XC3090L-8PC84BKJ - XC3000L 5V FPGA 84-Pin PLCC | AMD Xilinx
Référence : XC3090L-8PC84BKJ ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $26.1 | $261,00 |
| 100 | $23.75 | $2 375,00 |
| 500 | $21.4 | $10 700,00 |
| 1 000 | $19.2 | $19 200,00 |
XC3090L-8PC84BKJ Présentation
An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor device that allows designers to implement arbitrary digital logic by programming an on-chip interconnect of configurable logic blocks (CLBs) and input/output blocks (IOBs). In the broader taxonomy, an FPGA is a type of programmable logic device (PLD) sitting between simple PAL/GAL devices and fixed-function ASICs, offering the highest logic density and the most flexible I/O. The XC3000L family uses SRAM-based configuration cells, meaning the device must be configured at every power-up from an external PROM or microcontroller, and it supports unlimited in-system reprogramming.
Key features of the XC3090L-8PC84BKJ include 64,160-bit on-chip configuration memory, 144 user I/O pins routable to the 84-pin PLCC package, hierarchical CMOS SRAM configuration cells, and built-in boundary-scan (JTAG/IEEE 1149.1) support for board-level testability. The device uses a 5 ns CMOS process node and is specified over the commercial 0C to +70C junction temperature range with the 'C' suffix.
Typical applications include glue logic in embedded systems, custom state-machine controllers, bus-interface bridges (ISA-to-local bus, peripheral glue), prototype ASIC verification, and legacy industrial-control replacement. The XC3000L family was widely adopted in the 1990s for mid-complexity control logic, and surplus stock remains a frequent source for maintaining long-lifecycle equipment.
When designing with the XC3090L-8PC84BKJ, note that configuration loading time and external PROM compatibility are critical to bring-up. Designers should follow Xilinx XC3000 application-note guidelines for power-on sequencing because the low-voltage core is sensitive to supply ramp rates below 50 V/ms. The 84-pin PLCC package requires a through-hole socket, which simplifies field replacement but limits PCB density compared with later surface-mount FPGA packages.
Alternatives de remplacement direct pour XC3090L-8PC84BKJ — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC3090L-8PC84BKJ (même facteur de forme et même empreinte) — différant par Mounting Type, Package, Process Technology, Family, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC3090L-7PC84BKJ
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC3090L-100PC84BKJ
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC3090L-8PC84C
✅ Remplacement direct✓ En stock
$24.95 / unité
Voir la fiche technique →XC3090L-7PC84C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC3090L-125PC84C
✅ Remplacement direct✓ En stock
$64 / unité
Voir la fiche technique →XC3090A-7PC84I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC3090L-8PC84BKJ Valeurs maximales et caractéristiques électriques
| Family | XC3000L Low-Voltage Logic Cell Array |
| Logic Cells | 320 |
| Usable Gates | 6,000 |
| Configuration Memory | 64,160 bits |
| Maximum User I/O | 144 |
| Supply Voltage (Vcc) | 3.0 V to 3.6 V (low-voltage) |
| Speed Grade | -8 (approx. 70 MHz toggle) |
| Process Technology | 5 ns CMOS SRAM |
| Configuration Method | Serial/parallel SRAM, in-system reconfigurable |
| Boundary Scan | IEEE 1149.1 (JTAG) compliant |
| Boîtier | 84-pin PLCC (J-Lead), windowed ceramic (BKJ) |
| Température de fonctionnement | 0C to +70C (commercial, C suffix) |
| Type de montage | Through-hole (PLCC socket) |
| Statut RoHS | unknown - legacy windowed ceramic package |
| Configuration Pins | M0, M1, M2 mode-select + DIN, DOUT, CCLK, INIT |
Configuration des broches de XC3090L-8PC84BKJ
| Broche 1 | GND — Ground reference |
| Broche 2 | I/O — User I/O pin (PA0/PB side) |
| Broche 3 | I/O — User I/O pin |
| Broche 4 | I/O — User I/O pin |
| Broche 5 | I/O — User I/O pin |
| Broche 6 | I/O — User I/O pin |
| Broche 7 | I/O — User I/O pin |
| Broche 8 | I/O — User I/O pin |
| Broche 9 | I/O — User I/O pin |
| Broche 10 | I/O — User I/O pin |
| Broche 11 | I/O — User I/O pin |
| Broche 12 | I/O — User I/O pin |
| Broche 13 | I/O — User I/O pin |
| Broche 14 | I/O — User I/O pin |
| Broche 15 | I/O — User I/O pin |
| Broche 16 | I/O — User I/O pin |
| Broche 17 | I/O — User I/O pin |
| Broche 18 | I/O — User I/O pin |
| Broche 19 | I/O — User I/O pin |
| Broche 20 | I/O — User I/O pin |
| Broche 21 | I/O — User I/O pin |
| Broche 22 | I/O — User I/O pin |
| Broche 23 | I/O — User I/O pin |
| Broche 24 | I/O — User I/O pin |
| Broche 25 | I/O — User I/O pin |
| Broche 26 | I/O — User I/O pin |
| Broche 27 | I/O — User I/O pin |
| Broche 28 | I/O — User I/O pin |
| Broche 29 | I/O — User I/O pin |
| Broche 30 | I/O — User I/O pin |
| Broche 31 | VCC — 3.3V low-voltage supply |
| Broche 32 | I/O — User I/O pin |
| Broche 33 | I/O — User I/O pin |
| Broche 34 | I/O — User I/O pin |
| Broche 35 | I/O — User I/O pin |
| Broche 36 | I/O — User I/O pin |
| Broche 37 | I/O — User I/O pin |
| Broche 38 | I/O — User I/O pin |
| Broche 39 | I/O — User I/O pin |
| Broche 40 | I/O — User I/O pin |
| Broche 41 | I/O — User I/O pin |
| Broche 42 | I/O — User I/O pin |
| Broche 43 | I/O — User I/O pin |
| Broche 44 | I/O — User I/O pin |
| Broche 45 | M0 — Configuration mode select 0 |
| Broche 46 | M1 — Configuration mode select 1 |
| Broche 47 | M2 — Configuration mode select 2 |
| Broche 48 | I/O — User I/O pin |
| Broche 49 | I/O — User I/O pin |
| Broche 50 | I/O — User I/O pin |
| Broche 51 | I/O — User I/O pin |
| Broche 52 | I/O — User I/O pin |
| Broche 53 | I/O — User I/O pin |
| Broche 54 | I/O — User I/O pin |
| Broche 55 | I/O — User I/O pin |
| Broche 56 | I/O — User I/O pin |
| Broche 57 | I/O — User I/O pin |
| Broche 58 | I/O — User I/O pin |
| Broche 59 | I/O — User I/O pin |
| Broche 60 | I/O — User I/O pin |
| Broche 61 | I/O — User I/O pin |
| Broche 62 | I/O — User I/O pin |
| Broche 63 | CCLK — Configuration clock input |
| Broche 64 | I/O — User I/O pin |
| Broche 65 | I/O — User I/O pin |
| Broche 66 | I/O — User I/O pin |
| Broche 67 | I/O — User I/O pin |
| Broche 68 | I/O — User I/O pin |
| Broche 69 | I/O — User I/O pin |
| Broche 70 | I/O — User I/O pin |
| Broche 71 | I/O — User I/O pin |
| Broche 72 | I/O — User I/O pin |
| Broche 73 | I/O — User I/O pin |
| Broche 74 | I/O — User I/O pin |
| Broche 75 | DIN — Serial data input for configuration |
| Broche 76 | INIT — Configuration initialization / open-drain status |
| Broche 77 | DOUT — Serial data output for daisy-chain configuration |
| Broche 78 | I/O — User I/O pin |
| Broche 79 | I/O — User I/O pin |
| Broche 80 | I/O — User I/O pin |
| Broche 81 | I/O — User I/O pin |
| Broche 82 | I/O — User I/O pin |
| Broche 83 | I/O — User I/O pin |
| Broche 84 | VCC — 3.3V low-voltage supply |
Applications typiques
XC3090L-8PC84BKJ convient pour 6 applications: Industrial Glue Logic Replacement, Custom State-Machine Controller, Legacy Bus-Interface Bridge, Prototype ASIC Verification, Aerospace Sustainment / Avionics Legacy, Educational FPGA Trainer Platform.
Industrial Glue Logic Replacement
The XC3090L-8PC84BKJ is ideally suited for replacing aging discrete TTL and CMOS glue logic in long-lifecycle industrial equipment. Its 6,000 usable gates can absorb multiple 74LS/74HC chips into a single reconfigurable package, simplifying PCB layout and reducing board area. The 3.3V low-voltage operation matches modern 3.3V backplanes, eliminating legacy 5V regulator stages. With 320 logic cells and 144 user I/O, designers can implement bus arbiters, address decoders, interrupt controllers, and handshake logic in one device. The windowed BKJ package allows field erasure and reconfiguration during commissioning, valuable in industrial retrofits where logic must be tuned onsite.
Recommandé
Custom State-Machine Controller
With 320 logic cells organized as configurable logic blocks (CLBs), the XC3090L-8PC84BKJ fits complex state-machine controllers that previously required multiple PAL/GAL devices. Designers can implement 16-32 state FSMs with combinational decoders in a single chip, reducing propagation delay and improving noise immunity compared with cascaded PAL chains. The SRAM configuration permits last-minute state-table changes via PROM swap, shortening prototype cycles. Commercial temperature grade (0C to +70C) suits factory-floor cabinets, and the through-hole PLCC-84 package allows socket-mount replacement without desoldering during field service.
Recommandé
Legacy Bus-Interface Bridge
The XC3090L-8PC84BKJ bridges legacy buses such as ISA, PC/104, or VME to modern peripherals in sustainment and retrofit programs. Its 70+ usable I/O at PLCC-84 is sufficient to capture 16-bit data plus address and control signals on both sides of the bridge, with the remaining logic cells implementing protocol converters. Because the device must be configured from an external PROM at power-up, designers can swap bridges by changing only the bitstream image, not the hardware - ideal for sustaining 1990s-vintage test equipment where the host bus is fixed but the peripheral evolves.
Recommandé
Prototype ASIC Verification
In ASIC prototyping workflows, the XC3090L-8PC84BKJ implements the pre-silicon functional model of an upcoming gate-array or cell-based ASIC. Designers map RTL to FPGA logic cells at gate-equivalent ratios (typical 3:1 to 5:1 for XC3000L architecture), allowing early software development and system-level validation months before silicon is available. The SRAM configuration allows quick bitstream reload when RTL changes, and the JTAG boundary-scan supports board-level bring-up debugging. The windowed BKJ package permits unlimited UV erasure during long prototype cycles.
Recommandé
Aerospace Sustainment / Avionics Legacy
The XC3000L family remains in service across military and aerospace sustainment programs, where original equipment may operate for 25-30+ years and re-certification of new components is prohibitively expensive. The XC3090L-8PC84BKJ's -8 commercial speed grade and 0C-70C range suit avionics-grade cabinet environments with controlled cooling. Windowed ceramic packages (BKJ) are particularly valued for mission-critical rework since they permit field erasure. Xilinx's MIL-STD-883 screening heritage means these parts remain preferred for spares-pool replenishment despite being commercially obsolete.
Recommandé
Educational FPGA Trainer Platform
Universities and technical colleges use the XC3090L-8PC84BKJ in legacy digital-logic laboratories to teach FPGA fundamentals - configurable logic blocks, programmable interconnect, SRAM configuration flow, and JTAG boundary scan - before students advance to modern Vivado-based Spartan or Artix platforms. The PLCC-84 socket-mount package survives thousands of insertion cycles, and the windowed BKJ variant allows instructors to demonstrate UV erasure between lab sessions. The XC3000L architecture's simplicity (no hard IP cores, no transceivers) keeps focus on fundamental digital design rather than tool complexity.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC3090L-8PC84BKJ — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC3090L-7PC84BKJ | XC3090L-100PC84BKJ | XC3090L-8PC84C | XC3090L-7PC84C | XC3090L-125PC84C | XC3090A-7PC84I |
|---|---|---|---|---|---|---|---|
| Brand | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx |
| Package | PLCC-84 (J-Lead, windowed ceramic) | PLCC-84 (J-Lead) - same | PLCC-84 (J-Lead) - same | PLCC-84 (J-Lead) - same | PLCC-84 (J-Lead) - same | PLCC-84 (J-Lead) - same | PLCC-84 (J-Lead) - same |
| Speed Grade | -8 (~70 MHz) | -7 (~80 MHz) | -100 (~100 MHz) | -8 (~70 MHz) | -7 (~80 MHz) | -125 | -7 (~80 MHz) |
| Supply Voltage | 3.0 V to 3.6 V (low-voltage) | 3.0 V to 3.6 V - same | 3.0 V to 3.6 V - same | 3.0 V to 3.6 V - same | 3.0 V to 3.6 V - same | 3.0 V to 3.6 V - same | 4.75 V to 5.25 V (5V XC3000A - NOT compatible) |
| Usable Gates | 6,000 | 6,000 | 6,000 | 6,000 | 6,000 | 6,000 | 6,000 |
| Logic Cells | 320 | 320 | 320 | 320 | 320 | 320 | 320 |
| Package Type | Windowed ceramic (UV-erasable) | Windowed ceramic | Windowed ceramic | Plastic non-windowed | Plastic non-windowed | Plastic non-windowed | Industrial plastic |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Low-voltage 3.3V operation reduces power by ~60% vs XC3000 5V family (vs XC3090 (5V variant))
- Windowed ceramic BKJ package allows unlimited UV erasure for prototyping (vs XC3090L-8PC84C (plastic non-windowed))
- 144 I/O capacity with 64,160-bit configuration supports mid-complexity glue logic consolidation (vs XC3042L (smaller XC3000L family member))
Notes de conception
The XC3090L-8PC84BKJ requires a stable 3.3V supply within 3.0V-3.6V. Place a 10uF tantalum and 0.1uF ceramic decoupling pair adjacent to each VCC pin (typically pins 31 and 84 on the PLCC-84 package). Supply ramp rate must exceed 50 V/ms to ensure proper configuration startup; slower ramps can leave the device in an indeterminate state requiring power-cycle. Note that VCCO (output voltage) pins on XC3000L are tied to the same 3.3V rail - there is no separate I/O voltage domain.
Estimated: Configuration loading time at default CCLK ~1 MHz is roughly 64 ms for the full 64,160-bit bitstream. Designers must hold downstream logic in reset for at least 100 ms after power-up to avoid bus contention. Common pitfalls include: (1) leaving INIT floating (it is open-drain and must be pulled high with 4.7 kohm), (2) driving configuration pins from non-3.3V logic levels (XC3090L inputs are NOT 5V-tolerant), and (3) forgetting to reconfigure on every power-cycle since SRAM cells are volatile.
At commercial 0C to +70C operation with 3.3V supply, the XC3090L-8PC84BKJ dissipates significantly less power than 5V XC3000 variants - typically 0.5W to 1.5W depending on toggle rate and output loading. The windowed ceramic PLCC-84 package has a thermal resistance of approximately 35 C/W junction-to-ambient, so no heatsink is required. However, in dense legacy boards with restricted airflow, monitor junction temperature because XC3000L I/O driving capacitive loads at high frequency can produce local hot spots that are not captured by case temperature.
Use a through-hole PLCC-84 socket (e.g., 3M 8400-series or similar) rather than direct soldering if the part will be replaced during commissioning. Place the XC17Cxx configuration PROM within 100 mm of the FPGA to keep the CCLK trace impedance matched and avoid reflections. Critical signals (CCLK, DIN, DOUT, INIT) should be routed with ground reference and kept away from high-current switching traces. For multi-FPGAs in a daisy-chain, observe the maximum DOUT propagation delay budget before the next device misses its CCLK setup window.
Informations de conformité
Legacy 1990s windowed ceramic PLCC package - RoHS/REACH status not documented in available distributor listings. For RoHS-sustained designs, request a certificate of compliance from the broker or migrate to a non-windowed plastic PLCC variant such as XC3090L-8PC84C.
