XC3S200-4FT256I - 200K Spartan-3 FPGA | AMD | FTBGA-256
Référence : XC3S200-4FT256I ✗ Fin de vieXC3S200-4FT256I Présentation
A field-programmable gate array is a configurable digital semiconductor containing programmable logic blocks, programmable interconnect, and input/output resources. An FPGA belongs to the semiconductor hierarchy, programmable-logic IC hierarchy, and Spartan-3 FPGA family. Unlike a fixed-function application-specific integrated circuit, an FPGA allows system designers to implement parallel logic, control functions, signal processing, and interface logic in hardware and later update the configuration through a configuration memory or JTAG programming path.
The XC3S200-4FT256I combines 4,320 logic cells with 200K system gates and a maximum clock frequency of 630 MHz. The -4 speed designation identifies the performance grade, while the I suffix identifies the industrial temperature grade. The device is specified for 0 C to +85 C operation in the supplied distributor data, making it suitable for industrial and embedded control equipment where environmental requirements exceed consumer-grade conditions.
The 17 mm by 17 mm FTBGA-256 package supports compact PCB layouts but requires careful escape routing, via-in-pad or via fan-out strategies, assembly-process control, and inspection. The 1.2 V core supply requires a regulated, low-noise supply rail and appropriate power-plane distribution. Because this is a legacy Spartan-3 FPGA, designers should also verify configuration memory availability, toolchain support, lifecycle status, and second-source requirements before committing a new production design.
Typical applications include industrial control, instrumentation, data acquisition, communication interfaces, embedded signal processing, and prototype systems requiring configurable parallel logic. The high-pin-count package is particularly useful when the design needs numerous user I/O or dedicated interface resources, although the exact user I/O count is not provided in the verified data.
A key design consideration is that replacing an XC3S200-4FT256I is not limited to matching its package. A true drop-in candidate must also preserve pin assignment, voltage requirements, configuration behavior, timing characteristics, and software support. This page summarizes verified distributor and manufacturer-linked information, compares documented drop-in candidates, and identifies engineering details that must be confirmed before PCB release.
Alternatives de remplacement direct pour XC3S200-4FT256I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC3S200-4FT256I (même facteur de forme et même empreinte) — différant par Mounting Type, Operating Temperature, RoHS Status, System Gates.
XC3S200AN-4FT256I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC3S200-4FTG256I
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →XC3S250E-4FT256I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC3S200-4FT256I Valeurs maximales et caractéristiques électriques
| Device Type | Spartan-3 field-programmable gate array (FPGA) |
| System Gates | 50,000 gates |
| Nominal System Gates | 200,000 gates |
| Logic Cells / Logic Blocks | 4,320 |
| Fréquence d'horloge maximale | 630 MHz |
| Technology | 90 nm |
| Core Supply Voltage | 1.14 V to 1.26 V |
| Package Type | FTBGA-256 |
| Package Dimensions | 17 mm x 17 mm |
| Number of Terminals | 256 |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0 C to +85 C |
| Device Family | Spartan-3 |
| Speed Grade | -4 |
| Temperature Grade | Industrial |
| Statut RoHS | Compliant |
Guide de configuration des broches du XC3S200-4FT256I 17 mm x 17 mm
Configuration des broches du XC3S200-4FT256I (boîtier 17 mm x 17 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC3S200-4FT256I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC3S200-4FT256I convient pour 6 applications: Industrial Control Logic, Data Acquisition and Instrumentation, Communication Interface Consolidation, Embedded Signal Processing, Programmable Logic Prototyping, Custom Timing and Trigger Systems.
Industrial Control Logic
The XC3S200-4FT256I fits industrial control systems requiring configurable parallel logic, deterministic sequencing, and multiple external interfaces. Its 4,320 logic cells provide capacity for state machines, interlocks, counters, and supervisory control, while the 630 MHz maximum clock supports faster control-loop or communication-handling logic. The 0 C to +85 C industrial grade supports equipment operating across the stated environmental range. Designers should use the official ball map for I/O placement and confirm configuration retention because the supplied data does not identify the exact user-I/O count.
Recommandé
Data Acquisition and Instrumentation
The XC3S200-4FT256I can implement parallel sampling control, trigger sequencing, digital filtering, and data-format conversion in a compact instrument. A 630 MHz maximum device clock allows time-critical logic to be divided into multiple lower-frequency pipeline stages, while 200K system gates provide room for acquisition state machines and interface controllers. For measurement systems, isolate sensitive analog circuitry from FPGA switching and provide a low-noise 1.2 V core rail. Exact ADC interface timing and I/O voltage requirements remain to be confirmed from the complete datasheet.
Recommandé
Communication Interface Consolidation
The XC3S200-4FT256I is suitable for implementing protocol controllers, UART, SPI, Ethernet framing, or custom communication links in parallel hardware. Its 4,320 logic cells and 630 MHz maximum clock provide a balance between throughput and routing complexity for medium-speed embedded interfaces, while the 256-ball package offers numerous potential I/O sites. Because the verified data does not state user-I/O counts or supported I/O standards, engineers must confirm pin capabilities and voltage levels before assigning a bus. JTAG access and board-level test points should be included.
Recommandé
Embedded Signal Processing
The XC3S200-4FT256I can implement fixed-function digital filters, correlation, packet parsing, or sensor-data conditioning using parallel FPGA logic. The 630 MHz maximum clock enables pipelined processing stages, and the 4,320-cell fabric is suitable for moderate algorithmic widths rather than large processor-class workloads. Keep arithmetic paths short to simplify timing closure, and use synchronous design practices with registered pipeline boundaries. Block RAM, DSP resources, and specific performance figures are not included in the supplied data, so those values must be checked before sizing the algorithm.
Recommandé
Programmable Logic Prototyping
The XC3S200-4FT256I supports prototypes that combine control logic, interface adaptation, and parallel algorithms without producing a custom ASIC. Its 200K system gates and 4,320 logic cells are sufficient for educational, proof-of-concept, and legacy industrial-control designs, while the 630 MHz maximum clock supports synchronous logic and test benches. A migration plan should preserve configuration files, timing constraints, and pin constraints because changing to another FPGA can require complete toolchain and pinout verification. The FTBGA package also demands careful PCB assembly planning.
Recommandé
Custom Timing and Trigger Systems
The XC3S200-4FT256I can implement precise counters, programmable delays, trigger matrices, and multi-channel sequencing for test and measurement equipment. Its 630 MHz maximum clock supports high-rate timing references, while the 4,320 logic cells allow parallel channel logic and control-state machines to coexist on one device. Use dedicated clock routing, account for board skew and jitter, and keep trigger outputs synchronized through registered logic. Exact I/O standards and output timing are not present in the supplied data and must be verified from official timing specifications.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC3S200-4FT256I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC3S200AN-4FT256I | XC3S200-4FTG256I | XC3S250E-4FT256I |
|---|---|---|---|---|
| Package | FTBGA-256 | FTBGA-256 | FTBGA-256 | FTBGA-256 |
| Brand | AMD | AMD | AMD | AMD |
| Device Family | Spartan-3 | Spartan-3A | Spartan-3 | Spartan-3E |
| Package Dimensions | 17 mm x 17 mm | 17 mm x 17 mm | 17 mm x 17 mm | 17 mm x 17 mm |
Principaux différenciateurs
- Original 200K Spartan-3 resource level (vs XC3S250E-4FT256I)
- Directly documented 630 MHz clock rating (vs XC3S200AN-4FT256I)
- Verified original-family 256-terminal package and supply data (vs XC3S200AN-4FT256I)
Notes de conception
Design the 17 mm x 17 mm FTBGA-256 layout from the official package drawing rather than from a generic BGA escape pattern. Confirm ball-pitch, ball-map orientation, pad and solder-mask definitions, via requirements, and assembly-process capability with the exact device documentation. Keep the core-supply, ground, configuration, clock, and JTAG routing consistent with the manufacturer guidelines before releasing fabrication files.
The verified core-supply range is 1.14 V to 1.26 V, with approximately 1.2 V as the nominal operating point. Use a supply capable of meeting the required transient current, place local decoupling at the device, and provide low-impedance power and ground planes. Exact capacitor values and current limits are not present in the supplied data, so follow the official power-distribution and decoupling guidance before finalizing the schematic.
Treat clocks, JTAG, configuration interfaces, and high-speed user I/O as separate routing classes. Use short clock paths, avoid unnecessary stubs, provide clean return paths, and validate source-synchronous or externally clocked interfaces with board-level simulation. The maximum device clock is 630 MHz, but achievable system timing depends on routing, logic depth, I/O standards, and external clock quality.
Do not treat an FTBGA package match as proof of drop-in compatibility. Confirm the complete ordering code, ball assignment, device status, speed grade, temperature grade, configuration method, pin standards, and synthesis-tool support. The verified data does not supply a full programming pinout or a guaranteed cross-brand replacement, so use the official Spartan-3 documentation and obtain AMD or distributor confirmation before substitution.
Informations de conformité
RoHS compliance is identified in the supplied comparison data. The verified sources do not establish REACH, halogen-free, conflict-minerals, or automotive qualification status. The -I suffix identifies the industrial temperature grade in the supplied distributor data, not AEC-Q100 qualification.
