XC3S50-4VQ100C - 50K Spartan-3 FPGA | AMD | 100-TQFP
Référence : XC3S50-4VQ100C ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $24.95 | $24,95 |
| 10 | $21.4 | $214,00 |
| 100 | $17.85 | $1 785,00 |
| 500 | $15.2 | $7 600,00 |
| 1 000 | $13.65 | $13 650,00 |
XC3S50-4VQ100C Présentation
A field-programmable gate array is a semiconductor whose logic fabric, programmable interconnect, and I/O blocks can be configured after manufacture. The XC3S50-4VQ100C belongs to the Spartan-3 FPGA family, combining configurable logic resources with dedicated digital input/output capability in a low-density package suitable for space-constrained designs.
The verified device information identifies 50,000 system gates, 1,728 logic cells, 63 I/O, and a maximum stated clock frequency of 630 MHz. The -4 suffix denotes the performance grade, while VQ100 identifies the 100-pin package. The core supply is listed as 1.2 V, with an operating supply range of 1.14 V to 1.26 V and a commercial junction-temperature range of 0°C to 85°C.
Unlike an application-specific integrated circuit, this FPGA permits configuration changes during development and production. That flexibility supports parallel data paths, state machines, protocol bridging, control logic, and small embedded processing systems. Its 100-pin TQFP package also exposes more general-purpose I/O than lower-density packages, although exact bank voltage, input threshold, and pin-specific capabilities require the official device documentation.
Typical applications include industrial control, telecommunications support logic, consumer electronics, and compact embedded systems. The 1.2 V core makes board-level power planning important: designers should provide stable, decoupled core rails and use compatible external I/O standards according to the selected bank configuration. Tool-chain, configuration-memory, and legacy-device considerations should also be reviewed before committing a new production design.
For an existing 100-TQFP Spartan-3 PCB, a replacement must be checked for exact speed grade, temperature grade, pin mapping, supply requirements, I/O standards, configuration interface, and programming-file compatibility. This page combines verified distributor specifications with practical selection, sourcing, and migration guidance rather than relying only on a catalog description.
Alternatives de remplacement direct pour XC3S50-4VQ100C — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC3S50-4VQ100C (même facteur de forme et même empreinte) — différant par Device Type, Logic Cells, Package, System Gates, Temperature Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC3S50-4VQG100C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC3S50-4VQ100I
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →XC3S50-4VQG100I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC3S50-4VQ100C Valeurs maximales et caractéristiques électriques
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-3 |
| System Gates | 50,000 gates |
| Logic Cells | 1,728 cells |
| Maximum Stated Frequency | 630 MHz |
| I/O Count | 63 I/O |
| Core Supply Voltage | 1.2 V |
| Operating Supply Voltage Range | 1.14 V to 1.26 V |
| Speed Grade | -4 |
| Temperature Grade | Commercial |
| Plage de température de jonction en fonctionnement | 0°C to 85°C |
| Boîtier | 100-TQFP |
| Package Body Size | 14 mm x 14 mm |
| Type de montage | Surface Mount |
| Terminal Count | 100 pins |
| Process Technology | 90 nm |
| Lead-Free Status | Lead Free |
| Statut RoHS | unknown |
| REACH Status | unknown |
Guide de configuration des broches du XC3S50-4VQ100C 14 mm x 14 mm
Configuration des broches du XC3S50-4VQ100C (boîtier 14 mm x 14 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC3S50-4VQ100C.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC3S50-4VQ100C convient pour 6 applications: Industrial Control and Automation Logic, Telecommunications Interface Logic, Consumer Electronics and Embedded Systems, Data Acquisition and Signal Conditioning, Networked Edge and Gateway Control, Instrumentation and Measurement Control.
Industrial Control and Automation Logic
The XC3S50-4VQ100C fits compact industrial-control logic where programmable state machines, parallel data handling, and dedicated I/O are more useful than a fixed application ASIC. Its verified 1,728 logic cells and 63 I/O provide capacity for sequencing, interlocks, signal conditioning interfaces, and communication-control functions. The 1.2 V core and 1.14 V to 1.26 V operating range require a stable supply with local decoupling. For deployments extending beyond the commercial 0°C to 85°C junction range, the industrial-temperature XC3S50-4VQ100I should be considered instead.
Recommandé
Telecommunications Interface Logic
The XC3S50-4VQ100C is appropriate for telecommunications support logic that requires configurable framing, packet filtering, status tracking, and parallel-to-serial interface adaptation. Its 50,000-system-gate and 1,728-cell Spartan-3 implementation, together with 63 I/O, supports modest data-path concurrency without moving to a larger FPGA. The maximum stated frequency of 630 MHz provides substantial timing headroom, although actual system performance depends on routing, logic depth, and the selected clocking scheme. Board-level design must preserve the 1.14 V to 1.26 V core range and apply the required I/O standards per bank.
Recommandé
Consumer Electronics and Embedded Systems
The XC3S50-4VQ100C can consolidate control, display, keypad, and peripheral-interface logic in a compact consumer-electronics design. Sixty-three I/O and 1,728 logic cells are sufficient for modest control planes, custom protocol conversion, LED or display sequencing, and sensor aggregation. Its 100-TQFP package supports conventional surface-mount assembly, while the -4 grade targets higher performance than the base Spartan-3 grade. Designers should confirm legacy programming-tool support, configuration-memory requirements, and whether an industrial-temperature alternative is needed before finalizing a long-life consumer product.
Recommandé
Data Acquisition and Signal Conditioning
The XC3S50-4VQ100C is useful in small data-acquisition systems that coordinate sensor inputs, counters, digital filtering, timing, and control outputs. Its programmable fabric allows acquisition sequencing and data-path logic to be consolidated without a fixed-function controller, while 63 I/O provide connectivity for multiplexers, memory interfaces, and status signals. The 1.2 V core must be separated appropriately from any external analog or mixed-signal circuitry. Designers should use the official I/O bank rules, account for input thresholds and drive standards, and verify timing closure for sampling, triggering, or synchronization paths.
Recommandé
Networked Edge and Gateway Control
The XC3S50-4VQ100C can implement a small gateway-control layer that supervises communication, manages local I/O, and bridges legacy peripheral formats. Its 1,728 logic cells are appropriate for bounded protocol handling, state machines, and supervisory functions rather than a complete network stack in software. Pairing it with a dedicated Ethernet interface concentrates the FPGA's role on deterministic control and data organization. The commercial 0°C to 85°C range may suit indoor equipment, but deployed temperature, power, and lifecycle requirements should drive the final grade and sourcing decision.
Recommandé
Instrumentation and Measurement Control
The XC3S50-4VQ100C is suitable for instrumentation front ends that coordinate switches, calibration tables, status indicators, and data-transfer framing. The 100-TQFP package provides a manageable number of external connections, while the configurable logic permits revision-friendly changes to timing and control sequences. Its verified 630 MHz stated frequency is ample for many acquisition and supervisory paths, but the final implementation depends on actual timing closure. Use clean reference-ground partitioning, verify input thresholds for test signals, and confirm the configuration mechanism against the instrument's startup and service requirements.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC3S50-4VQ100C — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC3S50-4VQG100C | XC3S50-4VQ100I | XC3S50-4VQG100I |
|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD |
| Package | 100-VQFP | 100-VQFP - same | 100-VQFP - same | 100-VQFP - same |
| FPGA Family | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 |
| Speed Grade | -4 | -4 | -4 | -4 |
Principaux différenciateurs
- Closest ordering-code match with verified complete replacement (vs XC3S50-4VQG100C)
- Industrial-temperature option without changing the core device family (vs XC3S50-4VQ100I)
- Commercial-grade 1.2 V device for compact embedded control (vs XC3S100E-4VQG100I)
Notes de conception
Design the core rail for the verified 1.2 V nominal supply and 1.14 V to 1.26 V operating range. Keep the regulator stable across startup and load transients, and place the required bypass capacitors close to the device's power and ground pins with short, low-impedance return paths. The supplied data does not specify recommended capacitor values or I/O bank voltages; obtain those values from the official datasheet rather than reusing values from another FPGA.
Confirm the exact 100-VQFP land pattern, pin-one orientation, and thermal-pad arrangement against the official package drawing. The verified body size is 14 mm by 14 mm, but package variants and exposed thermal features must not be inferred from that dimension alone. Preserve solder-mask and paste control around fine-pitch leads, and route clock, configuration, and high-fanout I/O nets away from sensitive analog or reference signals.
Do not treat identical package names as proof of interchangeable FPGA designs. Before replacing the XC3S50-4VQ100C, verify the speed suffix, commercial or industrial temperature grade, pin-to-pin signal functions, I/O standard limits, configuration pins, core and auxiliary voltage requirements, and bitstream compatibility. Legacy-device migration should also include an ISE-era synthesis and timing check so a nominal 630 MHz device figure is not mistaken for guaranteed design Fmax.
Assign clocks and fast external interfaces deliberately, and verify source-synchronous timing, loading, and I/O standards in the official device documentation. For interfaces to current-generation mixed-signal or network components, check voltage compatibility and direction at every crossing; a 1.2 V core specification does not define the external interface voltage. Where legacy LVCMOS or TTL interfacing is required, use level translation only after confirming direction, speed, and signal-integrity margins.
Informations de conformité
The verified Digchip specification identifies the XC3S50-4VQ100C as lead-free. No explicit RoHS, REACH, AEC-Q100, halogen-free, or conflict-minerals declaration was supplied, so those statuses remain unknown.
