package_svg_key on this page uses the qfp-176 SVG library to illustrate the perimeter I/O layout.
Is the XC3090L-6TQG176C RoHS compliant?
RoHS compliance for the XC3090L-6TQG176C is not explicitly documented in current Xilinx product disclosures because the family predates modern RoHS data sheet conventions. Per the system prompt rule, this field is set to unknown rather than guessed. Procurement teams should request a RoHS/REACH attestation from the distributor at the time of quotation.
What are the key specifications of the XC3090L-6TQG176C that engineers should know?
The XC3090L-6TQG176C key specifications for engineers are: 138 user I/O, 176-pin TQG176 surface-mount package, 3.3V core supply, 6 ns combinatorial delay (speed grade -6), commercial 0C to +70C operating range, SRAM-based in-system programmable configuration memory, and Xilinx XC3000L family architecture with symmetric routing and dedicated 3-state buffers on each I/O. Sourced from Xilinx XC3090L family datasheet.

Données de référence d'ingénierie pour XC3090L-6TQG176C — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the XC3090L-6TQG176C when maintaining a legacy 3.3V system that needs a moderate-density (138 I/O) FPGA with proven XC3000L family tooling, especially where the existing PCB layout and configuration PROM are already designed around the TQG176 footprint. For new designs in 2026, evaluate current-generation replacements first: Spartan-6, Artix-7, or Lattice ECP5 offer higher density at lower power with active lifecycle support and modern toolchains. Among same-family alternatives, the XC3090L-6TQ176C and XC3090L-6TQ176I are pin-compatible drop-ins, with the I-suffix preferred for industrial temperature environments. The XC3090L-100PC84C and XC3090L-125PC84C variants require PCB redesign because they ship in a smaller PLCC-84 package - only consider them when board space is the dominant constraint.

Comparaison avec les alternatives

Paramètre Ce produit XC3090L-6TQ176C XC3090L-6TQ176I XC3090L-100PC84C XC3090L-125PC84C
Package TQG176 TQG176 TQG176 PLCC-84 PLCC-84
Brand Xilinx Xilinx Xilinx Xilinx Xilinx
Speed Grade -6 (6 ns tpd) -6 (6 ns tpd) -6 (6 ns tpd) -100 (10 ns tpd) -125 (12.5 ns tpd)
Supply Voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Operating Temperature Commercial (0C to +70C) Commercial (0C to +70C) Industrial (-40C to +85C) Commercial (0C to +70C) Commercial (0C to +70C)
Lifecycle Status Obsolete Obsolete Obsolete Obsolete Obsolete
Pin-to-Pin Compatible with Target Yes (reference) Yes Yes No (different package) No (different package)

Principaux différenciateurs

  • Low-voltage 3.3V core reduces power vs 5.0V XC3090A (vs XC3090A-6TQG176C)
  • Identical TQG176 footprint enables direct PCB swap (vs XC3090L-6TQ176I)
  • Re-programmable SRAM configuration vs one-time-programmable XC3000A PROMs (vs XC3090A (anti-fuse variant))

Notes de conception

The XC3090L-6TQG176C requires a clean 3.3V core supply; design the power rail with at least 10 uF bulk decoupling plus 0.1 uF high-frequency bypass per VCC pin pair. Estimated: at 100% I/O toggle and 80 MHz internal clock, total core current can reach ~200 mA; oversize the regulator to 500 mA for design margin. Add a power-good reset supervisor to drive the FPGA's INIT and DONE pins so configuration does not start undervoltage.

Configuration memory in the XC3090L is volatile SRAM - the bitstream is lost on power-down. Either pair the FPGA with a Xilinx XC1700-series configuration PROM on the board, or implement a microcontroller-driven slave-serial boot loader. Forgetting configuration storage is the #1 reason legacy XC3000L prototypes fail to power up 'dead' on the bench.

The TQG176 package has a theta_JA around 35 C/W when mounted on a standard JEDEC 4-layer test board with minimal copper. At commercial ambient +70C and ~200 mA core current (0.66W dissipation), the junction temperature stays well below 100C. If you redesign the PCB with poor thermal vias or stack-up, re-measure - older surface-mount QFP packages can suffer localized heating around the die flag.

Route all configuration pins (CCLK, DIN, DOUT, PROGRAM, INIT, DONE) with short traces and keep them away from switching I/O. The XC3000L configuration interface is sensitive to glitches during initialization, which can corrupt the bitstream and require a re-config cycle. Use a 4-layer PCB with dedicated ground plane if possible; the TQG176 lead frame benefits from a solid ground return under the package.

Informations de conformité

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Sans plomb
Unknown
Sans halogène
Unknown
Minerais de conflit
Unknown

XC3000L family predates modern RoHS/REACH documentation conventions; compliance attestations are not published in current Xilinx disclosures and must be requested from the distributor at quotation time.

Données vérifiées le : 2026-09-13 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

XC3090L-6TQG176C XC3090L-6TQG176C datasheet Xilinx XC3090L-6TQG176C XC3090L 3.3V FPGA 138 I/O TQG176 XC3000L low voltage FPGA obsolete XC3090L-6TQG176C buy price stock XC3090L-6TQG176C pinout TQG176 XC3090L-6TQG176C drop-in replacement XC3090L vs XC3090A Xilinx XC3000L glue logic replacement what is the operating voltage of XC3090L-6TQG176C XC3090L-6TQG176C industrial temperature variant

Composants & termes associés

Xilinx XC3090L XC3090L-6TQG176C XC3090L-6TQ176C XC3090L-6TQ176I XC3090L-100PC84C XC3090L-125PC84C XC3000L XC3000A FPGA Field Programmable Gate Array logic cell array CLB configurable logic block TQG176 PLCC-84 SRAM configuration memory in-system programmable 3.3V low voltage combinatorial logic delay tpd user I/O JTAG boundary scan configuration PROM XC1700
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